CN2763980Y - Back-to-back package IC - Google Patents
Back-to-back package IC Download PDFInfo
- Publication number
- CN2763980Y CN2763980Y CNU2004200549171U CN200420054917U CN2763980Y CN 2763980 Y CN2763980 Y CN 2763980Y CN U2004200549171 U CNU2004200549171 U CN U2004200549171U CN 200420054917 U CN200420054917 U CN 200420054917U CN 2763980 Y CN2763980 Y CN 2763980Y
- Authority
- CN
- China
- Prior art keywords
- integrated circuit
- utility
- model
- chip
- metal lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
Abstract
The utility model discloses a back-to-back package integrated circuit which comprises a metal lead frame. The utility model is characterized in that integrated circuit chips are arranged on both the front face and the back face of the metal lead frame; the chips and wire leads are covered by plastic package. The utility model has the advantages of novel structure, artful design, easy package and reliable lead connection. The utility model is especially suitable for mass production.
Description
Technical field:
The utility model relates to the components and parts in the electronic technology, is a kind of integrated circuit, specifically, is a kind of back-to-back encapsulated integrated circuit.
Background technology:
The integrated circuit of Plastic Package has its current normal structure and technological process at present, and this normal structure and technological process were used two, 30 years in the world.In recent years, along with electronic product constantly develops towards light, thin, short, little direction, integrated circuit was also developing to the high density, compact direction, and was synchronous therewith, and the encapsulation technology of integrated circuit has also obtained swift and violent development.The integrated circuit of the traditional standard profile of Plastic Package generally is to be assembled by chip, Plastic Package, spun gold or aluminium wire, lead frame etc.Now market has occurred that the multicore sheet is packaged together, chip is two-layer or the product of two-layer above overlapping encapsulation, and such multicore sheet encapsulated integrated circuit has been widely used in many portable type electronic products such as digital camera, palmtop PC.But also there are many problems in the overlapping encapsulated integrated circuit of these existing multicore sheets, and as under the much the same situation of multicore sheet size, the connection of lead-in wire will get into trouble, and reliability structurally is also good inadequately.
Summary of the invention:
The purpose of this utility model provides a kind of back-to-back encapsulated integrated circuit that encapsulates easily, goes between and connect reliably, be particularly suitable for producing in enormous quantities.
Technical solution of the present utility model is: a kind of back-to-back encapsulated integrated circuit, metal lead wire frame is arranged, and it is characterized in that: the tow sides at metal lead wire frame all are placed with integrated circuit (IC) chip, are covered with Plastic Package outside chip and lead-in wire.
A glue-line is arranged between the slide holder of integrated circuit (IC) chip described in the utility model and metal lead wire frame.
The beneficial effects of the utility model are: novel structure, design are ingenious, encapsulation easily, lead-in wire connect reliable, be particularly suitable for producing in enormous quantities.
Below in conjunction with drawings and Examples the utility model is further described:
Description of drawings:
Accompanying drawing is the structural representation of a kind of back-to-back encapsulated integrated circuit of the present utility model.
Embodiment:
Accompanying drawing has been described an embodiment of the present utility model, in this embodiment, metal lead wire frame 1,2 is arranged, and all is placed with integrated circuit (IC) chip 3,4 at the tow sides of metal lead wire frame 1,2, at chip 3,4 and go between and be covered with Plastic Package 7 outside 5,6.Between the slide holder of described integrated circuit (IC) chip 3,4 and metal lead wire frame 1,2 glue-line is arranged.
The utility model adds man-hour finishing structure, need add the cushion block that gets on the right track at glue application region and weld zone, and the lead of secondary load face framework will carry out pressure-sizing, destroys the silver coating of bonding region when preventing load for the first time, needs abundant curing after the load for the first time.Need add two heating plates and two block pressur plates (carry out respectively tow sides bonding with) in the weld zone, the heat block of bonding region and the effect of pressing plate are to prevent in bonding process, the dropping of the reverse side chip that the vibration of framework may cause.And, cause first solder joint to be affected because of the heating of chip surface is more weak because the chip on the slide holder is unsettled.
Claims (2)
1, a kind of back-to-back encapsulated integrated circuit has metal lead wire frame, it is characterized in that: the tow sides at metal lead wire frame all are placed with integrated circuit (IC) chip, are covered with Plastic Package outside chip and lead-in wire.
2, back-to-back encapsulated integrated circuit according to claim 1 is characterized in that: a glue-line is arranged between the slide holder of integrated circuit (IC) chip and metal lead wire frame.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2004200549171U CN2763980Y (en) | 2004-12-16 | 2004-12-16 | Back-to-back package IC |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2004200549171U CN2763980Y (en) | 2004-12-16 | 2004-12-16 | Back-to-back package IC |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2763980Y true CN2763980Y (en) | 2006-03-08 |
Family
ID=36141518
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2004200549171U Expired - Lifetime CN2763980Y (en) | 2004-12-16 | 2004-12-16 | Back-to-back package IC |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2763980Y (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100365814C (en) * | 2004-12-16 | 2008-01-30 | 南通富士通微电子股份有限公司 | Back-to-back packaging integrated circuit and its producing method |
-
2004
- 2004-12-16 CN CNU2004200549171U patent/CN2763980Y/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100365814C (en) * | 2004-12-16 | 2008-01-30 | 南通富士通微电子股份有限公司 | Back-to-back packaging integrated circuit and its producing method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CX01 | Expiry of patent term |
Expiration termination date: 20141216 Granted publication date: 20060308 |