CN1865366B - 提高有机聚合物涂层对铜表面附着力的方法和组合物 - Google Patents
提高有机聚合物涂层对铜表面附着力的方法和组合物 Download PDFInfo
- Publication number
- CN1865366B CN1865366B CN2005100714869A CN200510071486A CN1865366B CN 1865366 B CN1865366 B CN 1865366B CN 2005100714869 A CN2005100714869 A CN 2005100714869A CN 200510071486 A CN200510071486 A CN 200510071486A CN 1865366 B CN1865366 B CN 1865366B
- Authority
- CN
- China
- Prior art keywords
- copper surface
- aqueous solution
- solution composition
- water
- organic polymer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/383—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by microetching
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
- C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
- C23C22/60—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using alkaline aqueous solutions with pH greater than 8
- C23C22/63—Treatment of copper or alloys based thereon
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/32—Alkaline compositions
- C23F1/34—Alkaline compositions for etching copper or alloys thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
- H05K2203/0793—Aqueous alkaline solution, e.g. for cleaning or etching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
- H05K2203/0796—Oxidant in aqueous solution, e.g. permanganate
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Chemical Treatment Of Metals (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Paints Or Removers (AREA)
Abstract
Description
铜预处理方法 | 粘接强度(MPa) |
未处理 | <5,可用手除去 |
喷沙处理 | 8.9 |
文献[4]报道的方法 | 13.7 |
本发明方法 | >20,在测试范围之外 |
粘接强度(MPa) | |
未经预处理 | 17.8 |
文献[4]报道的方法 | 11.1 |
本发明方法 | 37.4 |
Claims (8)
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2005100714869A CN1865366B (zh) | 2005-05-16 | 2005-05-16 | 提高有机聚合物涂层对铜表面附着力的方法和组合物 |
BRPI0612427-5A BRPI0612427A2 (pt) | 2005-05-16 | 2006-05-15 | composição de solução aquosa para o tratamento de superfìcies de cobre, uso da dita composição, método para melhorar a aderência de polìmeros orgãnicos a superfìcies de cobre, artigo e método para preparar tal artigo |
EP06759770A EP1883718A2 (en) | 2005-05-16 | 2006-05-15 | Method and composition for improving adhesion of organic polymer coatings with copper surface |
KR1020077026549A KR20080012296A (ko) | 2005-05-16 | 2006-05-15 | 유기 중합체 코팅의 구리 표면과의 부착성을 향상시키는방법 및 조성물 |
US11/914,472 US20080187672A1 (en) | 2005-05-16 | 2006-05-15 | Method and Composition for Improving Adhesion of Organic Polymer Coatings with Copper Surface |
PCT/US2006/018583 WO2006124693A2 (en) | 2005-05-16 | 2006-05-15 | Method and composition for improving adhesion of organic polymer coatings with copper surface |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2005100714869A CN1865366B (zh) | 2005-05-16 | 2005-05-16 | 提高有机聚合物涂层对铜表面附着力的方法和组合物 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1865366A CN1865366A (zh) | 2006-11-22 |
CN1865366B true CN1865366B (zh) | 2010-12-15 |
Family
ID=37024181
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2005100714869A Active CN1865366B (zh) | 2005-05-16 | 2005-05-16 | 提高有机聚合物涂层对铜表面附着力的方法和组合物 |
Country Status (6)
Country | Link |
---|---|
US (1) | US20080187672A1 (zh) |
EP (1) | EP1883718A2 (zh) |
KR (1) | KR20080012296A (zh) |
CN (1) | CN1865366B (zh) |
BR (1) | BRPI0612427A2 (zh) |
WO (1) | WO2006124693A2 (zh) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103448202B (zh) * | 2012-05-28 | 2016-08-17 | 比亚迪股份有限公司 | 一种金属树脂复合体的制备方法及其制备的金属树脂复合体 |
KR101772724B1 (ko) * | 2013-04-19 | 2017-08-30 | (주)엘지하우시스 | 단열재 고정용 패스너 조성물, 패스너 및 단열재 고정용 패스너의 설치 방법 |
KR102581678B1 (ko) | 2015-04-15 | 2023-09-22 | 헨켈 아게 운트 코. 카게아아 | 폴리아미도아민 중합체를 포함하는 얇은 부식 보호 코팅 |
CN106198853B (zh) * | 2016-06-21 | 2018-01-05 | 中色奥博特铜铝业有限公司 | 一种硫酸盐黑化液中硫酸铵与甘氨酸含量的检测方法 |
CN109980174A (zh) * | 2017-12-27 | 2019-07-05 | 中国电子科技集团公司第十八研究所 | 提高电池热熔性聚合物铜箔表面附着力方法及表面处理剂 |
CN109852182B (zh) * | 2019-02-26 | 2021-06-11 | 昆山市板明电子科技有限公司 | 用于提高阻焊油墨附着力的组合物及其使用方法 |
CN111069004A (zh) * | 2019-12-26 | 2020-04-28 | 宁波索立安电气有限公司 | 一种铜导电件与环氧树脂之间的粘结密封工艺 |
CN111519190B (zh) * | 2020-05-27 | 2022-03-18 | 湖北兴福电子材料有限公司 | 一种铜制程面板中稳定蚀刻锥角的蚀刻液及稳定方法 |
CN112871603A (zh) * | 2021-01-08 | 2021-06-01 | 彭卫娟 | 一种金属漆涂层及其制备方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1295954A (zh) * | 1969-11-03 | 1972-11-08 | ||
GB1316030A (en) * | 1970-12-26 | 1973-05-09 | Mitsubishi Gas Chemical Co | Etchant for chemical dissolution of copper |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS586800B2 (ja) * | 1975-12-12 | 1983-02-07 | ニホンコウギヨウ カブシキガイシヤ | インサツカイロヨウドウハクオヒヨウメンシヨリスル ホウホウ |
US4576910A (en) * | 1983-06-09 | 1986-03-18 | Fuji Photo Film Co., Ltd. | Silver halide color light-sensitive material containing magenta color image-forming polymer or copolymer coupler latex |
JPS61176192A (ja) * | 1985-01-31 | 1986-08-07 | 株式会社日立製作所 | 銅と樹脂との接着方法 |
JPH01255298A (ja) * | 1988-04-05 | 1989-10-12 | Matsushita Electric Works Ltd | 多層配線基板の製造方法 |
JPH0244797A (ja) * | 1988-08-05 | 1990-02-14 | Matsushita Electric Works Ltd | 多層配線基板の製造方法 |
US5869130A (en) * | 1997-06-12 | 1999-02-09 | Mac Dermid, Incorporated | Process for improving the adhesion of polymeric materials to metal surfaces |
-
2005
- 2005-05-16 CN CN2005100714869A patent/CN1865366B/zh active Active
-
2006
- 2006-05-15 EP EP06759770A patent/EP1883718A2/en not_active Withdrawn
- 2006-05-15 WO PCT/US2006/018583 patent/WO2006124693A2/en active Application Filing
- 2006-05-15 US US11/914,472 patent/US20080187672A1/en not_active Abandoned
- 2006-05-15 BR BRPI0612427-5A patent/BRPI0612427A2/pt not_active IP Right Cessation
- 2006-05-15 KR KR1020077026549A patent/KR20080012296A/ko not_active Application Discontinuation
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1295954A (zh) * | 1969-11-03 | 1972-11-08 | ||
GB1316030A (en) * | 1970-12-26 | 1973-05-09 | Mitsubishi Gas Chemical Co | Etchant for chemical dissolution of copper |
Also Published As
Publication number | Publication date |
---|---|
US20080187672A1 (en) | 2008-08-07 |
KR20080012296A (ko) | 2008-02-11 |
WO2006124693A2 (en) | 2006-11-23 |
BRPI0612427A2 (pt) | 2010-11-09 |
WO2006124693A3 (en) | 2006-12-28 |
EP1883718A2 (en) | 2008-02-06 |
CN1865366A (zh) | 2006-11-22 |
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Legal Events
Date | Code | Title | Description |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: 3M CHINA CO., LTD. Free format text: FORMER OWNER: 3M INNOVATIVE PROPERTIES COMPANY Effective date: 20110426 |
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C41 | Transfer of patent application or patent right or utility model | ||
COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: MINNESOTA, THE USA TO: 200233 NO. 222, TIANLIN ROAD, SHANGHAI, CHINA |
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TR01 | Transfer of patent right |
Effective date of registration: 20110426 Address after: 200233 No. 222, Shanghai, Tianlin Road, China Patentee after: 3M China Co., Ltd. Address before: American Minnesota Patentee before: 3M Innovative Properties Company |