CN1956157A - 形成引脚模块阵列封装的方法 - Google Patents

形成引脚模块阵列封装的方法 Download PDF

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Publication number
CN1956157A
CN1956157A CNA200610142387XA CN200610142387A CN1956157A CN 1956157 A CN1956157 A CN 1956157A CN A200610142387X A CNA200610142387X A CN A200610142387XA CN 200610142387 A CN200610142387 A CN 200610142387A CN 1956157 A CN1956157 A CN 1956157A
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China
Prior art keywords
pin
nead frame
assembling
conductive pin
frame assembling
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CNA200610142387XA
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CN100576477C (zh
Inventor
威廉·F·博格奥特
弗朗西斯·J·卡尔尼
乔斯弗·K·弗蒂
詹姆斯·P·莱特曼
杰·A·尤德
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Semiconductor Components Industries LLC
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Semiconductor Components Industries LLC
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Abstract

一种用于形成有引脚模块阵列封装的方法，在一种实施方案中，包括将引脚框架装配放置到具有引脚腔的成型装置中。该方法还包括在引脚框架装配中的导电引脚和引脚腔之间形成密封，以及灌封引脚框架装配以形成模块阵列装配。然后，将模块阵列装配分离成单独的有引脚模块封装。

Description

形成引脚模块阵列封装的方法
技术领域
本发明一般地涉及电子设备，更特别地涉及半导体封装和装配方法。
背景技术
在便携式电子的小型化中手持消费产品市场迅速发展。目前在蜂窝式电话和数字助理市场的驱动下，这些设备的制造商受到不断缩小的格式和对更像PC的功能性的要求的挑战。这一挑战断定表面安装元件制造商设计他们的产品以支配可能的最小区域的压力。这样，这允许便携式电子设计者将另外的功能包含在设备中而不增加整体产品尺寸。
在芯片级封装(CSP)技术中，制造商努力使封装尺寸尽可能接近半导体芯片的尺寸。无引脚四方扁平封装(QFN)是被广泛接受和使用的低成本芯片级封装的例子。QFN平台是成本合算的，因为平台使用高自动化装配设备和模块阵列封装(MAP)灌封工艺。但是，因为QFN是无引脚的，在将QFN器件粘附到下一级装配如印刷电路板之后，制造商不能执行接线的可见检查。这可能导致具有可靠性问题的最终产品。另外，现有的有引脚CSP技术如小型IC(SOIC)平台的制造比QFN平台更昂贵，并且它们与MAP装配技术不兼容。
因此，需要制造成本合算并与MAP装配技术兼容的有引脚封装的结构和方法。
附图说明
图1说明在制造的中间步骤的根据本发明的引脚框架装配的局部顶视图；
图2说明在后继形成模块阵列装配的处理之后图1的引脚框架装配的局部顶视图；
图3说明在进一步处理之后图2的模块阵列装配的一部分的局部顶视图；
图4说明根据本发明的半导体封装的顶视图；
图5说明图4的半导体封装的横截面侧视图；
图6说明根据本发明的另一种半导体封装的横截面侧视图；
图7说明用于形成有引脚模块阵列封装的根据本发明的制造装置的局部横截面视图；
图8说明图7的制造装置的一部分的局部顶视图；
图9说明沿着图8中的参考线9-9获取的图7的制造装置的一部分的局部横截面端视图；
图10说明在后继步骤中图9的制造装置的一部分的局部横截面端视图；
图11说明具有根据本发明的可选引脚框架装配的图7的制造装置的局部横截面视图；
图12说明根据本发明的用于形成模块封装的另一种制造装置的局部横截面视图；
图13说明图12的制造装置的一部分的局部顶视图；
图14说明图12的制造装置的一部分的局部底视图；以及
图15说明图12的制造装置的另一部分的局部横截面视图。
具体实施方式
为了容易理解，附图中的元素不一定按比例画出，并且贯穿各个图在适当的地方使用相似的元素编号来表示相同或相似的元素。
图1显示在制造的中间阶段的根据本发明的主引脚框架装配10。引脚框架装配10包括条或列引脚框架11。在一种实施方案中，条引脚框架11基本上是扁平结构，并包括单规格化学研磨或冲压的材料片如铜合金(例如，TOMAC 4，TAMAC 5，2ZFROFC或CDA194)，镀铁/镍合金的铜(例如镀合金42的铜)、镀铝的铜、镀塑料的铜等。电镀材料包括铜、银或多层电镀如镍钯和金。配置条引脚框架11例如与标准QFN封装装配工具兼容。
条引脚框架11还包括细长的标记板或芯片附着板12，它们与横栏14构成整体。在一种实施方案中，横栏14与彼此隔开并彼此基本平行的标记板12的端部垂直。长条16的引脚支撑结构形成并置于伸长的标记板12之间，并且包括布置在细长标记板12附近的多个导电引脚17。在一种实施方案中，导电引脚17和引脚支撑长条16形成“梳状”形状或结构，其中导电引脚17相对于细长标记板12基本垂直。
在一种实施方案中(例如，在图5中显示)，导电引脚17和细长标记板12相对于彼此不偏离，而是基本上共面，或尽可能平坦。在另一种实施方案中，它们相对于彼此偏离，例如在图6和图11中显示。在另一种实施方案中，导电引脚17形状上是矩形，但是它们可以具有跟选定印刷电路板或下一级装配版图兼容的其他形状。在又一种实施方案中，导电引脚17包括为连接结构提供增大的表面积的接合柱。
引脚框架装配10还包括使用附着层25(如图5中所示)如焊料或高导电率环氧材料附着到细长标记板12的多个电子芯片18和19。作为例子，电子芯片18和19包括功率MOSFET、双极功率晶体管、绝缘栅双极晶体管、晶闸管、二极管、传感器、被动器件、光学器件、集成电路、逻辑器件、存储器件，或它们的组合。如图1中所示，细长标记板12提供具有不同尺寸的电子芯片，这提供增加的制造灵活性并且节省成本，因为相同的引脚框架可以用来制造不同类型的器件。在一种实施方案中，导电引脚17之间的间距是恒定的。
连接结构21将电子芯片18和19电连接到导电引脚17。作为例子，连接结构21包括连接线210(图5中所示)、线焊、导电夹或带211(图5中所示)等。当使用夹或带时，焊料或导电环氧树脂适合于将夹或带粘附到引脚17以及电子芯片18和19上。
图2显示在用塑料灌封层23灌封结构的一部分之后主引脚框架装配10的顶视图。在所示的例子中，在细长标记板12、导电结构21、电子芯片18和19，以及细长标记板12附近的导电引脚17部分之上形成灌封层23的地方使用条模块阵列工艺。作为例子，将装配结构10放置到成型装置如转移成型设备中。将固态树脂球放置到锅24中。当加热锅24以熔化固态树脂球时，促使液化树脂材料从锅24中通过流槽26进入槽型腔中，以形成连续灌封层或灌封层23，同时保留引脚17的一部分和引脚支撑长条16暴露或不灌封，从而形成模块阵列装配28。
图3显示在制造的下一步骤期间模块阵列装配28的一部分的顶视图。在该步骤中，使用锯切割、激光切割或类似技术将各个部件从模块阵列装配28中分割或分离。作为例子，分割线31是第一或水平切割线，在那里分割装置切割过灌封层23和细长标记板12。分割线32是第二或垂直切割线，在那里分割装置切割过导电引脚17和横栏14。
图4显示根据本发明的具有暴露的或向外延伸的导电引脚17的半导体封装34的顶视图。在一种实施方案中，如图5中封装34的横截面侧视图中所示的，导电引脚17从灌封部分23从封装34的底面36向外延伸。根据本发明，封装36包括模块侧面38，它们对应于向外延伸出导电引脚的侧面，并且在灌封过程中用成型结构形成。封装34还包括在分割、切割或分离过程中形成的分割或切割侧面39(图4中所示)。如图所示暴露导电引脚17和细长标记板12的底面170和120，以便连结或连结到下一级装配。
图6显示根据本发明的可选封装44的横截面侧视图。封装44跟封装34类似，除了细长标记板12相对于导电引脚17偏离，使得灌封层23覆盖细长标记板12的底面120。另外，在任意的引脚成形工艺之后显示导电引脚17，该工艺将它们弯曲成期望形状，例如所示的“鸥翼”形。如图6中所示，暴露导电引脚17的底面170。
根据本发明，条引脚框架11不提供、没有，或不依赖环氧塑封坝条以避免必须使用作为装配工艺一部分的昂贵冲压工具。但是，需要方法和成型结构形成封装34和44，而不在灌封工艺过程中在导电引脚17之间形成灌封材料或闪标(flash)。图7-11显示根据本发明的用于制造具有无坝条引脚框架的有引脚封装例如但不限于封装34和44的工艺和结构。
图7显示根据本发明的用于形成有引脚模块阵列封装的成型装置71的横截面和侧视图。在一种实施方案中，装置71用来槽成型或灌封图2中所示的引脚框架装配10。装置71包括顶成型模具72和具有空腔的底成型模具73。在该实施方案中，将引脚框架装配10放置在底成型模具73中，使得引脚框架11的部分177在底成型模具73的上表面或平面75上方延伸。将在下面更详细地说明，使用例如变细、成形或变窄的引脚腔来实现这点。另外，在该实施方案中，将电子芯片18放置成将电子芯片18和连接结构21放置在空腔76内的芯片向下配置。
底成形模具73还包括用于支撑导电引脚17的多个半嵌入引脚腔、沟道或部分77。根据本发明，沟道77收窄、成形或变细，使得导电引脚77的部分177最初在主表面75上方延伸。结果，当使顶成型模具72接触底成型模具73时，将引脚17的柔软或易弯部分夹入引脚腔77中。这形成密封，防止在成型过程中导电引脚17之间的灌封材料23的流动。
图8是底成型模具73的一部分的顶视图，其显示引脚腔77和放置在引脚腔77中的导电引脚17。根据本发明，使引脚腔77变细、收窄或具有与导电引脚17形成密封81的形状，以防止灌封材料23在导电引脚17之间的流动。作为例子，引脚腔77显示为具有变细或收窄的部分772，其具有比导电引脚17的宽度小的宽度。引脚腔77还包括例如比导电引脚17宽的变宽部分771。
图9是沿着图8的参考线9-9获取的装置71的局部横截面端视图，其显示了具有在底成型模具73的主表面75上方的部分177的导电引脚17。图9还显示具有这样形状的引脚腔77，该形状具有基本上形成跟导电引脚17的密封81的变细部分772。
图10显示在将顶成型模块72放置成与底成型模块73接触之后的图9看到的装置71，它将导电引脚17的一部分夹入引脚腔77中以形成密封81。也就是，成型装置71关闭，由此将导电引脚17推入到导电腔77中以在导电引脚17和引脚腔77之间形成密封81。例如通过选择导电引脚17的柔软材料实现这点。换句话说，导电引脚17由具有比顶成型模具72和底成型模具73小的硬度的材料制成。根据本发明，这用来防止灌封材料在导电引脚17之间的流动并消除对于引脚框架11上的环氧塑封坝条的需要。这节省材料成本并消除对于在成型之后使用昂贵的冲压工具去除坝条的需要。
图11是具有可选引脚框架111的装置71的横截面视图。引脚框架111跟引脚框架11类似，除了标记板12跟导电引脚17偏离距离110之外。偏离110提供例如图6中所示的封装结构44，其中标记板12被灌封或不暴露。
现在转向图12-15，描述了根据本发明的、不使用具有环氧塑封坝条的引脚框架的、在封装的多于两个侧面上具有引脚的用于形成单腔模块封装的结构和方法。图12显示成型装置271的一部分的横截面视图，它包括顶成型模具272、底成型模具273，以及成型板274。在一种实施方案中，底成型模具273具有用于保持引脚框架阵列281的单腔276。引脚框架阵列281包括用于支撑电子芯片289的多个标记板212以及在标记板212附近的多个导电引脚217。使用导电结构221如连接线、夹、带等将电子芯片289电连接到导电引脚217。
顶成型模具272显示为具有用于将树脂成型复合物或成型材料注入装置271中的开口或开孔372。成型板274包括根据最终产品的期望外形或形状成形的腔376。模型板274还包括用于允许树脂成型复合物流入腔376中的开口或开孔374。成型板274还包括多个引脚腔、切口或沟道377，它们在成型工艺过程中成形、收窄或变细以形成密封或夹紧导电引脚217的一部分。
图13显示结合图12描述的、在底成型模块273中形成的、用于保持具有多个标记板212、多个导电引脚217和多个电子芯片289的引脚框架阵列281的腔276的局部顶视图。虚线131表示对应于成型板274的腔376的形状的灌封层或成型钝化层的外形的例子。
图14是成型板274的局部底视图，其显示其中放置、密封或夹住导电引脚217的引脚腔377。引脚腔377具有例如变细部分872，当成型板274和导电引脚217之间进行接触时其形成跟导电引脚217的密封881。导电引脚217包含柔软材料如铜等或具有比成型板274包含的材料小的硬度的材料，并且被夹进或推进变细部分872，以便当成型装置271关闭时像所示那样在导电引脚217和引脚腔377之间形成密封881。
图15显示加上了顶成型模具272和底成型模具273的沿着图14中的参考线15-15的局部横截面视图，并显示了夹进引脚腔377中形成密封881的导电引脚217的例子。这防止树脂成型复合物在导电引脚217之间流动，并消除对于环氧成型坝条的需要。
因此，显然地，根据本发明已提供了使用不依赖于环氧成型坝条的引脚框架形成有引脚模块阵列封装的结构和方法。该方法和结构提供成本合算的有引脚模块阵列封装，并且为制造商提供当把封装附着到下一级装配时检查接合完整度的期望能力。
虽然已参考具体实施方案描述本发明，但并不打算将本发明局限于这些示例实施方案。

Claims (10)

1.一种用于形成有引脚模块阵列封装器件的方法，包括步骤：
提供引脚框架装配，它具有多个标记板部分、与该多个标记板部分间隔开的多个引脚，以及附着到该多个标记板部分并电连接到该多个导电引脚的多个电子芯片，其中该引脚框架装配不依赖于坝条；
将引脚框架装配放置到包括用来形成跟该多个引脚的密封的引脚腔的成型装置中；
形成多个引脚跟引脚腔的密封；
用灌封材料灌封该引脚框架装配，其中所述密封防止了灌封材料在引脚之间流动，从而形成模块阵列装配；以及
分割模块阵列装配以形成各个有引脚模块阵列封装，其中该有引脚模块阵列封装具有从有引脚模块阵列封装的侧面向外延伸的引脚。
2.根据权利要求1的方法，其中将引脚框架装配放置到成型装置中的步骤包括将引脚框架装配放置到具有包括腔和引脚腔的底成型模具的成型装置中，其中放置步骤还包括将引脚框架装配放置到底成型模具中，使得电子芯片处于底成型模具的腔中。
3.根据权利要求1的方法，其中将引脚框架装配放置到成型装置中的步骤包括将引脚框架装配放置到具有包含单个底腔的底成型模具、包含成型腔和引脚腔的成型板的成型装置中，并且其中放置步骤还包括放置引脚框架装配使得电子芯片处于成型腔中。
4.根据权利要求1的方法，其中分割步骤包括通过该多个标记板和该多个引脚的部分来分离模块阵列装配。
5.根据权利要求1的方法，其中将引脚框架装配放置到成型装置中的步骤包括将引脚框架装配放置到成型装置中，其中引脚腔包括具有比该多个引脚的宽度小的宽度的变细部分。
6.一种用于形成模块封装的工艺，包括步骤：
提供具有导电引脚的引脚框架装配，其中该引脚框架装配没有成型坝条；
将该引脚框架装配放置到具有变细的引脚腔的成型装置中，其中将导电引脚放置成跟变细的引脚腔有间距；
在变细的引脚腔和导电引脚之间形成密封；
灌封该引脚框架装配，由此所述密封防止灌封材料在相邻导电引脚之间流动，从而形成模块引脚框架装配；以及
分离该模块引脚框架装配，由此形成各个单独的有引脚模块封装。
7.根据权利要求6的工艺，其中提供引脚框架装配的步骤包括提供具有跟导电引脚基本上共面的标记板部分的引脚框架装配。
8.根据权利要求6的工艺，其中提供引脚框架装配的步骤包括提供具有跟导电引脚偏离一定距离的标记板部分的引脚框架装配。
9.一种用于形成有引脚模块阵列封装的方法，包括步骤：
将具有导电引脚、具有附着到其上并电连接到导电引脚的电子芯片的标记板部分的引脚框架装配放置到具有用来防止灌封材料在相邻导电引脚之间流动的多个引脚沟道的成型装置中，其中引脚框架装配没有坝条；
将导电引脚夹进引脚沟道中；
成型引脚框架装配的一部分，同时保留导电引脚的一部分暴露，以形成模块引脚框架装配；以及
将模块引脚框架装配分割成各个单独的有引脚模块阵列封装。
10.根据权利要求9的方法，其中夹进步骤包括步骤：
将导电引脚放置到具有比导电引脚宽度小的宽度的变细部分的引脚沟道中；以及
关闭成型装置以将导电引脚推进变细的部分中，由此在导电引脚和引脚沟道之间形成密封。
CN200610142387A 2005-10-28 2006-10-11 形成引脚模块阵列封装的方法 Expired - Fee Related CN100576477C (zh)

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