CN205755051U - 一种新型高导热电路板 - Google Patents
一种新型高导热电路板 Download PDFInfo
- Publication number
- CN205755051U CN205755051U CN201620701869.3U CN201620701869U CN205755051U CN 205755051 U CN205755051 U CN 205755051U CN 201620701869 U CN201620701869 U CN 201620701869U CN 205755051 U CN205755051 U CN 205755051U
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- Prior art keywords
- circuit substrate
- circuit board
- fin
- groove
- adhesive layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000010410 layer Substances 0.000 claims abstract description 26
- 239000000758 substrate Substances 0.000 claims abstract description 26
- 239000003292 glue Substances 0.000 claims abstract description 19
- 239000012790 adhesive layer Substances 0.000 claims abstract description 16
- 230000005855 radiation Effects 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 5
- 230000017525 heat dissipation Effects 0.000 abstract description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 230000009286 beneficial effect Effects 0.000 abstract 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 9
- 239000011889 copper foil Substances 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 4
- 239000010949 copper Substances 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 241001311547 Patina Species 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 230000001166 anti-perspirative effect Effects 0.000 description 1
- 239000003213 antiperspirant Substances 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 235000014593 oils and fats Nutrition 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000036647 reaction Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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Abstract
Description
Claims (3)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620701869.3U CN205755051U (zh) | 2016-07-06 | 2016-07-06 | 一种新型高导热电路板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620701869.3U CN205755051U (zh) | 2016-07-06 | 2016-07-06 | 一种新型高导热电路板 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205755051U true CN205755051U (zh) | 2016-11-30 |
Family
ID=57380776
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620701869.3U Active CN205755051U (zh) | 2016-07-06 | 2016-07-06 | 一种新型高导热电路板 |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205755051U (zh) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111601467A (zh) * | 2020-07-02 | 2020-08-28 | 遂宁市海翔电子科技有限公司 | 一种高散热5g电路板的精密制作方法 |
| CN111683475A (zh) * | 2020-06-29 | 2020-09-18 | 四川海英电子科技有限公司 | 一种复合式高频电路板的生产方法 |
-
2016
- 2016-07-06 CN CN201620701869.3U patent/CN205755051U/zh active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111683475A (zh) * | 2020-06-29 | 2020-09-18 | 四川海英电子科技有限公司 | 一种复合式高频电路板的生产方法 |
| CN111601467A (zh) * | 2020-07-02 | 2020-08-28 | 遂宁市海翔电子科技有限公司 | 一种高散热5g电路板的精密制作方法 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: Novel high heat conduction circuit board Effective date of registration: 20181026 Granted publication date: 20161130 Pledgee: China Postal Savings Bank Limited by Share Ltd. Suining Sui branch Pledgor: SICHUAN HAIYING ELECTRONIC TECHNOLOGY Co.,Ltd. Registration number: 2018510000108 |
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| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20201125 Granted publication date: 20161130 Pledgee: China Postal Savings Bank Limited by Share Ltd. Suining Sui branch Pledgor: SICHUAN HAIYING ELECTRONIC TECHNOLOGY Co.,Ltd. Registration number: 2018510000108 |
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| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: A new type of high thermal conductivity circuit board Effective date of registration: 20210127 Granted publication date: 20161130 Pledgee: Suining branch of Bank of China Ltd. Pledgor: SICHUAN HAIYING ELECTRONIC TECHNOLOGY Co.,Ltd. Registration number: Y2021980000674 |
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| PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20220120 Granted publication date: 20161130 Pledgee: Suining branch of Bank of China Ltd. Pledgor: SICHUAN HAIYING ELECTRONIC TECHNOLOGY Co.,Ltd. Registration number: Y2021980000674 |
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| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: A new type of high thermal conductivity circuit board Effective date of registration: 20220402 Granted publication date: 20161130 Pledgee: Suining Fengfa Modern Agricultural Financing Guarantee Co.,Ltd. Pledgor: SICHUAN HAIYING ELECTRONIC TECHNOLOGY Co.,Ltd. Registration number: Y2022980003717 |
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| PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20221227 Granted publication date: 20161130 Pledgee: Suining Fengfa Modern Agricultural Financing Guarantee Co.,Ltd. Pledgor: SICHUAN HAIYING ELECTRONIC TECHNOLOGY Co.,Ltd. Registration number: Y2022980003717 |
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| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: A new type of high thermal conductivity circuit board Effective date of registration: 20230105 Granted publication date: 20161130 Pledgee: Suining Fengfa Financing Guarantee Group Co.,Ltd. Pledgor: SICHUAN HAIYING ELECTRONIC TECHNOLOGY Co.,Ltd. Registration number: Y2022980029897 |
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| PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Granted publication date: 20161130 Pledgee: Suining Fengfa Financing Guarantee Group Co.,Ltd. Pledgor: SICHUAN HAIYING ELECTRONIC TECHNOLOGY Co.,Ltd. Registration number: Y2022980029897 |
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| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: A new type of high thermal conductivity circuit board Granted publication date: 20161130 Pledgee: Suining Fengfa Financing Guarantee Group Co.,Ltd. Pledgor: SICHUAN HAIYING ELECTRONIC TECHNOLOGY Co.,Ltd. Registration number: Y2024980001767 |