CN1729428A - 通过施加电场在光固化组合物中加工纳米级图形的方法和系统 - Google Patents
通过施加电场在光固化组合物中加工纳米级图形的方法和系统 Download PDFInfo
- Publication number
- CN1729428A CN1729428A CN02810019.0A CN02810019A CN1729428A CN 1729428 A CN1729428 A CN 1729428A CN 02810019 A CN02810019 A CN 02810019A CN 1729428 A CN1729428 A CN 1729428A
- Authority
- CN
- China
- Prior art keywords
- substrate
- template
- polymerizable composition
- electric field
- composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
Landscapes
- Engineering & Computer Science (AREA)
- Nanotechnology (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Theoretical Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Mathematical Physics (AREA)
- Manufacturing & Machinery (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Polymerisation Methods In General (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Moulding By Coating Moulds (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US29166401P | 2001-05-16 | 2001-05-16 | |
| US60/291,664 | 2001-05-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1729428A true CN1729428A (zh) | 2006-02-01 |
Family
ID=32710708
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN02810019.0A Pending CN1729428A (zh) | 2001-05-16 | 2002-05-16 | 通过施加电场在光固化组合物中加工纳米级图形的方法和系统 |
Country Status (7)
| Country | Link |
|---|---|
| EP (1) | EP1512048B1 (enExample) |
| JP (1) | JP2005520220A (enExample) |
| CN (1) | CN1729428A (enExample) |
| AT (1) | ATE356374T1 (enExample) |
| AU (1) | AU2002368430A1 (enExample) |
| DE (1) | DE60218755T2 (enExample) |
| WO (1) | WO2004063815A2 (enExample) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101446762B (zh) * | 2008-12-31 | 2011-07-27 | 西安交通大学 | 非接触式模板约束下的电场诱导微复型方法 |
| CN102253435A (zh) * | 2011-07-11 | 2011-11-23 | 西安交通大学 | 一种利用电场诱导制造聚合物柱面微透镜的微加工方法 |
| WO2020073632A1 (en) * | 2018-10-11 | 2020-04-16 | Boe Technology Group Co., Ltd. | Imprint template, method of fabricating imprint template, apparatus for performing method of fabricating imprint template, imprint mold for fabricating an imprint template |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7077992B2 (en) | 2002-07-11 | 2006-07-18 | Molecular Imprints, Inc. | Step and repeat imprint lithography processes |
| MY144124A (en) * | 2002-07-11 | 2011-08-15 | Molecular Imprints Inc | Step and repeat imprint lithography systems |
| US6871558B2 (en) | 2002-12-12 | 2005-03-29 | Molecular Imprints, Inc. | Method for determining characteristics of substrate employing fluid geometries |
| US7122079B2 (en) | 2004-02-27 | 2006-10-17 | Molecular Imprints, Inc. | Composition for an etching mask comprising a silicon-containing material |
| US7654816B2 (en) * | 2004-10-07 | 2010-02-02 | Hewlett-Packard Development Company, L.P. | Lithographic mask alignment |
| CN100395121C (zh) * | 2004-11-19 | 2008-06-18 | 鸿富锦精密工业(深圳)有限公司 | 热压印方法 |
| JP4742665B2 (ja) * | 2005-04-28 | 2011-08-10 | 旭硝子株式会社 | エッチング処理された処理基板の製造方法 |
| JP4736522B2 (ja) * | 2005-04-28 | 2011-07-27 | 旭硝子株式会社 | エッチング処理された処理基板の製造方法 |
| JP5002211B2 (ja) * | 2005-08-12 | 2012-08-15 | キヤノン株式会社 | インプリント装置およびインプリント方法 |
| JP5268239B2 (ja) * | 2005-10-18 | 2013-08-21 | キヤノン株式会社 | パターン形成装置、パターン形成方法 |
| DE102006007800B3 (de) | 2006-02-20 | 2007-10-04 | MAX-PLANCK-Gesellschaft zur Förderung der Wissenschaften e.V. | Strukturierungsverfahren und Bauteil mit einer strukturierten Oberfläche |
| CN101496106A (zh) * | 2006-07-28 | 2009-07-29 | 国际商业机器公司 | 用于使聚合物层的表面图案化的器件和方法 |
| KR101322133B1 (ko) * | 2006-11-24 | 2013-10-25 | 엘지디스플레이 주식회사 | 임프린트 리소그래피용 스탬프 및 이를 이용한 임프린트리소그래피 방법 |
| JP5328869B2 (ja) * | 2011-10-21 | 2013-10-30 | 東芝機械株式会社 | 転写用の型の製造方法 |
| JP6273860B2 (ja) * | 2014-01-27 | 2018-02-07 | 大日本印刷株式会社 | インプリントモールド及び半導体デバイスの製造方法 |
| JP6980478B2 (ja) * | 2017-09-29 | 2021-12-15 | キヤノン株式会社 | インプリント装置、インプリント方法および物品の製造方法 |
| NL2021092B1 (en) * | 2018-06-08 | 2019-12-13 | Qlayers Holding B V | Application of a coating on a base structure |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| IT1068535B (it) * | 1975-11-03 | 1985-03-21 | Ibm | Apparecchio e processo elettrolito grafico |
| WO2000021689A1 (en) * | 1998-10-09 | 2000-04-20 | The Trustees Of Princeton University | Microscale patterning and articles formed thereby |
| DE60019974T2 (de) * | 1999-12-23 | 2005-11-10 | The University Of Massachusetts, Boston | Verfahren zur herstellung von submikron mustern auf filmen |
-
2002
- 2002-05-16 CN CN02810019.0A patent/CN1729428A/zh active Pending
- 2002-05-16 EP EP02808354A patent/EP1512048B1/en not_active Expired - Lifetime
- 2002-05-16 AU AU2002368430A patent/AU2002368430A1/en not_active Abandoned
- 2002-05-16 AT AT02808354T patent/ATE356374T1/de not_active IP Right Cessation
- 2002-05-16 WO PCT/US2002/015551 patent/WO2004063815A2/en not_active Ceased
- 2002-05-16 DE DE60218755T patent/DE60218755T2/de not_active Expired - Fee Related
- 2002-05-16 JP JP2004566379A patent/JP2005520220A/ja active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101446762B (zh) * | 2008-12-31 | 2011-07-27 | 西安交通大学 | 非接触式模板约束下的电场诱导微复型方法 |
| CN102253435A (zh) * | 2011-07-11 | 2011-11-23 | 西安交通大学 | 一种利用电场诱导制造聚合物柱面微透镜的微加工方法 |
| WO2020073632A1 (en) * | 2018-10-11 | 2020-04-16 | Boe Technology Group Co., Ltd. | Imprint template, method of fabricating imprint template, apparatus for performing method of fabricating imprint template, imprint mold for fabricating an imprint template |
| US11420361B2 (en) | 2018-10-11 | 2022-08-23 | Boe Technology Group Co., Ltd. | Imprint template, method of fabricating imprint template, apparatus for performing method of fabricating imprint template, imprint mold for fabricating an imprint template |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2004063815A2 (en) | 2004-07-29 |
| AU2002368430A1 (en) | 2004-08-10 |
| JP2005520220A (ja) | 2005-07-07 |
| DE60218755T2 (de) | 2007-11-15 |
| ATE356374T1 (de) | 2007-03-15 |
| EP1512048A2 (en) | 2005-03-09 |
| WO2004063815A3 (en) | 2004-12-29 |
| EP1512048B1 (en) | 2007-03-07 |
| DE60218755D1 (de) | 2007-04-19 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |