CN1715979A - 具有刚性和挠性电路板的光纤收发机模块 - Google Patents
具有刚性和挠性电路板的光纤收发机模块 Download PDFInfo
- Publication number
- CN1715979A CN1715979A CNA2005100645093A CN200510064509A CN1715979A CN 1715979 A CN1715979 A CN 1715979A CN A2005100645093 A CNA2005100645093 A CN A2005100645093A CN 200510064509 A CN200510064509 A CN 200510064509A CN 1715979 A CN1715979 A CN 1715979A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- rigid
- optical
- interface
- circuit boards
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000835 fiber Substances 0.000 title claims abstract description 9
- 230000003287 optical effect Effects 0.000 claims abstract description 74
- 230000008878 coupling Effects 0.000 claims abstract description 41
- 238000010168 coupling process Methods 0.000 claims abstract description 41
- 238000005859 coupling reaction Methods 0.000 claims abstract description 41
- 239000013307 optical fiber Substances 0.000 claims abstract description 14
- 238000004891 communication Methods 0.000 abstract description 4
- 230000013011 mating Effects 0.000 abstract 1
- 239000000758 substrate Substances 0.000 description 12
- 230000005540 biological transmission Effects 0.000 description 6
- 230000001419 dependent effect Effects 0.000 description 6
- 230000000712 assembly Effects 0.000 description 4
- 238000000429 assembly Methods 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000003466 welding Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000001154 acute effect Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000005693 optoelectronics Effects 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/428—Electrical aspects containing printed circuit boards [PCB]
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/428—Electrical aspects containing printed circuit boards [PCB]
- G02B6/4281—Electrical aspects containing printed circuit boards [PCB] the printed circuit boards being flexible
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/4283—Electrical aspects with electrical insulation means
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4246—Bidirectionally operating package structures
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optical Couplings Of Light Guides (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Combinations Of Printed Boards (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/866,265 | 2004-06-14 | ||
| US10/866,265 US7137744B2 (en) | 2004-06-14 | 2004-06-14 | Fiber optic transceiver module with rigid and flexible circuit boards |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1715979A true CN1715979A (zh) | 2006-01-04 |
Family
ID=35460627
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2005100645093A Pending CN1715979A (zh) | 2004-06-14 | 2005-04-11 | 具有刚性和挠性电路板的光纤收发机模块 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US7137744B2 (enExample) |
| JP (1) | JP2006004921A (enExample) |
| CN (1) | CN1715979A (enExample) |
| SG (1) | SG118369A1 (enExample) |
| TW (1) | TWI329753B (enExample) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102100010A (zh) * | 2008-05-20 | 2011-06-15 | 菲尼萨公司 | 具有双印刷电路板的收发器模块 |
| CN102213805A (zh) * | 2010-04-12 | 2011-10-12 | 安华高科技光纤Ip(新加坡)私人有限公司 | 具有城堞式电气转弯的光电子收发器模块 |
| CN101581815B (zh) * | 2008-05-15 | 2012-06-06 | 日立电线株式会社 | 光电转换模块 |
| CN104614818A (zh) * | 2015-01-22 | 2015-05-13 | 中航光电科技股份有限公司 | 设备机箱 |
| CN105099563A (zh) * | 2014-05-22 | 2015-11-25 | 华为技术有限公司 | 光收发器和主动光缆 |
| CN105974535A (zh) * | 2011-07-01 | 2016-09-28 | 申泰公司 | 用于ic封装的收发机和接口 |
| CN109491024A (zh) * | 2018-11-28 | 2019-03-19 | 深圳亚力盛连接器有限公司 | 一种光电转换连接装置 |
Families Citing this family (31)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7056032B2 (en) | 2001-09-17 | 2006-06-06 | Stratos International, Inc. | Transceiver assembly for use in fiber optics communications |
| US7073954B1 (en) | 2001-09-17 | 2006-07-11 | Stratos International, Inc. | Transceiver assembly for use in fiber optics communications |
| US7073955B1 (en) | 2001-09-17 | 2006-07-11 | Stratos International, Inc. | Transceiver assembly for use in fiber optics communications |
| US7406230B2 (en) * | 2004-10-05 | 2008-07-29 | Sumitomo Electric Industries, Ltd. | Optical transceiver with a pluggable function |
| US7416353B2 (en) * | 2004-10-05 | 2008-08-26 | Sumitomo Electric Industries, Ltd. | Heat dissipating mechanism of a pluggable optical transceiver |
| US7186144B1 (en) * | 2005-12-01 | 2007-03-06 | Adc Telecommunications, Inc. | Connector including media converter |
| GB0600162D0 (en) * | 2006-01-05 | 2006-02-15 | Zinwave Ltd | Communications device |
| JP2007317901A (ja) * | 2006-05-26 | 2007-12-06 | Sumitomo Electric Ind Ltd | 光トランシーバ |
| US7805622B2 (en) * | 2007-01-26 | 2010-09-28 | Emcore Corporation | Pluggable transceiver module |
| JP2009277441A (ja) * | 2008-05-13 | 2009-11-26 | Tokyo Eletec Kk | 回路基板用接続具 |
| EP2211217B1 (en) | 2009-01-21 | 2016-01-13 | Harman Becker Automotive Systems GmbH | Printed circuit board fiberoptical transceiver in surface mount technology (SMT) |
| JP5157964B2 (ja) * | 2009-02-27 | 2013-03-06 | オムロン株式会社 | 光伝送モジュール、電子機器、及び光伝送モジュールの製造方法 |
| JP4863319B2 (ja) * | 2009-05-19 | 2012-01-25 | 日本航空電子工業株式会社 | 光コネクタ |
| JP5513358B2 (ja) * | 2010-02-05 | 2014-06-04 | 日東電工株式会社 | 回路付サスペンション基板 |
| US8047856B2 (en) * | 2010-02-24 | 2011-11-01 | Avago Technologies Fiber Ip (Singapore) Pte. Ltd. | Array connector for optical transceiver module |
| US20110243509A1 (en) * | 2010-04-05 | 2011-10-06 | Avago Technologies Fiber Ip (Singapore) Pte. Ltd. | Opto-electronic transceiver module system |
| JP5845672B2 (ja) | 2011-07-13 | 2016-01-20 | セイコーエプソン株式会社 | センサーデバイスおよび電子機器 |
| US9052880B2 (en) | 2012-04-18 | 2015-06-09 | International Business Machines Corporation | Multi-level interconnect apparatus |
| JP5656099B1 (ja) | 2013-06-28 | 2015-01-21 | Toto株式会社 | 光レセプタクル、フェルールおよびプラグフェルール |
| CN104020537B (zh) * | 2014-05-20 | 2016-01-13 | 昆山柯斯美光电有限公司 | 高速光电转换装置及其组装方法 |
| US9800075B2 (en) | 2014-06-04 | 2017-10-24 | Societe Bic | Smart charging cable and method for operating a portable electronic device |
| WO2016014622A1 (en) * | 2014-07-23 | 2016-01-28 | Fci Asia Pte. Ltd | Optoelectrical connector module |
| JP6794354B2 (ja) | 2014-11-14 | 2020-12-02 | アンフェノール・エフシーアイ・アジア・ピーティーイー.・リミテッドAmphenol FCI Asia Pte.Ltd. | 据付部材を有するオンボード送受信機組立体 |
| CN105934136B (zh) * | 2016-05-17 | 2019-06-04 | 广东海信宽带科技有限公司 | 光模块 |
| US10439307B2 (en) * | 2017-07-26 | 2019-10-08 | Hewlett Packard Enterprise Development Lp | Cuts in a circuit board |
| US11095075B2 (en) * | 2019-01-17 | 2021-08-17 | TE Connectivity Services Gmbh | Electrical device with a plug connector having a flexible section |
| US11768341B2 (en) * | 2019-09-18 | 2023-09-26 | Nippon Telegraph And Telephone Corporation | Package for optical module |
| TW202127078A (zh) | 2019-11-18 | 2021-07-16 | 美商山姆科技公司 | 電纜連接器以及板連接器 |
| EP4240120A4 (en) * | 2020-12-31 | 2024-05-29 | Samsung Electronics Co., Ltd. | FLEXIBLE CIRCUIT BOARD AND ELECTRONIC DEVICE WITH THE FLEXIBLE CIRCUIT BOARD |
| CN113325527B (zh) * | 2021-05-27 | 2022-04-01 | 中航光电科技股份有限公司 | 一种有源连接器及其刚柔印制板组件 |
| CN118678541B (zh) * | 2024-08-20 | 2024-10-22 | 深圳环光时代技术有限公司 | 一种高速光收发引擎线路板 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0584048U (ja) * | 1992-04-08 | 1993-11-12 | 日本航空電子工業株式会社 | 配線基板の接続装置 |
| JP3066794B2 (ja) * | 1996-06-07 | 2000-07-17 | 日本航空電子工業株式会社 | スタッキング接続用コネクタ及びそのコンタクト |
| JP3740748B2 (ja) * | 1996-06-18 | 2006-02-01 | 松下電器産業株式会社 | 光ファイバモジュール |
| JP2001042170A (ja) * | 1999-07-28 | 2001-02-16 | Canon Inc | 光配線装置、その駆動方法およびそれを用いた電子機器 |
| US6702480B1 (en) * | 2001-06-02 | 2004-03-09 | Aralight, Inc. | Opto-electronic chip package |
| US7056032B2 (en) * | 2001-09-17 | 2006-06-06 | Stratos International, Inc. | Transceiver assembly for use in fiber optics communications |
| JP2003149513A (ja) * | 2001-11-13 | 2003-05-21 | Honda Tsushin Kogyo Co Ltd | O/e変換コネクタ |
| US7064962B2 (en) * | 2002-09-06 | 2006-06-20 | Stratos International, Inc. | Transponder assembly for use with parallel optics modules in fiber optic communications systems |
-
2004
- 2004-06-14 US US10/866,265 patent/US7137744B2/en not_active Expired - Lifetime
-
2005
- 2005-03-16 TW TW094108052A patent/TWI329753B/zh not_active IP Right Cessation
- 2005-04-11 CN CNA2005100645093A patent/CN1715979A/zh active Pending
- 2005-05-20 JP JP2005147784A patent/JP2006004921A/ja active Pending
- 2005-06-10 SG SG200503734A patent/SG118369A1/en unknown
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101581815B (zh) * | 2008-05-15 | 2012-06-06 | 日立电线株式会社 | 光电转换模块 |
| CN102100010A (zh) * | 2008-05-20 | 2011-06-15 | 菲尼萨公司 | 具有双印刷电路板的收发器模块 |
| CN102100010B (zh) * | 2008-05-20 | 2014-03-12 | 菲尼萨公司 | 具有双印刷电路板的收发器模块 |
| CN102213805A (zh) * | 2010-04-12 | 2011-10-12 | 安华高科技光纤Ip(新加坡)私人有限公司 | 具有城堞式电气转弯的光电子收发器模块 |
| CN105974535A (zh) * | 2011-07-01 | 2016-09-28 | 申泰公司 | 用于ic封装的收发机和接口 |
| US9835811B2 (en) | 2011-07-01 | 2017-12-05 | Samtec, Inc. | Transceiver and interface for IC package |
| US9841572B2 (en) | 2011-07-01 | 2017-12-12 | Samtec, Inc. | Transceiver and interface for IC package |
| US9915796B2 (en) | 2011-07-01 | 2018-03-13 | Samtec, Inc. | Transceiver and interface for IC package |
| US9915797B2 (en) | 2011-07-01 | 2018-03-13 | Samtec, Inc. | Transceiver and interface for IC package |
| US10436992B2 (en) | 2011-07-01 | 2019-10-08 | Samtec, Inc. | Transceiver and interface for IC package |
| CN105974535B (zh) * | 2011-07-01 | 2022-05-27 | 申泰公司 | 用于ic封装的收发机和接口 |
| CN105099563A (zh) * | 2014-05-22 | 2015-11-25 | 华为技术有限公司 | 光收发器和主动光缆 |
| CN104614818A (zh) * | 2015-01-22 | 2015-05-13 | 中航光电科技股份有限公司 | 设备机箱 |
| CN109491024A (zh) * | 2018-11-28 | 2019-03-19 | 深圳亚力盛连接器有限公司 | 一种光电转换连接装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2006004921A (ja) | 2006-01-05 |
| TWI329753B (en) | 2010-09-01 |
| US20050276547A1 (en) | 2005-12-15 |
| TW200540483A (en) | 2005-12-16 |
| SG118369A1 (en) | 2006-01-27 |
| US7137744B2 (en) | 2006-11-21 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C12 | Rejection of a patent application after its publication | ||
| RJ01 | Rejection of invention patent application after publication |