CN1819327B - 光调制器模块 - Google Patents
光调制器模块 Download PDFInfo
- Publication number
- CN1819327B CN1819327B CN2006100057128A CN200610005712A CN1819327B CN 1819327 B CN1819327 B CN 1819327B CN 2006100057128 A CN2006100057128 A CN 2006100057128A CN 200610005712 A CN200610005712 A CN 200610005712A CN 1819327 B CN1819327 B CN 1819327B
- Authority
- CN
- China
- Prior art keywords
- transmission lines
- transmission line
- high frequency
- chip carrier
- frequency substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000003287 optical effect Effects 0.000 title claims abstract description 40
- 230000005540 biological transmission Effects 0.000 claims abstract description 105
- 239000000758 substrate Substances 0.000 claims abstract description 72
- 238000004806 packaging method and process Methods 0.000 claims description 35
- 230000005684 electric field Effects 0.000 description 8
- 238000005538 encapsulation Methods 0.000 description 8
- 239000004020 conductor Substances 0.000 description 7
- 239000013307 optical fiber Substances 0.000 description 5
- 230000008878 coupling Effects 0.000 description 4
- 238000010168 coupling process Methods 0.000 description 4
- 238000005859 coupling reaction Methods 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 230000001939 inductive effect Effects 0.000 description 2
- 239000000969 carrier Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004021 metal welding Methods 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/4279—Radio frequency signal propagation aspects of the electrical connection, high frequency adaptations
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Optical Modulation, Optical Deflection, Nonlinear Optics, Optical Demodulation, Optical Logic Elements (AREA)
- Semiconductor Lasers (AREA)
- Optical Couplings Of Light Guides (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005030249A JP2006215440A (ja) | 2005-02-07 | 2005-02-07 | 光変調器モジュール |
| JP2005-030249 | 2005-02-07 | ||
| JP2005030249 | 2005-02-07 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1819327A CN1819327A (zh) | 2006-08-16 |
| CN1819327B true CN1819327B (zh) | 2011-06-22 |
Family
ID=36291084
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2006100057128A Expired - Fee Related CN1819327B (zh) | 2005-02-07 | 2006-01-06 | 光调制器模块 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US7391099B2 (enExample) |
| EP (1) | EP1688771A1 (enExample) |
| JP (1) | JP2006215440A (enExample) |
| CN (1) | CN1819327B (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5945213B2 (ja) * | 2012-10-30 | 2016-07-05 | 日本電信電話株式会社 | 光半導体装置 |
| CN111965770B (zh) * | 2020-09-25 | 2022-09-16 | 青岛海信宽带多媒体技术有限公司 | 一种光模块 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58150885A (ja) * | 1982-03-02 | 1983-09-07 | Sanyo Electric Co Ltd | 電子砂時計 |
| JPH01143502A (ja) * | 1987-11-30 | 1989-06-06 | Matsushita Electric Ind Co Ltd | マイクロ波集積回路 |
| JPH06130338A (ja) * | 1992-10-22 | 1994-05-13 | Fujitsu Ltd | 光導波路デバイス |
| JPH09252164A (ja) * | 1996-03-15 | 1997-09-22 | Mitsubishi Electric Corp | レーザダイオードモジュール |
| US5982793A (en) * | 1996-05-20 | 1999-11-09 | Matsushita Electric Industrial Co., Ltd. | Semiconductor laser module with internal matching circuit |
| JPH10275957A (ja) * | 1997-03-31 | 1998-10-13 | Hitachi Ltd | 光半導体チップキャリア |
| JP2001160670A (ja) * | 1999-11-30 | 2001-06-12 | Murata Mfg Co Ltd | 実装部品搭載装置 |
| JP3909257B2 (ja) * | 2002-03-12 | 2007-04-25 | 日本オプネクスト株式会社 | 光結合装置 |
| JP2003318601A (ja) * | 2002-04-25 | 2003-11-07 | Opnext Japan Inc | 高周波伝送線路及びこれを用いた光モジュール |
| JP2004093606A (ja) * | 2002-08-29 | 2004-03-25 | Opnext Japan Inc | 光モジュール及び光伝送装置 |
| JP3805736B2 (ja) * | 2002-10-10 | 2006-08-09 | 日本オプネクスト株式会社 | 伝送線路及びこれを用いた光モジュール |
| US6873449B1 (en) * | 2003-09-05 | 2005-03-29 | The Furukawa Electric Co., Ltd. | Signal transmission line for an optical modulator |
-
2005
- 2005-02-07 JP JP2005030249A patent/JP2006215440A/ja active Pending
-
2006
- 2006-01-06 CN CN2006100057128A patent/CN1819327B/zh not_active Expired - Fee Related
- 2006-01-27 EP EP06001757A patent/EP1688771A1/en not_active Withdrawn
- 2006-01-31 US US11/342,883 patent/US7391099B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| JP2006215440A (ja) | 2006-08-17 |
| US20060175676A1 (en) | 2006-08-10 |
| EP1688771A1 (en) | 2006-08-09 |
| US7391099B2 (en) | 2008-06-24 |
| CN1819327A (zh) | 2006-08-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN100428591C (zh) | 高速率半导体光发射组件的封装结构及方法 | |
| US7489514B2 (en) | LSI package equipped with interface module, interface module and connection holding mechanism | |
| JP4131935B2 (ja) | インターフェイスモジュールとインターフェイスモジュール付lsiパッケージ及びその実装方法 | |
| US7911066B2 (en) | Through-chip via interconnects for stacked integrated circuit structures | |
| US6911734B2 (en) | Semiconductor device and electronic device | |
| US8031992B2 (en) | Optoelectronic module and method for producing an optoelectronic module | |
| WO2021098266A1 (zh) | 一种边耦合光电器件封装结构及其制备方法 | |
| WO2022141953A1 (zh) | 一种to封装结构 | |
| CN1819327B (zh) | 光调制器模块 | |
| KR100883128B1 (ko) | 광 하이브리드 모듈 | |
| TWI247144B (en) | Receiving optical subassembly | |
| US6927477B2 (en) | Coplanar line, and a module using the coplanar line | |
| JP2000019473A (ja) | 光モジュールの実装構造 | |
| CN111766664A (zh) | 一种光发射组件及光模块 | |
| EP4421852A1 (en) | Photoelectric transceiver assembly and method for manufacturing same | |
| JP2004335584A (ja) | 半導体パッケージ | |
| EP1267459A1 (en) | Heatsinks for laser electronic packages | |
| US7029185B2 (en) | Optical chip module and optical chip module device | |
| EP1605506A2 (en) | Semiconductor device | |
| JP3916072B2 (ja) | 交流結合回路 | |
| JPS62124780A (ja) | 光半導体モジユ−ル | |
| CN110082868A (zh) | 光收发组件及具有其的光模块 | |
| JP2004342882A (ja) | 半導体ステム | |
| CN111916419B (zh) | 用于光电模块的电耦合配件和方法 | |
| JP3848616B2 (ja) | ガラス端子 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee |
Owner name: OCLARO INC. Free format text: FORMER NAME: JAPAN KOSHIN CO. LTD. |
|
| CP01 | Change in the name or title of a patent holder |
Address after: Kanagawa Patentee after: Oclaro Japan, Inc. Address before: Kanagawa Patentee before: Opnext Japan, Inc. |
|
| CP01 | Change in the name or title of a patent holder |
Address after: Kanagawa Patentee after: Lang Mei Tong Co.,Ltd. of Japan Address before: Kanagawa Patentee before: Oclaro Japan, Inc. |
|
| CP01 | Change in the name or title of a patent holder | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110622 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |