CN1732568A - 具内部偏馈射频功率晶体管 - Google Patents

具内部偏馈射频功率晶体管 Download PDF

Info

Publication number
CN1732568A
CN1732568A CNA2003801070887A CN200380107088A CN1732568A CN 1732568 A CN1732568 A CN 1732568A CN A2003801070887 A CNA2003801070887 A CN A2003801070887A CN 200380107088 A CN200380107088 A CN 200380107088A CN 1732568 A CN1732568 A CN 1732568A
Authority
CN
China
Prior art keywords
input
output
transistor
amplifier
bias
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CNA2003801070887A
Other languages
English (en)
Other versions
CN100459121C (zh
Inventor
N·V·迪西特
L·莱顿
G·C·马
P·佩鲁古帕里
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wolfspeed Inc
Original Assignee
Infineon Technologies AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Infineon Technologies AG filed Critical Infineon Technologies AG
Publication of CN1732568A publication Critical patent/CN1732568A/zh
Application granted granted Critical
Publication of CN100459121C publication Critical patent/CN100459121C/zh
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/58Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64Impedance arrangements
    • H01L23/66High-frequency adaptations
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42Wire connectors; Manufacturing methods related thereto
    • H01L24/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03FAMPLIFIERS
    • H03F3/00Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
    • H03F3/04Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements with semiconductor devices only
    • H03F3/14Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements with semiconductor devices only with amplifying devices having more than three electrodes or more than two PN junctions
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03FAMPLIFIERS
    • H03F3/00Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
    • H03F3/189High-frequency amplifiers, e.g. radio frequency amplifiers
    • H03F3/19High-frequency amplifiers, e.g. radio frequency amplifiers with semiconductor devices only
    • H03F3/195High-frequency amplifiers, e.g. radio frequency amplifiers with semiconductor devices only in integrated circuits
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03FAMPLIFIERS
    • H03F3/00Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
    • H03F3/60Amplifiers in which coupling networks have distributed constants, e.g. with waveguide resonators
    • H03F3/602Combinations of several amplifiers
    • H03F3/604Combinations of several amplifiers using FET's
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/58Structural electrical arrangements for semiconductor devices not otherwise provided for
    • H01L2223/64Impedance arrangements
    • H01L2223/66High-frequency adaptations
    • H01L2223/6644Packaging aspects of high-frequency amplifiers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/58Structural electrical arrangements for semiconductor devices not otherwise provided for
    • H01L2223/64Impedance arrangements
    • H01L2223/66High-frequency adaptations
    • H01L2223/6644Packaging aspects of high-frequency amplifiers
    • H01L2223/665Bias feed arrangements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491Disposition
    • H01L2224/4912Layout
    • H01L2224/49175Parallel arrangements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42Wire connectors; Manufacturing methods related thereto
    • H01L24/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/072Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/00014Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01005Boron [B]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01006Carbon [C]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01014Silicon [Si]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01015Phosphorus [P]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01073Tantalum [Ta]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
    • H01L2924/13Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304Transistor
    • H01L2924/1306Field-effect transistor [FET]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901Structure
    • H01L2924/1904Component type
    • H01L2924/19041Component type being a capacitor
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901Structure
    • H01L2924/1904Component type
    • H01L2924/19042Component type being an inductor
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901Structure
    • H01L2924/1904Component type
    • H01L2924/19043Component type being a resistor
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30Technical effects
    • H01L2924/301Electrical effects
    • H01L2924/30105Capacitance
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30Technical effects
    • H01L2924/301Electrical effects
    • H01L2924/30107Inductance
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30Technical effects
    • H01L2924/301Electrical effects
    • H01L2924/3011Impedance
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30Technical effects
    • H01L2924/301Electrical effects
    • H01L2924/3011Impedance
    • H01L2924/30111Impedance matching

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Microwave Amplifiers (AREA)
  • Amplifiers (AREA)

Abstract

传统宽频射频功率放大器系使用1/4波长传输线将占用印刷电路板相对较大空间之栅极偏压直流源极从栅极电路去耦合,及第二1/4波长传输线将漏极偏压直流源极从漏板电路去耦合。新宽频射频功率放大器不需1/4波长传输线而使用具有用于注入栅极偏压及漏极偏压直流源极之独立终端的晶体管,藉此免除空间并促进更高密度封装。功率放大器晶体管可以单印模电路或并联操作之多印模电路来实施。

Description

具内部偏馈射频功率晶体管
发明背景
本发明大致属于被用于无线通信应用中之射频(RF)放大器,更特定属于高频,高功率电阻器领域。
背景
无线通信应用中使用射频功率放大器系已熟知。由于如个人通信服务之无线服务需求近期成长,无线网络操作频率系急遽增加而现在超过2GhZ。射频功率放大器阶系普遍被用于无线通信网路无线基地台放大器中。该功率放大器亦被广泛用于其它射频相关应用,如手机,呼叫系统,导航系统,电视,航空电子及军事应用。该电路必须操作之高频处,主动组件之阻抗匹配及偏压系为功率放大器有效操作之重要因素。被用来匹配功率晶体管至外部装置之输入及输出电路,通常系以印刷电路板上之接线电感,带状线路或微带结构及分离电容器之组合来实施。
如图2及3所示,典型共享电源放大器阶系具有一射频馈给,一功率晶体管200及一射频输出。功率晶体管200系为一三终端装置,具有一输入终端210,一输出终端220,及为被接地之凸缘205之一共享终端。功率晶体管200系将来自该射频馈给之低功率信号放大为从该射频输出被传递至负载之高功率信号。一输入偏压网络系提供被称为输入偏馈之直流电压至建立晶体管200之输入操作点之功率晶体管200。输出偏压网络系提供被称为输出偏馈之直流电压至建立晶体管200之输出操作点之功率晶体管200。
一输入阻抗变压器231系于操作频率及功率位准处将该射频馈给之阻抗(通常为50欧姆)转换为输入终端210处之阻抗(通常为8-10欧姆)。输入阻抗变压器231较佳为操作频率处之1/4波长(lambda)微带传输味线。
同样地,一输出阻抗变压器241系于操作频率及功率位准处将该输出终端220处之阻抗(通常为1至10欧姆)转换为射频输出之阻抗(通常为50欧姆)。输出阻抗变压器241较佳为操作频率处之1/4波长微带传输线。
输入阻隔电容器232可防止因阻隔直流电压形成之射频馈给电路负载不致进入放大器阶。输出阻隔电容器242可防止因阻隔直流电压形成之射频输出电路负载不致从射频输出。
此外,防止被产生于功率放大器阶内部之高频信号不致沿非预期传输路径逸散系很重要。为了防止功率放大器中之高频信号不致污染可偏压该放大器之直流电压源,设计者通常使用被以微带结构实施之1/4波长传输线。传输线理论预测被短路中止于其末端之1/4波长传输线系于近端具有为开放电路之一近端。实务上,被以相对较低阻抗终止之1/4波长传输线系出现驱动源之高阻抗。此方式系防止被引导朝向输入终端210之射频功率不致泄漏至输入偏压网络,及提供一种耦合直流电压至功率晶体管200而不干扰阻抗匹配结构之方法。
例如,图2及3所示之输入偏压电路上,输入偏压传输线233系为具有其末端被耦合至输入偏馈之直流电压源之1/4波长传输线。近端系被耦合至功率晶体管之输入终端210。组合输入偏馈之直流电压源及去耦合电容器234及235系对接近线233末端处之广泛频率短路。
电容器234系具有小电容值且被选为具有操作频率处或附近之串联共振。具有陶介电值之电容器234典型值系为5至50pF。电容器235系具有大电容值且被选为具有用于低中频之高电容电抗及适度电感。具有钽介电值之电容器235典型值系为0.05至0.5uF。放大器应被操作为连续波(CW)放大器,电容器235并不需要被适度去耦合。
输入偏馈电压之直流电压源系形成低频交流信号及直流之短路。因为线233末端系被短路终止,所以线233近端之输入阻抗似乎为被产生于输入终端210附近之高频信号之开放电路。此开放电路系阻隔射频信号不致沿非预期传输路径逸散,特别是防止污染输入偏馈之直流电压源。
同样地,1/4波长传输线系被用来防止来自输出终端220之射频信号不致流回输出偏馈之直流电压源。输出偏馈传输线243系为具有其末端被耦合至输出偏馈之直流电压源之1/4波长传输线。近端系被耦合至功率晶体管输出终端220。组合输出偏馈之直流电压源及去耦合电容器244及245系形成接近线243末端处之广泛频率短路。电容器244系具有小电容值且被选为具有操作频率处或附近之串联共振。具有陶介电值之电容器244典型值系为5至50pF。具有钽介电值之电容器245典型值系为0.05至0.5uF。因为线243末端系被短路终止,所以线243近端之输入阻抗似乎为被产生于可阻隔射频信号不污染输出偏馈之直流电压源之输入终端210附近之信号之开放电路。
虽然使用1/4波长传输线来提供输入及输出偏压至晶体管200已被发现为实务偏压解,但仍具有使其用途非最佳之若干因素。印刷电路板上之相对较大区域系为其实施所需,藉以降低放大器之封装密度。此外,1/4波长传输易发出射频能量,降低整体放大器效率。再者,将1/4波长传输线耦合至功率晶体管输入系因使设计处理复杂化之分配组件效应而很难模制。
典型功率晶体管200之实体配置系被更详细描绘于图1A中,而晶体管200之等效电路系出现于图3。功率晶体管200系具有一晶体管印模219,一栅极调谐网络,及一漏极调谐网络。晶体管印模219系较佳为一场效晶体管印模且特别为具有被形成于上表面之一栅极及漏极区域之横向扩散金属氧化硅装置(LDMOS)。高传导潜沉区域系被形成来提供印模219之源极区域及下表面间之低电阻传导路径。印模219系被接合至凸缘205,藉此热及机械耦合印模至该凸缘及电耦合该源极至该凸缘。以下图标及正文中,晶体管印模系被描述为一横向扩散金属氧化硅装置,熟练实施者将得知具有许多制造可接受放大器之其它印模类型选择。
接引线系被用来电耦合印模219之栅极至印模219之输入终端210及漏极至输出终端220。接引线亦被用来互连其它组件。这些接引线系具有典型操作频率不能被忽略之自电应。栅极调谐网络系被要求有效耦合来自射频馈给之射频功率至印模219之栅极。同样地,漏极调谐网络亦被要求有效耦合来自印模219之栅极之射频功率至射频输出及负载。
栅极调谐网络提供补偿接引线电感器及与印模219之栅极连结之输入电容。栅极调谐网络系包含一”T网络”及一”分路网络”。T网络系包含各被耦合至中央节点之被耦合至输入终端210之一第一接引线电感211,被耦合至印模219之栅极之一第二接引线电感212,及被耦合接地于凸缘205上之一第一输入电容器216。分路网络系包含被耦合至相对较高电容之第二输入电容217之第三接引线电感213。第二输入电容217系为一阻隔电容器,其可防止电感213不致于印模219栅极处将直流偏压短路接地。第三接引线电感213系被耦合至印模219之栅极,而第二输入电容器217系被耦合接地于凸缘205上。
T网络系以基本频率将阻抗”注视”转换为晶体管输入终端210来匹配线231之阻抗。分路网络系提供基本信号频率之共振而使栅极电抗无效。
漏极调谐网络提供补偿接引线电感器及与印模219之漏极连结之电容。漏极调谐网络系包含一分路网络及一串联电感。串联电感系为连接印模219之漏极至输出终端220之第五接引线215结果。分路网络系包含被耦合至第一输出电容器218之第四接引线电感214。该第四接引线电感214系被耦合至印模219之漏极,而该第一输出电容器218系被耦合接地于凸缘205上。这些组件系提供预定负载阻抗处之宽频匹配。
图1B系描绘功率晶体管100替代型式之实体配置,其具有两个类似被耦合及并联操作的晶体管200者之电路。类似晶体管200,晶体管100系具有三终端装置:一输入终端110,一输出终端120,及一凸缘105。第一印模电路系具有一印模,一栅极调谐网络,及一漏极调谐网络。第二印模电路系具有一印模,一栅极调谐网络,及一漏极调谐网络。经济及实务生产容限内,两印模电路系被匹配使负载可被各印模电路大约等分。各电路功能系如上述的晶体管200。熟练实施者亦得知三个或更多印模电路可被并联耦合来提供额外功率处理能力。
输入偏压传输线233及输出偏压传输线243系占用包含其之印刷电路板上相对较大及有价值空间。三终端射频功率晶体管封装已限制设计者对其提供输入偏压及输出偏压之选择。射频放大器之逐增高密度封装需求系暗示降低被放大器阶消耗之基板空间系可预期及较低成本。因此,需要更有效使用印刷电路板空间而无实际效能损失之输入偏压电路及输出偏压电路。
发明摘要
依据一般观点,在此揭示及说明之本发明系有关被设计及建构来克服上述问题并促使更简单大规模生产之高频,高功率,宽频射频放大器。
一实施例中,宽频射频放大器系包含具有5终端之功率晶体管封装。如图4A所示,晶体管晶体管300系具有一输入终端310,一输出终端320,一凸缘305,一输入偏压终端350,一输出偏压终端360。当被用与新偏压电路共同操作时,输入偏压终端350之增加物系不需1/4波长输入偏压传输线,藉此降低被放大器阶占用之总面积。输出偏压终端360被以类似方式处理,不需1/4波长输出偏压传输线。
另一实施例中,宽频射频放大器系包含具有7终端之功率晶体管封装。如图4B所示,功率晶体管400系具有一输入终端410,一输出终端420,一凸缘405,一第一输入偏压终端450,一第二输入偏压终端451,一第一输出偏压终端460,及一第二输出偏压终端461。当被用与新偏压电路共同操作时,第一及第二输入偏压终端450及451之增加物分别不需第一及第二1/4波长输入偏压传输线,藉此降低被放大器阶占用之总面积。第一及第二输出偏压终端被以类似方式处理。
在此揭示之本发明其它观点及特色此后将得知。
图标简单说明
图标系描绘被揭示发明较佳实施例之设计及使用,其中不同实施例中之类似
组件为了容易描绘系藉由相同参考数字来参照,而其中:
图1A描绘具有一印模电路之典型先前技术之射频功率晶体管实体配置。
图1B描绘具有两个被耦合及并联操作之印模电路之替代先前技术射频功率晶体管实体配置。
图2描绘使用具有图1A之功率晶体管之先前技术宽频射频功率放大器实体配置。
图3系为图2所示先前技术宽频射频功率放大器区段之等效电路图。
图4A描绘具有一印模电路之新射频功率晶体管实体配置。该功率晶体管系具有输入及输出终端处之直流阻隔,及一独立输入偏压终端及输出偏压终端。
图4B描绘具有两个被耦合及并联操作之印模电路之新射频功率晶体管实体配置。该功率晶体管系具有输入及输出终端处之直流阻隔,及用于各印模之一独立输入偏压终端及输出偏压终端。
图5描绘使用具有图4A之功率晶体管之新宽频射频功率放大器区段实体配置。
图6系为图5所示新宽频射频功率放大器区段之等效电路图。
图7描绘使用具有图4B之功率晶体管之新宽频射频功率放大器区段实体配置。
图8系为图7所示新宽频射频功率放大器区段之等效电路图。
较佳实施例之详细说明
图4A描绘一新功率晶体管300及图6所示用于晶体管300之等效电路实体配置。类似图1A之先前技术晶体管,此功率晶体管300系具有一输入终端310,一输出终端320,一场效晶体管印模319,一栅极调谐网络,及一漏极调谐网络。场效晶体管印模319系较佳为一横向扩散金属氧化硅装置。印模319系被接合至凸缘305,藉此热及机械耦合印模319至该凸缘及电耦合源极至凸缘305。不像图1A之先前技术晶体管,此功率晶体管300系具有一输入偏压终端350及一输出偏压终端360,使晶体管300为五个终端装置。以下图标及正文中,晶体管印模系被描述为一横向扩散金属氧化硅装置,熟练实施者将得知具有许多制造可接受放大器之其它印模类型选择。
此外,亦注意晶体管300具有一输入阻隔电容器332及一输出阻隔电容器342。先前技术放大器中,这些电容器系外接图2及3所示的晶体管。输入阻隔电容器332系具有其被接合至最接近印模319之位置处之输入终端310之第一终端,及被电耦合至印模319栅极之其第二终端。输出阻隔电容器342系具有其被接合至最接近印模319之位置处之输出终端320之第一终端,及被电耦合至印模319漏极之其第二终端。
接引线系被用来电耦合晶体管300之组件。许多例中,这些接引线系具有典型操作频率时不能被忽略之自电感。接引线系被用来电耦合印模319栅极经由输入阻隔电容器332至输入终端310,及电耦合印模319漏极经由输出阻隔电容器342至输出终端320。栅极调谐网络系被要求有效耦合来自射频馈给之射频功率至印模319之栅极。同样地,漏极调谐网络亦被要求有效耦合来自印模319之栅极之射频功率至射频输出及负载。
栅极调谐网络提供补偿接引线电感器及与印模319之栅极连结之输入电容。参考图6,栅极调谐网络系包含一”T网络”及一”分路网络”。T网络系包含各被耦合至中央节点之被耦合至输入阻隔电容器332之一第一接引线电感311,被耦合至印模319之栅极之一第二接引线电感312,及被耦合接地于凸缘305上之一第一输入电容器316。分路网络系包含被耦合至相对较高电容之第二输入电容317之第三接引线电感313。第二输入电容317系为一阻隔电容器,其可防止电感313不致于印模319栅极处将直流偏压短路接地。第三接引线电感313系被耦合至印模319之栅极,而第二输入电容器317系被耦合接地于凸缘305上。
T网络系以基本频率将阻抗”注视”转换为晶体管输入终端310来匹配线331之阻抗。分路网络系提供基本信号频率之共振而使栅极电抗无效。
漏极调谐网络提供补偿接引线电感器及与印模319之漏极连结之电容。漏极调谐网络系包含一分路网络及一串联电感。串联电感系为连接印模319之漏极至输出阻隔电容器342之第五接引线315结果。分路网络系包含被耦合至第一输出电容器318之第四接引线电感314。该第四接引线电感314系被耦合至印模319之漏极,而该第一输出电容器318系被耦合接地于凸缘305上。这些组件系提供预定负载阻抗处之宽频匹配来提供预期功率位准以利有效放大器操作。
输入偏压接引线351系被用来经由第二输入电容器317电耦合印模319之栅极。输出偏压接引线361系被用来经由第一输出电容器318电耦合印模319之漏极。
图5及6系描绘新共享源极功率放大器阶中的晶体管300使用。类似图2及3之先前技术功率放大器,此功率放大器系具有一射频馈给,一功率晶体管300及一射频输出。然而,重要应注意输入偏馈并不以1/4波长传输线被电耦合至栅极。明确地说,输入偏馈系被直接电耦合至输出偏馈终端360。
回忆图4A,功率晶体管300系为一5终端装置,具有一输入终端310,一输出终端320,被接地之一凸缘305,一输入偏压终端350及一输出偏压终端360。类似图2及3所示之先前技术放大器,图5及6中之功率晶体管300系将来自射频馈给之低功率信号放大为从射频输出被传递至负载之高功率信号。输入阻抗变压器331系将射频馈给之阻抗转换为输入终端310处之阻抗。输入阻抗变压器331系较佳为操作频率处之1/4波长微带传输线。输出阻抗变压器341系将输出终端320处之阻抗转换为射频输出处之阻抗。输出阻抗变压器341亦较佳为操作频率处之1/4波长微带传输线。
输入阻隔电容器332系阻隔内及外直流电压经由输入终端310进入或离开功率晶体管300。输出阻隔电容器342系阻隔内及外直流电压经由输出终端320进入或离开功率晶体管300。
输入偏馈系提供直流电压至功率晶体管300以建立晶体管300之输入操作点。防止被产生于功率放大器阶内部之高频信号不致沿非预期传输路径逸散系很重要。特别重要系防止功率放大器中之高频信号不致污染可偏压该放大器之直流电压源极。图6所示之新输入偏馈及输出偏馈系可不使用先前技术1/4波长传输线而有效将直流电压偏压源极与被产生于放大器阶内部之高频信号隔离。
输入偏馈电路具有一输入偏馈导体333,输入去耦合电容器334及335,及一输入偏压接引线351。输入偏压接引线351系被电耦合至输入偏馈终端350,且与输入偏馈导体333结合来提供经由输入分路网络电感313至印模319栅极之直流路径。输入去耦合电容器334及335系提供从输入偏馈终端350至接地之交流分路路径。输入偏压接引线电感351系被保持如实际上一样低。
输入偏馈导体333系电耦合输入偏馈直流源极至输入偏馈终端350。假设其具有非常低电感,则其可为针对此被选择之任何低电感导体。功率平面,多精确规格接引线,或较大规格镶饰,缕或固导体均可有利地被单独或组合使用。
第一输入去耦合电容器334系具有小电容值且被选择具有操作频率处或附近之串联共振。具有陶介电值之电容器334典型值系为5至50pF。电容器335系具有大电容值且被选为具有用于低中介射频之高电容电抗及适度电感。具有钽介电值之电容器335典型值系为0.05至0.5uF。
输出偏馈电路系以类似输入偏馈电路方式操作。其可不使用先前技术1/4波长传输线而有效将来自输出偏压源极之直流电压与被产生于放大器阶内部之高频信号隔离。来自输出偏压源极之直流电压系被注入被耦合至晶体管输出之输出分路网络。
输出偏馈系提供直流电压至功率晶体管300以建立晶体管300之输入操作点。输出偏馈电路系具有一输出偏馈导体343,输出去耦合电容器344及345,及一输出偏压接引线361。输出偏压接引线361系被电耦合至输出偏馈终端360,且与输出偏馈导体343结合来提供经由输出分路网络电感314至印模319漏极之直流路径。输出去耦合电容器344及345系提供从输出偏馈终端360至接地之低阻抗交流分路路径。输出偏压接引线361系被保持如实际上一样低。
第一输出去耦合电容器344系具有小电容值且被选择具有操作频率处或附近之串联共振。具有陶介电值之电容器344典型值系为5至50pF。电容器345系具有大电容值且被选为具有用于低中介射频之高电容电抗及适度电感。具有钽介电值之电容器345典型值系为0.05至0.5uF。
图4B描绘类似晶体管300者之具有两个被耦合及并联操作之印模电路之新射频功率晶体管实体配置。此晶体管500之等效电路系出现于图8。晶体管500系具有七个终端:一输入终端110,一输出终端120,一凸缘105,一第一输入偏压终端550,一第二输入偏压终端555,一第一输出偏压终端560,及一第二输出偏压终端565。
第一印模电路系具有一印模519,一第一栅极调谐网络,及一第一漏极调谐网络。第二印模电路系具有一印模529,一第二栅极调谐网络,及一第二漏极调谐网络。各印模电路功能系个别如上述图4A的晶体管300。经济及实务生产容限内,该两印模电路系被匹配使各印模电路可大约均等分享该负载。熟练实施者亦得知三个或更多印模电路可被并联耦合来提供额外功率处理能力。
图7及8系描绘新共享源极功率放大器阶中的晶体管500使用。类似图5及6之功率放大器,此功率放大器系具有一射频馈给,一功率晶体管500及一射频输出。此功率放大器可具有一单输入偏压终端及一单输出偏压终端,或相反地,其可具有如图7及8所示用于各印模电路之一独立输入偏压终端及输出偏压终端。
回忆图4B,功率晶体管500系为一7终端装置,具有一输入终端510,一输出终端520,被接地之一凸缘505,一第一输入偏压终端550,一第一输出偏压终端560,一第二输入偏压终端555,一第二输出偏压终端565。类似图2及3所示之先前技术放大器,功率晶体管500系将来自射频馈给之低功率信号放大为从射频输出被传递至负载之高功率信号。输入阻抗变压器531系将射频馈给之阻抗转换为输入终端510处之阻抗。
输入阻抗变压器531系较佳为操作频率处之1/4波长微带传输线。输出阻抗变压器541系将输出终端520处之阻抗转换为射频输出处之阻抗。输出阻抗变压器541亦较佳为操作频率处之1/4波长微带传输线。
输入阻隔电容器532系阻隔内及外直流电压经由输入终端510进入或离开功率晶体管500。输出阻隔电容器542系阻隔内及外直流电压经由输出终端520进入或离开功率晶体管500。
第一输入偏馈电路系以如图5及6所说明相同方式提供直流电压来偏向第一印模519之输入。再者,第一输出偏馈电路系以如图5及6所说明相同方式提供直流电压来偏向第一印模519之输出。同样地,第二输入偏馈电路系提供直流电压来偏向第二印模529之输入,而第二输出偏馈电路系提供直流电压来偏向第二印模529之输出。
熟练实施者将得知第一及第二印模电路之直流电压输入偏馈源极可为独立源极或共享源极。输入偏馈共享可藉由增添电耦合第一印模519之栅极至第二印模529之栅极之接引线而被达成于功率晶体管内部。可替代是,输入偏馈共享亦可藉由增添电耦合第一分路电容器517至第二分路电容器527之接引线而被达成。再者,该接引线易增加某些应用之放大器稳定性。独立输入偏馈或共享输入偏馈配置均可以成本及效能要求为基础被选择。
同样地,第一及第二印模电路之直流电压输出偏馈源极可为独立源极或共享源极。输出偏馈共享可藉由增添电耦合第一输出分路电容器518至第二输出分路电容器之接引线而被达成于功率晶体管内部。再者,该接引线易增加某些应用之放大器稳定性。独立输出偏馈或共享输出偏馈配置均可以成本及效能要求为基础被选择。
虽然本发明特定实施例已被显示及说明,但本发明并不限于较佳实施例,熟练技术人士了解只要不背离仅被附带权利要求及其等同者定义之本发明范畴,均可作各种改变及修改。

Claims (28)

1.功率晶体管,包含:
-一凸缘;
-一印模,具有一栅极一源极及一漏极,其中该源极系被电耦合至该凸缘;
-一栅极调谐电路,被放置于该凸缘上,具有一输入及一输出,该输出系被与该栅极耦合;
-一漏极调谐电路,被放置于该凸缘上,具有一输入及一输出,该输入系被与该漏极耦合;
-一输入终端,被机械耦合至该凸缘,且被与该栅极调谐电路之该输入电耦合;
-一输入偏压终端,被机械耦合至该凸缘,且被与该栅极电耦合;
-一输出偏压终端,被机械耦合至该凸缘,且被与该漏极电耦合。
2.如权利要求1的晶体管,其中该印模系为一横向扩散金属氧化硅晶体管。
3.如权利要求1的晶体管,其中该栅极调谐网络及该漏极调谐网络各包含一T网络及一分路网络。
4.如权利要求3的晶体管,其中该偏压输入终端及该偏压输出终端各被与该个别分路网络耦合。
5.如权利要求3的晶体管,其中该T网络系包含被串联耦合之第一及第二接引线,及被耦合于该接引线及源极连接间之一电容器。
6.如权利要求1的晶体管,进一步包含被电耦合于该输入终端及该栅极调谐网络间之一输入阻隔电容器。
7.如权利要求6的晶体管,其中该输入阻隔电容器系被放置于该输入终端之近端。
8.如权利要求1的晶体管,进一步包含被电耦合于该输出终端及该漏极调谐网络间之一输出阻隔电容器。
9.如权利要求8的晶体管,其中该输出阻隔电容器系被放置于该输出终端之近端。
10.如权利要求1的晶体管,其中复数印模,复数栅极调谐电路及复数漏极调谐电路系被提供。
11.一种宽频射频信号放大器,包含:
被附着至垫座表面之至少一晶体管,该晶体管系具有一射频输入及一射频输出,一偏压输入及一偏压输出;该垫座包含一支架结构,参考接地及用于该晶体管之散热件;
一射频输入路径,被电子连接至该晶体管输入,一输入匹配网络,被配置以输入阻抗耦合该输入信号至该晶体管输入,及一输入直流偏压网络,被配置偏压该晶体管输入至一输入操作点,及
一射频输出路径,被电子连接至该晶体管输出,一输出匹配网络,被配置以输出阻抗耦合该个别组件输出信号至该晶体管输出,及一输出直流偏压网络,被配置偏压该晶体管输出至一输出操作点。
12.如权利要求11的该放大器,其中复数晶体管系被提供于该垫座上,且其中该输出路径系包含被配置分割射频输入信号为复数组件输入信号之一分裂器,而其中该分裂器,输入匹配网络及输入偏压网络系至少被部分实施于多位准印刷电路板中。
13.如权利要求12的该放大器,其中该输出路径系包含一组合器,被配置组合被接收于该晶体管输出处之组件输出信号为射频输出信号,而其中该组合器,输出匹配网络及输出偏压网络系至少被部分实施于印刷电路板中。
14.如权利要求11的该放大器,其中该印刷电路板系具有被裁制容纳该垫座之一开口。
15.如权利要求11的该放大器,其中该输入及输出路径系包含被实施于印刷电路板中之个别输入及输出参考接地架,而该垫座及印刷电路板系被安置,使该输入及输出参考接地架邻接该垫座表面。
16.如权利要求15的该放大器,进一步包含电子连接该输入及输出参考接地架至该垫座表面之个别导体。
17.如权利要求16的该放大器,其中该导体系包含各组接引线,该印刷电路板及垫座系被非常接近放置,使该接引线得以提供相对较低电感传输路径。
18.如权利要求11的该放大器,其中该输入匹配网络系包含被实施于印刷电路板中且电子连接该组件输入信号至各晶体管输入之传输线,该传输线系具有该射频输入信号基本频率大约四分之一波长之长度。
19.如权利要求11的该放大器,其中该输出匹配网络系包含被实施于印刷电路板中且电子连接该组件输出信号至该组合器之传输线,该传输线系具有该射频输入信号基本频率大约四分之一波长之长度。
20.如权利要求11的该放大器,其中该输入匹配网络系包含被附着至该垫座之个别输入匹配电容器,该个别输入偏压网络系电子连接输入直流偏压源极至个别输入匹配电容器,该输出匹配网络系包含被附着至该垫座之个别输出匹配电容器,而该个别输出偏压网络系电子连接输出直流偏压源极至个别输出匹配电容器。
21.如权利要求20的该放大器,其中该输入直流偏压源极系经由被实施于该印刷电路板中之个别输入传输线被连接至该输入匹配电容器,而其中该输出直流偏压源板系经由被实施于印刷电路板中之个别输出传输线被连接至该输出匹配电容器,而该个别输入及输出传输线各具有该射频输入信号基本频率大约四分之一波长之长度。
22.如权利要求20的该放大器,其中该输入直流偏压源极系被连接至该输入匹配电容器,而其中该输出直流偏压源极系被连接至该输出匹配电容器,该输入或输出直流偏压源极并不经由具有该射频输入信号基本频率大约四分之一波长之长度之传输线来传送。
23.如权利要求13的该放大器,其中该分裂器及组合器系为被动组件。
24.如权利要求11的该放大器,其中该输入阻抗系相对较高,而该输入操作点系相对较低。
25.如权利要求13的该放大器,进一步包含
第一复数导体,可电子连接被实施于该印刷电路板中之个别输入路径传输线至个别晶体管输入,及第二复数导体电子连接被实施于该印刷电路板中之个别输出路径传输线至个别晶体管输出。
26.如权利要求25的该放大器,其中该第一及第二复数导体系包含延伸于该印刷电路板及该垫座间之各组接引线。
27.如权利要求第10项的该放大器,其中该垫座及印刷电路板系被附着至一共享参考接地及一散热件。
28.如权利要求27的该放大器,其中该输入及输出路径系包含被实施于该印刷电路板中之个别输入及输出参考接地架,而该输入及输出参考接地架系藉由提供低电感路径之个别复数接引线被电子连接至该垫座。
CNB2003801070887A 2002-12-19 2003-11-24 具内部偏馈射频功率晶体管 Expired - Lifetime CN100459121C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/324,694 US6734728B1 (en) 2002-12-19 2002-12-19 RF power transistor with internal bias feed
US10/324,694 2002-12-19

Publications (2)

Publication Number Publication Date
CN1732568A true CN1732568A (zh) 2006-02-08
CN100459121C CN100459121C (zh) 2009-02-04

Family

ID=32229987

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB2003801070887A Expired - Lifetime CN100459121C (zh) 2002-12-19 2003-11-24 具内部偏馈射频功率晶体管

Country Status (5)

Country Link
US (1) US6734728B1 (zh)
EP (1) EP1573813B1 (zh)
CN (1) CN100459121C (zh)
TW (1) TWI285993B (zh)
WO (1) WO2004057666A2 (zh)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103178040A (zh) * 2011-12-21 2013-06-26 财团法人工业技术研究院 半导体结构及其制造方法
CN107508561A (zh) * 2017-08-14 2017-12-22 电子科技大学 一种跨倍频程宽带功率放大器及其实现方法
CN108206677A (zh) * 2016-12-20 2018-06-26 恩智浦美国有限公司 用于具有增强视频带宽的rf功率放大器的多基带终端组件
WO2022143504A1 (zh) * 2020-12-30 2022-07-07 华为技术有限公司 一种射频放大器
CN117895933A (zh) * 2024-03-18 2024-04-16 上海唯捷创芯电子技术有限公司 射频开关电路、芯片及其电子设备

Families Citing this family (43)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6798313B2 (en) * 2001-06-04 2004-09-28 U.S. Monolithics, L.L.C. Monolithic microwave integrated circuit with bondwire and landing zone bias
JP2005033350A (ja) * 2003-07-09 2005-02-03 Renesas Technology Corp 高周波電力増幅モジュールおよび半導体集積回路装置
US7109589B2 (en) * 2004-08-26 2006-09-19 Agere Systems Inc. Integrated circuit with substantially perpendicular wire bonds
WO2007003224A1 (en) * 2005-07-05 2007-01-11 Freescale Semiconductor, Inc. Compensation for parasitic coupling between rf or microwave transistors in the same package
US7564303B2 (en) * 2005-07-26 2009-07-21 Infineon Technologies Ag Semiconductor power device and RF signal amplifier
US7372334B2 (en) 2005-07-26 2008-05-13 Infineon Technologies Ag Output match transistor
JP4828969B2 (ja) * 2006-03-10 2011-11-30 株式会社東芝 半導体装置の実装構造
US7961470B2 (en) * 2006-07-19 2011-06-14 Infineon Technologies Ag Power amplifier
US20080231373A1 (en) * 2007-03-20 2008-09-25 Hafizur Rahman Output Circuit
US7994630B2 (en) * 2009-02-09 2011-08-09 Infineon Technologies Ag Power transistor package with integrated bus bar
EP2425527B1 (en) * 2009-04-30 2013-12-25 Freescale Semiconductor, Inc. Wireless communication device and semiconductor package device having a power amplifier therefor
EP2600525A3 (en) * 2009-04-30 2014-04-09 Freescale Semiconductor, Inc. Wireless communication device and semiconductor package device having a power amplifier therefor
US8659359B2 (en) 2010-04-22 2014-02-25 Freescale Semiconductor, Inc. RF power transistor circuit
US20110309872A1 (en) * 2010-06-17 2011-12-22 Cynthia Blair Voltage Spike Protection for Power DMOS Devices
EP2463905B1 (en) * 2010-12-10 2014-10-01 Nxp B.V. Packaged RF transistor with special supply voltage leads
JP5361934B2 (ja) * 2011-04-19 2013-12-04 株式会社東芝 電力増幅器
US9077285B2 (en) * 2012-04-06 2015-07-07 Freescale Semiconductor, Inc. Electronic devices with multiple amplifier stages and methods of their manufacture
US9312817B2 (en) 2012-07-20 2016-04-12 Freescale Semiconductor, Inc. Semiconductor package design providing reduced electromagnetic coupling between circuit components
US9281283B2 (en) * 2012-09-12 2016-03-08 Freescale Semiconductor, Inc. Semiconductor devices with impedance matching-circuits
JP6164721B2 (ja) * 2012-11-09 2017-07-19 住友電工デバイス・イノベーション株式会社 半導体装置
EP2733742B1 (en) * 2012-11-15 2015-08-19 Nxp B.V. Amplifier circuit
JP6073371B2 (ja) * 2012-12-03 2017-02-01 三菱電機株式会社 広帯域増幅器
US9240390B2 (en) * 2013-06-27 2016-01-19 Freescale Semiconductor, Inc. Semiconductor packages having wire bond wall to reduce coupling
EP2879174B1 (en) 2013-11-29 2021-09-08 Ampleon Netherlands B.V. Packaged RF power transistor device having next to each other ground leads and a video lead for connecting decoupling capacitors, RF power amplifier
KR101563212B1 (ko) * 2014-02-14 2015-10-26 알에프에이치아이씨 주식회사 고출력 반도체 소자 패키지
EP2916356B1 (en) 2014-03-04 2020-12-30 Ampleon Netherlands B.V. Amplifier structure
EP3113360A4 (en) * 2014-03-21 2017-03-08 Huawei Technologies Co., Ltd. Power amplification circuit and transmitter
JP6418050B2 (ja) * 2015-04-15 2018-11-07 三菱電機株式会社 増幅器
US10432152B2 (en) 2015-05-22 2019-10-01 Nxp Usa, Inc. RF amplifier output circuit device with integrated current path, and methods of manufacture thereof
JP6377305B2 (ja) 2016-07-01 2018-08-22 三菱電機株式会社 増幅器
JP6769646B2 (ja) * 2016-11-22 2020-10-14 住友電工デバイス・イノベーション株式会社 半導体装置
US10236833B2 (en) * 2017-08-02 2019-03-19 Infineon Technologies Ag RF amplifier with dual frequency response capacitor
US10141303B1 (en) 2017-09-20 2018-11-27 Cree, Inc. RF amplifier package with biasing strip
US10122336B1 (en) 2017-09-20 2018-11-06 Cree, Inc. Broadband harmonic matching network
US10438908B2 (en) 2017-10-19 2019-10-08 Nxp Usa, Inc. Integrally formed bias and signal lead for a packaged transistor device
US11336253B2 (en) 2017-11-27 2022-05-17 Wolfspeed, Inc. RF power amplifier with combined baseband, fundamental and harmonic tuning network
US10742171B2 (en) 2017-11-28 2020-08-11 Nxp Usa, Inc. Nested microstrip system and method
US10411659B2 (en) 2018-01-25 2019-09-10 Cree, Inc. RF power amplifier with frequency selective impedance matching network
US10541653B2 (en) * 2018-05-18 2020-01-21 Nxp Usa, Inc. Broadband power transistor devices and amplifiers with input-side harmonic termination circuits and methods of manufacture
US10742178B2 (en) 2018-05-18 2020-08-11 Nxp Usa, Inc. Broadband power transistor devices and amplifiers and methods of manufacture thereof
DE102018131040B4 (de) 2018-12-05 2022-02-24 Ferdinand-Braun-Institut gGmbH, Leibniz- Institut für Höchstfrequenztechnik Hochfrequenz-Leistungstransistor und Hochfrequenz-Leistungsverstärker
US11031913B2 (en) 2019-05-17 2021-06-08 Cree, Inc. Bias voltage connections in RF power amplifier packaging
EP3937375A1 (en) * 2020-07-09 2022-01-12 Infineon Technologies AG Device including power transistor and dc feed path and method

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5233453A (en) * 1975-09-10 1977-03-14 Nec Corp High frequency high output transistor amplifier
JPS5316588A (en) * 1976-07-30 1978-02-15 Toshiba Corp Integrated circuit
US4649416A (en) * 1984-01-03 1987-03-10 Raytheon Company Microwave transistor package
JP2529038B2 (ja) * 1991-07-19 1996-08-28 株式会社日立製作所 高周波高効率電力増幅器
JP2864841B2 (ja) * 1992-02-04 1999-03-08 三菱電機株式会社 高周波高出力トランジスタ
US5309014A (en) * 1992-04-02 1994-05-03 Motorola Inc. Transistor package
JP3060981B2 (ja) * 1997-02-21 2000-07-10 日本電気株式会社 マイクロ波増幅器
US6127894A (en) * 1998-01-21 2000-10-03 Uniden San Diego Research & Development Center, Inc. High frequency shunt feedback amplifier topology
AU5304500A (en) * 1999-06-07 2000-12-28 Ericsson Inc. High impedance matched rf power transistor
US6798313B2 (en) * 2001-06-04 2004-09-28 U.S. Monolithics, L.L.C. Monolithic microwave integrated circuit with bondwire and landing zone bias
US6614308B2 (en) * 2001-10-22 2003-09-02 Infineon Technologies Ag Multi-stage, high frequency, high power signal amplifier
CN1623232B (zh) * 2002-01-24 2010-05-26 Nxp股份有限公司 射频放大器装置以及与其相关的模块和方法

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103178040A (zh) * 2011-12-21 2013-06-26 财团法人工业技术研究院 半导体结构及其制造方法
CN108206677A (zh) * 2016-12-20 2018-06-26 恩智浦美国有限公司 用于具有增强视频带宽的rf功率放大器的多基带终端组件
CN108206677B (zh) * 2016-12-20 2023-09-26 恩智浦美国有限公司 用于具有增强视频带宽的rf功率放大器的多基带终端组件
CN107508561A (zh) * 2017-08-14 2017-12-22 电子科技大学 一种跨倍频程宽带功率放大器及其实现方法
CN107508561B (zh) * 2017-08-14 2020-09-25 电子科技大学 一种跨倍频程宽带功率放大器及其实现方法
WO2022143504A1 (zh) * 2020-12-30 2022-07-07 华为技术有限公司 一种射频放大器
CN117895933A (zh) * 2024-03-18 2024-04-16 上海唯捷创芯电子技术有限公司 射频开关电路、芯片及其电子设备

Also Published As

Publication number Publication date
WO2004057666A3 (en) 2004-09-10
WO2004057666A2 (en) 2004-07-08
TW200417134A (en) 2004-09-01
EP1573813B1 (en) 2016-10-19
EP1573813A2 (en) 2005-09-14
TWI285993B (en) 2007-08-21
CN100459121C (zh) 2009-02-04
US6734728B1 (en) 2004-05-11

Similar Documents

Publication Publication Date Title
CN1732568A (zh) 具内部偏馈射频功率晶体管
CN1976023B (zh) 输出匹配晶体管
KR100841119B1 (ko) 반도체 전력 디바이스 및 광대역 고주파 (rf) 신호증폭기
CN1701613B (zh) 具有rf旁路/输出匹配网络的封装rf功率晶体管
US6424223B1 (en) MMIC power amplifier with wirebond output matching circuit
CN1139145C (zh) 无线电设备的环形天线
CN1219773A (zh) 千瓦功率管
CN109672019B (zh) 一种终端mimo天线装置及实现天线信号传输方法
CN202261179U (zh) 一种p波段射频推挽高功率放大器
US9214903B2 (en) Amplifier
CN1101759A (zh) 带状线谐振器
AU1745100A (en) High frequency power transistor device
RU97114195A (ru) Устройство деления и суммирования радиочастотной мощности
CN109194295B (zh) 一种介质集成悬置线wlan双通带低噪声放大器
CN108233881A (zh) 紧凑型f类芯片和接线匹配拓扑结构
CN109462411A (zh) 射频放大模块及通信终端
CN110729281A (zh) 一种宽带大功率GaN预匹配功率管
US20080169883A1 (en) LC resonant circuit
CN110875722A (zh) 高频放大器
CN1149833C (zh) 卫星调谐器的输入电路
CN105634416A (zh) 一种内匹配功率管
CN1018494B (zh) 平衡环
CN1136751C (zh) 不可逆电路装置、复合电子部件和配用它们的通信设备
US9362883B2 (en) Passive radio frequency signal handler
CN1669098A (zh) 多抽头线圈

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
TR01 Transfer of patent right

Effective date of registration: 20180605

Address after: North Carolina

Patentee after: Cree, Inc.

Address before: Munich, Germany

Patentee before: INFINEON TECHNOLOGIES AG

TR01 Transfer of patent right
CX01 Expiry of patent term

Granted publication date: 20090204

CX01 Expiry of patent term