CN1960606A - 一种多层柔性线路板真空层压干膜的方法 - Google Patents
一种多层柔性线路板真空层压干膜的方法 Download PDFInfo
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- CN1960606A CN1960606A CN 200510022030 CN200510022030A CN1960606A CN 1960606 A CN1960606 A CN 1960606A CN 200510022030 CN200510022030 CN 200510022030 CN 200510022030 A CN200510022030 A CN 200510022030A CN 1960606 A CN1960606 A CN 1960606A
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- circuit board
- dry film
- flexible circuit
- layer
- vacuum lamination
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Abstract
Description
实施例一 | 实施例二 | 比较例一 | 比较例二 | |
气泡比例 | 0% | 0% | 10.5% | 8.2% |
Claims (9)
Priority Applications (1)
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CNB2005100220303A CN100505992C (zh) | 2005-11-02 | 2005-11-02 | 一种多层柔性线路板真空层压干膜的方法 |
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CNB2005100220303A CN100505992C (zh) | 2005-11-02 | 2005-11-02 | 一种多层柔性线路板真空层压干膜的方法 |
Publications (2)
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CN1960606A true CN1960606A (zh) | 2007-05-09 |
CN100505992C CN100505992C (zh) | 2009-06-24 |
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CNB2005100220303A Active CN100505992C (zh) | 2005-11-02 | 2005-11-02 | 一种多层柔性线路板真空层压干膜的方法 |
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102196678A (zh) * | 2010-03-05 | 2011-09-21 | 龙宇电子(深圳)有限公司 | 一种印刷电路板高铜厚厚芯板压合工艺 |
US20130269985A1 (en) * | 2010-12-28 | 2013-10-17 | Mitsui Chemicals Tohcello, Inc. | Resin composition, and protective film, dry film, circuit board, and multilayer circuit board containing same |
US9656450B2 (en) | 2008-01-02 | 2017-05-23 | Tpk Touch Solutions, Inc. | Apparatus for laminating substrates |
CN110171180A (zh) * | 2019-04-23 | 2019-08-27 | 惠州华科技术研究院有限公司 | 电子产品组件气囊式层压夹具、层压装置及其防残气的层压方法 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
IT1250461B (it) * | 1991-08-09 | 1995-04-07 | Morton Int Inc | Procedimento ed apparecchio per applicare in modo continuo in particolare maschere di saldatura su pannelli di circuiti stampati. |
IT1313118B1 (it) * | 1999-08-25 | 2002-06-17 | Morton Int Inc | Apparecchiatura di applicazione a vuoto dotata di mezzi trasportatorie procedimento per applicare un resist a film secco ad un pannello |
-
2005
- 2005-11-02 CN CNB2005100220303A patent/CN100505992C/zh active Active
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9656450B2 (en) | 2008-01-02 | 2017-05-23 | Tpk Touch Solutions, Inc. | Apparatus for laminating substrates |
CN102196678A (zh) * | 2010-03-05 | 2011-09-21 | 龙宇电子(深圳)有限公司 | 一种印刷电路板高铜厚厚芯板压合工艺 |
US20130269985A1 (en) * | 2010-12-28 | 2013-10-17 | Mitsui Chemicals Tohcello, Inc. | Resin composition, and protective film, dry film, circuit board, and multilayer circuit board containing same |
US9408296B2 (en) * | 2010-12-28 | 2016-08-02 | Mitsui Chemicals Tohcello, Inc. | Resin composition, and protective film, dry film, circuit board, and multilayer circuit board containing same |
CN110171180A (zh) * | 2019-04-23 | 2019-08-27 | 惠州华科技术研究院有限公司 | 电子产品组件气囊式层压夹具、层压装置及其防残气的层压方法 |
CN110171180B (zh) * | 2019-04-23 | 2023-09-08 | 惠州华科技术研究院有限公司 | 电子产品组件气囊式层压夹具、层压装置及其防残气的层压方法 |
Also Published As
Publication number | Publication date |
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CN100505992C (zh) | 2009-06-24 |
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C06 | Publication | ||
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EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Shenzhen BYD Electronic Component Co., Ltd. Assignor: Biyadi Co., Ltd. Contract fulfillment period: 2008.4.25 to 2015.11.14 Contract record no.: 2008440000067 Denomination of invention: Vacuum and high-pressure method of drying film for multiple layers of flexible circuit board License type: Exclusive license Record date: 20080504 |
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Free format text: EXCLUSIVE LICENCE; TIME LIMIT OF IMPLEMENTING CONTACT: 2008.4.25 TO 2015.11.14 Name of requester: BIYADI ELECTRON MEMBER CO., LTD., SHENZHEN CITY Effective date: 20080504 |
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Owner name: SHENZHEN BYD ELECTRONIC COMPONENT CO., LTD. Free format text: FORMER OWNER: BIYADI CO., LTD. Effective date: 20150901 |
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Effective date of registration: 20150901 Address after: 518119 Guangdong province Shenzhen City Dapeng new Kwai town Yanan Road No. 1 building experimental Byd Co Patentee after: Shenzhen BYD Electronic Component Co., Ltd. Address before: Kwai Chung town Yanan Road, BYD Industrial Park in Longgang District of Shenzhen City, Guangdong province 518119 Patentee before: Biyadi Co., Ltd. |
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CP01 | Change in the name or title of a patent holder |
Address after: 518119 Guangdong province Shenzhen City Dapeng new Kwai town Yanan Road No. 1 building experimental Byd Co Patentee after: Shenzhen helitai photoelectric Co., Ltd Address before: 518119 Guangdong province Shenzhen City Dapeng new Kwai town Yanan Road No. 1 building experimental Byd Co Patentee before: SHENZHEN BYD ELECTRONIC COMPONENT Co.,Ltd. |
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