TW200721929A - Method for manufacturing circuit substrate - Google Patents

Method for manufacturing circuit substrate

Info

Publication number
TW200721929A
TW200721929A TW095131176A TW95131176A TW200721929A TW 200721929 A TW200721929 A TW 200721929A TW 095131176 A TW095131176 A TW 095131176A TW 95131176 A TW95131176 A TW 95131176A TW 200721929 A TW200721929 A TW 200721929A
Authority
TW
Taiwan
Prior art keywords
circuit wiring
double
forming
metal layers
conductive metal
Prior art date
Application number
TW095131176A
Other languages
English (en)
Chinese (zh)
Other versions
TWI357291B (ja
Inventor
Takeshi Kunifuda
Original Assignee
Nippon Mektron Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Mektron Kk filed Critical Nippon Mektron Kk
Publication of TW200721929A publication Critical patent/TW200721929A/zh
Application granted granted Critical
Publication of TWI357291B publication Critical patent/TWI357291B/zh

Links

Landscapes

  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
TW095131176A 2005-09-02 2006-08-24 Method for manufacturing circuit substrate TW200721929A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005255048A JP4624217B2 (ja) 2005-09-02 2005-09-02 回路基板の製造方法

Publications (2)

Publication Number Publication Date
TW200721929A true TW200721929A (en) 2007-06-01
TWI357291B TWI357291B (ja) 2012-01-21

Family

ID=37818110

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095131176A TW200721929A (en) 2005-09-02 2006-08-24 Method for manufacturing circuit substrate

Country Status (3)

Country Link
JP (1) JP4624217B2 (ja)
CN (1) CN1925725B (ja)
TW (1) TW200721929A (ja)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100962371B1 (ko) * 2008-07-02 2010-06-10 삼성전기주식회사 인쇄회로기판 및 그 제조방법
CN101783332B (zh) * 2009-01-16 2012-01-25 日月光半导体制造股份有限公司 线路板及其制备工艺
CN102427670A (zh) * 2011-11-08 2012-04-25 汕头超声印制板（二厂）有限公司 一种印刷电路板的减薄铜层方法
CN104105361B (zh) * 2014-05-07 2018-08-31 深圳市环基实业有限公司 一种电路板选择性电镀导电孔的方法
CN108235598B (zh) * 2017-12-13 2019-10-18 深南电路股份有限公司 一种特殊的镀金焊盘制造方法
WO2020130101A1 (ja) * 2018-12-20 2020-06-25 日立化成株式会社 配線基板及びその製造方法
CN111712065B (zh) * 2020-07-08 2022-08-12 高德(江苏)电子科技股份有限公司 一种避免软硬结合板孔铜断裂的加工工艺
WO2022097481A1 (ja) * 2020-11-05 2022-05-12 Dic株式会社 セミアディティブ工法用積層体及びそれを用いたプリント配線板

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3250579B2 (ja) * 1993-01-14 2002-01-28 住友電気工業株式会社 歪補正回路
JP3142270B2 (ja) * 1998-04-01 2001-03-07 三井金属鉱業株式会社 プリント配線板の製造方法
DE59905871D1 (de) * 1998-09-18 2003-07-10 Vantico Ag Verfahren zur herstellung von geätzten schaltungen
JP2000282245A (ja) * 1999-03-30 2000-10-10 Ebara Udylite Kk コンディショナー組成物およびこれを利用するＰｄ−Ｓｎコロイド触媒の吸着量増大方法
CN1494120A (zh) * 2002-10-28 2004-05-05 华泰电子股份有限公司 集成电路封装基板的金属电镀方法
JP4133560B2 (ja) * 2003-05-07 2008-08-13 インターナショナル・ビジネス・マシーンズ・コーポレーション プリント配線基板の製造方法およびプリント配線基板

Also Published As

Publication number Publication date
JP2007067341A (ja) 2007-03-15
JP4624217B2 (ja) 2011-02-02
CN1925725A (zh) 2007-03-07
TWI357291B (ja) 2012-01-21
CN1925725B (zh) 2010-11-03

Similar Documents

Publication Publication Date Title
TW200721929A (en) Method for manufacturing circuit substrate
US7337537B1 (en) Method for forming a back-drilled plated through hole in a printed circuit board and the resulting printed circuit board
TW200635460A (en) Double-sided wiring board fabrication method, double-sided wiring board, and base material therefor
TW200731908A (en) Multilayer printed wiring board and method for manufacturing same
TW200623318A (en) Method for fabricating a multi-layer circuit board with fine pitch
WO2008008552A3 (en) Build-up printed wiring board substrate having a core layer that is part of a circuit
TW200704304A (en) Printed wiring board manufacturing method
TW200731898A (en) Circuit board structure and method for fabricating the same
WO2006134216A3 (en) Circuit board structure and method for manufacturing a circuit board structure
JP2005183952A (ja) 導電孔を有したプリント回路ボードの製造方法及びボード
TW200733842A (en) Multilayer printed wiring board and method for producing the same
TW200628041A (en) Multilayer circuit board and manufacturing method thereof
TW200624001A (en) Printed wiring board and manufacturing method therefor
TW200642554A (en) Multilayer circuit board with embedded components and method of manufacture
WO2010048653A3 (de) Verfahren zur integration eines elektronischen bauteils in eine leiterplatte
TW200636942A (en) Method of production of circuit board utilizing electroplating
TW200629998A (en) Printed circuit board and forming method thereof
MY159991A (en) Manufacturing method of printed wiring board and printed wiring board
EP1194024A4 (en) MULTILAYER PRINTED PCB AND ITS MANUFACTURING METHOD
TW200631481A (en) Printed wiring board manufacturing method
EP1619719A3 (en) Method of manufacturing a wiring board including electroplating
TW200420203A (en) Multilayer board and its manufacturing method
US10772220B2 (en) Dummy core restrict resin process and structure
TW200640314A (en) Manufacturing method of double-access flexible circuit board
EP1545176A4 (en) MULTILAYER PCB AND MANUFACTURING METHOD THEREFOR