CN101847591B - Method for packaging multiple chips on strip - Google Patents
Method for packaging multiple chips on strip Download PDFInfo
- Publication number
- CN101847591B CN101847591B CN2009100612952A CN200910061295A CN101847591B CN 101847591 B CN101847591 B CN 101847591B CN 2009100612952 A CN2009100612952 A CN 2009100612952A CN 200910061295 A CN200910061295 A CN 200910061295A CN 101847591 B CN101847591 B CN 101847591B
- Authority
- CN
- China
- Prior art keywords
- chip
- band
- crystal grain
- strip
- encapsulation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000000034 method Methods 0.000 title claims abstract description 24
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 11
- 239000013078 crystal Substances 0.000 claims abstract description 17
- 230000027455 binding Effects 0.000 claims abstract description 15
- 238000009739 binding Methods 0.000 claims abstract description 15
- 238000003466 welding Methods 0.000 claims abstract description 8
- 239000011265 semifinished product Substances 0.000 claims abstract description 7
- 238000007789 sealing Methods 0.000 claims abstract description 5
- 238000012360 testing method Methods 0.000 claims abstract description 4
- 238000005538 encapsulation Methods 0.000 claims description 15
- 238000005516 engineering process Methods 0.000 claims description 10
- 239000007787 solid Substances 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 5
- 239000000126 substance Substances 0.000 claims description 5
- 239000004033 plastic Substances 0.000 claims description 4
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- 238000012372 quality testing Methods 0.000 claims description 3
- 238000004891 communication Methods 0.000 claims description 2
- 238000001746 injection moulding Methods 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 239000002245 particle Substances 0.000 abstract description 4
- 239000002131 composite material Substances 0.000 abstract description 2
- 238000012536 packaging technology Methods 0.000 abstract 1
- 241000209094 Oryza Species 0.000 description 2
- 235000007164 Oryza sativa Nutrition 0.000 description 2
- 235000009566 rice Nutrition 0.000 description 2
- 244000247747 Coptis groenlandica Species 0.000 description 1
- 235000002991 Coptis groenlandica Nutrition 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 239000013067 intermediate product Substances 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
Landscapes
- Credit Cards Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
The invention relates to a method for packaging multiple chips on a strip, which comprises the following steps of: replacing the strip by a carrier; completing die bonding and binding or flip chip bonding of multiple chip crystal particles by using an ordinary electronic chip die bonder and a binding machine or a flip chip bonding device; detecting the quality of a semi-finished product in each step; after completing the test on the semi-finished product, sealing the crystal particles; and mounting, welding or bonding sealed particles on corresponding positions of the strip to complete packaging an intelligent card chip on the strip. The method fills the blank of strip-based multi-chip packaging technology in the intelligent card industry, has cost advantage, greatly lowers multi-chip packaging difficulty in the intelligent card industry and makes the production of double-interface cards and composite card simple and easy.
Description
Technical field
The invention belongs to a kind of method of intelligent card chip multi-disc encapsulation, particularly a kind of method that on band, realizes the encapsulation of multicore sheet.
Background technology
In smart card and relevant industries; At the contact intelligent card that manufactures a finished product, radio frequency smart card, double-interface card (single-chip possesses contact and non-contact function simultaneously) before; Intelligent card chip supplier generally provides the chip that is packaged into the band mode to smart card manufacturer and developer, as the important component part of smart card parts.
So-called band is the circuit board that a kind of outer appearnce is similar to the specific glass fiber material of film adhesive tape.Length is generally tens of rice to rice up to a hundred, and width has only 3.5 centimetres.Can encapsulate up to ten thousand intelligent card chips of 2 rows above the band at one.This band just is equivalent to up to ten thousand little circuit boards and is serially connected.This outward appearance and structure are well suited for the full-automatic assembly line of smart card production line and produce, so intelligent card chip supplier is packaged into the band mode with intelligent card chip to be supplied to smart card manufacturer and developer.
The existing band encapsulation technology and the technology of smart card industry only limit to the encapsulation to single intelligent card chip at present, also do not have the ripe multicore sheet encapsulation technology based on band.
Summary of the invention
The purpose of this invention is to provide a kind of needs to use generic encapsulation equipment on carrier, to accomplish paster welding operation, solid brilliant operation and bindings, and final step is realized the method for multicore sheet encapsulation on band.
To achieve these goals, the method that the present invention adopted is:
At first select for use a kind of carrier to substitute band; Accomplish paster or welding with common chip mounter to other electronic devices and components (like electric capacity, resistance); Accomplish solid crystalline substance and binding or flip chip bonding with solid brilliant machine of common electronic chip and binding machine to multiple chips crystal grain; Then these semi-finished product are done quality testing, after finishing the semi-finished product test, crystal grain is carried out seal operation; Particle paster, welding with good seal at last perhaps bonds to the relevant position on the band, accomplishes the process that on band, encapsulates multiple chips and other electronic devices and components.
Said carrier is the thin single or multiple lift pcb board of a slice, or the used support of plastic packaging processing universal electric chip.
Said binding machine is general binding machine.
During said flip chip bonding, the equipment of use is general flip chip bonding equipment.
The said method that crystal grain is carried out seal operation is: accomplish the operation of sealing crystal grain with epoxide resin material.
Said when crystal grain is carried out seal operation, adopt the technology of injection moulding.
The present invention has filled up the technological gap of smart card industry based on the encapsulation of the multicore sheet of band, and the cost very advantageous, greatly reduces the difficulty of the multicore sheet encapsulation of smart card industry, makes the production of double-interface card, composite card become simple.
Embodiment
Make further detailed description in the face of the present invention down.
Specific operation process of the present invention is:
At first select for use another kind of carrier to substitute band, be used for the paster and the welding of solid crystalline substance, binding and other electronic devices and components of multiple chips crystal grain.This carrier can be the little thin single or multiple lift pcb board of a slice area, also can be the used support of plastic packaging processing universal electric chip.The carrier that the electronic chip Packaging Industry uses these materials to do to bind always, available common solid brilliant machine and the production of binding machine operation.According to of the requirement of different chips, select for use aluminum steel to bind machine or gold thread binding machine binding chip to electrical characteristic.When being packaged with strict area and when highly controlling, can adopting flip chip bonding technology that chip is connected on the carrier to whole.
Quality testing can can both be found out the defective in the production process in each link in paster, solid crystalline substance and binding, flip chip bonding process.This operation is that smart card band encapsulation factory wants to do always, and the operation that cannot accomplish.On these universal supports, thereby the reparation that can detect easily and do over again improves the yields of end product greatly.
After finishing the semi-finished product test, can adopt several different methods to make the seal operation of intelligent card chip crystal grain.Through a glue, also can accomplish through the technology of plastic packaging.This operation also is very common operation in the electronic chip Packaging Industry.Most factories select for use epoxide resin material to seal the crystal grain of electronic chip.
When making the aforesaid operations operation, through solid brilliant, bind or the technology controlling and process of flip chip bonding, paster and sealing, multiple chips and associated electrical components and parts have been packaged into the intermediate products of a kind of precise height and volume.It is a kind of chip that is similar to the outward appearance of electronic chip commonly used.At this moment only need chip paster, the welding of many this outward appearances are perhaps bonded to the relevant position on the band, guarantee its electrical communication quality.Just satisfied conventional smart card industry all technical requirements, also can be fit to existing smart card production line the strip-type intelligent card chip.
The content of not doing in this specification to describe in detail belongs to this area professional and technical personnel's known prior art.
Claims (5)
1. on band, realize the method that the multicore sheet encapsulates for one kind, the method that is adopted is:
At first select for use a kind of carrier to substitute band, use common chip mounter to accomplish the paster or the welding of decoring other outer electronic devices and components of sheet crystal grain, with solid brilliant machine of common electronic chip and binding machine; Perhaps flip chip bonding equipment is accomplished solid crystalline substance and the binding to multiple chips crystal grain; Perhaps flip chip bonding in this process, is done quality testing to each link as semi-finished product; After finishing the semi-finished product test, crystal grain is carried out seal operation; When making the aforesaid operations operation; Technology controlling and process through solid crystalline substance, binding or flip chip bonding, paster and sealing; Multiple chips crystal grain and other electronic devices and components have been packaged into a kind of chip that is similar to the outward appearance of electronic chip commonly used; At this moment only need chip paster, the welding of many this outward appearances are perhaps bonded to the relevant position on the band, guarantee its electrical communication quality, accomplish the process of packaging smart card chip on band.
2. the method that on band, realizes the encapsulation of multicore sheet as claimed in claim 1, it is characterized in that: carrier is individual layer pcb board or multi-layer PCB board.
3. the method that on band, realizes the encapsulation of multicore sheet as claimed in claim 1 is characterized in that: carrier is the used support of plastic packaging processing universal electric chip.
4. the method that on band, realizes the encapsulation of multicore sheet as claimed in claim 1, it is characterized in that: the method for crystal grain being carried out seal operation is: accomplish the operation of sealing crystal grain with epoxide resin material.
5. like claim 1 or the 4 described methods that on band, realize the encapsulation of multicore sheet, it is characterized in that: when crystal grain is carried out seal operation, adopt the technology of injection moulding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009100612952A CN101847591B (en) | 2009-03-27 | 2009-03-27 | Method for packaging multiple chips on strip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009100612952A CN101847591B (en) | 2009-03-27 | 2009-03-27 | Method for packaging multiple chips on strip |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101847591A CN101847591A (en) | 2010-09-29 |
| CN101847591B true CN101847591B (en) | 2012-03-21 |
Family
ID=42772145
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009100612952A Expired - Fee Related CN101847591B (en) | 2009-03-27 | 2009-03-27 | Method for packaging multiple chips on strip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101847591B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102646606B (en) * | 2011-02-16 | 2014-12-24 | 中电智能卡有限责任公司 | Packaging method of integrated circuit (IC) card module |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5621242A (en) * | 1994-05-16 | 1997-04-15 | Samsung Electronics Co., Ltd. | Semiconductor package having support film formed on inner leads |
| CN1423315A (en) * | 2001-12-03 | 2003-06-11 | 夏普公司 | Semiconductor module and production method thereof and module for IC card etc. |
| CN1952958A (en) * | 2006-11-22 | 2007-04-25 | 凤凰微电子（中国）有限公司 | Method for fabricating and packaging chips and elements to smart card with plastic package technique |
| CN201000636Y (en) * | 2007-01-19 | 2008-01-02 | 江阴长电先进封装有限公司 | Moulding type package multi-chip integrated SIM card |
| CN101192275A (en) * | 2006-11-28 | 2008-06-04 | 卓恩民 | Memory card packaging structure and its manufacture method |
-
2009
- 2009-03-27 CN CN2009100612952A patent/CN101847591B/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5621242A (en) * | 1994-05-16 | 1997-04-15 | Samsung Electronics Co., Ltd. | Semiconductor package having support film formed on inner leads |
| CN1423315A (en) * | 2001-12-03 | 2003-06-11 | 夏普公司 | Semiconductor module and production method thereof and module for IC card etc. |
| CN1952958A (en) * | 2006-11-22 | 2007-04-25 | 凤凰微电子（中国）有限公司 | Method for fabricating and packaging chips and elements to smart card with plastic package technique |
| CN101192275A (en) * | 2006-11-28 | 2008-06-04 | 卓恩民 | Memory card packaging structure and its manufacture method |
| CN201000636Y (en) * | 2007-01-19 | 2008-01-02 | 江阴长电先进封装有限公司 | Moulding type package multi-chip integrated SIM card |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101847591A (en) | 2010-09-29 |
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| C14 | Grant of patent or utility model | ||
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Owner name: JIANGSU JINDONGFANG INFORMATION TECHNOLOGY CO., LT Free format text: FORMER OWNER: WANG HAIQUAN Effective date: 20150226 |
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| C41 | Transfer of patent application or patent right or utility model | ||
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 430060 WUHAN, HUBEI PROVINCE TO: 224313 YANCHENG, JIANGSU PROVINCE |
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| TR01 | Transfer of patent right |
Effective date of registration: 20150226 Address after: 224313, building 1, Haide Industrial Park, Airport Road, Sheyang, Yancheng City, Jiangsu Patentee after: Jiangsu Golden East Information Technology Co., Ltd. Address before: 430060, room 10, 401, Jiangnan village, Nanhu community, Wuchang District, Hubei, Wuhan Patentee before: Wang Haiquan |
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| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120321 Termination date: 20180327 |
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| CF01 | Termination of patent right due to non-payment of annual fee |