TW200720844A - Radiosensitive resin composition - Google Patents

Radiosensitive resin composition

Info

Publication number
TW200720844A
TW200720844A TW095143325A TW95143325A TW200720844A TW 200720844 A TW200720844 A TW 200720844A TW 095143325 A TW095143325 A TW 095143325A TW 95143325 A TW95143325 A TW 95143325A TW 200720844 A TW200720844 A TW 200720844A
Authority
TW
Taiwan
Prior art keywords
carbon atoms
group
resin composition
anion
equation
Prior art date
Application number
TW095143325A
Other languages
English (en)
Chinese (zh)
Inventor
Yuko Nakano
Original Assignee
Sumitomo Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Chemical Co filed Critical Sumitomo Chemical Co
Publication of TW200720844A publication Critical patent/TW200720844A/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0048—Photosensitive materials characterised by the solvents or agents facilitating spreading, e.g. tensio-active agents
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Materials For Photolithography (AREA)
TW095143325A 2005-11-30 2006-11-23 Radiosensitive resin composition TW200720844A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005345224A JP2007148208A (ja) 2005-11-30 2005-11-30 感放射線性樹脂組成物

Publications (1)

Publication Number Publication Date
TW200720844A true TW200720844A (en) 2007-06-01

Family

ID=38125720

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095143325A TW200720844A (en) 2005-11-30 2006-11-23 Radiosensitive resin composition

Country Status (4)

Country Link
JP (1) JP2007148208A (ja)
KR (1) KR20070056988A (ja)
CN (1) CN1975574B (ja)
TW (1) TW200720844A (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4564977B2 (ja) * 2007-04-05 2010-10-20 東京応化工業株式会社 感光性樹脂組成物、レジストパターンの製造方法、積層体、及びデバイス
JP5137673B2 (ja) * 2008-04-26 2013-02-06 日本化薬株式会社 Ｍｅｍｓ用感光性樹脂組成物及びその硬化物

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4963462A (en) * 1990-01-08 1990-10-16 Hoechst Celanese Corporation Positive working, peel developable, color proofing system having two photosensitive layers
CA2187046A1 (fr) * 1996-10-03 1998-04-03 Alain Vallee Sulfonylimidures et sulfonylmethylures, leur utilisation comme photoinitiateur
JP4199958B2 (ja) * 2002-06-03 2008-12-24 Ｊｓｒ株式会社 感放射線性樹脂組成物
JP2004139070A (ja) * 2002-09-27 2004-05-13 Sumitomo Chem Co Ltd 感放射線性樹脂組成物
CN1501167A (zh) * 2002-10-24 2004-06-02 住友化学工业株式会社 感放射线性树脂组成物
JP4148098B2 (ja) * 2002-10-24 2008-09-10 住友化学株式会社 感放射線性樹脂組成物
TWI281095B (en) * 2002-11-01 2007-05-11 Sumitomo Chemical Co Radiation sensitive resin composition
US6777460B2 (en) * 2002-12-23 2004-08-17 3M Innovative Properties Company Curing agents for cationically curable compositions
TW200502682A (en) * 2003-03-25 2005-01-16 Sumitomo Chemical Co Process for forming hardened resin pattern
JP2005265866A (ja) * 2003-03-25 2005-09-29 Sumitomo Chemical Co Ltd 硬化樹脂パターンの形成方法

Also Published As

Publication number Publication date
KR20070056988A (ko) 2007-06-04
JP2007148208A (ja) 2007-06-14
CN1975574B (zh) 2011-06-15
CN1975574A (zh) 2007-06-06

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