CN1940452A - 热管封口方法 - Google Patents

热管封口方法 Download PDF

Info

Publication number
CN1940452A
CN1940452A CNA200510100113XA CN200510100113A CN1940452A CN 1940452 A CN1940452 A CN 1940452A CN A200510100113X A CNA200510100113X A CN A200510100113XA CN 200510100113 A CN200510100113 A CN 200510100113A CN 1940452 A CN1940452 A CN 1940452A
Authority
CN
China
Prior art keywords
flat
folder
molds
heat pipe
section
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA200510100113XA
Other languages
English (en)
Inventor
侯春树
童兆年
刘泰健
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuzhun Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
Original Assignee
Fuzhun Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuzhun Precision Industry Shenzhen Co Ltd, Hon Hai Precision Industry Co Ltd filed Critical Fuzhun Precision Industry Shenzhen Co Ltd
Priority to CNA200510100113XA priority Critical patent/CN1940452A/zh
Priority to US11/308,863 priority patent/US7467466B2/en
Publication of CN1940452A publication Critical patent/CN1940452A/zh
Pending legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P15/00—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
    • B23P15/26—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass heat exchangers or the like
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0283—Means for filling or sealing heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks
    • H01L21/4882—Assembly of heatsink parts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P2700/00—Indexing scheme relating to the articles being treated, e.g. manufactured, repaired, assembled, connected or other operations covered in the subgroups
    • B23P2700/09—Heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making
    • Y10T29/49353—Heat pipe device making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making
    • Y10T29/49391—Tube making or reforming
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making
    • Y10T29/49393—Heat exchanger or boiler making with metallurgical bonding
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49826—Assembling or joining
    • Y10T29/49908—Joining by deforming

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Thermal Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Engineering & Computer Science (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)

Abstract

一种热管封口方法，具体步骤可总结为：提供一具有开口端的管体，将该管体固定；利用第一夹扁模具组及第二夹扁模具组作用于管体外表面，将管体开口端夹扁铆合，且第一夹扁模具组位于开口端端部，第二夹扁模具组与第一夹扁模具组相邻而位于临近管体中部的一侧；将管体夹扁段多余部分切除形成封口段；第一夹扁模具组先行离开管体，第二夹扁模具组继续夹持管体夹扁段；焊接封口段；第二夹扁模具组离开管体。本发明热管封口方法利用第一、第二夹扁模具组分段夹扁管体，且焊接时第二夹扁模具组继续夹持管体夹扁段可防止金属产生局部回弹现象，确保热管内保持较高的真空度。

Description

热管封口方法
【技术领域】
本发明涉及一种热管封口方法。
【背景技术】
传统的热管制造方法主要包括缩管、形成毛细结构、焊尾端、注水、抽真空、夹扁、切断、焊接...等繁复制程。
热管内的真空度直接影响相变潜热的响应温度大小，而热管封口的方式、时机及机构将主导热管的品质、可靠度及其使用寿命。请参阅图1，为现有技术中的热管封口过程，该夹扁方式是一次性的，以一组设计成特殊形状的封口模具2直接以机械力作用于热管4靠向一端的外表面，达到机械性接合后，再经过下一制程沾锡或焊接处理。请再参阅图2及图3，由基本物理作用力与反作用力得知金属受压产生塑性变形后会产生局部回弹现象，此时封口42处将有微裂缝422产生而导致封口42处漏率(即单位时间内流过漏孔(包括间隙)的气体量)增加，大气将由此微裂缝422进入热管4内，造成热管4内部真空度下降，热管4性能降低。在热管4使用寿命内，其内压力应维持在容许的压力以下，若漏率较大将导致热管4内压力快速升高，使热管4的使用寿命缩短。因此，有所谓的多功能性制程的开发，将注水、抽真空、夹扁、切断、焊接等制程合成一工站，在最短时间内将热管完成封口动作，此方式虽然可以改善现行制程真空度不易控制的缺点，但仍然无法完全有效得到最佳的真空度控制。其主要原因是在焊接前经铆合的热管因为金属的塑性变形回弹效应而使封口处漏率增加，气体仍有可能循此路径回到热管内，而破坏其真空度，因此难以制得高端性能的热管。
【发明内容】
有鉴于此，有必要提供一种热管封口方法，以确保热管内保持较高的真空度，提升热管的可靠性。
一种热管封口方法，具体步骤可总结为：提供一具有开口端的管体，并将该管体固定；利用第一夹扁模具组及第二夹扁模具组作用于管体外表面，将管体开口端夹扁铆合，且第一夹扁模具组位于开口端端部，第二夹扁模具组与第一夹扁模具组相邻而位于临近管体中部的一侧；将管体夹扁段多余部分切除形成封口段；第一夹扁模具组先行离开管体，第二夹扁模具组继续夹持管体夹扁段；焊接封口段；第二夹扁模具组离开管体。
相较于现有技术，所述热管封口方法利用第一、第二夹扁模具组分段夹扁管体，且焊接时第二夹扁模具组继续夹持管体夹扁段以防止金属产生局部回弹现象，可降低热管封口处的漏率进而可确保热管内保持较高的真空度。
下面参照附图，结合具体实施例对本发明作进一步的描述。
【附图说明】
图1是现有技术中热管封口过程结构示意图。
图2是按图1所示的过程制得的热管结构示意图。
图3是图2中局部放大示意图。
图4是本发明第一实施例热管封口的制造装置示意图。
图5A至图5F是本发明第一实施例的热管封口过程示意图。
图6A至图6C是本发明第二实施例的热管封口过程示意图。
【具体实施方式】
请参阅图4，是本发明热管封口方法涉及的制造装置的示意图，其通过一多功能性的制造装置实现热管的封口。该热管制造装置包括一真空泵20、一夹扁机30、一剪切机40、一焊接机50、一注液槽60、一真空计70、一注液阀门80及一真空阀门81。其中夹扁机30包括第一夹扁模具组32及第二夹扁模具组34(请参阅图5A)。
热管的封口过程如下：首先，将具一封闭端12及一开口端14的管体10(也可以为两端开放式管体)置于真空抽引管内，并以底座固定。管体10开口端14包括一缩管段16，且管内设有毛细结构。开启注液阀门80，关闭真空阀门81，将注液槽60内的工作液体注入到管体10内。随后，开启真空阀门81，关闭注液阀门80并启动真空泵20，将管体10内的气体由开口端14抽离。管体10的开口端14置有真空计70，显示管体10内真空度。请参图5A至图5F，当真空度达到设定值时，夹扁机30的二夹扁模具组32、34即直接以机械力作用于管体10开口端14的外表面，利用机械作用力将管体10开口端14夹扁铆合。其中，第一夹扁模具组32位于开口端14端部，第二夹扁模具组34与第一夹扁模具组32相邻而位于临近管体10中部的一侧。同时，将夹扁段多余部分以剪切机40切除形成封口段18。随后第一夹扁模具组32先行离开管体10，第二夹扁模具组34继续夹持管体10的夹扁段以防止金属产生局部回弹现象。随后以焊接机50，如氩焊或雷射焊接迅速将封口段18焊接，最后第二夹扁模34具组亦离开管体10，完成热管的夹扁、封口、焊接制程。
上一实施例中，管体10的开口端预先形成有一缩口段16，根据实际需要，可选用不具有缩口段16的直管体。
如图6A至图6C为本发明的第二实施例采用直管体100时的封口过程示意图，直管体100也包括一封闭端102及一开口端104。第二夹扁模具组34契合后其底部可形成一空间，使管体100临近开口端104的一侧冲压后形成一直径渐缩的缩管段106。使封口段108的宽度小于直管体100直径以便于组装。随后再经与上一实施例相同的制成，完成热管的切断、焊接制程。上述制程中缩管、夹扁、切断及焊接封口的动作得以在同一工站中快速完成，大幅降低制造时间、空间、人力、设备及生产的成本。
其中，工作液体可以是液态水、酮类、醇类、烷类。
本发明热管封口方法与现有技术相比具有如下优点：
(1)利用第一、第二夹扁模具组32、34可达到将热管管体10、100定位的效果；
(2)利用第一、第二夹扁模具组32、34可达到分段夹扁，在焊接封口时，热管封口段18、108仍保持被夹紧状态，以确保热管内维持较高的真空度；
(3)利用第二夹扁模具组34契合后其底部所形成的空间，可在直管100临近开口端104的一侧形成一缩管段106，使封口段108的宽度小于管体100直径以便于组装，采用上述制程，可使缩管、夹扁、切断及焊接封口的动作得以在同一工站中快速完成，大幅降低制造时间、空间、人力、设备及生产的成本。

Claims (3)

1.一种热管封口方法，包括以下步骤：
提供一具有开口端的管体，并将该管体固定；
利用第一夹扁模具组及第二夹扁模具组作用于管体外表面，将管体开口端夹扁铆合，且第一夹扁模具组位于开口端端部，第二夹扁模具组与第一夹扁模具组相邻而位于临近管体中部的一侧；
将管体夹扁段多余部分切除形成封口段；
第一夹扁模具组先行离开管体，第二夹扁模具组继续夹持管体夹扁段；
焊接封口段；
第二夹扁模具组离开管体。
2.如权利要求1所述的热管封口方法，其特征在于：第二夹扁模具组契合后可形成一空间，使管体临近开口端的一侧冲压后形成一直径渐缩的缩管段。
3.如权利要求2所述的热管封口方法，其特征在于：在缩管、夹扁、切断及焊接的过程中，该管体始终被定位于同一工站。
CNA200510100113XA 2005-09-30 2005-09-30 热管封口方法 Pending CN1940452A (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CNA200510100113XA CN1940452A (zh) 2005-09-30 2005-09-30 热管封口方法
US11/308,863 US7467466B2 (en) 2005-09-30 2006-05-16 Method for sealing a heat pipe

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNA200510100113XA CN1940452A (zh) 2005-09-30 2005-09-30 热管封口方法

Publications (1)

Publication Number Publication Date
CN1940452A true CN1940452A (zh) 2007-04-04

Family

ID=37900570

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA200510100113XA Pending CN1940452A (zh) 2005-09-30 2005-09-30 热管封口方法

Country Status (2)

Country Link
US (1) US7467466B2 (zh)
CN (1) CN1940452A (zh)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102305564A (zh) * 2011-08-26 2012-01-04 华南理工大学 一种纤维烧结式微热管及其制造方法
CN104501634A (zh) * 2014-11-21 2015-04-08 东莞汉旭五金塑胶科技有限公司 铝管与热导管的封包方法及其封包管体结构
CN105992504A (zh) * 2015-03-19 2016-10-05 奇鋐科技股份有限公司 散热装置制造方法
CN109708503A (zh) * 2018-12-27 2019-05-03 碳元科技股份有限公司 一种超薄热管及其制作工艺
CN111992989A (zh) * 2020-08-10 2020-11-27 惠州奥诺吉散热技术有限公司 一种均温板的注液管切断工艺及设备

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010060595A (ja) * 2008-09-01 2010-03-18 Konica Minolta Business Technologies Inc 定着装置および画像形成装置
US8240050B2 (en) * 2008-06-18 2012-08-14 Konica Minolta Business Technologies, Inc. Manufacturing method of heat equalizing member for fixing device and heat equalizing member for fixing device
TWI548477B (zh) * 2014-12-05 2016-09-11 奇鋐科技股份有限公司 熱傳單元封口方法
US10307874B2 (en) * 2015-01-06 2019-06-04 Asia Vital Components Co., Ltd. Method for sealing a heat transfer unit
US10029337B2 (en) * 2015-04-02 2018-07-24 Asia Vital Components Co., Ltd. Method of manufacturing heat dissipation device
PL231208B1 (pl) * 2016-06-04 2019-02-28 Garus Jerzy Zdzislaw Sposób wytwarzania ciepłowodów dla systemów grzewczych
CN205909724U (zh) * 2016-06-27 2017-01-25 富瑞精密组件（昆山）有限公司 组合式热管及应用该组合式热管的电子装置
TWI655404B (zh) * 2016-07-14 2019-04-01 大陸商昆山巨仲電子有限公司 Heat pipe and sealing method thereof
US10107562B2 (en) * 2016-09-03 2018-10-23 Kunshan Jue-Chung Electronics Co., Ltd. Heat pipe and sealing method thereof
CN106931813B (zh) * 2017-03-01 2023-06-23 华南理工大学 一种超薄热管自动二次除气定长机构
US10470291B2 (en) * 2017-07-21 2019-11-05 Chintung Lin Process for preparing an energy saving anti-burst heat dissipation device

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61134592A (ja) 1984-11-30 1986-06-21 Hitachi Chem Co Ltd ヒ−トパイプの製造法
TW493058B (en) * 1998-07-02 2002-07-01 Showa Denko Kk The remains of non condensing gas in heat pipe, the detecting method of non-remains, and the manufacturing method of pipes
CN1280290A (zh) 1999-07-08 2001-01-17 超众科技股份有限公司 一种热管成型的封口方法
TW593961B (en) * 2002-12-13 2004-06-21 Huei-Chiun Shiu Method and device for removing non-condensing gas in a heat pipe
TW573575U (en) * 2002-12-31 2004-01-21 Huei-Chiun Shiu Sealing structure for round tube shaped heat pipe
TW200510088A (en) * 2003-09-09 2005-03-16 Ya No Chao Tao Technology Co Ltd Method of sealing heat pipe
US6957691B2 (en) * 2003-11-12 2005-10-25 Pao-Shu Hsieh Sealing structure of a heat-dissipating tube
US7229104B2 (en) * 2004-02-04 2007-06-12 Hsu Hul-Chun Shrinkage-free sealing structure of heat pipe
US7650915B2 (en) * 2004-02-19 2010-01-26 Hul-Chun Hsu Method for removing vapor within heat pipe
US7538298B2 (en) * 2004-12-02 2009-05-26 Jia-Hao Li Gas removing apparatus for heat pipe
US7192064B2 (en) * 2005-03-10 2007-03-20 Hul-Chun Hsu Extrusion-sealed structure of heat pipe
US7073257B1 (en) * 2005-03-18 2006-07-11 Jaffe Limited Shrinkage-free sealing method and structure of heat pipe
US20060278383A1 (en) * 2005-05-27 2006-12-14 Jaffe Limited Sealing method and structure of heat pipe

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102305564A (zh) * 2011-08-26 2012-01-04 华南理工大学 一种纤维烧结式微热管及其制造方法
CN104501634A (zh) * 2014-11-21 2015-04-08 东莞汉旭五金塑胶科技有限公司 铝管与热导管的封包方法及其封包管体结构
CN105992504A (zh) * 2015-03-19 2016-10-05 奇鋐科技股份有限公司 散热装置制造方法
CN105992504B (zh) * 2015-03-19 2020-04-10 奇鋐科技股份有限公司 散热装置制造方法
CN109708503A (zh) * 2018-12-27 2019-05-03 碳元科技股份有限公司 一种超薄热管及其制作工艺
CN111992989A (zh) * 2020-08-10 2020-11-27 惠州奥诺吉散热技术有限公司 一种均温板的注液管切断工艺及设备

Also Published As

Publication number Publication date
US20070074395A1 (en) 2007-04-05
US7467466B2 (en) 2008-12-23

Similar Documents

Publication Publication Date Title
CN1940452A (zh) 热管封口方法
CN100467996C (zh) 热导管及其制造方法
CN100453954C (zh) 热管的封口方法
US8464566B2 (en) Method of manufacturing a valve housing
US6938449B2 (en) Hydraulic forming process, hydraulic forming device and metal separator for a fuel cell formed by hydraulic forming process
CN106311857B (zh) 一种复杂截面中空构件低压镦胀成形方法
CN102554009A (zh) 一种小半径弯头流体压力成形方法
CN107030200A (zh) 一种防跳废料的空调翅片冷冲模具
CN103521584A (zh) 燃油滤清器壳体的加工方法
CN108213886A (zh) 一种基于薄片叠层连接的随形流道散热器及其制备方法
CN101483112B (zh) 组装治具以及组装方法
CN202290949U (zh) 一种摩托车车架管件端头成形加工模具
CN1967907A (zh) 卡扣式滤芯聚合物极耳焊接方法
CN109127851A (zh) 一种基于液压的铝合金薄板零件的成形方法
CN109127886B (zh) 一种棱边圆角R≤2t难变形材料矩形截面空心件的气压-模压复合成形方法
CN102500681B (zh) 一种摩托车车架管件连接端头加工成形方法
CN1121726C (zh) 电池外壳的制造方法
CN1858538A (zh) 热管及用于热管封口的装置
CN111473146B (zh) 带一体式阀座的空调用不锈钢四通换向阀主阀及加工方法
CN1695844A (zh) 热管封口方法
JP3839787B2 (ja) 二重壁中空金属部品の製造方法
CN112916708A (zh) 一种轻卡顶盖板前风窗止口边带料整形模具及其控制方法
CN210754919U (zh) 斜接管锻造用模组件
US20050076691A1 (en) Apparatus and process for hydraulic high-pressure forming of a sheet
CN1586758A (zh) 整体成型碟形波纹管制作方法

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication