CN1649147A - Back-to-back packaging integrated circuit and its producing method - Google Patents
Back-to-back packaging integrated circuit and its producing method Download PDFInfo
- Publication number
- CN1649147A CN1649147A CNA2004100658281A CN200410065828A CN1649147A CN 1649147 A CN1649147 A CN 1649147A CN A2004100658281 A CNA2004100658281 A CN A2004100658281A CN 200410065828 A CN200410065828 A CN 200410065828A CN 1649147 A CN1649147 A CN 1649147A
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- China
- Prior art keywords
- integrated circuit
- chip
- metal lead
- wire frame
- lead wire
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Abstract
This invention discloses a back-to-back packaged IC and its production method. A metal lead frame characterizes in setting IC chips on the front and back of the frame, the chips and leads are covered by plastic package. The method characterizes in preparing a heating device for heating surface of the chips welded on the lead frame, and utilizing a heating block and a press board for soldering when bonding the two chips with tinsel to fully solidify them after inserting them the first time and accurately press the internal lead when inserting them the second time.
Description
Technical field:
The present invention relates to the components and parts in the electronic technology, is a kind of integrated circuit, specifically, is a kind of back-to-back encapsulated integrated circuit and production method thereof.
Background technology:
The integrated circuit of Plastic Package has its current normal structure and technological process at present, and this normal structure and technological process were used two, 30 years in the world.In recent years, along with electronic product constantly develops towards light, thin, short, little direction, integrated circuit was also developing to the high density, compact direction, and was synchronous therewith, and the encapsulation technology of integrated circuit has also obtained swift and violent development.The integrated circuit of the traditional standard profile of Plastic Package generally is to be assembled by chip, Plastic Package, spun gold or aluminium wire, lead frame etc.Now market has occurred that the multicore sheet is packaged together, chip is two-layer or the product of two-layer above overlapping encapsulation, and such multicore sheet encapsulated integrated circuit has been widely used in many portable type electronic products such as digital camera, palmtop PC.But also there are many problems in the overlapping encapsulated integrated circuit of these existing multicore sheets, and as under the much the same situation of multicore sheet size, the connection of lead-in wire will get into trouble, and reliability structurally is also good inadequately.
Summary of the invention:
The purpose of this invention is to provide a kind of back-to-back encapsulated integrated circuit and production method thereof that encapsulates easily, goes between and connect reliably, be particularly suitable for producing in enormous quantities.
Technical solution of the present invention is:
A kind of back-to-back encapsulated integrated circuit has metal lead wire frame, it is characterized in that: the tow sides at metal lead wire frame all are placed with integrated circuit (IC) chip, are covered with Plastic Package outside chip and lead-in wire.
A glue-line is arranged between the slide holder of integrated circuit (IC) chip described in the present invention and metal lead wire frame.
The method of the described back-to-back encapsulated integrated circuit of a kind of production claim 1, it is characterized in that: the heater of at first preparing the chip surface heating be used for welding on the metal lead wire frame, when two chips are carried out gold wire bonding, all utilize heat block and pressing plate to weld, fully solidify after the load in the first time; Lead at secondary load face framework carries out pressure-sizing.
Heater described in the present invention adopts and is respectively applied for two heat blocks and two pressing plates that the positive and negative welding is used.Positive and negative at metal lead wire frame all carries out the installation of chip and carries out gold wire bonding.Add the cushion block that gets on the right track at glue application region and weld zone.
Beneficial effect of the present invention is: novel structure, design are ingenious, encapsulation easily, lead-in wire connect reliable, be particularly suitable for producing in enormous quantities.
The present invention is further illustrated below in conjunction with drawings and Examples:
Description of drawings:
Accompanying drawing is the structural representation of a kind of back-to-back encapsulated integrated circuit of the present invention.
Embodiment:
Accompanying drawing has been described one embodiment of the present of invention, in this embodiment, metal lead wire frame 1,2 is arranged, and all is placed with integrated circuit (IC) chip 3,4 at the tow sides of metal lead wire frame 1,2, at chip 3,4 and go between and be covered with Plastic Package 7 outside 5,6.Between the slide holder of described integrated circuit (IC) chip 3,4 and metal lead wire frame 1,2 glue-line is arranged.
The present invention adds man-hour finishing structure, need add the cushion block that gets on the right track at glue application region and weld zone, and the lead of secondary load face framework will carry out pressure-sizing, destroys the silver coating of bonding region when preventing load for the first time, needs abundant curing after the load for the first time.Need add two heating plates and two block pressur plates (carry out respectively tow sides bonding with) in the weld zone, the heat block of bonding region and the effect of pressing plate are to prevent in bonding process, the dropping of the reverse side chip that the vibration of framework may cause.And, cause first solder joint to be affected because of the heating of chip surface is more weak because the chip on the slide holder is unsettled.
Claims (6)
1, a kind of back-to-back encapsulated integrated circuit has metal lead wire frame, it is characterized in that: the tow sides at metal lead wire frame all are placed with integrated circuit (IC) chip, are covered with Plastic Package outside chip and lead-in wire.
2, back-to-back encapsulated integrated circuit according to claim 1 is characterized in that: a glue-line is arranged between the slide holder of integrated circuit (IC) chip and metal lead wire frame.
3, the method for the described back-to-back encapsulated integrated circuit of a kind of production claim 1, it is characterized in that: the heater of at first preparing the chip surface heating be used for welding on the metal lead wire frame, when two chips are carried out gold wire bonding, all utilize heat block and pressing plate to weld, fully solidify after the load in the first time; Lead at secondary load face framework carries out pressure-sizing.
4, the method for the back-to-back encapsulated integrated circuit of production according to claim 3 is characterized in that: heater adopts and is respectively applied for two heat blocks and two pressing plates that the positive and negative welding is used.
5, according to the method for claim 3 or the back-to-back encapsulated integrated circuit of 4 described productions, it is characterized in that: the positive and negative at metal lead wire frame all carries out the installation of chip and carries out gold wire bonding.
6, according to the method for claim 3 or the back-to-back encapsulated integrated circuit of 4 described productions, it is characterized in that: add the cushion block that gets on the right track at glue application region and weld zone.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100658281A CN100365814C (en) | 2004-12-16 | 2004-12-16 | Back-to-back packaging integrated circuit and its producing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100658281A CN100365814C (en) | 2004-12-16 | 2004-12-16 | Back-to-back packaging integrated circuit and its producing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1649147A true CN1649147A (en) | 2005-08-03 |
| CN100365814C CN100365814C (en) | 2008-01-30 |
Family
ID=34868899
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2004100658281A Active CN100365814C (en) | 2004-12-16 | 2004-12-16 | Back-to-back packaging integrated circuit and its producing method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100365814C (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102569111A (en) * | 2011-12-27 | 2012-07-11 | 三星半导体(中国)研究开发有限公司 | Pressure plate for wire bonding |
| CN103188883B (en) * | 2011-12-29 | 2015-11-25 | 无锡华润安盛科技有限公司 | A kind of welding procedure of metal framework circuit board |
| CN109904276A (en) * | 2019-01-31 | 2019-06-18 | 中国科学院长春光学精密机械与物理研究所 | A kind of GaN base Vertical collection opto chip and preparation method thereof |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0575016A (en) * | 1991-09-11 | 1993-03-26 | Seiko Epson Corp | Semiconductor device |
| US5366933A (en) * | 1993-10-13 | 1994-11-22 | Intel Corporation | Method for constructing a dual sided, wire bonded integrated circuit chip package |
| KR100192179B1 (en) * | 1996-03-06 | 1999-06-15 | 김영환 | Semiconductor package |
| US6372551B1 (en) * | 2000-05-12 | 2002-04-16 | Siliconware Precison Industries Co., Ltd. | Method of manufacturing an image-sensor integrated circuit package without resin flash on lead frame and with increased wire bondability |
| KR100379600B1 (en) * | 2000-08-14 | 2003-04-10 | 삼성전자주식회사 | Method for manufacturing dual chip package |
| CN2763980Y (en) * | 2004-12-16 | 2006-03-08 | 南通富士通微电子股份有限公司 | Back-to-back package IC |
-
2004
- 2004-12-16 CN CNB2004100658281A patent/CN100365814C/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102569111A (en) * | 2011-12-27 | 2012-07-11 | 三星半导体(中国)研究开发有限公司 | Pressure plate for wire bonding |
| CN103188883B (en) * | 2011-12-29 | 2015-11-25 | 无锡华润安盛科技有限公司 | A kind of welding procedure of metal framework circuit board |
| CN109904276A (en) * | 2019-01-31 | 2019-06-18 | 中国科学院长春光学精密机械与物理研究所 | A kind of GaN base Vertical collection opto chip and preparation method thereof |
| CN109904276B (en) * | 2019-01-31 | 2021-01-26 | 中国科学院长春光学精密机械与物理研究所 | GaN-based vertical integrated optoelectronic chip and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN100365814C (en) | 2008-01-30 |
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| C14 | Grant of patent or utility model | ||
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Address after: Jiangsu province Nantong City Chongchuan road 226001 No. 288 Patentee after: Tongfu Microelectronics Co., Ltd. Address before: 226006 Jiangsu province Nantong City Chongchuan Road Development Zone No. 30 Patentee before: Fujitsu Microelectronics Co., Ltd., Nantong |
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| CP03 | Change of name, title or address |