CN1996055A - 一种掺杂稳定化氧化锆的耐高温光学膜及其制备方法 - Google Patents
一种掺杂稳定化氧化锆的耐高温光学膜及其制备方法 Download PDFInfo
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- CN1996055A CN1996055A CN 200610161333 CN200610161333A CN1996055A CN 1996055 A CN1996055 A CN 1996055A CN 200610161333 CN200610161333 CN 200610161333 CN 200610161333 A CN200610161333 A CN 200610161333A CN 1996055 A CN1996055 A CN 1996055A
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- 239000012788 optical film Substances 0.000 title claims abstract description 29
- 229910002076 stabilized zirconia Inorganic materials 0.000 title claims abstract description 26
- 238000000034 method Methods 0.000 title description 14
- 239000010408 film Substances 0.000 claims abstract description 84
- 229910052726 zirconium Inorganic materials 0.000 claims abstract description 35
- 229910052727 yttrium Inorganic materials 0.000 claims abstract description 34
- 238000004544 sputter deposition Methods 0.000 claims abstract description 31
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 12
- 238000002360 preparation method Methods 0.000 claims abstract description 9
- 150000003254 radicals Chemical class 0.000 claims abstract description 5
- 229910021486 amorphous silicon dioxide Inorganic materials 0.000 claims abstract description 3
- 239000003381 stabilizer Substances 0.000 claims abstract description 3
- 229910052751 metal Inorganic materials 0.000 claims description 53
- 239000002184 metal Substances 0.000 claims description 53
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 30
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 claims description 26
- 239000000463 material Substances 0.000 claims description 26
- 229910052786 argon Inorganic materials 0.000 claims description 15
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 14
- 239000001301 oxygen Substances 0.000 claims description 14
- 229910052760 oxygen Inorganic materials 0.000 claims description 14
- 239000000758 substrate Substances 0.000 claims description 13
- 239000007789 gas Substances 0.000 claims description 11
- 239000000956 alloy Substances 0.000 claims description 8
- 229910045601 alloy Inorganic materials 0.000 claims description 8
- 239000000203 mixture Substances 0.000 claims description 4
- 238000001755 magnetron sputter deposition Methods 0.000 claims description 3
- 230000003647 oxidation Effects 0.000 claims description 3
- 238000007254 oxidation reaction Methods 0.000 claims description 3
- 230000006641 stabilisation Effects 0.000 claims 2
- 238000011105 stabilization Methods 0.000 claims 2
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 claims 1
- 229910001882 dioxygen Inorganic materials 0.000 claims 1
- 230000001105 regulatory effect Effects 0.000 claims 1
- 238000004804 winding Methods 0.000 claims 1
- 230000003287 optical effect Effects 0.000 abstract description 37
- 229910018072 Al 2 O 3 Inorganic materials 0.000 abstract description 17
- 238000005546 reactive sputtering Methods 0.000 abstract description 16
- 239000013077 target material Substances 0.000 abstract description 8
- 238000005259 measurement Methods 0.000 abstract description 4
- 238000001914 filtration Methods 0.000 abstract 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 44
- 239000010410 layer Substances 0.000 description 39
- 235000012239 silicon dioxide Nutrition 0.000 description 24
- 238000002834 transmittance Methods 0.000 description 23
- 229910004298 SiO 2 Inorganic materials 0.000 description 21
- 239000000377 silicon dioxide Substances 0.000 description 20
- 239000002356 single layer Substances 0.000 description 18
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 description 15
- 239000010409 thin film Substances 0.000 description 14
- 238000010438 heat treatment Methods 0.000 description 12
- 229910052681 coesite Inorganic materials 0.000 description 8
- 229910052906 cristobalite Inorganic materials 0.000 description 8
- 229910052682 stishovite Inorganic materials 0.000 description 8
- 238000012360 testing method Methods 0.000 description 8
- 229910052905 tridymite Inorganic materials 0.000 description 8
- 239000013078 crystal Substances 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 238000000411 transmission spectrum Methods 0.000 description 6
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 5
- 230000005540 biological transmission Effects 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 5
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 4
- 238000004833 X-ray photoelectron spectroscopy Methods 0.000 description 4
- 238000013461 design Methods 0.000 description 4
- 239000010453 quartz Substances 0.000 description 4
- 230000007704 transition Effects 0.000 description 4
- 238000000576 coating method Methods 0.000 description 3
- 238000010183 spectrum analysis Methods 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 229910052593 corundum Inorganic materials 0.000 description 2
- 238000002425 crystallisation Methods 0.000 description 2
- 230000008025 crystallization Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- ZKATWMILCYLAPD-UHFFFAOYSA-N niobium pentoxide Inorganic materials O=[Nb](=O)O[Nb](=O)=O ZKATWMILCYLAPD-UHFFFAOYSA-N 0.000 description 2
- URLJKFSTXLNXLG-UHFFFAOYSA-N niobium(5+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Nb+5].[Nb+5] URLJKFSTXLNXLG-UHFFFAOYSA-N 0.000 description 2
- BPUBBGLMJRNUCC-UHFFFAOYSA-N oxygen(2-);tantalum(5+) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ta+5].[Ta+5] BPUBBGLMJRNUCC-UHFFFAOYSA-N 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 230000003595 spectral effect Effects 0.000 description 2
- PBCFLUZVCVVTBY-UHFFFAOYSA-N tantalum pentoxide Inorganic materials O=[Ta](=O)O[Ta](=O)=O PBCFLUZVCVVTBY-UHFFFAOYSA-N 0.000 description 2
- 229910001845 yogo sapphire Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910010413 TiO 2 Inorganic materials 0.000 description 1
- 238000000149 argon plasma sintering Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000005094 computer simulation Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- RKTYLMNFRDHKIL-UHFFFAOYSA-N copper;5,10,15,20-tetraphenylporphyrin-22,24-diide Chemical compound [Cu+2].C1=CC(C(=C2C=CC([N-]2)=C(C=2C=CC=CC=2)C=2C=CC(N=2)=C(C=2C=CC=CC=2)C2=CC=C3[N-]2)C=2C=CC=CC=2)=NC1=C3C1=CC=CC=C1 RKTYLMNFRDHKIL-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000446 fuel Substances 0.000 description 1
- 229910052735 hafnium Inorganic materials 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 229910052758 niobium Inorganic materials 0.000 description 1
- 239000010955 niobium Substances 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 230000005693 optoelectronics Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- VSZWPYCFIRKVQL-UHFFFAOYSA-N selanylidenegallium;selenium Chemical compound [Se].[Se]=[Ga].[Se]=[Ga] VSZWPYCFIRKVQL-UHFFFAOYSA-N 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 229910001233 yttria-stabilized zirconia Inorganic materials 0.000 description 1
- RVRKDGLTBFWQHH-UHFFFAOYSA-N yttrium zirconium Chemical compound [Y][Zr][Y] RVRKDGLTBFWQHH-UHFFFAOYSA-N 0.000 description 1
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Abstract
Description
膜层 | 材料 | 厚度(纳米) |
1 | 钇稳定氧化锆(YSZ) | 9.68 |
2 | 二氧化硅(SiO2) | 108.77 |
3 | 钇稳定氧化锆(YSZ) | 53.77 |
4 | 二氧化硅(SiO2) | 68.31 |
5 | 钇稳定氧化锆(YSZ) | 45.35 |
6 | 二氧化硅(SiO2) | 77.26 |
7 | 钇稳定氧化锆(YSZ) | 51.97 |
8 | 二氧化硅(SiO2) | 76.36 |
9 | 钇稳定氧化锆(YSZ) | 48.83 |
10 | 二氧化硅(SiO2) | 74.78 |
11 | 钇稳定氧化锆(YSZ) | 50.99 |
12 | 二氧化硅(SiO2) | 77.78 |
13 | 钇稳定氧化锆(YSZ) | 49.79 |
14 | 二氧化硅(SiO2) | 72.24 |
15 | 钇稳定氧化锆(YSZ) | 49.49 |
16 | 二氧化硅(SiO2) | 76.42 |
17 | 钇稳定氧化锆(YSZ) | 43.42 |
18 | 二氧化硅(SiO2) | 79.23 |
19 | 钇稳定氧化锆(YSZ) | 25.24 |
20 | 二氧化硅(SiO2) | 67.18 |
Claims (3)
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CNB2006101613338A CN100434937C (zh) | 2006-12-18 | 2006-12-18 | 一种掺杂稳定化氧化锆的耐高温光学膜及其制备方法 |
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CN1996055A true CN1996055A (zh) | 2007-07-11 |
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Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102560358A (zh) * | 2010-12-16 | 2012-07-11 | 鸿富锦精密工业(深圳)有限公司 | 壳体及其制备方法 |
CN103941321A (zh) * | 2013-06-20 | 2014-07-23 | 厦门天马微电子有限公司 | 光学膜及液晶显示器 |
CN108609862A (zh) * | 2018-06-04 | 2018-10-02 | 中建材蚌埠玻璃工业设计研究院有限公司 | 一种增加超薄玻璃硬度与耐磨性的方法 |
CN112391594A (zh) * | 2020-09-30 | 2021-02-23 | 科立视材料科技有限公司 | 一种具有氧化锆保护镀层的铂金通道及其制备方法 |
CN114231896A (zh) * | 2021-12-16 | 2022-03-25 | 武汉光安伦光电技术有限公司 | 半导体芯片腔面ZrAlO膜系加工的工艺方法 |
CN115478247A (zh) * | 2021-05-28 | 2022-12-16 | 上海日岳新能源有限公司 | 耐磨耐高温大晶格陶瓷薄膜绝热结构 |
CN115921863A (zh) * | 2022-12-12 | 2023-04-07 | 巨玻固能(苏州)薄膜材料有限公司 | 镀膜材料、复合氧化物薄膜、制备方法及光学产品 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN85100096B (zh) * | 1985-04-01 | 1988-12-07 | 清华大学 | 平面磁控溅射靶及其镀膜方法 |
CN1004495B (zh) * | 1985-07-25 | 1989-06-14 | 清华大学 | 复合磁控溅射靶及其镀膜方法 |
US5753385A (en) * | 1995-12-12 | 1998-05-19 | Regents Of The University Of California | Hybrid deposition of thin film solid oxide fuel cells and electrolyzers |
US5923471A (en) * | 1996-11-26 | 1999-07-13 | Deposition Sciences, Inc. | Optical interference coating capable of withstanding severe temperature environments |
CN1084481C (zh) * | 1998-11-04 | 2002-05-08 | 中国科学院山西煤炭化学研究所 | 氧化锆/氧化硅系高抗激光损伤高反膜的制备方法 |
CN2426612Y (zh) * | 2000-04-27 | 2001-04-11 | 中国科学院长春光学精密机械与物理研究所 | 一种1.06mn激光防护镜片 |
CN1553220A (zh) * | 2003-12-18 | 2004-12-08 | 同济大学 | 一种高激光损伤阈值ZrO2薄膜的制备方法 |
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- 2006-12-18 CN CNB2006101613338A patent/CN100434937C/zh not_active Expired - Fee Related
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102560358A (zh) * | 2010-12-16 | 2012-07-11 | 鸿富锦精密工业(深圳)有限公司 | 壳体及其制备方法 |
CN103941321A (zh) * | 2013-06-20 | 2014-07-23 | 厦门天马微电子有限公司 | 光学膜及液晶显示器 |
CN103941321B (zh) * | 2013-06-20 | 2017-08-01 | 厦门天马微电子有限公司 | 光学膜及液晶显示器 |
CN108609862A (zh) * | 2018-06-04 | 2018-10-02 | 中建材蚌埠玻璃工业设计研究院有限公司 | 一种增加超薄玻璃硬度与耐磨性的方法 |
CN112391594A (zh) * | 2020-09-30 | 2021-02-23 | 科立视材料科技有限公司 | 一种具有氧化锆保护镀层的铂金通道及其制备方法 |
CN115478247A (zh) * | 2021-05-28 | 2022-12-16 | 上海日岳新能源有限公司 | 耐磨耐高温大晶格陶瓷薄膜绝热结构 |
CN114231896A (zh) * | 2021-12-16 | 2022-03-25 | 武汉光安伦光电技术有限公司 | 半导体芯片腔面ZrAlO膜系加工的工艺方法 |
CN114231896B (zh) * | 2021-12-16 | 2024-02-20 | 武汉光安伦光电技术有限公司 | 半导体芯片腔面ZrAlO膜系加工的工艺方法 |
CN115921863A (zh) * | 2022-12-12 | 2023-04-07 | 巨玻固能(苏州)薄膜材料有限公司 | 镀膜材料、复合氧化物薄膜、制备方法及光学产品 |
CN115921863B (zh) * | 2022-12-12 | 2023-10-27 | 巨玻固能(苏州)薄膜材料有限公司 | 镀膜材料、复合氧化物薄膜、制备方法及光学产品 |
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