TW200720844A - Radiosensitive resin composition - Google Patents

Radiosensitive resin composition

Info

Publication number
TW200720844A
TW200720844A TW095143325A TW95143325A TW200720844A TW 200720844 A TW200720844 A TW 200720844A TW 095143325 A TW095143325 A TW 095143325A TW 95143325 A TW95143325 A TW 95143325A TW 200720844 A TW200720844 A TW 200720844A
Authority
TW
Taiwan
Prior art keywords
carbon atoms
group
resin composition
anion
equation
Prior art date
Application number
TW095143325A
Other languages
Chinese (zh)
Inventor
Yuko Nakano
Original Assignee
Sumitomo Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Chemical Co filed Critical Sumitomo Chemical Co
Publication of TW200720844A publication Critical patent/TW200720844A/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0048—Photosensitive materials characterised by the solvents or agents facilitating spreading, e.g. tensio-active agents
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Materials For Photolithography (AREA)

Abstract

A radiosensitive resin composition comprising a alkaline soluble hardening resin (A), a guionediazide compound (B), a cationic polymerization initiator (C) containing an onium cation and an anion selected from the group consisting of an anion given by the equation (1) and an anion given by the equation (2), and a solvent (H), (wherein R1 to R3, R11 and R33 each independently represents a linear perfluoroalkyl group having 1-20 carbon atoms, a branched perfluoroalkyl group having 3-20 carbon atoms, a cyclic perfluoroalkyl group having 3-20 carbon atoms or a perfluoroaryl group having 6-20 carbon atoms, any one of the groups of -O-, -N(R)-, or -SO2- may be inserted between carbon atoms of the above each group (R represents a hydrogen atom or alkyl group having 1-4 carbon atoms), R11 and R33 or any two of R1 to R3 may be bonded to form a ring structure and one or two ring structure may form a hetero ring).
TW095143325A 2005-11-30 2006-11-23 Radiosensitive resin composition TW200720844A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005345224A JP2007148208A (en) 2005-11-30 2005-11-30 Radiation-sensitive resin composition

Publications (1)

Publication Number Publication Date
TW200720844A true TW200720844A (en) 2007-06-01

Family

ID=38125720

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095143325A TW200720844A (en) 2005-11-30 2006-11-23 Radiosensitive resin composition

Country Status (4)

Country Link
JP (1) JP2007148208A (en)
KR (1) KR20070056988A (en)
CN (1) CN1975574B (en)
TW (1) TW200720844A (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4564977B2 (en) * 2007-04-05 2010-10-20 東京応化工業株式会社 Photosensitive resin composition, method for producing resist pattern, laminate, and device
JP5137673B2 (en) * 2008-04-26 2013-02-06 日本化薬株式会社 Photosensitive resin composition for MEMS and cured product thereof

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4963462A (en) * 1990-01-08 1990-10-16 Hoechst Celanese Corporation Positive working, peel developable, color proofing system having two photosensitive layers
CA2187046A1 (en) * 1996-10-03 1998-04-03 Alain Vallee Sulfonylimides and sulfonylmethylides, use thereof as photoinitiators
JP4199958B2 (en) * 2002-06-03 2008-12-24 Ｊｓｒ株式会社 Radiation sensitive resin composition
JP2004139070A (en) * 2002-09-27 2004-05-13 Sumitomo Chem Co Ltd Radiation-sensitive resin composition
CN1501167A (en) * 2002-10-24 2004-06-02 住友化学工业株式会社 Radiation-sensitive resin composition
JP4148098B2 (en) * 2002-10-24 2008-09-10 住友化学株式会社 Radiation sensitive resin composition
TWI281095B (en) * 2002-11-01 2007-05-11 Sumitomo Chemical Co Radiation sensitive resin composition
US6777460B2 (en) * 2002-12-23 2004-08-17 3M Innovative Properties Company Curing agents for cationically curable compositions
TW200502682A (en) * 2003-03-25 2005-01-16 Sumitomo Chemical Co Process for forming hardened resin pattern
JP2005265866A (en) * 2003-03-25 2005-09-29 Sumitomo Chemical Co Ltd Method of forming hardening resin pattern

Also Published As

Publication number Publication date
KR20070056988A (en) 2007-06-04
JP2007148208A (en) 2007-06-14
CN1975574B (en) 2011-06-15
CN1975574A (en) 2007-06-06

Similar Documents

Publication Publication Date Title
EP2233521A4 (en) Rubber composition
EP1632534A3 (en) Curable resin composition, curable film and cured film
TW200710578A (en) Antireflective hardmask composition and methods for using same
IN2012DE02278A (en)
TW200632551A (en) A salt suitable for an acid generator and a chemically amplified resist composition containing the same
TW200626660A (en) Epoxy resin composition and semiconductor device
MX2015010754A (en) Anti-fouling compositions with a fluorinated oxyalkylene-containi ng polymer or oligomer.
EP2090594A4 (en) Actinic-energy-ray-curable water-based resin composition, actinic-energy-ray-curable coating material, method of forming cured coating film, and article
HK1142348A1 (en) Epoxy resin composition
WO2009060681A1 (en) Organic metal compound, composition for trapping moisture and oxygen, cured body, and organic el device
EP1826196A3 (en) Vinyl ether compounds
TW200706694A (en) Water-soluble preflux and use thereof
WO2012118684A3 (en) Silicone hydrogel contact lenses
WO2008123238A1 (en) Resin composition
TW200801062A (en) Epoxy resin molding material for sealing and device of electronic part
SG166764A1 (en) Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same
WO2008123237A1 (en) Epoxy resin composition
WO2006055232A3 (en) Organohydrogenpoly siloxane resin and silicon composition
TW200634432A (en) Photosensitive resin composition for interplayer insulating film
WO2009005135A1 (en) Curing agent for epoxy resin and curing agent composition for epoxy resin
ATE538178T1 (en) SILICONE HYDRGELS WITH AMINO SURFACE GROUPS
TW200640937A (en) Cyclic siloxane compound, material for si-containing film forming, and the use thereof
WO2008105398A1 (en) Cbp compound
TW200720844A (en) Radiosensitive resin composition
JP2004051995A5 (en)