CN1818002B - 抛光浆料 - Google Patents
抛光浆料 Download PDFInfo
- Publication number
- CN1818002B CN1818002B CN2005101347759A CN200510134775A CN1818002B CN 1818002 B CN1818002 B CN 1818002B CN 2005101347759 A CN2005101347759 A CN 2005101347759A CN 200510134775 A CN200510134775 A CN 200510134775A CN 1818002 B CN1818002 B CN 1818002B
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- persursor material
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- polishing
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- 239000002002 slurry Substances 0.000 title claims abstract description 111
- 238000005498 polishing Methods 0.000 title claims abstract description 88
- 239000002245 particle Substances 0.000 title claims description 195
- 238000000034 method Methods 0.000 title abstract description 88
- 239000000463 material Substances 0.000 claims description 103
- CETPSERCERDGAM-UHFFFAOYSA-N ceric oxide Chemical compound O=[Ce]=O CETPSERCERDGAM-UHFFFAOYSA-N 0.000 claims description 77
- 229910000422 cerium(IV) oxide Inorganic materials 0.000 claims description 77
- 239000003795 chemical substances by application Substances 0.000 claims description 60
- GHLITDDQOMIBFS-UHFFFAOYSA-H cerium(3+);tricarbonate Chemical compound [Ce+3].[Ce+3].[O-]C([O-])=O.[O-]C([O-])=O.[O-]C([O-])=O GHLITDDQOMIBFS-UHFFFAOYSA-H 0.000 claims description 58
- 239000006061 abrasive grain Substances 0.000 claims description 48
- 239000006185 dispersion Substances 0.000 claims description 35
- 239000008187 granular material Substances 0.000 claims description 13
- 238000006243 chemical reaction Methods 0.000 claims description 10
- 238000002156 mixing Methods 0.000 claims description 10
- 239000002994 raw material Substances 0.000 claims description 4
- 230000001143 conditioned effect Effects 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 abstract description 15
- 150000004767 nitrides Chemical class 0.000 abstract description 11
- 230000008569 process Effects 0.000 abstract description 3
- 235000012431 wafers Nutrition 0.000 abstract 1
- 238000001354 calcination Methods 0.000 description 85
- 238000012545 processing Methods 0.000 description 60
- 238000004513 sizing Methods 0.000 description 53
- 239000000843 powder Substances 0.000 description 34
- 229910000420 cerium oxide Inorganic materials 0.000 description 29
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 29
- 238000009826 distribution Methods 0.000 description 27
- 238000004519 manufacturing process Methods 0.000 description 18
- 238000002360 preparation method Methods 0.000 description 15
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 15
- 238000000227 grinding Methods 0.000 description 14
- 239000000654 additive Substances 0.000 description 11
- 230000000996 additive effect Effects 0.000 description 11
- 230000006641 stabilisation Effects 0.000 description 11
- 238000011105 stabilization Methods 0.000 description 11
- 238000005516 engineering process Methods 0.000 description 9
- 238000010298 pulverizing process Methods 0.000 description 9
- 238000012360 testing method Methods 0.000 description 9
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 8
- 239000000203 mixture Substances 0.000 description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 7
- 230000008859 change Effects 0.000 description 7
- 239000013078 crystal Substances 0.000 description 7
- 239000008367 deionised water Substances 0.000 description 7
- 229910021641 deionized water Inorganic materials 0.000 description 7
- 239000007787 solid Substances 0.000 description 7
- 238000001556 precipitation Methods 0.000 description 6
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 description 5
- 125000000129 anionic group Chemical group 0.000 description 5
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 5
- 150000001875 compounds Chemical class 0.000 description 5
- 239000002270 dispersing agent Substances 0.000 description 5
- 229910052760 oxygen Inorganic materials 0.000 description 5
- 239000001301 oxygen Substances 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 4
- 235000011089 carbon dioxide Nutrition 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000001035 drying Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000002955 isolation Methods 0.000 description 4
- 229920000642 polymer Polymers 0.000 description 4
- 239000000047 product Substances 0.000 description 4
- 238000010521 absorption reaction Methods 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- 230000002776 aggregation Effects 0.000 description 3
- 238000004458 analytical method Methods 0.000 description 3
- 229920006318 anionic polymer Polymers 0.000 description 3
- 239000006227 byproduct Substances 0.000 description 3
- -1 carboxyl-propenyl Chemical group 0.000 description 3
- 230000001276 controlling effect Effects 0.000 description 3
- 238000009792 diffusion process Methods 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 229920000193 polymethacrylate Polymers 0.000 description 3
- 229910052761 rare earth metal Inorganic materials 0.000 description 3
- 239000000377 silicon dioxide Substances 0.000 description 3
- 229960001866 silicon dioxide Drugs 0.000 description 3
- 235000012239 silicon dioxide Nutrition 0.000 description 3
- 229910052684 Cerium Inorganic materials 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- 229920002125 Sokalan® Polymers 0.000 description 2
- 239000013543 active substance Substances 0.000 description 2
- 238000004220 aggregation Methods 0.000 description 2
- 230000032683 aging Effects 0.000 description 2
- 239000001569 carbon dioxide Substances 0.000 description 2
- 229910002092 carbon dioxide Inorganic materials 0.000 description 2
- GWXLDORMOJMVQZ-UHFFFAOYSA-N cerium Chemical compound [Ce] GWXLDORMOJMVQZ-UHFFFAOYSA-N 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000001914 filtration Methods 0.000 description 2
- 230000012010 growth Effects 0.000 description 2
- 230000002045 lasting effect Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000002105 nanoparticle Substances 0.000 description 2
- 238000012856 packing Methods 0.000 description 2
- 239000004584 polyacrylic acid Substances 0.000 description 2
- 230000001376 precipitating effect Effects 0.000 description 2
- 238000002203 pretreatment Methods 0.000 description 2
- 150000002910 rare earth metals Chemical class 0.000 description 2
- 230000000630 rising effect Effects 0.000 description 2
- 239000007858 starting material Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 238000005303 weighing Methods 0.000 description 2
- 238000001238 wet grinding Methods 0.000 description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 1
- 244000287680 Garcinia dulcis Species 0.000 description 1
- 206010021703 Indifference Diseases 0.000 description 1
- 229920002845 Poly(methacrylic acid) Polymers 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 1
- 238000002441 X-ray diffraction Methods 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- 239000003082 abrasive agent Substances 0.000 description 1
- 239000002250 absorbent Substances 0.000 description 1
- 238000005054 agglomeration Methods 0.000 description 1
- 238000000149 argon plasma sintering Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 150000004649 carbonic acid derivatives Chemical class 0.000 description 1
- 125000005586 carbonic acid group Chemical group 0.000 description 1
- HDXXSUQVQKJEBI-UHFFFAOYSA-N carbonic acid;cerium Chemical compound [Ce].OC(O)=O HDXXSUQVQKJEBI-UHFFFAOYSA-N 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 238000000975 co-precipitation Methods 0.000 description 1
- 238000005354 coacervation Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 230000000994 depressogenic effect Effects 0.000 description 1
- 238000009837 dry grinding Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000011163 secondary particle Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 238000000527 sonication Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 230000002194 synthesizing effect Effects 0.000 description 1
- 238000007669 thermal treatment Methods 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82B—NANOSTRUCTURES FORMED BY MANIPULATION OF INDIVIDUAL ATOMS, MOLECULES, OR LIMITED COLLECTIONS OF ATOMS OR MOLECULES AS DISCRETE UNITS; MANUFACTURE OR TREATMENT THEREOF
- B82B3/00—Manufacture or treatment of nanostructures by manipulation of individual atoms or molecules, or limited collections of atoms or molecules as discrete units
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1454—Abrasive powders, suspensions and pastes for polishing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/32115—Planarisation
- H01L21/3212—Planarisation by chemical mechanical polishing [CMP]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Organic Chemistry (AREA)
- Crystallography & Structural Chemistry (AREA)
- Nanotechnology (AREA)
- Materials Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Compounds Of Alkaline-Earth Elements, Aluminum Or Rare-Earth Metals (AREA)
Abstract
Description
D1 (尺寸较大) | D50 (尺寸中等) | D99 (尺寸较小) | |
前驱体材料1 | 365.3μm | 120.5μm | 2.4μm |
前驱体材料2 | 107.7μm | 34.9μm | 2.5μm |
前驱体材料3 | 51.9μm | 6.483μm | 1.5μm |
dD1(nm) | dD15(nm) | dD50(nm) | |
浆料1 | 4 | 3 | 3 |
浆料2 | 234 | 110 | 43 |
Claims (6)
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020040107276 | 2004-12-16 | ||
KR1020040107276A KR101082620B1 (ko) | 2004-12-16 | 2004-12-16 | 연마용 슬러리 |
KR10-2004-0107276 | 2004-12-16 | ||
KR10-2005-0063665 | 2005-07-14 | ||
KR1020050063665A KR100637403B1 (ko) | 2005-07-14 | 2005-07-14 | 연마 입자, 연마용 슬러리 및 이의 제조 방법 |
KR1020050063665 | 2005-07-14 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2007103016209A Division CN101255286B (zh) | 2004-12-16 | 2005-12-16 | 磨料颗粒、抛光浆料及其制造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1818002A CN1818002A (zh) | 2006-08-16 |
CN1818002B true CN1818002B (zh) | 2013-04-10 |
Family
ID=36918209
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2007103016209A Active CN101255286B (zh) | 2004-12-16 | 2005-12-16 | 磨料颗粒、抛光浆料及其制造方法 |
CN2005101347759A Active CN1818002B (zh) | 2004-12-16 | 2005-12-16 | 抛光浆料 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2007103016209A Active CN101255286B (zh) | 2004-12-16 | 2005-12-16 | 磨料颗粒、抛光浆料及其制造方法 |
Country Status (2)
Country | Link |
---|---|
KR (1) | KR101082620B1 (zh) |
CN (2) | CN101255286B (zh) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2010038617A1 (ja) * | 2008-10-01 | 2010-04-08 | 旭硝子株式会社 | 研磨スラリー、その製造方法、研磨方法および磁気ディスク用ガラス基板の製造方法 |
CN103011240A (zh) * | 2012-12-24 | 2013-04-03 | 赣州虔东稀土集团股份有限公司 | 一种大颗粒稀土碳酸盐及其制备方法与应用 |
CN103468149A (zh) * | 2013-09-18 | 2013-12-25 | 苏州市博飞光学有限公司 | 一种氯化稀土抛光粉及生产方法 |
CN104673098B (zh) * | 2013-11-28 | 2017-01-18 | 安阳工学院 | 氧化铈基稀土抛光粉的制备工艺 |
KR102632104B1 (ko) * | 2017-11-30 | 2024-02-02 | 솔브레인 주식회사 | 연마용 슬러리 조성물, 이의 제조방법 및 이를 이용한 반도체 박막의 연마방법 |
KR102679496B1 (ko) * | 2017-11-30 | 2024-07-01 | 솔브레인 주식회사 | 연마용 슬러리 조성물, 이의 제조방법 및 이를 이용한 반도체 박막의 연마 방법 |
CN112724836B (zh) * | 2020-12-24 | 2022-03-29 | 德米特(苏州)电子环保材料有限公司 | 一种铈锆掺杂抛光液及其制备方法和应用 |
CN112680115A (zh) * | 2021-01-04 | 2021-04-20 | 上海晖研材料科技有限公司 | 一种氧化铈颗粒在抛光工艺中的应用 |
CN112723405A (zh) * | 2021-01-04 | 2021-04-30 | 上海晖研材料科技有限公司 | 一种氧化铈颗粒及含其的抛光浆料 |
CN112758974A (zh) * | 2021-01-04 | 2021-05-07 | 上海晖研材料科技有限公司 | 一种氧化铈颗粒的制备方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1480503A (zh) * | 1997-12-18 | 2004-03-10 | 日立化成工业株式会社 | 研磨剂、基片的研磨法和半导体装置的制造方法 |
JP2004250714A (ja) * | 2004-05-17 | 2004-09-09 | Hitachi Chem Co Ltd | 酸化セリウム研磨剤および基板の研磨法 |
JP2004289170A (ja) * | 2004-05-10 | 2004-10-14 | Hitachi Chem Co Ltd | 酸化セリウム研磨剤および基板の研磨法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100622519B1 (ko) * | 1996-09-30 | 2006-09-11 | 히다치 가세고교 가부시끼가이샤 | 산화세륨 입자 |
CA2263241C (en) * | 1996-09-30 | 2004-11-16 | Masato Yoshida | Cerium oxide abrasive and method of abrading substrates |
JPH11181407A (ja) * | 1997-12-18 | 1999-07-06 | Hitachi Chem Co Ltd | 酸化セリウム研磨剤および基板の研磨法 |
US6143662A (en) * | 1998-02-18 | 2000-11-07 | Rodel Holdings, Inc. | Chemical mechanical polishing composition and method of polishing a substrate |
KR100417529B1 (ko) * | 2001-04-09 | 2004-02-05 | (주)케이.씨.텍 | 글리코 써멀법에 의한 나노 크기 세리아 분말의 제조방법 |
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2004
- 2004-12-16 KR KR1020040107276A patent/KR101082620B1/ko active IP Right Grant
-
2005
- 2005-12-16 CN CN2007103016209A patent/CN101255286B/zh active Active
- 2005-12-16 CN CN2005101347759A patent/CN1818002B/zh active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1480503A (zh) * | 1997-12-18 | 2004-03-10 | 日立化成工业株式会社 | 研磨剂、基片的研磨法和半导体装置的制造方法 |
JP2004289170A (ja) * | 2004-05-10 | 2004-10-14 | Hitachi Chem Co Ltd | 酸化セリウム研磨剤および基板の研磨法 |
JP2004250714A (ja) * | 2004-05-17 | 2004-09-09 | Hitachi Chem Co Ltd | 酸化セリウム研磨剤および基板の研磨法 |
Also Published As
Publication number | Publication date |
---|---|
CN1818002A (zh) | 2006-08-16 |
CN101255286B (zh) | 2011-09-14 |
CN101255286A (zh) | 2008-09-03 |
KR101082620B1 (ko) | 2011-11-15 |
KR20060068556A (ko) | 2006-06-21 |
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