CN1697022A - 消除因传统机加工处理而形成在磁头外围上的缺陷的方法 - Google Patents
消除因传统机加工处理而形成在磁头外围上的缺陷的方法 Download PDFInfo
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Abstract
本发明揭示了一种加工磁头的方法。磁头可以从排状棒料中切割出来。干净空气的射流可以干燥所述磁头。由水射流导引的激光可以微研磨磁头的外围。所述磁头的边缘和前缘的角可以做成预定半径的圆角。所述磁头可以用去离子水清洁,然后在热烘炉中干燥。
Description
发明领域
本发明涉及磁硬盘驱动器的磁头。更明确地,本发明涉及制造用于硬盘驱动器的磁头。
背景技术
硬盘驱动器是常用的信息存储设备,基本上包括一组可由磁读写部件读写的旋转碟片。通常称为变换器的数据传送部件典型地由磁头主体携带并嵌装在其中,所述磁头主体保持在碟片上所形成的离散的数据磁道上方的接近的相关位置上,以便允许进行读写操作。为了相对于碟片的表面适当定位变换器,在磁头主体上形成的空气支承表面(ABS)经受流动的空气流,所述空气流提供了足够的提升力以使磁头和变换器在碟片的数据磁道上方“飞行”。磁碟的高速旋转使得在大致平行于该碟片切线速度方向上产生沿其表面的空气流或风流。该空气流与磁头主体的ABS相合作,使磁头在旋转的碟片上方飞行。实际上,该悬浮的磁头通过这个自促动的空气支承与碟片表面机械地分开。
在ABS设计中一些主要目的是使磁头和它附随的变换器尽量靠近旋转碟片的表面飞行,在变化的飞行条件下均匀地保持一致的接近距离。通常空气支承磁头和旋转的磁碟之间的高度或分隔间隙定义为飞行高度。一般,安装的变换器或读/写部件在离旋转碟片的表面大约仅几个纳米的上方飞行。磁头的飞行高度被认为是影响安装的读/写部件的磁碟读写能力的最重要参数之一。相对小的飞行高度使得变换器在碟片表面上的不同数据位之间获得更大的分辨率,从而提高数据密度和存储容量。随着轻便紧凑的笔记本式电脑的日益流行,其使用相对较小但功能强大的硬盘驱动器,从而日益需要逐渐小的飞行高度。
如图1所示,已知用于普通双体磁头104的ABS102设计形成有一对平行的轨道106和108,所述轨道沿着面对着碟片的磁头表面的外边缘延伸。其他的ABS102结构也已经开发出来,包括三条或更多额外的轨道,带有不同的表面面积和几何形状。这两条轨道106和108典型地沿从前缘110到后缘112的磁头主体长度的至少部分布置。前缘110定义为在旋转碟片朝向后缘112通过磁头104的长度之前穿过的磁头边缘。尽管存在典型地由机加工处理而带来的不希望的大公差,前缘110可以做成锥形。变换器或磁性部件114典型地安装在沿磁头的后缘112的某些位置上,如图1所示。轨道106和108形成了磁头在上面飞行的空气支承表面,并在与由旋转碟片产生的空气流相接触时提供所述需要的提升力。随着碟片的旋转,产生的风或空气流沿双体磁头轨道106和108的下面和它们之间流动。当空气流在轨道106和108的下面通过的时候,提高了轨道和碟片之间的空气压力,从而提供正增压和提升力。一般双体磁头产生了足够的提升力或正载荷,以便使磁头在旋转碟片上方的适当高度处飞行。如果没有轨道106和108,磁头主体104的较大表面面积会产生过多的较大的空气支承表面面积。一般,随着空气支承表面面积的增大,产生的提升力的量也会提高。因此没有轨道时磁头会在离旋转碟片过远的地方飞行,从而丧失了所有前述具有低飞行高度的好处。
目前磁头的制造工艺包括金刚石相关机加工过程例如切片、研磨、抛光和切割。特别切割过程非常重要,通常使用高速旋转的圆形金刚石锯条进行,同时恒定供给冷却水以降低工作材料的温度。
在这个切割过程中,沿切割表面的边缘116受到机械变形而沿磁头边缘形成突起。典型地变形量处于10到15个纳米的高度范围之间,这依赖于机加工参数例如进给速度、锯条质量及其他。当磁头边缘突起高于磁头的ABS时也可能导致在磁头碟片分界面的灾难性损坏。当减少驱动头的形状系数例如从皮米(PICO)磁头到飞米(FEMTO)磁头时,这个问题就变得非常严重。
传统的金刚石锯切处理的另一个主要问题是加工产生的热导致产生沿磁头边缘的微裂纹或裂痕。当安装到驱动器中的时候,在磁头承受热或机械震动负载时这些微裂纹就会成为破裂的中心点。随着磁头容量的不断增加和其飞行高度的持续减小,这变成了不希望的缺陷。
另一个主要问题是衬底的磁头边缘的微裂纹或裂痕可能引起衬底微粒的产生。作为切割的结果,这些微粒会从ABS的前缘和切割边缘产生。
将这些问题减到最小的一个方法可能是优化切割机器的切割参数,例如进给速度、冷却剂流速和转轴旋转速度。通过这种方法,堆积和微裂纹的量可以减少到某一个范围,但是不会消除,因为由于切割的结果而常会存在一定的变形和裂痕。
另一个方法是,使用激光加热磁头的切割边缘116,从而改变应力水平,因此磁头边缘突起变成位于磁头的ABS下方。由于这个过程同样改变磁头隆起和反向隆起的曲率,仅当磁头所需的曲率大于突起的曲率的时候,这个过程可以补偿所述磁头突起。通过ABS设计的优点,飞行高度可以实质上不受磁头曲率的影响或者要求磁头没有任何曲率。同样这种技术不是针对由于前缘而产生的微粒,所述前缘可变成微粒产生的源头。另一种改变磁头104曲率的技术是通过用激光加热磁头的背面以便改变磁头的曲率,而使磁头边缘突起位于ABS表面之下。
多数前述的技术使用传统持续或脉冲的激光去融化磁头材料。这些激光的一个主要问题是产生局部热量。所述热可以导致材料的重新定位,和进一步引起边缘的微裂纹和裂痕,从而会导致驱动器的灾难性损坏。
如上所述,由于切割处理是磁头万向组件(HGA)制造过程开始之前的最后加工步骤,所以切割处理是磁头制作的一个重要步骤。如图2所示,切割步骤在沿空气支承表面(ABS)102的边缘116上留下了机械应力和变形202。这些变形202可能是由于在ABS102上产生的压缩应力集中而引起的,这些应力是由之前的处理例如研磨产生的。随着碟片的存储容量的持续增长,更需要磁头离碟片表面更近距离飞行。如果磁头边缘116处的变形202刚好比ABS高,这样就会导致碟片驱动器的灾难性损坏。
附图说明
图1是现有技术的带有读/写头的磁头装置的立体图。
图2是现有技术中由于切割处理而变形的磁头的立体图。
图3用流程图示出了根据本发明一个实施例的一个机加工磁头的方法。
图4是根据本发明一个实施例的夹具和磁头的立体图。
图5a-b是根据本发明一个实施例的磁头和水射流导引激光的立体图。
图6是根据本发明一个实施例的其边缘做成圆角的磁头的侧视图。
图7a-b是根据本发明一个实施例的其前缘的角做成圆角的磁头的立体图和俯视图。
具体实施方式
本发明揭示了一种加工磁头的方法。在一个实施例中,磁头从排状的棒料中切割出来,干净空气的射流可以吹干磁头。由水射流导引的激光微研磨磁头的外围。磁头的边缘和前缘的角可做成预定半径的圆角。磁头通过去离子水清洁,然后在热烘炉中干燥。
图3用流程图示出了根据本发明实施例的机加工磁头的方法。如图4所示,该过程开始于(方框305)放置排状棒料于夹具或分离(partoff)工具402(方框310)中。所述排状棒料可以由铝钛碳(AlTiC)组合物制成。传统的金刚石锯可以用来将排状棒料切割成磁头104(方框315)。典型地这个方法会产生从ABS衬垫朝向磁头边缘的大约20到40微米的突起,其高度大约是12微米,如之前图2所示。切割之后,磁头可以用干净空气射流吹干(方框320)。
如图5a中所示,已分离的磁头104可以保留在夹具402上,使用激光502微研磨磁头104的ABS102的全部外围504。如图5b所示,激光502由水射流506导引(方框330)。水射流506可以通过非常小的喷嘴聚焦在磁头104上。激光502可以是脉冲激光。激光束穿过水射流506击中磁头104。通过使用穿过水射流506的脉冲激光502,冷却效果可以压制激光的加热效果。水射流506主要用作激光束502的光学导引。由于在激光束融化材料时水射流起了冷却作用,所以磁头不会因热感应损坏。磁头的曲率没有改变,边缘504也没有毛刺、裂纹和裂痕。SYNOVA公司的Micro-jet激光可以用作水射流导引激光502。
另外,水射流导引激光502可以用来切割排状棒料,达到更窄的大约30微米的切割切口404。切割切口404是切割表面406之间的距离。减小切割切口404令到排状棒料包括更多的磁头,从而降低材料成本。
磁头的微研磨量完全依赖于排状块的切割和磁头的形状参数。如图6所示,通过沿切割边缘和前缘504形成小半径曲率602(方框335),磁头边缘突起506可以完全消除。将边缘做圆角可以减少在驱动器运作时微粒从磁头产生的可能性。对于制造过程中的这部分,水射流的喷嘴可以开至40微米。
在驱动器承受震动负载的时候,前缘形成的角702可能会损坏碟片。如图7a立体图和图7b俯视图所示,水射流导引激光502可以将前缘的角702研磨至合适的半径(方框340)。研磨可以结合到切割过程中,从而减少生产线的工序。
然后磁头104可以用常规的去离子水清洁(方框345)。接着磁头可以在热烘炉中干燥(方框350)。然后磁头104可以从分离工具402上卸下,放进托架中以进行常规制造过程(方框355),从而完成整个过程(方框360)。
虽然在这里说明和描述了几个实施例,但是在不脱离本发明的精神和预期的保护范围的前提下,本发明的修改和变化都包含在上面的启示和随附的权利要求书范围之内。
Claims (20)
1.一种方法,包括:
从排状棒料切割出磁头;
用激光微研磨所述磁头的外围;和
用水射流导引所述激光。
2.根据权利要求1所述的方法,其特征在于,所述激光是脉冲激光。
3.根据权利要求1所述的方法,其特征在于,所述激光穿过所述水射流,所述激光和水击中所述磁头。
4.根据权利要求1所述的方法,其特征在于,还包括在切割和微研磨之间使用干净的压缩空气射流去干燥所述磁头。
5.根据权利要求1所述的方法,其特征在于,还包括使用激光和水射流消除所述磁头的边缘突起。
6.根据权利要求5所述的方法,其特征在于,还包括沿所述磁头的切割边缘和前缘做小半径曲率的圆角。
7.根据权利要求1所述的方法,其特征在于,还包括使用消离子水清洁所述磁头。
8.根据权利要求1所述的方法,其特征在于,还包括在热烘炉中干燥所述磁头。
9.根据权利要求1所述的方法,其特征在于,还包括在所述磁头前缘形成圆角。
10.一种磁头制造系统,包括:
金刚石锯,用于从排状棒料中切割出磁头;
激光,用于微研磨所述磁头的外围;和
水射流,用于导引所述激光。
11.根据权利要求10所述的磁头制造系统,其特征在于,所述激光是脉冲激光。
12.根据权利要求10所述的磁头制造系统,其特征在于,所述激光穿过所述水射流,所述激光和水击中所述磁头。
13.根据权利要求10所述的磁头制造系统,其特征在于,还包括用于在切割和微研磨之间干燥所述磁头的压缩空气射流。
14.根据权利要求10所述的磁头制造系统,其特征在于,所述激光和水射流用于消除所述磁头的边缘突起。
15.根据权利要求14所述的磁头制造系统,其特征在于,所述激光和水射流用于沿所述磁头的切割边缘和前缘形成小半径曲率的圆角。
16.根据权利要求10所述的磁头制造系统,其特征在于,还包括通过喷洒而清洁所述磁头的去离子水射流。
17.根据权利要求10所述的磁头制造系统,其特征在于,还包括通过浸洗而清洁所述磁头的去离子水容器。
18.根据权利要求10所述的磁头制造系统,其特征在于,还包括用于干燥所述磁头的热烘炉。
19.根据权利要求10所述的磁头制造系统,其特征在于,所述激光和水射流用于在所述磁头前缘形成圆角。
20.根据权利要求10所述的磁头制造系统,其特征在于,还包括用于支撑所述磁头的夹具。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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US10/833,878 US6960117B1 (en) | 2004-04-28 | 2004-04-28 | Method to eliminate defects on the periphery of a slider due to conventional machining processes |
US10/833878 | 2004-04-28 |
Publications (2)
Publication Number | Publication Date |
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CN1697022A true CN1697022A (zh) | 2005-11-16 |
CN100470635C CN100470635C (zh) | 2009-03-18 |
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US (1) | US6960117B1 (zh) |
JP (1) | JP2005317190A (zh) |
CN (1) | CN100470635C (zh) |
HK (1) | HK1085565A1 (zh) |
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US20130219699A1 (en) | 2012-02-29 | 2013-08-29 | Sae Magnetics (H.K.) Ltd. | Manufacturing method of a slider and manufacturing apparatus thereof |
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- 2005-04-28 CN CNB200510071300XA patent/CN100470635C/zh not_active Expired - Fee Related
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US6960117B1 (en) | 2005-11-01 |
US20050245173A1 (en) | 2005-11-03 |
JP2005317190A (ja) | 2005-11-10 |
CN100470635C (zh) | 2009-03-18 |
HK1085565A1 (en) | 2006-08-25 |
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