CN1975574B - 辐射敏感性树脂组合物 - Google Patents

辐射敏感性树脂组合物 Download PDF

Info

Publication number
CN1975574B
CN1975574B CN2006101604841A CN200610160484A CN1975574B CN 1975574 B CN1975574 B CN 1975574B CN 2006101604841 A CN2006101604841 A CN 2006101604841A CN 200610160484 A CN200610160484 A CN 200610160484A CN 1975574 B CN1975574 B CN 1975574B
Authority
CN
China
Prior art keywords
radiation
resin composition
sensitive resin
methyl
structural unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2006101604841A
Other languages
English (en)
Chinese (zh)
Other versions
CN1975574A (zh
Inventor
中野由子
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Chemical Co Ltd
Original Assignee
Sumitomo Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Chemical Co Ltd filed Critical Sumitomo Chemical Co Ltd
Publication of CN1975574A publication Critical patent/CN1975574A/zh
Application granted granted Critical
Publication of CN1975574B publication Critical patent/CN1975574B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0048—Photosensitive materials characterised by the solvents or agents facilitating spreading, e.g. tensio-active agents
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Materials For Photolithography (AREA)
CN2006101604841A 2005-11-30 2006-11-28 辐射敏感性树脂组合物 Expired - Fee Related CN1975574B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2005345224 2005-11-30
JP2005345224A JP2007148208A (ja) 2005-11-30 2005-11-30 感放射線性樹脂組成物
JP2005-345224 2005-11-30

Publications (2)

Publication Number Publication Date
CN1975574A CN1975574A (zh) 2007-06-06
CN1975574B true CN1975574B (zh) 2011-06-15

Family

ID=38125720

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2006101604841A Expired - Fee Related CN1975574B (zh) 2005-11-30 2006-11-28 辐射敏感性树脂组合物

Country Status (4)

Country Link
JP (1) JP2007148208A (ja)
KR (1) KR20070056988A (ja)
CN (1) CN1975574B (ja)
TW (1) TW200720844A (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4564977B2 (ja) * 2007-04-05 2010-10-20 東京応化工業株式会社 感光性樹脂組成物、レジストパターンの製造方法、積層体、及びデバイス
JP5137673B2 (ja) * 2008-04-26 2013-02-06 日本化薬株式会社 Ｍｅｍｓ用感光性樹脂組成物及びその硬化物

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0437015A2 (en) * 1990-01-08 1991-07-17 Hoechst Celanese Corporation Positive working, peel developable, colour proofing system having two photosensitive layers
CN1501167A (zh) * 2002-10-24 2004-06-02 住友化学工业株式会社 感放射线性树脂组成物
CN1542548A (zh) * 2002-11-01 2004-11-03 住友化学工业株式会社 感放射线性树脂组合物
CN1550893A (zh) * 2003-03-25 2004-12-01 住友化学工业株式会社 固化树脂图案的形成方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2187046A1 (fr) * 1996-10-03 1998-04-03 Alain Vallee Sulfonylimidures et sulfonylmethylures, leur utilisation comme photoinitiateur
JP4199958B2 (ja) * 2002-06-03 2008-12-24 Ｊｓｒ株式会社 感放射線性樹脂組成物
JP2004139070A (ja) * 2002-09-27 2004-05-13 Sumitomo Chem Co Ltd 感放射線性樹脂組成物
JP4148098B2 (ja) * 2002-10-24 2008-09-10 住友化学株式会社 感放射線性樹脂組成物
US6777460B2 (en) * 2002-12-23 2004-08-17 3M Innovative Properties Company Curing agents for cationically curable compositions
JP2005265866A (ja) * 2003-03-25 2005-09-29 Sumitomo Chemical Co Ltd 硬化樹脂パターンの形成方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0437015A2 (en) * 1990-01-08 1991-07-17 Hoechst Celanese Corporation Positive working, peel developable, colour proofing system having two photosensitive layers
CN1501167A (zh) * 2002-10-24 2004-06-02 住友化学工业株式会社 感放射线性树脂组成物
CN1542548A (zh) * 2002-11-01 2004-11-03 住友化学工业株式会社 感放射线性树脂组合物
CN1550893A (zh) * 2003-03-25 2004-12-01 住友化学工业株式会社 固化树脂图案的形成方法

Also Published As

Publication number Publication date
KR20070056988A (ko) 2007-06-04
TW200720844A (en) 2007-06-01
CN1975574A (zh) 2007-06-06
JP2007148208A (ja) 2007-06-14

Similar Documents

Publication Publication Date Title
TWI403836B (zh) 感光性樹脂組成物
TWI507817B (zh) 彩色濾光片用著色組成物、彩色濾光片及彩色液晶顯示元件
JP2008009121A (ja) ポジ型着色感放射線性樹脂組成物
TWI395054B (zh) 感光性樹脂組成物（二）
TWI470349B (zh) 感光性組成物、由此組成物所獲得的硬化膜以及具有此硬化膜的顯示元件
CN101256360B (zh) 放射线敏感性树脂组合物、层间绝缘膜和微透镜、以及它们的制备方法
TWI396940B (zh) 感光性樹脂組成物
CN1975574B (zh) 辐射敏感性树脂组合物
TW201027252A (en) Radiosensitive resin composition, interlayer insulation film, microlens and methods for manufacturing them
JP4148098B2 (ja) 感放射線性樹脂組成物
JP4403805B2 (ja) 感放射線性樹脂組成物
CN1716094B (zh) 辐射敏感树脂组合物
KR101056719B1 (ko) 경화 수지 패턴의 형성 방법
JP4696761B2 (ja) 感放射線性樹脂組成物
JP4720320B2 (ja) 感放射線性樹脂組成物
JP4640099B2 (ja) 感放射線性樹脂組成物
JP4148100B2 (ja) 感放射線性樹脂組成物
KR20040038826A (ko) 감방사선성 수지 조성물
JP4000903B2 (ja) 感放射線性樹脂組成物
JP2005181353A (ja) 感放射線性樹脂組成物
JP2005265866A (ja) 硬化樹脂パターンの形成方法
KR101039558B1 (ko) 감방사선성 수지 조성물
CN1716095B (zh) 辐射敏感的树脂组成物、固化树脂图案与液晶显示器
JP2003156843A (ja) 感放射線性樹脂組成物
CN101387829A (zh) 放射线敏感性树脂组合物

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20110615

Termination date: 20131128