CN1701613B - 具有rf旁路/输出匹配网络的封装rf功率晶体管 - Google Patents

具有rf旁路/输出匹配网络的封装rf功率晶体管 Download PDF

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Publication number
CN1701613B
CN1701613B CN038253658A CN03825365A CN1701613B CN 1701613 B CN1701613 B CN 1701613B CN 038253658 A CN038253658 A CN 038253658A CN 03825365 A CN03825365 A CN 03825365A CN 1701613 B CN1701613 B CN 1701613B
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CN
China
Prior art keywords
transistor
lead
packaged
power
video
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
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CN038253658A
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English (en)
Chinese (zh)
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CN1701613A (zh
Inventor
E·J·小克雷斯恩兹
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Wolfspeed Inc
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Cree Microwave LLC
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Publication date
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Publication of CN1701613A publication Critical patent/CN1701613A/zh
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Publication of CN1701613B publication Critical patent/CN1701613B/zh
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    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03F—AMPLIFIERS
    • H03F3/00—Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
    • H03F3/189—High-frequency amplifiers, e.g. radio frequency amplifiers
    • H03F3/19—High-frequency amplifiers, e.g. radio frequency amplifiers with semiconductor devices only
    • H03F3/195—High-frequency amplifiers, e.g. radio frequency amplifiers with semiconductor devices only in integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/66—High-frequency adaptations
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03F—AMPLIFIERS
    • H03F1/00—Details of amplifiers with only discharge tubes, only semiconductor devices or only unspecified devices as amplifying elements
    • H03F1/56—Modifications of input or output impedances, not otherwise provided for
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
    • H01L2223/64—Impedance arrangements
    • H01L2223/66—High-frequency adaptations
    • H01L2223/6644—Packaging aspects of high-frequency amplifiers
    • H01L2223/665—Bias feed arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1305—Bipolar Junction Transistor [BJT]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/30107—Inductance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Amplifiers (AREA)
CN038253658A 2002-09-30 2003-09-17 具有rf旁路/输出匹配网络的封装rf功率晶体管 Expired - Lifetime CN1701613B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/262,217 US6822321B2 (en) 2002-09-30 2002-09-30 Packaged RF power transistor having RF bypassing/output matching network
US10/262,217 2002-09-30
PCT/US2003/029719 WO2004032188A2 (en) 2002-09-30 2003-09-17 Packaged rf power transistor having rf bypassing/output matching network

Publications (2)

Publication Number Publication Date
CN1701613A CN1701613A (zh) 2005-11-23
CN1701613B true CN1701613B (zh) 2010-10-13

Family

ID=32030167

Family Applications (1)

Application Number Title Priority Date Filing Date
CN038253658A Expired - Lifetime CN1701613B (zh) 2002-09-30 2003-09-17 具有rf旁路/输出匹配网络的封装rf功率晶体管

Country Status (7)

Country Link
US (1) US6822321B2 (enExample)
EP (1) EP1547394B1 (enExample)
JP (1) JP5009500B2 (enExample)
CN (1) CN1701613B (enExample)
AU (1) AU2003275086A1 (enExample)
TW (1) TWI318455B (enExample)
WO (1) WO2004032188A2 (enExample)

Families Citing this family (47)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7109589B2 (en) * 2004-08-26 2006-09-19 Agere Systems Inc. Integrated circuit with substantially perpendicular wire bonds
US7268627B2 (en) * 2004-11-03 2007-09-11 Theta Microelectronics, Inc. Pre-matching of distributed and push-pull power transistors
US20060138650A1 (en) * 2004-12-28 2006-06-29 Freescale Semiconductor, Inc. Integrated circuit packaging device and method for matching impedance
US7193473B2 (en) * 2005-03-24 2007-03-20 Cree, Inc. High power Doherty amplifier using multi-stage modules
US7372334B2 (en) * 2005-07-26 2008-05-13 Infineon Technologies Ag Output match transistor
US7564303B2 (en) * 2005-07-26 2009-07-21 Infineon Technologies Ag Semiconductor power device and RF signal amplifier
US7378920B2 (en) * 2006-02-14 2008-05-27 Freescale Semiconductor, Inc. Methods and apparatus for a high-frequency output match circuit
WO2007122586A2 (en) * 2006-04-26 2007-11-01 Nxp B.V. A high power integrated rf amplifier
US20080231373A1 (en) * 2007-03-20 2008-09-25 Hafizur Rahman Output Circuit
US8330265B2 (en) * 2007-06-22 2012-12-11 Cree, Inc. RF transistor packages with internal stability network and methods of forming RF transistor packages with internal stability networks
US8592966B2 (en) * 2007-06-22 2013-11-26 Cree, Inc. RF transistor packages with internal stability network including intra-capacitor resistors and methods of forming RF transistor packages with internal stability networks including intra-capacitor resistors
US8076994B2 (en) * 2007-06-22 2011-12-13 Cree, Inc. RF power transistor packages with internal harmonic frequency reduction and methods of forming RF power transistor packages with internal harmonic frequency reduction
JP5030228B2 (ja) * 2007-11-30 2012-09-19 矢崎総業株式会社 電気接続箱
WO2009130544A1 (en) * 2008-04-22 2009-10-29 Freescale Semiconductor, Inc. Wireless communication unit and semiconductor device having a power amplifier therefor
US7948312B2 (en) * 2009-05-13 2011-05-24 Qualcomm, Incorporated Multi-bit class-D power amplifier system
US8536950B2 (en) * 2009-08-03 2013-09-17 Qualcomm Incorporated Multi-stage impedance matching
US8102205B2 (en) 2009-08-04 2012-01-24 Qualcomm, Incorporated Amplifier module with multiple operating modes
US8659359B2 (en) 2010-04-22 2014-02-25 Freescale Semiconductor, Inc. RF power transistor circuit
EP2388815A1 (en) * 2010-05-10 2011-11-23 Nxp B.V. A transistor package
USD680119S1 (en) * 2011-11-15 2013-04-16 Connectblue Ab Module
USD668659S1 (en) * 2011-11-15 2012-10-09 Connectblue Ab Module
USD689053S1 (en) * 2011-11-15 2013-09-03 Connectblue Ab Module
USD668658S1 (en) * 2011-11-15 2012-10-09 Connectblue Ab Module
USD692896S1 (en) * 2011-11-15 2013-11-05 Connectblue Ab Module
USD680545S1 (en) * 2011-11-15 2013-04-23 Connectblue Ab Module
US9281283B2 (en) 2012-09-12 2016-03-08 Freescale Semiconductor, Inc. Semiconductor devices with impedance matching-circuits
EP2802075B1 (en) 2013-05-07 2017-02-15 Ampleon Netherlands B.V. Dual-band semiconductor RF amplifier device
EP2830089B1 (en) * 2013-07-25 2017-07-12 Ampleon Netherlands B.V. RF power device
EP3066683B1 (en) 2013-11-07 2019-04-24 NXP USA, Inc. Bond wire arrangement with adjustable losses
JP6478253B2 (ja) * 2014-03-21 2019-03-06 華為技術有限公司Ｈｕａｗｅｉ Ｔｅｃｈｎｏｌｏｇｉｅｓ Ｃｏ．，Ｌｔｄ． 電力増幅回路およびトランスミッタ
US9515011B2 (en) 2014-05-28 2016-12-06 Cree, Inc. Over-mold plastic packaged wide band-gap power transistors and MMICS
US9472480B2 (en) 2014-05-28 2016-10-18 Cree, Inc. Over-mold packaging for wide band-gap semiconductor devices
US9641163B2 (en) 2014-05-28 2017-05-02 Cree, Inc. Bandwidth limiting methods for GaN power transistors
US9438184B2 (en) 2014-06-27 2016-09-06 Freescale Semiconductor, Inc. Integrated passive device assemblies for RF amplifiers, and methods of manufacture thereof
CN105322895B (zh) * 2015-05-06 2018-11-09 苏州能讯高能半导体有限公司 一种偏置自适应内匹配功放管及基于该功放管的功放模块
US10432152B2 (en) 2015-05-22 2019-10-01 Nxp Usa, Inc. RF amplifier output circuit device with integrated current path, and methods of manufacture thereof
US9571044B1 (en) 2015-10-21 2017-02-14 Nxp Usa, Inc. RF power transistors with impedance matching circuits, and methods of manufacture thereof
US9692363B2 (en) * 2015-10-21 2017-06-27 Nxp Usa, Inc. RF power transistors with video bandwidth circuits, and methods of manufacture thereof
CN106206524B (zh) * 2016-07-07 2019-01-22 昆山华太电子技术有限公司 一种封装管壳体
US10270402B1 (en) * 2017-11-30 2019-04-23 Nxp Usa, Inc. Broadband input matching and video bandwidth circuits for power amplifiers
US10673386B2 (en) * 2017-12-05 2020-06-02 Nxp Usa, Inc. Wideband power amplifiers with harmonic traps
US10566938B1 (en) * 2018-12-11 2020-02-18 Nxp Usa, Inc. System and method for providing isolation of bias signal from RF signal in integrated circuit
CN111510085B (zh) * 2020-05-12 2023-06-23 苏州远创达科技有限公司 一种功率放大器的输出电路
US12183669B2 (en) 2021-12-17 2024-12-31 Macom Technology Solutions Holdings, Inc. Configurable metal—insulator—metal capacitor and devices
US12230614B2 (en) 2021-12-17 2025-02-18 Macom Technology Solutions Holdings, Inc. Multi-typed integrated passive device (IPD) components and devices and processes implementing the same
US12417966B2 (en) * 2021-12-17 2025-09-16 Macom Technology Solutions Holdings, Inc. IPD components having SiC substrates and devices and processes implementing the same
CN120934465A (zh) * 2025-10-16 2025-11-11 成都屿西半导体科技有限公司 一种扩展调制带宽的射频微波放大器

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1329772A (zh) * 1998-12-02 2002-01-02 艾利森公司 固定增益、固定相位射频功率组件
US20020020894A1 (en) * 2000-08-15 2002-02-21 Masaaki Nishijima RF passive circuit and RF amplifier with via-holes

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58131775A (ja) * 1982-01-29 1983-08-05 Fujitsu Ltd 電界効果半導体装置
JPH0233963A (ja) * 1988-07-23 1990-02-05 Nec Corp 高周波トランジスタ
JPH03283901A (ja) * 1990-03-30 1991-12-13 Nec Corp ハイブリット型マイクロ波集積回路
US5272450A (en) 1991-06-20 1993-12-21 Microwave Modules & Devices, Inc. DC feed network for wideband RF power amplifier
US5309014A (en) * 1992-04-02 1994-05-03 Motorola Inc. Transistor package
US5752182A (en) * 1994-05-09 1998-05-12 Matsushita Electric Industrial Co., Ltd. Hybrid IC
JPH08222657A (ja) * 1995-02-17 1996-08-30 Hitachi Ltd 半導体集積回路装置
US6675383B1 (en) * 1997-01-22 2004-01-06 Nielsen Media Research, Inc. Source detection apparatus and method for audience measurement
US6081160A (en) * 1998-05-20 2000-06-27 Powerwave Technologies, Inc. Method and apparatus for increasing the bandwidth, and reducing the size, of the DC feed network for wideband RF amplifiers using selective placement of high dielectric constant material
JP4163818B2 (ja) * 1999-07-07 2008-10-08 三菱電機株式会社 内部整合型トランジスタ
US20020050851A1 (en) * 1999-12-22 2002-05-02 Grundlingh Johan M. Method and apparatus for biasing radio frequency power transistors
JP2002176368A (ja) * 2001-07-11 2002-06-21 Nec Corp 送信出力増幅器のバイアス電流最適化制御が可能な送信電力制御装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1329772A (zh) * 1998-12-02 2002-01-02 艾利森公司 固定增益、固定相位射频功率组件
US20020020894A1 (en) * 2000-08-15 2002-02-21 Masaaki Nishijima RF passive circuit and RF amplifier with via-holes

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
CN 1329772 A,全文.

Also Published As

Publication number Publication date
EP1547394A4 (en) 2006-09-20
WO2004032188A3 (en) 2004-06-17
US20040061214A1 (en) 2004-04-01
AU2003275086A1 (en) 2004-04-23
EP1547394A2 (en) 2005-06-29
JP5009500B2 (ja) 2012-08-22
AU2003275086A8 (en) 2004-04-23
US6822321B2 (en) 2004-11-23
TW200408128A (en) 2004-05-16
CN1701613A (zh) 2005-11-23
JP2006501678A (ja) 2006-01-12
EP1547394B1 (en) 2016-07-27
WO2004032188A2 (en) 2004-04-15
TWI318455B (en) 2009-12-11

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C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
ASS Succession or assignment of patent right

Owner name: CREE RESEARCH, INC.

Free format text: FORMER OWNER: CREE MICROWAVE INC.

Effective date: 20110816

C41 Transfer of patent application or patent right or utility model
TR01 Transfer of patent right

Effective date of registration: 20110816

Address after: North Carolina

Patentee after: CREE, Inc.

Address before: California, USA

Patentee before: Cree Microwave, Inc.

CX01 Expiry of patent term
CX01 Expiry of patent term

Granted publication date: 20101013