CN1694260A - 接触式影像截取结构 - Google Patents
接触式影像截取结构 Download PDFInfo
- Publication number
- CN1694260A CN1694260A CNA2005100645962A CN200510064596A CN1694260A CN 1694260 A CN1694260 A CN 1694260A CN A2005100645962 A CNA2005100645962 A CN A2005100645962A CN 200510064596 A CN200510064596 A CN 200510064596A CN 1694260 A CN1694260 A CN 1694260A
- Authority
- CN
- China
- Prior art keywords
- image display
- display structure
- contact image
- sensor chip
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/8592—Applying permanent coating, e.g. protective coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
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- Image Input (AREA)
- Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)
Abstract
Description
Claims (17)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2005100645962A CN100435342C (zh) | 2005-04-15 | 2005-04-15 | 接触式影像截取结构 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2005100645962A CN100435342C (zh) | 2005-04-15 | 2005-04-15 | 接触式影像截取结构 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1694260A true CN1694260A (zh) | 2005-11-09 |
CN100435342C CN100435342C (zh) | 2008-11-19 |
Family
ID=35353142
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2005100645962A Expired - Fee Related CN100435342C (zh) | 2005-04-15 | 2005-04-15 | 接触式影像截取结构 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN100435342C (zh) |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102651066A (zh) * | 2012-04-05 | 2012-08-29 | 苏州佳世达电通有限公司 | 指纹成像装置及应用于该指纹成像装置的指纹成像方法 |
CN103604784A (zh) * | 2013-11-05 | 2014-02-26 | 浙江工业大学 | Cmos接触式荧光检测分析阵列传感芯片 |
CN103902955A (zh) * | 2012-12-26 | 2014-07-02 | 周正三 | 杂散光耦合式生物信息感测模块及使用其的电子设备 |
CN104914930A (zh) * | 2015-05-30 | 2015-09-16 | 广东欧珀移动通信有限公司 | 一种玻璃盖板及用户终端 |
WO2016000598A1 (zh) * | 2014-07-01 | 2016-01-07 | 苏州晶方半导体科技股份有限公司 | 指纹识别芯片封装结构和封装方法 |
CN106326812A (zh) * | 2015-06-30 | 2017-01-11 | 康而富控股股份有限公司 | 用于指纹辨识板的框体及其制造方法、及导光结构 |
KR20170026537A (ko) * | 2014-07-01 | 2017-03-08 | 차이나 와퍼 레벨 씨에스피 씨오., 엘티디. | 지문 인식 칩 패키징 구조 및 패키징 방법 |
CN107203733A (zh) * | 2016-03-16 | 2017-09-26 | 上海箩箕技术有限公司 | 光学指纹传感器模组 |
US10096643B2 (en) | 2014-07-01 | 2018-10-09 | China Wafer Level Csp Co., Ltd. | Fingerprint recognition chip packaging structure and packaging method |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI514286B (zh) * | 2013-10-16 | 2015-12-21 | Pixart Imaging Inc | 薄型生理特徵偵測模組 |
TWI552092B (zh) * | 2015-07-14 | 2016-10-01 | Concraft Holding Co Ltd | A frame for a fingerprint identification plate, a method of manufacturing the same, and a light guide structure using the same |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5264393A (en) * | 1988-11-25 | 1993-11-23 | Fuji Photo Film Co., Ltd. | Solid state image pickup device and method of manufacturing the same |
JP2858088B2 (ja) * | 1994-11-30 | 1999-02-17 | 株式会社ユニトロン | 受光装置 |
US5865935A (en) * | 1995-02-02 | 1999-02-02 | Eastman Kodak Company | Method of packaging image sensors |
ATE280976T1 (de) * | 2000-03-24 | 2004-11-15 | Infineon Technologies Ag | Gehäuse für biometrische sensorchips |
CN1171308C (zh) * | 2000-11-28 | 2004-10-13 | 矽品精密工业股份有限公司 | 影像感应器封装 |
JP2003233805A (ja) * | 2001-12-04 | 2003-08-22 | Canon Inc | 画像入力装置 |
JP2005018594A (ja) * | 2003-06-27 | 2005-01-20 | Canon Inc | 指紋入力装置、その製造方法、及び個人認証システム |
-
2005
- 2005-04-15 CN CNB2005100645962A patent/CN100435342C/zh not_active Expired - Fee Related
Cited By (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102651066A (zh) * | 2012-04-05 | 2012-08-29 | 苏州佳世达电通有限公司 | 指纹成像装置及应用于该指纹成像装置的指纹成像方法 |
CN103902955A (zh) * | 2012-12-26 | 2014-07-02 | 周正三 | 杂散光耦合式生物信息感测模块及使用其的电子设备 |
CN103604784B (zh) * | 2013-11-05 | 2016-05-18 | 浙江工业大学 | Cmos接触式荧光检测分析阵列传感芯片 |
CN103604784A (zh) * | 2013-11-05 | 2014-02-26 | 浙江工业大学 | Cmos接触式荧光检测分析阵列传感芯片 |
KR20170026537A (ko) * | 2014-07-01 | 2017-03-08 | 차이나 와퍼 레벨 씨에스피 씨오., 엘티디. | 지문 인식 칩 패키징 구조 및 패키징 방법 |
WO2016000598A1 (zh) * | 2014-07-01 | 2016-01-07 | 苏州晶方半导体科技股份有限公司 | 指纹识别芯片封装结构和封装方法 |
KR20170021319A (ko) * | 2014-07-01 | 2017-02-27 | 차이나 와퍼 레벨 씨에스피 씨오., 엘티디. | 지문 인식 칩 패키징 구조 및 패키징 방법 |
KR101878695B1 (ko) * | 2014-07-01 | 2018-07-16 | 차이나 와퍼 레벨 씨에스피 씨오., 엘티디. | 지문 인식 칩 패키징 구조 및 패키징 방법 |
KR101881040B1 (ko) * | 2014-07-01 | 2018-08-16 | 차이나 와퍼 레벨 씨에스피 씨오., 엘티디. | 지문 인식 칩 패키징 구조 및 패키징 방법 |
US10096643B2 (en) | 2014-07-01 | 2018-10-09 | China Wafer Level Csp Co., Ltd. | Fingerprint recognition chip packaging structure and packaging method |
US10108837B2 (en) | 2014-07-01 | 2018-10-23 | China Wafer Level Csp Co., Ltd. | Fingerprint recognition chip packaging structure and packaging method |
KR101911710B1 (ko) * | 2014-07-01 | 2018-10-25 | 차이나 와퍼 레벨 씨에스피 씨오., 엘티디. | 지문 인식 칩 패키징 구조 및 패키징 방법 |
US10133907B2 (en) | 2014-07-01 | 2018-11-20 | China Wafer Level Csp Co., Ltd. | Fingerprint recognition chip packaging structure and packaging method |
CN104914930A (zh) * | 2015-05-30 | 2015-09-16 | 广东欧珀移动通信有限公司 | 一种玻璃盖板及用户终端 |
CN106326812A (zh) * | 2015-06-30 | 2017-01-11 | 康而富控股股份有限公司 | 用于指纹辨识板的框体及其制造方法、及导光结构 |
CN106326812B (zh) * | 2015-06-30 | 2020-02-21 | 康而富控股股份有限公司 | 用于指纹辨识板的框体及其制造方法、及导光结构 |
CN107203733A (zh) * | 2016-03-16 | 2017-09-26 | 上海箩箕技术有限公司 | 光学指纹传感器模组 |
Also Published As
Publication number | Publication date |
---|---|
CN100435342C (zh) | 2008-11-19 |
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Legal Events
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
ASS | Succession or assignment of patent right |
Owner name: YECHENG TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: YILIN SCIENCE + TECH CO LTD Effective date: 20070817 |
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C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20070817 Address after: No. 16, No. eight, No. 2, Zhonghe Road, Taipei, Taiwan, No. 5 Applicant after: Yilin Science &. Technology Co., Ltd. Address before: Taiwan, China Applicant before: Yilin Science &. Technology Co., Ltd. |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20081119 |