CN1925725B - 电路基板的制造方法 - Google Patents

电路基板的制造方法 Download PDF

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Publication number
CN1925725B
CN1925725B CN2006101422241A CN200610142224A CN1925725B CN 1925725 B CN1925725 B CN 1925725B CN 2006101422241 A CN2006101422241 A CN 2006101422241A CN 200610142224 A CN200610142224 A CN 200610142224A CN 1925725 B CN1925725 B CN 1925725B
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CN
China
Prior art keywords
sides
conductive metal
wiring
metal layer
mentioned
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Expired - Fee Related
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CN2006101422241A
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English (en)
Chinese (zh)
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CN1925725A (zh
Inventor
国府田猛
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Mektron KK
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Nippon Mektron KK
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Publication of CN1925725A publication Critical patent/CN1925725A/zh
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Publication of CN1925725B publication Critical patent/CN1925725B/zh
Expired - Fee Related legal-status Critical Current
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  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
CN2006101422241A 2005-09-02 2006-09-01 电路基板的制造方法 Expired - Fee Related CN1925725B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2005-255048 2005-09-02
JP2005255048 2005-09-02
JP2005255048A JP4624217B2 (ja) 2005-09-02 2005-09-02 回路基板の製造方法

Publications (2)

Publication Number Publication Date
CN1925725A CN1925725A (zh) 2007-03-07
CN1925725B true CN1925725B (zh) 2010-11-03

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Family Applications (1)

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CN2006101422241A Expired - Fee Related CN1925725B (zh) 2005-09-02 2006-09-01 电路基板的制造方法

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JP (1) JP4624217B2 (ja)
CN (1) CN1925725B (ja)
TW (1) TW200721929A (ja)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100962371B1 (ko) * 2008-07-02 2010-06-10 삼성전기주식회사 인쇄회로기판 및 그 제조방법
CN101783332B (zh) * 2009-01-16 2012-01-25 日月光半导体制造股份有限公司 线路板及其制备工艺
CN102427670A (zh) * 2011-11-08 2012-04-25 汕头超声印制板（二厂）有限公司 一种印刷电路板的减薄铜层方法
CN104105361B (zh) * 2014-05-07 2018-08-31 深圳市环基实业有限公司 一种电路板选择性电镀导电孔的方法
CN108235598B (zh) * 2017-12-13 2019-10-18 深南电路股份有限公司 一种特殊的镀金焊盘制造方法
WO2020130100A1 (ja) * 2018-12-20 2020-06-25 日立化成株式会社 配線基板及びその製造方法
CN111712065B (zh) * 2020-07-08 2022-08-12 高德(江苏)电子科技股份有限公司 一种避免软硬结合板孔铜断裂的加工工艺
WO2022097481A1 (ja) * 2020-11-05 2022-05-12 Dic株式会社 セミアディティブ工法用積層体及びそれを用いたプリント配線板

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1319323A (zh) * 1998-09-18 2001-10-24 范蒂科股份公司 制造刻蚀电路的方法
CN1494120A (zh) * 2002-10-28 2004-05-05 华泰电子股份有限公司 集成电路封装基板的金属电镀方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3250579B2 (ja) * 1993-01-14 2002-01-28 住友電気工業株式会社 歪補正回路
JP3142270B2 (ja) * 1998-04-01 2001-03-07 三井金属鉱業株式会社 プリント配線板の製造方法
JP2000282245A (ja) * 1999-03-30 2000-10-10 Ebara Udylite Kk コンディショナー組成物およびこれを利用するＰｄ−Ｓｎコロイド触媒の吸着量増大方法
JP4133560B2 (ja) * 2003-05-07 2008-08-13 インターナショナル・ビジネス・マシーンズ・コーポレーション プリント配線基板の製造方法およびプリント配線基板

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1319323A (zh) * 1998-09-18 2001-10-24 范蒂科股份公司 制造刻蚀电路的方法
CN1494120A (zh) * 2002-10-28 2004-05-05 华泰电子股份有限公司 集成电路封装基板的金属电镀方法

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
JP平1-146392A 1989.06.08

Also Published As

Publication number Publication date
JP4624217B2 (ja) 2011-02-02
TW200721929A (en) 2007-06-01
JP2007067341A (ja) 2007-03-15
TWI357291B (ja) 2012-01-21
CN1925725A (zh) 2007-03-07

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