CN1956232A - 磷光板和具有该磷光板的发光装置 - Google Patents

磷光板和具有该磷光板的发光装置 Download PDF

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Publication number
CN1956232A
CN1956232A CN200610150797.9A CN200610150797A CN1956232A CN 1956232 A CN1956232 A CN 1956232A CN 200610150797 A CN200610150797 A CN 200610150797A CN 1956232 A CN1956232 A CN 1956232A
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CN
China
Prior art keywords
light
phosphor
phosphor plate
container
led element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN200610150797.9A
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English (en)
Chinese (zh)
Inventor
林稔真
加藤英昭
川口洋明
成田巧
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyoda Gosei Co Ltd
Original Assignee
Toyoda Gosei Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyoda Gosei Co Ltd filed Critical Toyoda Gosei Co Ltd
Publication of CN1956232A publication Critical patent/CN1956232A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8511—Wavelength conversion means characterised by their material, e.g. binder
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/49105—Connecting at different heights
    • H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/882—Scattering means

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  • Led Device Packages (AREA)
  • Led Devices (AREA)
CN200610150797.9A 2005-10-26 2006-10-26 磷光板和具有该磷光板的发光装置 Pending CN1956232A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005311624A JP2007123438A (ja) 2005-10-26 2005-10-26 蛍光体板及びこれを備えた発光装置
JP2005311624 2005-10-26

Publications (1)

Publication Number Publication Date
CN1956232A true CN1956232A (zh) 2007-05-02

Family

ID=38063420

Family Applications (1)

Application Number Title Priority Date Filing Date
CN200610150797.9A Pending CN1956232A (zh) 2005-10-26 2006-10-26 磷光板和具有该磷光板的发光装置

Country Status (3)

Country Link
US (1) US20070120463A1 (enExample)
JP (1) JP2007123438A (enExample)
CN (1) CN1956232A (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009105923A1 (zh) * 2008-02-25 2009-09-03 鹤山丽得电子实业有限公司 一种发光二极管器件的制造方法
CN101997077A (zh) * 2009-08-07 2011-03-30 株式会社小糸制作所 发光模块
CN101689588B (zh) * 2007-06-18 2012-11-07 吉可多公司 固态照明设备
CN109618560A (zh) * 2015-12-18 2019-04-12 弗劳恩霍夫应用研究促进协会 用于由初级光产生次级光的转换器、包括这种转换器的照明装置以及用于制造所述转换器和照明装置的方法

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JP5073946B2 (ja) * 2005-12-27 2012-11-14 新光電気工業株式会社 半導体装置および半導体装置の製造方法
JP2008306013A (ja) * 2007-06-08 2008-12-18 Ushio Inc 照明装置
KR100880638B1 (ko) * 2007-07-06 2009-01-30 엘지전자 주식회사 발광 소자 패키지
KR100882204B1 (ko) 2007-08-08 2009-02-06 (주) 아모엘이디 반도체 패키지
US8118447B2 (en) 2007-12-20 2012-02-21 Altair Engineering, Inc. LED lighting apparatus with swivel connection
KR20100128336A (ko) * 2008-03-21 2010-12-07 나노그램 코포레이션 금속 규소 질화물 또는 금속 규소 산질화물 서브미크론 인광체 입자 및 이들 인광체의 합성 방법
JP5173663B2 (ja) * 2008-08-07 2013-04-03 オリンパス株式会社 光源装置およびこれを用いた内視鏡装置
US8653984B2 (en) 2008-10-24 2014-02-18 Ilumisys, Inc. Integration of LED lighting control with emergency notification systems
US8324817B2 (en) 2008-10-24 2012-12-04 Ilumisys, Inc. Light and light sensor
US8901823B2 (en) 2008-10-24 2014-12-02 Ilumisys, Inc. Light and light sensor
US7938562B2 (en) 2008-10-24 2011-05-10 Altair Engineering, Inc. Lighting including integral communication apparatus
US8214084B2 (en) 2008-10-24 2012-07-03 Ilumisys, Inc. Integration of LED lighting with building controls
US7928655B2 (en) * 2008-11-10 2011-04-19 Visera Technologies Company Limited Light-emitting diode device and method for fabricating the same
US20100127289A1 (en) * 2008-11-26 2010-05-27 Bridgelux, Inc. Method and Apparatus for Providing LED Package with Controlled Color Temperature
JP5327601B2 (ja) 2008-12-12 2013-10-30 東芝ライテック株式会社 発光モジュールおよび照明装置
US20100186066A1 (en) * 2009-01-20 2010-07-22 Pollard Stephen M Methods and systems for facilitating personal data propagation
US8296323B2 (en) * 2009-01-20 2012-10-23 Titanium Fire Ltd. Personal data subscriber systems and methods
CA2765199A1 (en) * 2009-06-23 2011-01-13 Altair Engineering, Inc. Led lamp with a wavelength converting layer
US8258524B2 (en) * 2010-01-26 2012-09-04 Sharp Kabushiki Kaisha Light emitting diode device
WO2011119958A1 (en) 2010-03-26 2011-09-29 Altair Engineering, Inc. Inside-out led bulb
WO2011119921A2 (en) 2010-03-26 2011-09-29 Altair Engineering, Inc. Led light with thermoelectric generator
DE102010034913B4 (de) 2010-08-20 2023-03-30 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Strahlung emittierendes Bauelement und Verfahren zur Herstellung des Strahlung emittierenden Bauelements
TWI449866B (zh) * 2010-09-30 2014-08-21 Hon Hai Prec Ind Co Ltd Led照明裝置
EP2633227B1 (en) 2010-10-29 2018-08-29 iLumisys, Inc. Mechanisms for reducing risk of shock during installation of light tube
US8901578B2 (en) * 2011-05-10 2014-12-02 Rohm Co., Ltd. LED module having LED chips as light source
WO2013131002A1 (en) 2012-03-02 2013-09-06 Ilumisys, Inc. Electrical connector header for an led-based light
TWM443813U (en) * 2012-03-06 2012-12-21 Winsky Technology Ltd Illumination device
US9163794B2 (en) 2012-07-06 2015-10-20 Ilumisys, Inc. Power supply assembly for LED-based light tube
US9271367B2 (en) 2012-07-09 2016-02-23 Ilumisys, Inc. System and method for controlling operation of an LED-based light
JP6040019B2 (ja) * 2012-12-10 2016-12-07 スタンレー電気株式会社 半導体発光装置
US10125971B2 (en) * 2013-02-19 2018-11-13 Michael Graziano LED lamp integrated to electric fan
US9285084B2 (en) 2013-03-14 2016-03-15 Ilumisys, Inc. Diffusers for LED-based lights
US9267650B2 (en) 2013-10-09 2016-02-23 Ilumisys, Inc. Lens for an LED-based light
CA2937642A1 (en) 2014-01-22 2015-07-30 Ilumisys, Inc. Led-based light with addressed leds
US9510400B2 (en) 2014-05-13 2016-11-29 Ilumisys, Inc. User input systems for an LED-based light
US9892944B2 (en) 2016-06-23 2018-02-13 Sharp Kabushiki Kaisha Diodes offering asymmetric stability during fluidic assembly
US9985190B2 (en) 2016-05-18 2018-05-29 eLux Inc. Formation and structure of post enhanced diodes for orientation control
US9917226B1 (en) 2016-09-15 2018-03-13 Sharp Kabushiki Kaisha Substrate features for enhanced fluidic assembly of electronic devices
US9755110B1 (en) 2016-07-27 2017-09-05 Sharp Laboratories Of America, Inc. Substrate with topological features for steering fluidic assembly LED disks
US10249599B2 (en) 2016-06-29 2019-04-02 eLux, Inc. Laminated printed color conversion phosphor sheets
US10161568B2 (en) 2015-06-01 2018-12-25 Ilumisys, Inc. LED-based light with canted outer walls
US9627437B1 (en) 2016-06-30 2017-04-18 Sharp Laboratories Of America, Inc. Patterned phosphors in through hole via (THV) glass
US10243097B2 (en) 2016-09-09 2019-03-26 eLux Inc. Fluidic assembly using tunable suspension flow
US9837390B1 (en) 2016-11-07 2017-12-05 Corning Incorporated Systems and methods for creating fluidic assembly structures on a substrate

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6635363B1 (en) * 2000-08-21 2003-10-21 General Electric Company Phosphor coating with self-adjusting distance from LED chip
US20020084745A1 (en) * 2000-12-29 2002-07-04 Airma Optoelectronics Corporation Light emitting diode with light conversion by dielectric phosphor powder

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101689588B (zh) * 2007-06-18 2012-11-07 吉可多公司 固态照明设备
WO2009105923A1 (zh) * 2008-02-25 2009-09-03 鹤山丽得电子实业有限公司 一种发光二极管器件的制造方法
CN101997077A (zh) * 2009-08-07 2011-03-30 株式会社小糸制作所 发光模块
CN101997077B (zh) * 2009-08-07 2014-06-11 株式会社小糸制作所 发光模块
CN109618560A (zh) * 2015-12-18 2019-04-12 弗劳恩霍夫应用研究促进协会 用于由初级光产生次级光的转换器、包括这种转换器的照明装置以及用于制造所述转换器和照明装置的方法

Also Published As

Publication number Publication date
JP2007123438A (ja) 2007-05-17
US20070120463A1 (en) 2007-05-31

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