CN101192275A - Memory card packaging structure and its manufacture method - Google Patents
Memory card packaging structure and its manufacture method Download PDFInfo
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- CN101192275A CN101192275A CN 200610163007 CN200610163007A CN101192275A CN 101192275 A CN101192275 A CN 101192275A CN 200610163007 CN200610163007 CN 200610163007 CN 200610163007 A CN200610163007 A CN 200610163007A CN 101192275 A CN101192275 A CN 101192275A
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- chip
- memory card
- circuit board
- printed circuit
- packaging structure
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1517—Multilayer substrate
- H01L2924/15172—Fan-out arrangement of the internal vias
- H01L2924/15174—Fan-out arrangement of the internal vias in different layers of the multilayer substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/30107—Inductance
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Abstract
The invention provides a memory card package structure which comprises a printed circuit board and at least one chip package body, wherein, the upper surface of the printed circuit board is provided with a plurality of bond pads, and the lower surface of the printed circuit board is provided with an exposed gold finger; each chip package body comprises at least one chip and a baseplate, wherein, the inside of the baseplate is provided with at least one layer of wirings, which are provided with a plurality of conductive terminals which are exposed on the lower surface of the baseplate, and the conductive terminals and the bond pads are bonded and electrically communicated. The package method of the memory card comprises: at least one chip package body taking the baseplate as a chip socket is provided; the chip package body is bonded on the printed circuit board, so that the chip package body and the printed circuit board are electrically connected; the chip package body and the printed circuit board are covered. Multilayer wirings can be arranged in the baseplate of the invention to increase the freedom and the elasticity of the package design, and the functions and storage capacity of the memory card can be increased by adopting a laminated multiple chip package.
Description
Technical field
The present invention relates to a kind of memory card packaging structure and method thereof, particularly relate to a kind of employing chip packing-body, and with memory card packaging structure and the method thereof of substrate as the chip bearing.
Background technology
Memory card (memory card) is a kind of very light and handy Portable data memory device, progress along with science and technology, memory card has been widely used in electronic installation miscellaneous, personal computer (Personal Computer for example, PC), mobile phone (cell phone), digital camera (DigitalCamera, DC), digital camera (Digital Video, DV) and personal digital assistant (PersonalDigital Assistant, PDA) ... etc., different demands according to various application, memory card has many different sizes, external form and specification, for example: numeric security card (Secure Digital card, SDcard), mini numeric security card (mini SD card), miniature numeric security card (micro SD card, μ SD card), multimedia card (Multi Media Card, MMC) and flash memory (CompactFlash card, CF card) ... etc.
Generally speaking, a memory card comprises at least one chip (chip), and a flash memory (flashmemory) chip for example, chip can directly adhere to a printed circuit board (PCB) (Printed Circuit Board PCB) goes up and its electric connection; Also can be packaged into a chip packing-body earlier, for example (Dynamic Random Access Memory DRAM), electrically connects with the printed circuit board (PCB) adhesion and with circuit board a dynamic RAM again.
The chip packing-body of the memory card that prior art is used, for example a thin-type small-size encapsulates (ThinSmall Out-Line Package, TSOP) body, employing lead frame (lead frame) comes carries chips and electrically connects with printed circuit board (PCB), Fig. 1 is the diagrammatic cross-section of the thin-type small-size packaging body 1 of a prior art, Fig. 2 is its schematic top plan view, one chip 12 is arranged on the chip bearing (chip carrier) 142 of lead frame 14, lead frame 14 has a plurality of outer pins (outerlead) 144, and chip 12 electrically connects with a plurality of bonding wires (bonding wire) 16 and lead frame 14, one packing colloid (molding compound), 18 coating chips 12 and chip bearing 142, and expose outer pin 144.
Fig. 3 is the schematic top plan view of a prior art printed circuit board (PCB) 2, and the upper surface of printed circuit board (PCB) 2 is provided with a plurality of weld pads (solder pad) 22.
Fig. 4 is the schematic top plan view of a prior art memory card packaging structure 3, the a plurality of outer pin 144 of thin-type small-size packaging body 1 is adhered with a plurality of weld pads of printed circuit board (PCB) 2 22 and is electrically conducted, and resistance (resistor), electric capacity (capacitor) or inductance passive devices 32 such as (inductor) are arranged on the printed circuit board (PCB) 2, and electrically conduct with it.
As mentioned above, because the thin-type small-size packaging body adopts lead frame as the chip bearing, and the thickness of thin-type small-size packaging body has its specification limits, so be not suitable for the stacked-up type multichip packaging structure (Stacked-type Multi Chip Package, St.MCP), very and since the space limited, passive device is difficult for inserting in the thin-type small-size packaging body, therefore, prior art adopts the chip packing-body of lead frame to make the function of memory card and capacity be restricted, and can't further promote.
Summary of the invention
For addressing the above problem, it is the memory card packaging structure and the method thereof of the chip packing-body of chip (chip) bearing with substrate (substrate) that one of the object of the invention provides a kind of, applicable to numeric security card, mini numeric security card, miniature numeric security card and multimedia card or flash memory ... etc.
One of the object of the invention provides a kind of memory card packaging structure, and it adopts the chip packing-body that covers crystalline substance (flip chip) formula Chip Packaging.
One of the object of the invention provides a kind of memory card packaging structure, and it adopts the chip packing-body of stacked-up type multicore sheet encapsulation.
Therefore, the chip packing-body of memory card of the present invention adopts substrate to have many advantages as the chip bearing: 1. degree of freedom and the elasticity of multilayer wiring (trace) with the increase package design can be set in the substrate, and can adopt the encapsulation of stacked-up type multicore sheet to increase the function and the storage volume of memory card; 2. can place passive device in the chip packing-body,, so on the printed circuit board (PCB) plural chip packing-body can be set, further increase the function and the storage volume of memory card with the encapsulated space of saving printed circuit board (PCB).
In order to achieve the above object, the memory card packaging structure of one embodiment of the invention comprises: a printed circuit board (PCB), and it has one first upper surface and one first lower surface, and first lower surface is provided with a golden finger of exposure, and first upper surface is provided with a plurality of weld pads; And at least one chip packing-body, each chip packing-body comprises an at least one chip and a substrate, substrate has one second upper surface and one second lower surface, chip packing-body is arranged at second upper surface, substrate inside is provided with one deck wiring at least, and wiring has a plurality of conducting terminals that are exposed to second lower surface, and conducting terminal and weld pad adhesion also electrically conduct.
In order to achieve the above object, the memory card packaging method of one embodiment of the invention comprises: providing with a substrate is at least one chip packing-body of chip bearing; The adhesion chip packing-body electrically connects chip packing-body and printed circuit board (PCB) on a printed circuit board (PCB); And cover covers chip packing-body and printed circuit board (PCB).
Below will be by specific embodiment, and accompanying drawing illustrates in detail shown in cooperating, when the effect that is easier to understand purpose of the present invention, technology contents, characteristics and is reached.
Description of drawings
Fig. 1 and Fig. 2 are respectively the diagrammatic cross-section and the schematic top plan view of prior art thin-type small-size packaging body;
Fig. 3 is the schematic top plan view of prior art printed circuit board (PCB);
Fig. 4 is the schematic top plan view of prior art memory card packaging structure;
Fig. 5 and Fig. 6 are respectively the diagrammatic cross-section and the elevational schematic view of the chip packing-body of one embodiment of the invention;
Fig. 7 is the schematic top plan view of the printed circuit board (PCB) of one embodiment of the invention;
Fig. 8 is the schematic top plan view of the memory card packaging structure of one embodiment of the invention;
Fig. 9 and Figure 10 are the diagrammatic cross-section of the memory card packaging structure of the embodiment of the invention;
Figure 11 and Figure 12 are the diagrammatic cross-section of the chip packing-body of the embodiment of the invention;
Figure 13 is the schematic top plan view of the memory card packaging structure of one embodiment of the invention;
Figure 14 is the diagrammatic cross-section of the chip packing-body of one embodiment of the invention;
Figure 15 is the schematic top plan view of the memory card packaging structure of one embodiment of the invention;
Figure 16 is the process flow diagram of the memory card packaging method of one embodiment of the invention.
Symbol description among the figure
1 thin-type small-size packaging body
12 chips
14 lead frames
142 chip bearings
144 outer pins
16 bonding wires
18 packing colloids
2 printed circuit board (PCB)s
22 weld pads
3 memory card packaging structures
32 passive devices
4,4 ' chip packing-body
42 chips
44 substrates (comprise upper and lower surface, be referred to as the second upper and lower surface in the present invention)
442 wirings
4422 conducting terminals
46 bonding wires
48 packing colloids
49 passive devices
5,5 ' printed circuit board (PCB) (comprise upper and lower surface, be referred to as the first upper and lower surface in the present invention)
52 weld pads
54 golden fingers
6,7,7 ' memory card packaging structure
72 loam cakes
74 packing colloids
8,8 ' chip packing-body
81,82,83 chips
84,85 substrates
842,852 wirings
86 soldered balls
87 bonding wires
9,9 ' memory card packaging structure
92 passive devices
The S1 step 1
The S2 step 2
The S3 step 3
Embodiment
Be described in detail as follows, described preferred embodiment is only done an explanation but not in order to limit the present invention.
Fig. 5 and Fig. 6 are respectively the diagrammatic cross-section and the elevational schematic view of the chip packing-body 4 of one embodiment of the invention, at least one chip packing-body 4, this chip packing-body 4 comprises an at least one chip 42 and a substrate 44, this substrate 44 has one second upper surface and one second lower surface, one chip 42 is arranged at second upper surface of a substrate 44, and promptly chip packing-body is arranged at this second upper surface; Substrate 44 inside have one deck wiring 442, wiring 442 has second lower surface that a plurality of conducting terminals 4422 are exposed to substrate 44, a plurality of bonding wires 46 electrically connect chip 42 and substrate 44, one packing colloid 48 coats second upper surface and the chip 42 of bonding wire 46, substrate 44, and expose second lower surface of substrate 44, in one embodiment, the material of packing colloid 48 is epoxy resin (epoxy resin).
Fig. 7 is the schematic top plan view of the printed circuit board (PCB) 5 of one embodiment of the invention, and the upper surface of printed circuit board (PCB) 5 is provided with a plurality of weld pads 52.
Fig. 8 is the schematic top plan view of the memory card packaging structure 6 of one embodiment of the invention, one printed circuit board (PCB) 5, have one first upper surface and one first lower surface, chip packing-body 4 is arranged at first upper surface of printed circuit board (PCB) 5, and conducting terminal 4422 (not shown) and weld pad 52 adhesions also electrically conduct.This first lower surface is provided with a golden finger 54 of exposure, and this first upper surface is provided with a plurality of weld pads 52 (as shown in Figure 9).
Therefore, one of feature of memory card packaging structure of the present invention is to comprise a chip packing-body, and it adopts substrate as the chip bearing.So memory card packaging structure of the present invention is applicable to the memory card of different size, external form and specification, for example: numeric security card, mini numeric security card, miniature numeric security card and multimedia card or flash memory ... etc., but be not limited thereto.
The above-mentioned explanation that continues, after the adhesion of finishing chip packing-body, an available loam cake or a packing colloid cover cover chip packing-body and upper surface of base plate with the protection memory card, prevent from that external force or grit from polluting to cause memory card to damage; Please refer to Fig. 9, Fig. 9 is the diagrammatic cross-section of the memory card packaging structure 7 of one embodiment of the invention, and a loam cake 72 is in order to cover cap chip packing-body 4 first upper surface with printed circuit board (PCB) 5, and exposes first lower surface of printed circuit board (PCB) 5; One golden finger (golden finger) 54 is exposed to first lower surface of printed circuit board (PCB) 5, when memory card inserted the slot of an electronic installation (not shown), golden finger 54 was as the electric connection terminal of power delivery between electronic installation and memory card and exchanges data.Please refer to Figure 10, it is the diagrammatic cross-section of the memory card packaging structure 7 ' of another embodiment of the present invention, the memory card packaging structure 7 of 7 ' and Fig. 9 of Figure 10 has difference, and the memory card packaging structure 7 ' of Figure 10 is with first upper surface of a packing colloid 74 coating chip packaging bodies 4 with printed circuit board (PCB) 5.
This skill had know the knowledgeable usually when can understanding the present invention, for example flash chip and dynamic RAM applicable to chip miscellaneous and chip packing-body; And of the present invention with substrate as the applicable various encapsulating structure of the chip packing-body of chip bearing, crystal covering type Chip Packaging for example, please refer to Figure 11, it is the diagrammatic cross-section of the chip packing-body 8 of one embodiment of the invention, chip packing-body 8 is the crystal covering type Chip Packaging, the active surface of chip 82 is towards substrate 84 second upper surfaces, and chip 82 electrically connects with the wiring 842 of a plurality of soldered balls (flip ball) 86 with substrate 84.
Because the present invention adopts substrate as the chip bearing, so having enough spaces, chip packing-body inside can do the encapsulation of stacked-up type multicore sheet, please refer to Figure 12, it is the diagrammatic cross-section of the chip packing-body 8 ' of another embodiment of the present invention, chip packing-body 8 ' is the encapsulation of stacked-up type multicore sheet, it comprises the chip 81 and chip 83 that is stacked and placed on the substrate 85, in this embodiment, chip 81 electrically connects by bonding wire 87 and substrate 85 with chip 83, also can adopt alternate manners such as soldered ball in another embodiment, therefore, according to spirit of the present invention, such as adopt chip packing-body and all contain within the scope of the invention as the memory card packaging structure of chip bearing, do not repeat them here with substrate.
In addition, adopting substrate is that substrate inside can be provided with multilayer wiring to increase the degree of freedom and the elasticity of package design as another advantage of chip bearing, and for example substrate 85 inside are provided with two layers of wiring 852 (refer again to Figure 12).
Generally speaking, memory card must have passive devices such as resistance, electric capacity or inductance to reach functions such as filtered noise, please refer to Figure 13, it is the schematic top plan view of the memory card packaging structure 6 ' of one embodiment of the invention, chip packing-body 4 is arranged at first upper surface of printed circuit board (PCB) 5, and passive devices 92 such as resistance, electric capacity or inductance also are arranged at first upper surface of printed circuit board (PCB) 5, and electrically conduct with printed circuit board (PCB) 5.
Very and, because the present invention adopts substrate to have bigger space as the chip packing-body inside of chip bearing, so can be packaged in chip packing-body inside to passive devices such as resistance, electric capacity or inductance to save the encapsulated space of printed circuit board (PCB), please refer to Figure 14, it is the diagrammatic cross-section of the chip packing-body 4 ' of one embodiment of the invention, chip packing-body 4 ' comprises at least one passive device 49, and it is arranged at second upper surface of substrate 44, and electrically connects with substrate 44.
As mentioned above, because of passive device of the present invention can be packaged in chip packing-body inside, the printed circuit board space of saving can be provided with encapsulating more than one chip packing-body in same memory card again, please refer to Figure 15, it is the schematic top plan view of the memory card packaging structure 9 ' of one embodiment of the invention, and two chip packing-bodies 4 ' are arranged at printed circuit board (PCB) 5 ' and go up to increase the function and the storage volume of memory card.
In sum, the chip packing-body of memory card of the present invention adopts substrate to have many advantages as the chip bearing: 1. degree of freedom and the elasticity of multilayer wiring with the increase package design can be set in the substrate, and can adopt the encapsulation of stacked-up type multicore sheet to increase the function and the storage volume of memory card; 2. can be arranged at the encapsulated space of chip packing-body inside to passive device, so on the printed circuit board (PCB) plural chip packing-body can be set, further increase the function and the storage volume of memory card with the saving memory card.
On the other hand, Figure 16 is the process flow diagram of the memory card packaging method of an embodiment provided by the invention, comprising: step 1 (S1), and providing with the substrate is at least one chip packing-body of chip bearing; Step 2 (S2), adhesion chip packing-body electrically connect chip packing-body and printed circuit board (PCB) on a printed circuit board (PCB); And step 3 (S3), cover covers chip packing-body and printed circuit board (PCB).
In one embodiment of this invention, can use a loam cake or a packing colloid to cover and cover chip packing-body and printed circuit board (PCB), the material of packing colloid can be epoxy resin, and memory card packaging method of the present invention can comprise that at least one passive device of adhesion is on printed circuit board (PCB).
Therefore, memory card packaging method of the present invention have step simple, with the prior art processing procedure compatible and advantages such as enforcement easily.
Above-described embodiment only is explanation technological thought of the present invention and characteristics, its purpose makes the personage who has the knack of this skill can understand content of the present invention and is implementing according to this, when not limiting claim of the present invention with this, promptly the equalization of doing according to disclosed spirit generally changes or modifies, and must be encompassed in the claim of the present invention.
Claims (22)
1. memory card packaging structure comprises:
One printed circuit board (PCB) has one first upper surface and one first lower surface, and this first lower surface is provided with a golden finger of exposure, and this first upper surface is provided with a plurality of weld pads; And
At least one chip packing-body, this chip packing-body comprises an at least one chip and a substrate, this substrate has one second upper surface and one second lower surface, this chip packing-body is arranged at this second upper surface, and this substrate inside is provided with one deck wiring at least, this wiring has a plurality of conducting terminals that are exposed to this second lower surface, and these conducting terminals and the adhesion of these weld pads also electrically conduct.
2. memory card packaging structure as claimed in claim 1 comprises a loam cake, first upper surface of its this printed circuit board (PCB) of cover cap and this chip packing-body, and expose first lower surface of this printed circuit board (PCB).
3. memory card packaging structure as claimed in claim 1 comprises a packing colloid, and it coats first upper surface and this chip packing-body of this printed circuit board (PCB), and exposes first lower surface of this printed circuit board (PCB).
4. memory card packaging structure as claimed in claim 1, the material of wherein said packing colloid are epoxy resin.
5. memory card packaging structure as claimed in claim 1 comprises at least one passive device, and it is arranged on this first upper surface of this printed circuit board (PCB), and electrically connects with this printed circuit board (PCB).
6. as memory card packaging structure as described in the claim 5, wherein said passive device is resistance, electric capacity or inductance.
7. memory card packaging structure as claimed in claim 1, wherein said chip packing-body comprises a plurality of bonding wires, and it electrically connects this chip and this substrate.
8. memory card packaging structure as claimed in claim 1, wherein said chip packing-body comprises at least one packing colloid, and it coats second upper surface and this chip of this Chip Packaging structure base board, and exposes second lower surface of this Chip Packaging structure base board.
9. memory card packaging structure as claimed in claim 8, wherein the material of this packing colloid is an epoxy resin.
10. memory card packaging structure as claimed in claim 1, wherein said chip packing-body are the stacked-up type Chip Packaging, and it comprises a plurality of chips that are stacked and placed on this substrate, and these chips and the electric connection of this substrate.
11. memory card packaging structure as claimed in claim 10 also comprises a plurality of bonding wires and electrically connects these chips and this substrate.
12. memory card packaging structure as claimed in claim 1, wherein said chip packing-body are the crystal covering type Chip Packaging, the active surface of this chip is towards this second upper surface, and this chip electrically connects with a plurality of soldered balls and this substrate.
13. memory card packaging structure as claimed in claim 1, wherein said chip packing-body comprises at least one passive device, and it is arranged on this second upper surface of this substrate, and electrically connects with this substrate.
14. memory card packaging structure as claimed in claim 13, wherein said passive device are resistance, electric capacity or inductance.
15. memory card packaging structure as claimed in claim 1, wherein said memory card are a numeric security card, a mini numeric security card, a miniature numeric security card, a multimedia card or a flash memory.
16. memory card packaging structure as claimed in claim 1, wherein said chip packing-body are dynamic RAM.
17. memory card packaging structure as claimed in claim 1, wherein said chip are flash chip.
18. a memory card packaging method comprises:
Provide with a substrate is at least one chip packing-body of chip bearing;
Adhere this chip packing-body on a printed circuit board (PCB), this chip packing-body and this printed circuit board (PCB) are electrically connected; And
Cover covers this chip packing-body and this printed circuit board (PCB).
19. memory card packaging method as claimed in claim 18 also comprises at least one passive device of adhesion on this printed circuit board (PCB).
20. covering this chip packing-body and this printed circuit board (PCB), memory card packaging method as claimed in claim 18, wherein said cover be to use that housing covers on one.
21. memory card packaging method as claimed in claim 18, wherein said cover cover this chip packing-body and this printed circuit board (PCB) is to use a packing colloid cover to cover.
22. memory card packaging method as claimed in claim 19, the material of wherein said packing colloid are epoxy resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200610163007 CN101192275A (en) | 2006-11-28 | 2006-11-28 | Memory card packaging structure and its manufacture method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200610163007 CN101192275A (en) | 2006-11-28 | 2006-11-28 | Memory card packaging structure and its manufacture method |
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| Publication Number | Publication Date |
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| CN101192275A true CN101192275A (en) | 2008-06-04 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN 200610163007 Pending CN101192275A (en) | 2006-11-28 | 2006-11-28 | Memory card packaging structure and its manufacture method |
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| CN (1) | CN101192275A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102298721A (en) * | 2010-06-22 | 2011-12-28 | 安泰科技有限公司 | Plastic card package and plastic card package manufacturing method |
| CN101847591B (en) * | 2009-03-27 | 2012-03-21 | 王海泉 | Method for packaging multiple chips on strip |
| CN101937886B (en) * | 2009-06-30 | 2012-06-27 | 国碁电子(中山)有限公司 | Thin chip package structure and method |
| CN101661911B (en) * | 2008-08-27 | 2013-04-17 | 日月光半导体制造股份有限公司 | Chip package structure |
| CN103196595A (en) * | 2012-01-09 | 2013-07-10 | 英飞凌科技股份有限公司 | A sensor arrangement and a method for forming the sensor arrangement, a measurement circuit, and chip-packages |
| CN103425943A (en) * | 2012-05-17 | 2013-12-04 | 慧荣科技股份有限公司 | Embedded multimediacard and electronic device using the same, and energining board for embedded multimediacard |
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2006
- 2006-11-28 CN CN 200610163007 patent/CN101192275A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101661911B (en) * | 2008-08-27 | 2013-04-17 | 日月光半导体制造股份有限公司 | Chip package structure |
| CN101847591B (en) * | 2009-03-27 | 2012-03-21 | 王海泉 | Method for packaging multiple chips on strip |
| CN101937886B (en) * | 2009-06-30 | 2012-06-27 | 国碁电子(中山)有限公司 | Thin chip package structure and method |
| CN102298721A (en) * | 2010-06-22 | 2011-12-28 | 安泰科技有限公司 | Plastic card package and plastic card package manufacturing method |
| CN103196595A (en) * | 2012-01-09 | 2013-07-10 | 英飞凌科技股份有限公司 | A sensor arrangement and a method for forming the sensor arrangement, a measurement circuit, and chip-packages |
| CN103196595B (en) * | 2012-01-09 | 2015-08-19 | 英飞凌科技股份有限公司 | Sensor device and form its method, measuring element and chip package |
| CN103425943A (en) * | 2012-05-17 | 2013-12-04 | 慧荣科技股份有限公司 | Embedded multimediacard and electronic device using the same, and energining board for embedded multimediacard |
| CN103425943B (en) * | 2012-05-17 | 2016-11-23 | 慧荣科技股份有限公司 | Embedded multi-media card and relevant electronic installation and its project plate |
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