CN1862395B - 阳极化方法和由其生产的层 - Google Patents
阳极化方法和由其生产的层 Download PDFInfo
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- CN1862395B CN1862395B CN2006100803161A CN200610080316A CN1862395B CN 1862395 B CN1862395 B CN 1862395B CN 2006100803161 A CN2006100803161 A CN 2006100803161A CN 200610080316 A CN200610080316 A CN 200610080316A CN 1862395 B CN1862395 B CN 1862395B
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Classifications
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- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
- H01L21/02227—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process
- H01L21/02258—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process formation by anodic treatment, e.g. anodic oxidation
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- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
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- C25D11/024—Anodisation under pulsed or modulated current or potential
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- C—CHEMISTRY; METALLURGY
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- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
- C25D11/02—Anodisation
- C25D11/04—Anodisation of aluminium or alloys based thereon
- C25D11/06—Anodisation of aluminium or alloys based thereon characterised by the electrolytes used
- C25D11/10—Anodisation of aluminium or alloys based thereon characterised by the electrolytes used containing organic acids
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
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- C25D11/04—Anodisation of aluminium or alloys based thereon
- C25D11/12—Anodising more than once, e.g. in different baths
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
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- C25D11/16—Pretreatment, e.g. desmutting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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Abstract
公开了在感光体衬底上形成阻挡层的多步骤阳极化方法。该方法在相对短的时期内产生层。也公开了产生相对硬的阳极化层的预热操作。预热操作可以与任一种多步骤阳极化方法,或与常规方法结合使用。
Description
技术领域
本公开内容在各种例示实施方案中涉及快速阳极化方法,该方法产生适于感光体衬底的硬阳极化阻挡层。
背景技术
静电摄影成像系统是公知的,它包括静电潜像在静电摄影成像表面或感光体上的形成和显影。静电复印感光体可以采用单层或多层结构制备。依赖于应用,感光体可以采用几种形式,如柔性带、圆筒形转鼓、板等制备。带通常在聚合物衬底上制备,聚(对苯二甲酸乙二醇酯)是最通常的。对于转鼓,衬底典型地是金属圆筒。通常,中空铝圆筒广泛用于低和中体积应用。然而,转鼓结构对于高体积和颜色应用具有某些工艺限制。
感光体通过将各层(即生电层、输电层等)按顺序施加到聚合物或转鼓衬底外表面上而制备。许多涂覆技术(即喷涂、纺丝、挤出、浸渍、叶片涂覆,辊涂等)可用于生产这些层。气相沉积也可用于一些颜料的金属化和施加。
目前,不能制备没有缺陷和碳纤维问题的长寿命感光体。然而,衬底上的电解阻挡层可延长感光体的寿命。然而,这种阻挡层典型地要求至多15分钟以进行施加,因此对于工业制造不具有吸引力。电解阻挡层的另一个缺点涉及阻挡的硬度不够和因此差的碳纤维坚固性。
延长的感光体寿命,例如两到十倍的寿命增加,和坚固性目前由于部分使用电解阻挡层,且特别是由低温受控电压和有机酸阳极化形成的电解阻挡层而达到。尽管该过程看起来可在小于一分钟内基本完成,但如果在一、二、五和十分钟各点终止该过程,则获得涉及缺陷程度的混合结果,因此延长寿命。已经证明通过持续施加电压超过十分钟的时间获得一致的结果。相信在延长的加工时间期间另外的杂质被从铝感光体衬底表面除去。当这种杂质被留在原位和不脱除时,这些杂质作为引发缺陷的部位。然而,超过一分钟的时间对于大多数工业制造操作不具有吸引力。
因此,需要提供可靠地促进延长的寿命但可以在一分钟或更少时间内进行的方法。
发明内容
本公开内容在各种例示实施方案中涉及在感光体衬底上由有机酸阳极化形成阻挡层的方法。该方法包括提供感光体衬底和提供有机酸电解质。该方法进一步包括使感光体衬底与电解质接触。该方法也包括对与电解质接触的感光体衬底施加多步骤电压程序。该程序包括第一步骤,其中将第一电压施加第一时期,和第二步骤,其中将小于第一电压的第二电压施加第二时期。
在实施方案中,在上述方法中第二电压是第一电压的约50%-约20%。在实施方案中,在上述方法中第二电压是第一电压的约40%-约30%。在实施方案中,在上述方法中第一时期和第二时期的总和小于5分钟。在实施方案中,在上述方法中第一时期和第二时期的总和小于1分钟。在实施方案中,在上述方法中第一步骤采用约20-约24伏的电压和第二步骤采用约12-约17伏的电压。
在实施方案中,在上述方法中所述程序包括第三步骤,其中将小于第二电压的第三电压施加第三时期。在实施方案中,在该方法中第三电压是第二电压的约30%-约20%。在实施方案中,在该方法中第二电压是第一电压的约40%-约30%。在实施方案中,在该方法中第一时期、第二时期和第三时期的总和小于5分钟。在实施方案中,在该方法中第一时期、第二时期和第三时期的总和小于1分钟。在实施方案中,在该方法中第一步骤采用约22-约26伏的电压,第二步骤采用约14-约18伏的电压和第三步骤采用约10-约14伏的电压。
在实施方案中,上述方法进一步包括:在施加多步骤电压程序之前,对感光体进行加热操作,其中使感光体经历约450℃-约650℃的温度。在实施方案中,在该方法中使感光体经历约550℃的温度。
本公开内容也涉及由以上方法生产的衬底和阻挡层。
在另一个例示实施方案中,提供在感光体衬底上由有机酸阳极化形成阻挡层的方法。该方法包括提供感光体衬底和提供有机酸电解质。该方法包括加热感光体衬底到约450℃-约650℃的温度。该方法也包括使感光体衬底与电解质接触。并且该方法包括对与电解质接触的感光体衬底施加电压一定的时间以在其上形成阳极化层。
在实施方案中,在上述方法中温度是约550℃。在实施方案中,在上述方法中加热进行约10秒-约60秒的时期。
在阅读和理解优选实施方案的以下详细描述时,本例示性实施方案的其它优点和益处对本领域技术人员是显然的。
具体实施方式
例示的实施方案提供快速和低电压阳极化方法以形成用于衬底如用于有机光导体感光体的那些的电解阻挡层。该方法使用降低的电压程序,如约24伏-约12伏以将加工时间从15分钟降低到低至42秒。获得的阳极化阻挡层延长有机光电导感光体的功能寿命和防止由涂覆层的碳纤维穿透引起的缺陷。
例示的实施方案提供使用多步骤电压程序形成电解阻挡层的方法。两步骤程序可采用第一步骤,其中将第一电压施加第一时期,和第二步骤,其中将小于第一电压的第二电压施加第二时期。第二电压是第一电压的约50%-约20%,且特别是第一电压的约40%-约30%。第一步骤的代表性电压可以是约20-约24伏,而第二步骤的代表性电压可以是约12-约17伏。两步骤程序的总时间,即第一和第二时期的总和小于约5分钟,且特别小于约1分钟。
三步骤程序可采用第一步骤,其中将第一电压施加第一时期;第二步骤,其中将小于第一电压的第二电压施加第二时期;和第三步骤,其中将小于第二电压的第三电压施加第三时期。第二电压是第一电压的约40%-约30%。第三电压是第二电压的约30%-约20%。第一步骤的代表性电压可以是约22-约26伏,第二步骤的代表性电压可以是约14-约18伏,和第三步骤的代表性电压可以是约10-约12伏。
通过在较高电压下开始加工和在加工期间逐渐降低电压,可以快速获得与从施加较长时间较低电压形成的阻挡层相同的阻挡层。例如,在24伏下开始,10秒后逐步降低到16伏下另外12秒,随后在12伏下另外20秒,产生与使用12伏15分钟获得的相同阻挡层,但仅需42秒。因此,该方法现在与一分钟的制造工艺步骤窗相容。
在1%w/w柠檬酸电解质中在14℃下在一分钟或更短时间内,通过分别在20和24伏下开始阻挡层加工15秒,随后分别在12和17伏下25秒,产生在12伏下形成厚度为二十纳米和在17伏下形成厚度为三十纳米的阻挡层。测试这些阻挡层并发现这些阻挡层相似于当使用12和17伏15分钟时产生的阻挡层。
除这些两步骤电压工艺以外,三步骤电压工艺也产生具有优异特性的层。实际上,尽管尚未得到证明,但相信电压的连续或逐渐降低会产生可比的结果。
注意到仅保持较高的电压较短的时间产生对于用于许多感光体而言太厚的阻挡层,因此产生超过100伏的残余电压。
尽管不希望受任何特定的理论约束,但相信更积极的开始电压在最先几秒内深度清洁衬底表面,而没有足够的时间形成太厚的阻挡层,随后在降低的电压下产生可使用的阻挡层。
例示的实施方案也提供特别使用热预处理的阳极化方法,该预处理在衬底如用于有机光电导体感光体的衬底上产生硬阳极化阻挡层。获得的硬层延长感光体寿命和降低碳纤维穿透问题。例示的实施方案可采用550℃热预处理。相信热处理产生在电解(阳极化)步骤期间增长的结晶氧化物″晶种″,引起更硬的阳极化阻挡层的形成。
在元件被阳极化之前通过使天然氧化铝在感光体衬底上经历高温,相对于正常无定形形式阻挡层成为结晶。此结晶变体比无定形形式更硬。
更具体地,采用加热预处理的例示性实施方案方法可以与形成电解阻挡层的常规方法,更具体地与在此所述的加速方法结合使用。例示的实施方案热处理的特征为使元件接收阻挡层,如感光体到约450℃-约650℃,和特别地约500℃的温度。然而,这种加热的时期可变化,可以采用约10秒-约60秒,和特别地约30秒的时间。
首先使清洁的感光体衬底在550℃下经历30秒热处理,然后在10伏下在1%柠檬酸电解质中在14℃下阳极化15分钟。或者,例示的实施方案包括使用16伏15秒随后使用10伏25秒。这些方法将产生电容等于在12伏下在相同系统中在15分钟之后产生的阻挡层的结晶阻挡层。
尽管在此所述的此热处理不引起天然氧化物生长非常多,但相信热处理引起在随后电解(阳极化)步骤期间增长的结晶氧化物″晶种″的形成。
下面是电解工艺的一般性描述。在电解池中,工作电极是感光体衬底(阳极)。对电极可以是同心的,通常围绕衬底的外部。在圆筒形衬底的情况下为同时清洁衬底的内部,同心对电极可以布置在衬底的内部。对电极或电极可以是贵金属如金、银、铂、钯;惰性金属如石墨;或强被动材料如钛、铅、钽或其合金。采用能够输送直流电压的电源调节池电压。
使用的电解质可以是任意的几种酸。这些包括柠檬酸一水合物、草酸二水合物和d-酒石酸。优选,柠檬酸以0.5和1.0w/v%(pH 2)使用。草酸以0.5、0.62和1.0w/v%(pH 1)使用。D-酒石酸以0.5和1.0w/v%(pH 2.5)使用。使用的温度是13-18℃。这些浴通常对浓度变化不敏感且仅对这些范围中的温度变化轻微敏感。注意这些特性使这些浴对于制造是有吸引力的(低浓度和对操作参数变化的稳健性)。除这些有机酸以外,也可以使用通常用于阳极化的无机酸如硫酸、铬酸等。通常,优选柠檬酸,因为它是最环境友好的。使用的电压通常为8-24伏。
在实施方案中,在衬底表面上形成金属氧化物层,其中由例示的实施方案增加的金属氧化物层的厚度为约50-约200埃,和更特别地约70-约150埃。金属氧化物可以例如是氧化铝。实际厚度难以测量。因此在替代的方案中,测量成品感光体的所谓V低并在工艺中调节以保持V低到小于100伏。在阳极化工艺结束时通过的最终电流用作了解已经获得良好阻挡层的替代物。注意到除阻挡层的厚度以外此最终电流依赖于几个因素。这些其它因素因此优选保持恒定和包括:阳极化部件的数目和尺寸、支架(固定部件)结构和较小程度的电解质温度。也注意到优选足够的电解质运动(混合)以保证均匀的温度(+/-1℃)。
衬底优选是中空圆圆筒并定义为顶部非成像部分、中间成像部分和底部非成像部分。这三个衬底部分的精确尺寸在实施方案中变化。作为举例说明性尺寸,顶部非成像部分的长度为约10-约50mm,和特别地约20-约40mm。中间成像部分的长度可以为从约200到大于1000mm,和特别地约250-约300mm。底部非成像部分的长度可以为约10-约1mm,和特别地约5-约10mm。衬底可以没有层状材料或可以在将衬底浸入涂料溶液之前由层状材料涂覆。
衬底可以完全由导电金属配制,或它可以是具有导电表面的绝缘材料。衬底可以是不透明或基本透明的并可包括具有所需机械性能的许多合适材料。整个衬底可包括与导电表面中相同的材料或导电物质仅可以是衬底上的涂层。可以采用任何合适的导电材料。典型的导电材料包括金属如铜、黄铜、镍、锌、铬、不锈钢;和导电塑料和橡胶、铝、半透明铝、钢、镉、钛、银、金、通过在其中包含合适的材料或通过在潮湿气氛中调节以保证足够水含量的存在以使材料导电而变为导电的纸、铟、锡、金属氧化物,包括氧化锡和氧化铟锡等。涂覆或未涂覆的衬底可以是柔性或刚性的,并可具有任何数目的诸如圆筒转鼓、环状柔性带等的构造。此(基条)应当优选是可阳极化的(Ti,Al等)或在阳极化工艺之后加入。
依赖于光电导元件的所需用途,衬底元件层的厚度可以在相当宽的范围内变化。通常,导电层的厚度为约50埃到10厘米,尽管厚度可以在此范围以外。如所需,可以将导电衬底涂覆到绝缘材料上。此外,衬底可包括金属化塑料,如钛化或铝化MYLAR(购自DuPont)。涂覆或未涂覆的衬底可以是柔性或刚性的,并可具有任何数目的构造。衬底优选具有中空、圆筒形构造。
光敏元件的层包括诸如替代层、电荷阻挡层、粘合层、输电层和生电层的层。
在某些实施方案中,可以通过在基料树脂如聚酯、聚苯乙烯、聚乙烯醇缩丁醛、聚乙烯基吡咯烷酮、甲基纤维素、聚丙烯酸酯、纤维素酯等中分散选自如下的生电材料(CGL)形成涂料溶液:偶氮颜料如苏丹红、Dian蓝、Janus绿B等;奎宁颜料如Algol黄、芘醌、阴丹士林艳紫RRP等;喹啉并花青颜料;苝颜料;靛蓝颜料如靛蓝、硫靛蓝等;双苯并咪唑颜料如Indofast橙调色剂等;酞菁颜料如铜酞菁、铝氯酞菁等;喹吖啶酮颜料;或甘菊环化合物。
颜料粒子的平均粒度为约0.05微米-约0.10微米。通常,用于浸没涂料混合物的生电层分散体包含重量比为20%颜料/80%聚合物到80%颜料/20%聚合物的颜料和成膜聚合物。将颜料和聚合物组合分散在溶剂中以获得3-6wt%的固体含量,基于混合物的总重量。然而,可以采用这些范围以外的百分比,只要满足此公开内容的方法的目的。代表性生电层涂料分散体包括例如约2wt%羟基镓酞菁;约1wt%醋酸乙烯酯、氯乙烯和马来酸的三元共聚物(或醋酸乙烯酯、乙烯醇和丙烯酸羟乙酯的三元共聚物);和约97wt%环己酮。
在其它实施方案中,可以通过在具有成膜性能的树脂中溶解选自如下的输电材料(CTL)形成涂料溶液:在主链或侧链中具有多环芳族环的化合物如蒽、芘、菲、蔻等,或含氮杂环如吲哚、咔唑、唑、异唑、噻唑、咪唑、吡唑、二唑、吡唑啉、噻二唑、三唑等,和腙化合物。这种树脂可包括聚碳酸酯、聚甲基丙烯酸酯、聚丙烯酸酯、聚苯乙烯、聚酯、聚砜、苯乙烯-丙烯腈共聚物、苯乙烯-甲基丙烯酸甲酯共聚物等。
举例说明性输电层涂料溶液包含例如约10wt%的N,N’-二苯基-N,N’-双(3-甲基苯基)-[1,1’-联苯]-4,4’-二胺;约14wt%聚(4,4’-二苯基-1,1’-环己烷碳酸酯)(400分子量);约57wt%四氢呋喃;和约19wt%单氯苯。
此外,生电层、输电层和/或其它层可以采用任何合适的顺序施加以产生正性或负性感光体。
由本公开内容生成的感光体可以由如下方式用于电子照相成像工艺:例如首先使感光体均匀带静电荷,然后使带电的感光体暴露于活化电磁辐射如光的图案中,它选择性地消散在感光体受照区域中的电荷同时在非受照区域中留下静电图像。然后可以通过例如由显影剂组合物在感光体表面上沉积细分的验电调色剂粒子在一个或多个显影站显影此静电潜像以形成可见图像。可以将获得的可见调色剂图像转印到合适的接收元件如纸上。然后典型地在再充电用于形成后继图像之前在清洁站清洁感光体。
Claims (10)
1.在感光体衬底上由有机酸阳极化形成阻挡层的方法,包括:
提供感光体衬底;
提供有机酸电解质;
对与电解质接触的感光体衬底施加多步骤电压程序,其中所述程序包括第一步骤,其中将20~24伏的第一电压施加第一时期,和第二步骤,其中将12~17伏的第二电压施加第二时期,其中第一时期与第二时期的总和小于5分钟。
2.权利要求1的方法,其中第一时期与第二时期的总和小于1分钟。
3.权利要求1的方法,进一步包括:
在施加多步骤电压程序之前,使感光体经历加热操作,其中使感光体经历450℃-650℃的温度。
4.权利要求3的方法,其中所述温度为550℃。
5.通过权利要求1的方法在感光体衬底上由有机酸阳极化形成的阻挡层。
6.在感光体衬底上由有机酸阳极化形成阻挡层的方法,包括:
提供感光体衬底;
提供有机酸电解质;
对与电解质接触的感光体衬底施加多步骤电压程序,其中所述程序包括第一步骤,其中将22~26伏的第一电压施加第一时期,和第二步骤,其中将14~18伏的第二电压施加第二时期,以及第三步骤,其中将10~12伏的第三电压施加第三时期,其中第一时期、第二时期与第三时期的总和小于5分钟。
7.权利要求6的方法,其中第一时期、第二时期与第三时期的总和小于1分钟。
8.权利要求6的方法,进一步包括:
在施加多步骤电压程序之前,使感光体经历加热操作,其中使感光体经历450℃-650℃的温度。
9.权利要求8的方法,其中所述温度为550℃。
10.通过权利要求6的方法在感光体衬底上由有机酸阳极化形成的阻挡层。
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US11/125,866 | 2005-05-10 |
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CN1206851A (zh) * | 1997-07-16 | 1999-02-03 | 富士电机株式会社 | 电摄影光电导体用基体以及使用该基体的电摄影光电导体 |
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US4265990A (en) * | 1977-05-04 | 1981-05-05 | Xerox Corporation | Imaging system with a diamine charge transport material in a polycarbonate resin |
US4390611A (en) * | 1980-09-26 | 1983-06-28 | Shozo Ishikawa | Electrophotographic photosensitive azo pigment containing members |
GB2129812B (en) * | 1982-11-05 | 1985-11-13 | Stc Plc | Compositions for inhibiting corrosion of metal surfaces |
US4596754A (en) * | 1984-04-27 | 1986-06-24 | Ricoh Company, Ltd. | Electrophotographic printing original plate and electrophotographic plate making process using the printing original plate |
US4588667A (en) * | 1984-05-15 | 1986-05-13 | Xerox Corporation | Electrophotographic imaging member and process comprising sputtering titanium on substrate |
US4797337A (en) * | 1987-07-27 | 1989-01-10 | Xerox Corporation | Disazo photoconductive imaging members |
US5089092A (en) * | 1989-09-26 | 1992-02-18 | Kyoto University | Porous aluminum oxide film and method of forming of the same |
US5733661A (en) * | 1994-11-11 | 1998-03-31 | Mitsubishi Chemical Corporation | High-permittivity composite oxide film and uses thereof |
US5841179A (en) * | 1996-08-28 | 1998-11-24 | Advanced Micro Devices, Inc. | Conductive layer with anti-reflective surface portion |
US20030065934A1 (en) * | 2001-09-28 | 2003-04-03 | Angelo Michael F. | After the fact protection of data in remote personal and wireless devices |
US6789602B2 (en) * | 2002-02-11 | 2004-09-14 | Commonwealth Industries, Inc. | Process for producing aluminum sheet product having controlled recrystallization |
US7029810B2 (en) * | 2002-09-20 | 2006-04-18 | Ricoh Company, Ltd. | Electrophotographic image forming apparatus |
US7285366B2 (en) * | 2004-09-28 | 2007-10-23 | Konica Minolta Business Technologies, Inc. | Organic photoreceptor, an image forming method, an image forming apparatus and a process cartridge |
US20080043726A1 (en) * | 2006-08-21 | 2008-02-21 | Telefonaktiebolaget L M Ericsson (Publ) | Selective Control of User Equipment Capabilities |
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JP平1-244469A 1989.09.28 |
JP昭61-198245A 1986.09.02 |
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