CN1875043B - 湿气硬化的热熔粘合剂、其制备方法及其用途 - Google Patents
湿气硬化的热熔粘合剂、其制备方法及其用途 Download PDFInfo
- Publication number
- CN1875043B CN1875043B CN2004800317016A CN200480031701A CN1875043B CN 1875043 B CN1875043 B CN 1875043B CN 2004800317016 A CN2004800317016 A CN 2004800317016A CN 200480031701 A CN200480031701 A CN 200480031701A CN 1875043 B CN1875043 B CN 1875043B
- Authority
- CN
- China
- Prior art keywords
- hotmelt
- moisture
- carboxylic acid
- crosslinking
- acid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/4009—Two or more macromolecular compounds not provided for in one single group of groups C08G18/42 - C08G18/64
- C08G18/4018—Mixtures of compounds of group C08G18/42 with compounds of group C08G18/48
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/08—Processes
- C08G18/10—Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/08—Processes
- C08G18/10—Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step
- C08G18/12—Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step using two or more compounds having active hydrogen in the first polymerisation step
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/4009—Two or more macromolecular compounds not provided for in one single group of groups C08G18/42 - C08G18/64
- C08G18/4063—Mixtures of compounds of group C08G18/62 with other macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/42—Polycondensates having carboxylic or carbonic ester groups in the main chain
- C08G18/4236—Polycondensates having carboxylic or carbonic ester groups in the main chain containing only aliphatic groups
- C08G18/4238—Polycondensates having carboxylic or carbonic ester groups in the main chain containing only aliphatic groups derived from dicarboxylic acids and dialcohols
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
- C09J175/06—Polyurethanes from polyesters
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G2170/00—Compositions for adhesives
- C08G2170/20—Compositions for hot melt adhesives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G2170/00—Compositions for adhesives
- C08G2170/90—Compositions for adhesives used in footwear
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G2250/00—Compositions for preparing crystalline polymers
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Polyurethanes Or Polyureas (AREA)
- Polyesters Or Polycarbonates (AREA)
- Liquid Crystal (AREA)
Abstract
Description
Claims (24)
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102004008692.3 | 2004-02-20 | ||
DE102004008692 | 2004-02-20 | ||
DE102004028488A DE102004028488A1 (de) | 2004-02-20 | 2004-06-11 | Feuchtigkeitshärtende Schmelzklebstoffe, Verfahren zu deren Herstellung und deren Verwendung |
DE102004028488.1 | 2004-06-11 | ||
PCT/EP2004/053670 WO2005090428A1 (de) | 2004-02-20 | 2004-12-22 | Feuchtigkeitshärtende schmelzklebstoffe, verfahren zu deren herstellung und deren verwendung |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1875043A CN1875043A (zh) | 2006-12-06 |
CN1875043B true CN1875043B (zh) | 2010-04-28 |
Family
ID=34959799
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2004800317016A Expired - Fee Related CN1875043B (zh) | 2004-02-20 | 2004-12-22 | 湿气硬化的热熔粘合剂、其制备方法及其用途 |
Country Status (15)
Country | Link |
---|---|
US (1) | US20070213465A1 (zh) |
EP (1) | EP1716192B1 (zh) |
JP (1) | JP4658972B2 (zh) |
KR (1) | KR100812932B1 (zh) |
CN (1) | CN1875043B (zh) |
AT (1) | ATE365756T1 (zh) |
AU (1) | AU2004317328A1 (zh) |
CA (1) | CA2556545C (zh) |
DE (2) | DE102004028488A1 (zh) |
ES (1) | ES2289582T3 (zh) |
MY (1) | MY138490A (zh) |
PL (1) | PL1716192T3 (zh) |
RU (1) | RU2343167C9 (zh) |
TW (1) | TWI378982B (zh) |
WO (1) | WO2005090428A1 (zh) |
Families Citing this family (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8247514B2 (en) * | 2006-09-01 | 2012-08-21 | Momentive Performance Materials Inc. | Silylated polyurethane compositions and adhesives therefrom |
US8247079B2 (en) * | 2006-09-01 | 2012-08-21 | Momentive Performance Materials Inc. | Laminate containing a silylated polyurethane adhesive composition |
DE102007033651A1 (de) * | 2007-07-17 | 2009-01-22 | Evonik Degussa Gmbh | Feuchtigkeitshärtender Schmelzklebstoff mit guter Haftung |
CN101547991B (zh) * | 2007-07-19 | 2012-05-30 | Dic株式会社 | 湿气固化型聚氨酯热熔粘合剂和使用其的层叠体及透湿薄膜 |
JP5566051B2 (ja) * | 2009-05-28 | 2014-08-06 | ヘンケルジャパン株式会社 | Icカード用湿気硬化型ホットメルト接着剤 |
DE102013204550A1 (de) | 2013-03-15 | 2014-09-18 | Evonik Industries Ag | Verwendung von Polyestern mit inhärentem Flammschutz in Kleb- und Dichtstoffen |
JP6175869B2 (ja) * | 2013-04-03 | 2017-08-09 | Dic株式会社 | 湿気硬化型ウレタンホットメルト樹脂組成物及び成形品 |
JP2015168724A (ja) * | 2014-03-05 | 2015-09-28 | 日東シンコー株式会社 | シール材、及び、ホットメルト接着剤 |
CN105683234B (zh) | 2013-10-22 | 2019-03-26 | 埃莱万斯可再生能源科学股份有限公司 | 聚酯多元醇及其制造和使用方法 |
GB201322933D0 (en) * | 2013-12-23 | 2014-02-12 | Croda Int Plc | A polyol |
US9884981B2 (en) * | 2014-02-21 | 2018-02-06 | IFS Industries Inc. | Polyol compositions for hot melt adhesives |
PL2944662T3 (pl) * | 2014-05-16 | 2019-01-31 | Henkel Ag & Co. Kgaa | Termoplastyczny poliuretanowy klej topliwy |
DE102014218188B4 (de) | 2014-09-11 | 2023-01-19 | Evonik Operations Gmbh | Formulierung zur Beschichtung von Substraten, Verfahren zur Beschichtung von Substraten, beschichtete Substrate sowie Verwendung der Formulierung |
CN107109177A (zh) * | 2014-09-26 | 2017-08-29 | 汉高股份有限及两合公司 | 反应性聚氨酯热熔粘合剂及其用途 |
MY181850A (en) | 2015-02-05 | 2021-01-11 | Evonik Operations Gmbh | Isocyanate-free synthesis of carbonate-modified polymers |
US10246617B2 (en) * | 2015-03-02 | 2019-04-02 | Evonik Degussa Gmbh | Adhesives with low VOC and fogging values |
US10435602B2 (en) | 2015-03-02 | 2019-10-08 | Evonik Degussa Gmbh | Adhesives with low VOC and fogging values |
KR102606493B1 (ko) | 2015-09-17 | 2023-11-28 | 다우 글로벌 테크놀로지스 엘엘씨 | 감소된 발화 민감도를 가진 폴리머 코팅물 조성물 |
EP3243863A1 (de) | 2016-05-09 | 2017-11-15 | Evonik Degussa GmbH | Verwendung von block-copolymeren in klebstoffen |
EP3580257A1 (en) * | 2017-02-09 | 2019-12-18 | Lubrizol Advanced Materials, Inc. | Reactive hot-melt adhesive composition containing a polyester-polyurethane |
KR102356309B1 (ko) * | 2017-11-20 | 2022-01-28 | 에스케이케미칼 주식회사 | 열용융 접착제용 폴리에스테르 수지 조성물 |
EP3636687A1 (de) | 2018-10-12 | 2020-04-15 | Evonik Operations GmbH | Thermisch lösbare reaktivklebstoffe |
WO2021086526A1 (en) * | 2019-10-30 | 2021-05-06 | Henkel IP & Holding GmbH | Polyurethane hot melt adhesive for low temperature application |
CN112142960B (zh) * | 2020-09-29 | 2022-05-24 | 美瑞新材料股份有限公司 | 一种疏水性聚酯多元醇及基于其制备的聚氨酯弹性体 |
US20240110006A1 (en) | 2021-01-30 | 2024-04-04 | Merz+Benteli Ag | Silane-terminated polymers |
JP7544312B1 (ja) | 2022-10-18 | 2024-09-03 | Dic株式会社 | 湿気硬化型ポリウレタンホットメルト樹脂組成物、硬化物、積層体、及び、表皮材 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5019638A (en) * | 1988-08-11 | 1991-05-28 | Huels Aktiengesellschaft | Rapidly setting, moisture-curable hot melt adhesives and their use |
US5407517A (en) * | 1990-03-23 | 1995-04-18 | Bayer Aktiengesellschaft | Hotmelt bonding process |
US5916964A (en) * | 1997-07-14 | 1999-06-29 | Reichhold Chemicals, Inc. | Reactive hot melt adhesives |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4808255A (en) * | 1987-05-07 | 1989-02-28 | H. B. Fuller Company | Thermally stable reactive hot melt urethane adhesive composition having a thermoplastic polymer, a compatible, curing urethane polyester polyol prepolymer and a tackifying agent |
JPH0776332B2 (ja) * | 1988-11-18 | 1995-08-16 | サンスター技研株式会社 | 湿気硬化性ホットメルト型接着剤組成物 |
DE4143454C2 (de) * | 1991-07-01 | 1995-01-05 | Fuller H B Licensing Financ | Verfahren zur Herstellung eines wasserdampfdurchlässigen Materials sowie ein solches Material |
FR2772779B1 (fr) * | 1997-12-19 | 2002-04-19 | Ato Findley Sa | Adhesif thermofusible reticulable par l'humidite a base de prepolymere polyurethane et utilisations dans le domaine de l'hygiene |
DE19961941A1 (de) * | 1999-12-22 | 2001-07-05 | Henkel Kgaa | Polyurethan-Zusammensetzungen auf der Basis von Polyether-Copolymeren |
US6630561B2 (en) * | 2000-04-24 | 2003-10-07 | Ube Industries, Ltd. | Crystalline polyesterpolyol and hot-melt adhesive |
-
2004
- 2004-06-11 DE DE102004028488A patent/DE102004028488A1/de not_active Withdrawn
- 2004-12-22 WO PCT/EP2004/053670 patent/WO2005090428A1/de active IP Right Grant
- 2004-12-22 KR KR1020067016605A patent/KR100812932B1/ko not_active IP Right Cessation
- 2004-12-22 JP JP2006553465A patent/JP4658972B2/ja not_active Expired - Fee Related
- 2004-12-22 EP EP04805002A patent/EP1716192B1/de not_active Not-in-force
- 2004-12-22 RU RU2006133444/04A patent/RU2343167C9/ru not_active IP Right Cessation
- 2004-12-22 US US10/589,980 patent/US20070213465A1/en not_active Abandoned
- 2004-12-22 DE DE502004004220T patent/DE502004004220D1/de active Active
- 2004-12-22 PL PL04805002T patent/PL1716192T3/pl unknown
- 2004-12-22 ES ES04805002T patent/ES2289582T3/es active Active
- 2004-12-22 AT AT04805002T patent/ATE365756T1/de active
- 2004-12-22 AU AU2004317328A patent/AU2004317328A1/en not_active Abandoned
- 2004-12-22 CA CA002556545A patent/CA2556545C/en not_active Expired - Fee Related
- 2004-12-22 CN CN2004800317016A patent/CN1875043B/zh not_active Expired - Fee Related
-
2005
- 2005-02-14 TW TW094104198A patent/TWI378982B/zh not_active IP Right Cessation
- 2005-02-18 MY MYPI20050637A patent/MY138490A/en unknown
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5019638A (en) * | 1988-08-11 | 1991-05-28 | Huels Aktiengesellschaft | Rapidly setting, moisture-curable hot melt adhesives and their use |
US5407517A (en) * | 1990-03-23 | 1995-04-18 | Bayer Aktiengesellschaft | Hotmelt bonding process |
US5916964A (en) * | 1997-07-14 | 1999-06-29 | Reichhold Chemicals, Inc. | Reactive hot melt adhesives |
Also Published As
Publication number | Publication date |
---|---|
KR100812932B1 (ko) | 2008-03-11 |
AU2004317328A1 (en) | 2005-09-29 |
JP4658972B2 (ja) | 2011-03-23 |
DE502004004220D1 (de) | 2007-08-09 |
CN1875043A (zh) | 2006-12-06 |
WO2005090428A1 (de) | 2005-09-29 |
EP1716192A1 (de) | 2006-11-02 |
CA2556545A1 (en) | 2005-09-29 |
EP1716192B1 (de) | 2007-06-27 |
TWI378982B (en) | 2012-12-11 |
ATE365756T1 (de) | 2007-07-15 |
DE102004028488A1 (de) | 2005-09-08 |
MY138490A (en) | 2009-06-30 |
TW200600560A (en) | 2006-01-01 |
PL1716192T3 (pl) | 2007-11-30 |
CA2556545C (en) | 2008-11-18 |
RU2006133444A (ru) | 2008-03-27 |
RU2343167C2 (ru) | 2009-01-10 |
KR20060120254A (ko) | 2006-11-24 |
RU2343167C9 (ru) | 2010-01-20 |
US20070213465A1 (en) | 2007-09-13 |
ES2289582T3 (es) | 2008-02-01 |
JP2007523240A (ja) | 2007-08-16 |
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Legal Events
Date | Code | Title | Description |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee |
Owner name: EVONIK DEGUSSA CO., LTD. Free format text: FORMER NAME: DEGUSSA CO., LTD. |
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CP01 | Change in the name or title of a patent holder |
Address after: Dusseldorf Patentee after: Degussa GmbH Address before: Dusseldorf Patentee before: Degussa AG |
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CP03 | Change of name, title or address |
Address after: essen Patentee after: Evonik Degussa GmbH Address before: Dusseldorf Patentee before: Degussa GmbH |
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CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100428 Termination date: 20201222 |
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CF01 | Termination of patent right due to non-payment of annual fee |