CN205755050U - 一种新型高密度互联印刷电路板 - Google Patents
一种新型高密度互联印刷电路板 Download PDFInfo
- Publication number
- CN205755050U CN205755050U CN201620701868.9U CN201620701868U CN205755050U CN 205755050 U CN205755050 U CN 205755050U CN 201620701868 U CN201620701868 U CN 201620701868U CN 205755050 U CN205755050 U CN 205755050U
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- Prior art keywords
- circuit board
- pcb
- fin
- adhesive tape
- double faced
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000002390 adhesive tape Substances 0.000 claims abstract description 26
- 239000010410 layer Substances 0.000 claims abstract description 20
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 18
- 239000000758 substrate Substances 0.000 claims abstract description 18
- 239000012790 adhesive layer Substances 0.000 claims abstract description 16
- 229910052802 copper Inorganic materials 0.000 claims abstract description 13
- 239000010949 copper Substances 0.000 claims abstract description 13
- 239000003292 glue Substances 0.000 claims description 2
- 230000017525 heat dissipation Effects 0.000 abstract description 3
- 230000009286 beneficial effect Effects 0.000 abstract 1
- 239000011889 copper foil Substances 0.000 description 6
- 239000000047 product Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 239000011265 semifinished product Substances 0.000 description 3
- 239000002253 acid Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 235000014593 oils and fats Nutrition 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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- Structure Of Printed Boards (AREA)
Abstract
Description
Claims (3)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201620701868.9U CN205755050U (zh) | 2016-07-06 | 2016-07-06 | 一种新型高密度互联印刷电路板 |
Applications Claiming Priority (1)
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CN201620701868.9U CN205755050U (zh) | 2016-07-06 | 2016-07-06 | 一种新型高密度互联印刷电路板 |
Publications (1)
Publication Number | Publication Date |
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CN205755050U true CN205755050U (zh) | 2016-11-30 |
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Family Applications (1)
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CN201620701868.9U Active CN205755050U (zh) | 2016-07-06 | 2016-07-06 | 一种新型高密度互联印刷电路板 |
Country Status (1)
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CN (1) | CN205755050U (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN117715393A (zh) * | 2024-02-05 | 2024-03-15 | 深圳市池纳光电有限公司 | 通过相变化材料进行z向热传导散热的手机及散热组件 |
-
2016
- 2016-07-06 CN CN201620701868.9U patent/CN205755050U/zh active Active
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN117715393A (zh) * | 2024-02-05 | 2024-03-15 | 深圳市池纳光电有限公司 | 通过相变化材料进行z向热传导散热的手机及散热组件 |
CN117715393B (zh) * | 2024-02-05 | 2024-04-26 | 深圳市池纳光电有限公司 | 通过相变化材料进行z向热传导散热的手机及散热组件 |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: Novel high -density interconnection printed circuit board Effective date of registration: 20181026 Granted publication date: 20161130 Pledgee: China Postal Savings Bank Limited by Share Ltd. Suining Sui branch Pledgor: SICHUAN HAIYING ELECTRONIC TECHNOLOGY Co.,Ltd. Registration number: 2018510000108 |
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PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
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Date of cancellation: 20201125 Granted publication date: 20161130 Pledgee: China Postal Savings Bank Limited by Share Ltd. Suining Sui branch Pledgor: SICHUAN HAIYING ELECTRONIC TECHNOLOGY Co.,Ltd. Registration number: 2018510000108 |
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PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: A new high density interconnection printed circuit board Effective date of registration: 20210127 Granted publication date: 20161130 Pledgee: Suining branch of Bank of China Ltd. Pledgor: SICHUAN HAIYING ELECTRONIC TECHNOLOGY Co.,Ltd. Registration number: Y2021980000674 |
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PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20220120 Granted publication date: 20161130 Pledgee: Suining branch of Bank of China Ltd. Pledgor: SICHUAN HAIYING ELECTRONIC TECHNOLOGY Co.,Ltd. Registration number: Y2021980000674 |
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PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: A new high density interconnected printed circuit board Effective date of registration: 20220402 Granted publication date: 20161130 Pledgee: Suining Fengfa Modern Agricultural Financing Guarantee Co.,Ltd. Pledgor: SICHUAN HAIYING ELECTRONIC TECHNOLOGY Co.,Ltd. Registration number: Y2022980003717 |
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PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
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Date of cancellation: 20221227 Granted publication date: 20161130 Pledgee: Suining Fengfa Modern Agricultural Financing Guarantee Co.,Ltd. Pledgor: SICHUAN HAIYING ELECTRONIC TECHNOLOGY Co.,Ltd. Registration number: Y2022980003717 |
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PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: A new type of high-density interconnection printed circuit board Effective date of registration: 20230105 Granted publication date: 20161130 Pledgee: Suining Fengfa Financing Guarantee Group Co.,Ltd. Pledgor: SICHUAN HAIYING ELECTRONIC TECHNOLOGY Co.,Ltd. Registration number: Y2022980029897 |
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PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Granted publication date: 20161130 Pledgee: Suining Fengfa Financing Guarantee Group Co.,Ltd. Pledgor: SICHUAN HAIYING ELECTRONIC TECHNOLOGY Co.,Ltd. Registration number: Y2022980029897 |
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PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: A New Type of High Density Interconnected Printed Circuit Board Granted publication date: 20161130 Pledgee: Suining Fengfa Financing Guarantee Group Co.,Ltd. Pledgor: SICHUAN HAIYING ELECTRONIC TECHNOLOGY Co.,Ltd. Registration number: Y2024980001767 |