CN1933169A - 降低串扰的cmos图像传感器 - Google Patents
降低串扰的cmos图像传感器 Download PDFInfo
- Publication number
- CN1933169A CN1933169A CNA2006101038463A CN200610103846A CN1933169A CN 1933169 A CN1933169 A CN 1933169A CN A2006101038463 A CNA2006101038463 A CN A2006101038463A CN 200610103846 A CN200610103846 A CN 200610103846A CN 1933169 A CN1933169 A CN 1933169A
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- Prior art keywords
- epitaxial loayer
- barrier layer
- image sensor
- cmos image
- substrate
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- 230000004888 barrier function Effects 0.000 claims abstract description 68
- 239000000758 substrate Substances 0.000 claims abstract description 55
- 238000009792 diffusion process Methods 0.000 claims abstract description 24
- 239000002800 charge carrier Substances 0.000 claims description 22
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims description 20
- 229910052796 boron Inorganic materials 0.000 claims description 20
- 229910052710 silicon Inorganic materials 0.000 claims description 16
- 239000010703 silicon Substances 0.000 claims description 16
- 238000000034 method Methods 0.000 claims description 13
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 7
- 229910052799 carbon Inorganic materials 0.000 claims description 7
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- 230000005684 electric field Effects 0.000 claims description 4
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
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- 229910052787 antimony Inorganic materials 0.000 claims description 3
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 claims description 3
- 229910052785 arsenic Inorganic materials 0.000 claims description 3
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 claims description 3
- 229910052733 gallium Inorganic materials 0.000 claims description 3
- 229910052738 indium Inorganic materials 0.000 claims description 3
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- 229910052698 phosphorus Inorganic materials 0.000 claims description 3
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- 239000000463 material Substances 0.000 description 9
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- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
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- 229910044991 metal oxide Inorganic materials 0.000 description 1
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- 210000001525 retina Anatomy 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/011—Manufacture or treatment of image sensors covered by group H10F39/12
- H10F39/026—Wafer-level processing
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/807—Pixel isolation structures
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/10—Integrated devices
- H10F39/12—Image sensors
- H10F39/18—Complementary metal-oxide-semiconductor [CMOS] image sensors; Photodiode array image sensors
- H10F39/184—Infrared image sensors
Landscapes
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Light Receiving Elements (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/197,004 | 2005-08-04 | ||
| US11/197,004 US7307327B2 (en) | 2005-08-04 | 2005-08-04 | Reduced crosstalk CMOS image sensors |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1933169A true CN1933169A (zh) | 2007-03-21 |
Family
ID=36950808
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2006101038463A Pending CN1933169A (zh) | 2005-08-04 | 2006-08-04 | 降低串扰的cmos图像传感器 |
Country Status (5)
| Country | Link |
|---|---|
| US (2) | US7307327B2 (enExample) |
| EP (1) | EP1750308B1 (enExample) |
| JP (1) | JP2007067393A (enExample) |
| CN (1) | CN1933169A (enExample) |
| TW (1) | TW200721468A (enExample) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101304035B (zh) * | 2007-05-08 | 2010-06-09 | 中芯国际集成电路制造(上海)有限公司 | 图像传感器及其形成方法 |
| CN101764103A (zh) * | 2008-12-24 | 2010-06-30 | 硅绝缘体技术有限公司 | 半导体衬底及其制造方法 |
| CN102222678A (zh) * | 2011-06-22 | 2011-10-19 | 格科微电子(上海)有限公司 | Cmos图像传感器及其形成方法 |
| TWI407782B (zh) * | 2008-05-30 | 2013-09-01 | Omnivision Tech Inc | 具有聚焦互連之影像感測器,及有效率地捕捉入射光之方法與裝置 |
| TWI455298B (zh) * | 2011-10-25 | 2014-10-01 | Pixart Imaging Inc | 感光元件及量測入射光的方法 |
| CN104637966A (zh) * | 2013-11-08 | 2015-05-20 | 瑞萨电子株式会社 | 半导体器件及其制造方法 |
| CN104065853B (zh) * | 2014-06-16 | 2017-02-15 | 北京航空航天大学 | 一种红外相机串扰消除方法 |
| CN114008475A (zh) * | 2019-06-18 | 2022-02-01 | ams国际有限公司 | 带有导光元件的飞行时间传感器 |
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| US7307327B2 (en) | 2005-08-04 | 2007-12-11 | Micron Technology, Inc. | Reduced crosstalk CMOS image sensors |
| US7728277B2 (en) * | 2005-11-16 | 2010-06-01 | Eastman Kodak Company | PMOS pixel structure with low cross talk for active pixel image sensors |
| KR100719361B1 (ko) * | 2005-11-22 | 2007-05-17 | 삼성전자주식회사 | 씨모스 이미지 센서 및 그 형성 방법 |
| KR100809323B1 (ko) * | 2006-01-31 | 2008-03-05 | 삼성전자주식회사 | 크로스토크가 감소하고 감도가 증가한 이미지 센서 |
| KR100703987B1 (ko) * | 2006-05-17 | 2007-04-09 | 삼성전자주식회사 | 이미지 센서의 제조 방법 및 그에 의해 제조된 이미지 센서 |
| KR100853788B1 (ko) * | 2006-11-27 | 2008-08-25 | 동부일렉트로닉스 주식회사 | 이미지 센서에서의 층 두께 측정 방법 및 이를 위한 이미지센서의 두께 측정 패턴 |
| US8440495B2 (en) * | 2007-03-06 | 2013-05-14 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method for reducing crosstalk in image sensors using implant technology |
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| US7307327B2 (en) | 2005-08-04 | 2007-12-11 | Micron Technology, Inc. | Reduced crosstalk CMOS image sensors |
-
2005
- 2005-08-04 US US11/197,004 patent/US7307327B2/en not_active Expired - Lifetime
-
2006
- 2006-07-24 EP EP06015356A patent/EP1750308B1/en not_active Ceased
- 2006-07-27 TW TW095127523A patent/TW200721468A/zh unknown
- 2006-08-04 JP JP2006212759A patent/JP2007067393A/ja not_active Withdrawn
- 2006-08-04 CN CNA2006101038463A patent/CN1933169A/zh active Pending
-
2007
- 2007-11-15 US US11/940,569 patent/US7592654B2/en not_active Expired - Lifetime
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101304035B (zh) * | 2007-05-08 | 2010-06-09 | 中芯国际集成电路制造(上海)有限公司 | 图像传感器及其形成方法 |
| TWI407782B (zh) * | 2008-05-30 | 2013-09-01 | Omnivision Tech Inc | 具有聚焦互連之影像感測器,及有效率地捕捉入射光之方法與裝置 |
| CN101764103A (zh) * | 2008-12-24 | 2010-06-30 | 硅绝缘体技术有限公司 | 半导体衬底及其制造方法 |
| CN102222678A (zh) * | 2011-06-22 | 2011-10-19 | 格科微电子(上海)有限公司 | Cmos图像传感器及其形成方法 |
| TWI455298B (zh) * | 2011-10-25 | 2014-10-01 | Pixart Imaging Inc | 感光元件及量測入射光的方法 |
| CN104637966A (zh) * | 2013-11-08 | 2015-05-20 | 瑞萨电子株式会社 | 半导体器件及其制造方法 |
| CN104065853B (zh) * | 2014-06-16 | 2017-02-15 | 北京航空航天大学 | 一种红外相机串扰消除方法 |
| CN114008475A (zh) * | 2019-06-18 | 2022-02-01 | ams国际有限公司 | 带有导光元件的飞行时间传感器 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2007067393A (ja) | 2007-03-15 |
| US20070029589A1 (en) | 2007-02-08 |
| US20080079045A1 (en) | 2008-04-03 |
| EP1750308B1 (en) | 2011-02-23 |
| US7307327B2 (en) | 2007-12-11 |
| US7592654B2 (en) | 2009-09-22 |
| TW200721468A (en) | 2007-06-01 |
| EP1750308A3 (en) | 2009-03-11 |
| EP1750308A2 (en) | 2007-02-07 |
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