CN1759639A - 用于保护部件或者模块的方法和装置 - Google Patents
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/562—Protection against mechanical damage
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
- H01L23/49816—Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49147—Assembling terminal to base
Abstract
本发明涉及用于保护部件或者模块的方法和装置,该方法和装置甚至能够增加部件或者模块的机械寿命。从模块到板的连通通常通过焊盘,如经由基板栅格阵列(LGA)来实现,其中,模块的内部区域设置有指定为用于电连通到板上的相应连接点的焊盘。为了保护部件或者模块,以及增加部件或者模块的机械寿命,部件或者模块(1)的外部区域设置有焊盘的外围外部排,其形成牺牲焊盘区域或者焊盘环(3),其中,单个的焊盘或者多个焊盘可以牺牲,而不破坏内部焊盘(2),该内部焊盘指定为用于电连通到设置在部件或者模块上的牺牲焊盘区域或者焊盘环内的板上的相应连接点。
Description
技术领域
本发明涉及用于保护部件或者模块的方法和装置,该方法和装置甚至能够增加部件或者模块的机械寿命。从模块到板的连通通常通过焊盘,如经由基板栅格阵列(LGA)来实现,其中,模块的内部区域设置有指定为用于电连通到板上的相应连接点的焊盘。
背景技术
从模块到板的连通通常通过模块上的焊盘来实现,当模块装配到板上时,该焊盘设置为与板上的导线或者触点接触。连接的焊盘难以检查,甚至难以确定或者估计模块关于焊盘的机械寿命。
发明内容
为了保护部件或者模块,以及增加部件或者模块的机械寿命,部件或者模块的外部区域设置有焊盘的外围外部排,其形成牺牲焊盘区域或者焊盘环,其中,单个的焊盘或者多个焊盘可以牺牲,而不破坏设置在部件或者模块上的牺牲焊盘区域或者焊盘环内的焊盘。通常通过进行模块的快速温度变化测试,同时检测和记录模块及其焊盘的构造的最后变化,来测量模块的机械寿命。当使用部件或者模块上的牺牲焊盘区域或者焊盘环,以及进行快速温度变化测试时,较容易检测部件或者模块上的损坏,因为牺牲焊盘区域或者焊盘环的焊盘或者多个焊盘首先被破坏,且焊盘区域或者焊盘环的任何焊盘的任何变形或者破裂可以容易地检测和记录为部件或者模块的质量的度量。
附图说明
图1是具有很多连接的矩形部件或者模块的底视图,其中,内部焊盘为未着色/白色,外部焊盘为着色/灰色,且构成为根据本发明的牺牲焊盘区域或者焊盘环。
图2是具有很多连接的圆形部件或者模块的底视图,其中,内部焊盘为未着色/白色,外部焊盘为着色/灰色,且构成为根据本发明的牺牲焊盘区域或者焊盘环。
图3是具有少量连接的矩形部件或者模块的底视图,其中,内部少量焊盘为未着色/白色,外部焊盘为着色/灰色,且构成为根据本发明的牺牲焊盘区域。
图4是具有很多连接的矩形部件或者模块的底视图,其中,内部焊盘为未着色/白色,外部焊盘为着色/灰色,且构成为根据本发明的牺牲焊盘区域或者焊盘环,以及其中,至少一个焊盘从焊盘区域或者焊盘环去除,以形成不对称的牺牲焊盘区域或者焊盘环。
具体实施方式
在图1中,显示了优选的矩形部件或者模块1,其中,6×9个内部焊盘2被外部焊盘区域或者焊盘环3围绕,该焊盘区域或者焊盘环包括四个外部焊盘排:2×10+2×7个焊盘。内部焊盘2设置为普通焊盘,其作用为连接到板,板上具有相应触点,其中,在部件或者模块上的每个焊盘使得能够与板上的相应触点接触,用于在部件或者模块与板之间交换电信号。外部焊盘区域或者焊盘环3构成牺牲焊盘区域或者焊盘环,且通常没有电接触功能,但是在该焊盘区域或者焊盘环中的任何焊盘可以另外用作生产线中的测试点/多个测试点,且可以连接到检测装置,其中,牺牲焊盘区域或者焊盘环的单个焊盘可以用作内部测试点,且在大多数情况下,它们的存在对于最终的使用者没有用。在牺牲焊盘区域或者焊盘环中的焊盘能够断开为开路,且这在大多数情况下不会影响部件或者模块的操作。
在图2中,显示了圆形部件或者模块4,其中,26个内部焊盘5被外部焊盘区域或者焊盘环6围绕。内部焊盘5设置为普通焊盘,其作用为连接到板,板上具有相应触点,其中,在部件或者模块上的每个焊盘5使得能够与板上的相应触点接触,用于在部件或者模块与板之间交换电信号。外部焊盘区域或者焊盘环6构成牺牲焊盘区域或者焊盘环,且通常没有电接触功能,但是在该焊盘区域或者焊盘环中的任何焊盘可以另外用作生产线中的测试点/多个测试点,其中,牺牲焊盘区域或者焊盘环的单个焊盘可以用作内部测试点,且在大多数情况下,它们的存在对于最终的使用者没有用。在牺牲焊盘区域或者焊盘环中的焊盘能够断开为开路,且这在大多数情况下不会影响部件或者模块的操作。
在图3中,显示了矩形部件或者模块7,其中,只有4个内部焊盘8被包括48个焊盘9的外部焊盘区域围绕。内部焊盘8设置为普通焊盘,其作用为连接到板,板上具有相应触点,其中,在部件或者模块上的每个焊盘使得能够与板上的相应触点接触,用于在部件或者模块与板之间交换电信号。外部焊盘区域9构成牺牲焊盘区域,且通常没有电接触功能,但是在该焊盘区域中的任何焊盘可以另外用作生产线中的测试点/多个测试点,其中,牺牲焊盘区域的单个焊盘可以用作内部测试点,且在大多数情况下,它们的存在对于最终的使用者没有用。在牺牲焊盘区域中的焊盘能够断开为开路,且这在大多数情况下不会影响部件或者模块的操作。
由于存在牺牲焊盘区域或者焊盘环,部件或者模块的机械寿命会增加。牺牲焊盘区域或者焊盘环给予第一内部连接点起作用的机械保护,防止水平和/或垂直载荷。当进行完快速温度变化测试时,在焊盘区域或者焊盘环内部的内部部分的任何部分被破坏以前,外部焊盘区域或者焊盘环的测试部分此时为部件或者模块的首先被破坏的部分。通过外部焊盘区域或者焊盘环,容易确定部件或者模块的机械寿命,当牺牲焊盘区域或者焊盘环的第一焊盘被破坏时,只通过在疲劳测试或者进行完快速温度变化测试下检测和记录,就能确定部件或者模块的很好限定的寿命。在测试时,在部件或者模块上的焊盘区域或者焊盘环的任何角部的焊盘首先被破坏,然后相邻放置的焊盘会被破坏,等等,因为机械应力在部件或者模决的角部处最大。
通过牺牲焊盘区域或者焊盘环,其中,在焊盘区域或者焊盘环中的每个形成的焊盘接地,获得了接地的屏蔽栅,这电保护放置在焊盘区域或者焊盘环内的电子电路和部件或者模块的元件。当在部件或者模块上生产数百个普通焊盘时,其中,外部焊盘功能为部件或者模块的牺牲焊盘区域或者焊盘环,与在板上的金属条相比,生产包括成排的许多单个放置的焊盘的牺牲焊盘区域或者焊盘环是更加经济和容易的。机械保护连同其它焊盘容易生产。通过在连接到板的部件或者模块的牺牲焊盘区域或者焊盘环中的外部焊盘,与如果在内部连接的焊盘外部有同质的焊盘环或者条相比,甚至可以视觉检查焊盘区域或者焊盘环内部的连接的焊盘,以确定连接的质量。如果能够确定焊盘区域或者焊盘环的焊盘的质量,根据焊盘区域或者焊盘环的焊盘的观察,可以估计内部焊盘的质量。没有焊盘区域或者焊盘环,难以确定或者估计内部焊盘的连接的质量。
对于高频模块应用,天线端口的回波损耗的测量可以监控牺牲焊盘区域或者焊盘环的情况。牺牲焊盘区域或者焊盘环可以连接到地,且当牺牲焊盘区域或者焊盘环接地开始减少时,那么可以通过天线端口上的增加的回波损耗来监控,且有损坏部件或者模块的危险。
为了将部件或者模块10正确放置在板上,单一焊盘11可以从牺牲焊盘区域或者焊盘环12去除,参见图4,而没有本质影响接地的屏蔽栅的效果。由于该不对称性,部件或者模块的使用者不会180度不正确地放置装置。通过该不对称性,以及从牺牲焊盘区域或者焊盘环去除焊盘,不要求诸如射频之类的敏感的模块信号和平稳的数据行发送通过几个层。敏感的信号可以在直接到安装的模块上的连接点或者焊盘13的板的顶部层上发送。
当部件或者模块装配到板上时,牺牲焊盘区域或者焊盘环的目的是增加部件或者模块的机械寿命。机械寿命通常通过进行快速温度变化测试来测量。在寿命测试环境下进行一定数量的温度循环以后,焊盘区域或者焊盘环的外部区域将开始首先损坏。这不会影响部件或者模块的性能,因为所有的电相互连接在LGA的中央。使用牺牲焊盘区域或者焊盘环概念将增加部件或者模块的机械寿命,且可以结合检测装置,例如在生产线上,提供额外数量的测试点。
很明显,本发明可以以很多方式变化。这样的变化不认为是偏离本发明的范围。如本领域中的普通技术人员可以明白的,所有这样的修改意在包括在后附的权利要求书的范围内。
Claims (5)
1、一种用于保护部件或者模块的方法,该部件或者模块包括用于将部件或者模块与具有相应触点的板连接的焊盘,其特征在于,给部件或者模块提供外部牺牲焊盘区域或者焊盘环,其包括放置在内部焊盘外的焊盘,该内部焊盘设置为与板的触点连接,其中,内部焊盘由牺牲焊盘区域或者焊盘环保护,且在模块的机械寿命下,在内部焊盘被破坏以前,焊盘区域或者焊盘环的焊盘或者多个焊盘会被破坏。
2.一种用于保护部件或者模块的装置,该部件或者模块包括用于将部件或者模块与具有相应触点的板连接的焊盘,其特征在于,在内部焊盘(2;5;8)外在部件或者模块(1;4;7)上设置外部牺牲焊盘区域或者焊盘环(3;6;9),其中,内部焊盘设置为由牺牲焊盘区域或者焊盘环(3;6;9)保护,且在模块的机械寿命下,在内部焊盘被破坏以前,焊盘区域或者焊盘环的焊盘或者多个焊盘会被破坏。
3.根据权利要求2所述的装置,其特征在于,从焊盘环去除牺牲焊盘区域或者焊盘环(12)的至少一个焊盘(11),以使得环不对称,其中,部件或者模块的使用者能够在板上正确放置部件或者模块(10),且敏感信号能够在板的顶部层上发送到部件或者模块的焊盘(13)。
4.根据权利要求2所述的装置,其特征在于,牺牲焊盘区域或者焊盘环(3;6;9)的至少一个焊盘设置为连接到检测装置。
5.根据权利要求2所述的装置,其特征在于,牺牲焊盘区域或者焊盘环(3;6;9)的焊盘设置为形成接地的屏蔽栅的部分。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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SE03006863 | 2003-03-13 | ||
SE0300686A SE0300686D0 (sv) | 2003-03-13 | 2003-03-13 | A method and device for protection of a component or module |
Publications (1)
Publication Number | Publication Date |
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CN1759639A true CN1759639A (zh) | 2006-04-12 |
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CNA2004800067167A Pending CN1759639A (zh) | 2003-03-13 | 2004-03-01 | 用于保护部件或者模块的方法和装置 |
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US (1) | US20060054353A1 (zh) |
EP (1) | EP1609338A1 (zh) |
JP (1) | JP2006520542A (zh) |
KR (1) | KR20050109982A (zh) |
CN (1) | CN1759639A (zh) |
SE (1) | SE0300686D0 (zh) |
TW (1) | TW200505301A (zh) |
WO (1) | WO2004082342A1 (zh) |
Cited By (1)
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CN105636352A (zh) * | 2016-01-15 | 2016-06-01 | 广东欧珀移动通信有限公司 | 硬板及具有其的移动终端 |
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US7257562B2 (en) * | 2000-10-13 | 2007-08-14 | Thallion Pharmaceuticals Inc. | High throughput method for discovery of gene clusters |
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US5490042A (en) * | 1992-08-10 | 1996-02-06 | Environmental Research Institute Of Michigan | Programmable silicon circuit board |
MY123146A (en) * | 1996-03-28 | 2006-05-31 | Intel Corp | Perimeter matrix ball grid array circuit package with a populated center |
JP2825085B2 (ja) * | 1996-08-29 | 1998-11-18 | 日本電気株式会社 | 半導体装置の実装構造、実装用基板および実装状態の検査方法 |
US6242815B1 (en) * | 1999-12-07 | 2001-06-05 | Advanced Semiconductor Engineering, Inc. | Flexible substrate based ball grid array (BGA) package |
JP2001203470A (ja) * | 2000-01-21 | 2001-07-27 | Toshiba Corp | 配線基板、半導体パッケージ、および半導体装置 |
JP2003017819A (ja) * | 2001-06-29 | 2003-01-17 | Fujitsu Ltd | プリント配線板及びその識別方法 |
TW531052U (en) * | 2002-04-29 | 2003-05-01 | Via Tech Inc | Flip chip and flip chip packaging substrate |
TW540823U (en) * | 2002-06-21 | 2003-07-01 | Via Tech Inc | Flip-chip package substrate |
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2003
- 2003-03-13 SE SE0300686A patent/SE0300686D0/xx unknown
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2004
- 2004-03-01 WO PCT/SE2004/000275 patent/WO2004082342A1/en active Application Filing
- 2004-03-01 JP JP2006507930A patent/JP2006520542A/ja not_active Abandoned
- 2004-03-01 KR KR1020057016990A patent/KR20050109982A/ko not_active Application Discontinuation
- 2004-03-01 CN CNA2004800067167A patent/CN1759639A/zh active Pending
- 2004-03-01 EP EP04716074A patent/EP1609338A1/en not_active Withdrawn
- 2004-03-03 TW TW093105545A patent/TW200505301A/zh unknown
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105636352A (zh) * | 2016-01-15 | 2016-06-01 | 广东欧珀移动通信有限公司 | 硬板及具有其的移动终端 |
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SE0300686D0 (sv) | 2003-03-13 |
EP1609338A1 (en) | 2005-12-28 |
TW200505301A (en) | 2005-02-01 |
US20060054353A1 (en) | 2006-03-16 |
KR20050109982A (ko) | 2005-11-22 |
JP2006520542A (ja) | 2006-09-07 |
WO2004082342A1 (en) | 2004-09-23 |
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