CN110828411A - Multi-chip bonding post-bending type packaging structure and method - Google Patents
Multi-chip bonding post-bending type packaging structure and method Download PDFInfo
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- CN110828411A CN110828411A CN201911136701.7A CN201911136701A CN110828411A CN 110828411 A CN110828411 A CN 110828411A CN 201911136701 A CN201911136701 A CN 201911136701A CN 110828411 A CN110828411 A CN 110828411A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/49—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions wire-like arrangements or pins or rods
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4885—Wire-like parts or pins
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/4985—Flexible insulating substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/8593—Reshaping, e.g. for severing the wire, modifying the wedge or ball or the loop shape
- H01L2224/85947—Reshaping, e.g. for severing the wire, modifying the wedge or ball or the loop shape by mechanical means, e.g. "pull-and-cut", pressing, stamping
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Engineering (AREA)
- Wire Bonding (AREA)
Abstract
The invention discloses a multi-chip bonding post-bending type packaging structure and a method, relating to the technical field of chip packaging, comprising a flexible circuit board, wherein a pad circuit is fixedly arranged at the position of the outer surface of the flexible circuit board, a pad surface layer is fixedly arranged on the inner surface of the flexible circuit board, and a via hole is arranged between the pad circuit and the pad surface layer inside the flexible circuit board. In addition, the bonding times of the chip bonding pad are greatly reduced, and the production efficiency is improved.
Description
Technical Field
The invention relates to the technical field of chip packaging, in particular to a multi-chip bonding rear bending type packaging structure and a multi-chip bonding rear bending type packaging method.
Background
The chip is widely applied to the electronic information industry as a core device for controlling, signal conversion and transmission of an integrated circuit. The chip is protected and applied by adopting a packaging method because the chip is required to be isolated from the outside during operation so as to prevent the electrical performance of the chip from being reduced due to the corrosion of impurities in the air to a chip circuit, and the packaged chip is more convenient to mount and transport. With the rapid development of electronic information technology, it is becoming an important development direction to integrate and package multiple chips with different functions in one structure body to save space on a circuit board and to miniaturize the whole integrated circuit.
At present, widely applied to the field of chip packaging is Wire Bonding technology, a metal Wire (gold Wire, aluminum Wire and the like) is used, hot pressing or ultrasonic energy is utilized to complete connection of interconnection wires inside a solid circuit in a microelectronic device, namely, connection between a chip and a circuit or a metal lead frame, product production in the technology is limited by metal Wire Bonding efficiency, as a Wire Bonding process can only be carried out one by Bonding pads, the efficiency is low, the Wire Bonding process cost is high, in addition, the chips can only be upwards arranged by Bonding pads, the required packaging size is large when multi-chip integrated packaging is carried out, and the small-size, light and thin market requirements of electronic products are difficult to adapt, therefore, technicians in the field provide a multi-chip Bonding and rear bending type packaging structure and method.
Disclosure of Invention
The invention aims to provide a multi-chip bonding rear-bending type packaging structure and a multi-chip bonding rear-bending type packaging method, which aim to solve the problems that the production of products is limited by the efficiency of metal wire bonding, the bonding pad can only be produced one by one in the wire bonding process, the efficiency is low, the cost of the wire bonding process is high, in addition, chips can only be arranged with the bonding pad facing upwards, the packaging size required during multi-chip integrated packaging is large, and the multi-chip bonding rear-bending type packaging structure and the multi-chip bonding rear-bending type packaging method are difficult to adapt to the market requirements of miniaturization.
In order to achieve the purpose, the invention provides the following technical scheme:
the utility model provides a multi-chip nation back bending type packaging structure, includes the flexible line way board, the fixed pad circuit that is provided with of outside surface position department of flexible line way board, the inboard fixed surface of flexible line way board is provided with the pad surface course, the one end of flexible line way board sets up IC1 terminal of buckling, the other end of flexible line way board is provided with IC34 terminal of buckling, the intermediate position department of flexible line way board is provided with IC2 and binds the end, IC1 buckles the fixed IC1 chip that is provided with in side of terminal, the fixed IC1 chip that is provided with in side of IC2 binding end, the fixed IC3 chip that is provided with in side of IC34 terminal of buckling, IC34 buckles the fixed IC4 chip that is provided with in one side position department that the side of terminal is close to IC3 chip.
As a further scheme of the invention: the flexible circuit board is characterized in that a via hole is formed in the position, located between the pad circuit and the pad surface layer, in the flexible circuit board.
As a further scheme of the invention: and a sealing adhesive layer is fixedly arranged at the outer side position of the flexible circuit board.
As a further scheme of the invention: an IC5 bent terminal is arranged at a position between the IC1 bent terminal and the IC2 binding end, and an IC6 bent terminal is arranged at a position between the IC34 bent terminal and the IC2 binding end.
As a further scheme of the invention: the side face of the IC5 bending terminal is fixedly provided with an IC5 chip, and the side face of the IC6 bending terminal is fixedly provided with an IC6 chip.
As a further scheme of the invention: a multi-chip bonding post-bending packaging method comprises the following steps:
sp 1: performing plate splicing design on pad connecting circuits of a plurality of chips, and designing a flexible circuit board into a double-sided board structure, wherein one side is a pad surface layer, the other side is a pad circuit bonded by the chips, the electrical function connection of the two sides is realized through via holes, and the length of bent terminals at the two sides of the flexible circuit board is calculated and determined according to requirements of bending radius, chip position and the like;
sp 2: bonding each chip to a corresponding area of a pad circuit of the flexible circuit board, and increasing the number of packaged chips by utilizing a side bending space of the flexible circuit board according to the size of each chip;
sp 3: punching and forming terminals which need to be bent after bonding chips in the jointed board of the flexible circuit board;
sp 4: bending the punched flexible circuit board terminal to the surface opposite to the bonding pad for fixing, determining the bending sequence according to the designed length of the circuit board bending terminal, and bending and fixing the short flexible circuit board terminal before bending;
sp 5: the chip fixed after being bent is subjected to glue sealing treatment, so that the chip is isolated from the external environment;
sp 6: and finally, carrying out splitting treatment, and cutting the chip jointed board after glue sealing to form a single chip, namely finishing the bending packaging design after bonding the chip.
Compared with the prior art, the invention has the beneficial effects that:
the invention realizes the bending packaging after bonding of multiple chips by utilizing the characteristic that the flexible circuit board can be bent, can realize smaller packaging size, is beneficial to realizing the miniaturization of electronic components, can increase the integrated quantity of chips and reduce the packaging size of the chips compared with the traditional chip packaging process, can increase the quantity of packaged chips by utilizing the side bending space of the flexible circuit board according to the size of each chip, achieves higher packaging space utilization rate, carries out mass production of the bonded boards by utilizing the production advantages of the flexible circuit board industry, greatly reduces the bonding times of chip bonding pads and improves the production efficiency.
Drawings
Fig. 1 is a schematic side view of a package structure before bending according to an embodiment of the invention;
FIG. 2 is a schematic diagram of a side view of the flexible printed circuit board according to the present invention;
FIG. 3 is a side view of the package structure after bending according to one embodiment of the present invention;
FIG. 4 is a schematic side view of the package structure after being encapsulated according to the embodiment of the invention;
fig. 5 is a schematic structural view of the package structure after being bent according to the second embodiment of the invention.
In the figure: 1. an IC1 chip; 2. an IC2 chip; 3. an IC3 chip; 4. an IC4 chip; 5. IC1 bent terminals; 6. an IC2 bound end; 7. IC34 bent terminals; 8. a flexible circuit board; 801. a pad line; 802. a pad surface layer; 803. a via hole; 9. a glue sealing layer; 10. an IC5 chip; 11. IC5 bent terminals; 12. an IC6 chip; 13. IC6 bends the terminals.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The first embodiment is as follows:
referring to fig. 1-4, in the embodiment of the present invention, a multi-chip bonding rear-bending package structure includes a flexible circuit board 8, a pad circuit 801 is fixedly disposed on an outer surface of the flexible circuit board 8, a pad surface layer 802 is fixedly disposed on an inner surface of the flexible circuit board 8, an IC1 bending terminal 5 is disposed at one end of the flexible circuit board 8, an IC34 bending terminal 7 is disposed at the other end of the flexible circuit board 8, an IC2 binding end 6 is disposed at a middle position of the flexible circuit board 8, an IC1 chip 1 is fixedly disposed on a side surface of the IC1 bending terminal 5, an IC1 chip 2 is fixedly disposed on a side surface of the IC2 binding end 6, an IC3 chip 3 is fixedly disposed on a side surface of the IC34 bending terminal 7, an IC4 chip 4 is fixedly disposed on a side surface of the IC34 bending terminal 7 close to the IC3 chip 3, a position of the flexible circuit board 8, between the pad circuit 801 and the pad, the fixed sealing compound layer 9 that is provided with in the outside position department of flexible line way board 8 plays isolated chip and external environment's guard action.
Example two:
referring to fig. 2 and 5, in an embodiment of the present invention, a multi-chip bonding rear-bending package structure includes a flexible circuit board 8, a pad circuit 801 is fixedly disposed at an outer surface of the flexible circuit board 8, a pad surface layer 802 is fixedly disposed at an inner surface of the flexible circuit board 8, an IC1 bending terminal 5 is disposed at one end of the flexible circuit board 8, an IC34 bending terminal 7 is disposed at the other end of the flexible circuit board 8, an IC2 binding end 6 is disposed at a middle position of the flexible circuit board 8, an IC1 chip 1 is fixedly disposed at a side surface of the IC1 bending terminal 5, an IC1 chip 2 is fixedly disposed at a side surface of the IC2 binding end 6, an IC3 chip 3 is fixedly disposed at a side surface of the IC34 bending terminal 7, an IC4 chip 4 is fixedly disposed at a side surface of the IC34 bending terminal 7 close to the IC3 chip 3, a position between the pad circuit 801 and the pad surface layer 802 is disposed inside of the, an adhesive layer 9 is fixedly arranged at the outer side position of the flexible circuit board 8, an IC5 bending terminal 11 is arranged at the position between the IC1 bending terminal 5 and the IC2 binding end 6, an IC6 bending terminal 13 is arranged at the position between the IC34 bending terminal 7 and the IC2 binding end 6, an IC5 chip 10 is fixedly arranged on the side surface of the IC5 bending terminal 11, and an IC6 chip 12 is fixedly arranged on the side surface of the IC6 bending terminal 13.
The side bending space of the flexible circuit board 8 is utilized to increase the number of packaged chips according to the size of each chip, and the higher packaging space utilization rate is achieved.
Example three:
in the embodiment of the invention, a multi-chip bonding post-bending type packaging method comprises the following use steps:
sp 1: the pad connecting circuits of a plurality of chips are subjected to plate splicing design, the flexible circuit board 8 is designed into a double-sided structure, one side of the double-sided structure is a pad surface layer 802, the other side of the double-sided structure is a pad circuit 801 bonded by the chips, the electrical function connection of the two sides is realized through a via hole 803, and the length of bending terminals on the two sides of the flexible circuit board 8 is calculated and determined according to the requirements of bending radius, chip position and the like;
sp 2: bonding each chip to a corresponding area of a pad circuit 801 of the flexible circuit board, and increasing the number of packaged chips by using a side bending space of the flexible circuit board 8 according to the size of each chip;
sp 3: punching and forming terminals which need to be bent after bonding the chips in the 8 jointed boards of the flexible circuit board;
sp 4: bending the 8 terminal of the punched flexible circuit board to the surface opposite to the bonding pad for fixing, determining the bending sequence according to the length of the designed bent terminal of the circuit board, and bending and fixing the short terminal of the bent terminal;
sp 5: the chip fixed after being bent is subjected to glue sealing treatment, so that the chip is isolated from the external environment;
sp 6: and finally, carrying out splitting treatment, and cutting the chip jointed board after glue sealing to form a single chip, namely finishing the bending packaging design after bonding the chip.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention are equivalent to or changed within the technical scope of the present invention.
Claims (6)
1. A multi-chip bonding rear bending type packaging structure is characterized by comprising a flexible circuit board (8), a pad circuit (801) is fixedly arranged on the outer side surface of the flexible circuit board (8), the inner side surface of the flexible circuit board (8) is fixedly provided with a pad surface layer (802), one end of the flexible circuit board (8) is provided with an IC1 bending terminal (5), the other end of the flexible circuit board (8) is provided with an IC34 bending terminal (7), an IC2 binding end (6) is arranged at the middle position of the flexible circuit board (8), the side surface of the IC1 bending terminal (5) is fixedly provided with an IC1 chip (1), the side surface of the binding end (6) of the IC2 is fixedly provided with an IC1 chip (2), the side surface of the IC34 bending terminal (7) is fixedly provided with an IC3 chip (3), the side face of the IC34 bending terminal (7) is fixedly provided with an IC4 chip (4) at a position close to one side of the IC3 chip (3).
2. The multi-chip bonded rear-bending packaging structure of claim 1, wherein a via hole (803) is opened in the flexible circuit board (8) at a position between the pad circuit (801) and the pad surface layer (802).
3. The multi-chip bonded rear-bending packaging structure according to claim 1, wherein an adhesive sealant layer (9) is fixedly arranged at the outer side position of the flexible circuit board (8).
4. A multi-chip bonding rear-bending package structure according to claim 1, wherein an IC5 bending terminal (11) is disposed at a position between the IC1 bending terminal (5) and the IC2 binding end (6), and an IC6 bending terminal (13) is disposed at a position between the IC34 bending terminal (7) and the IC2 binding end (6).
5. The multi-chip bonding rear-bending packaging structure according to claim 4, wherein the IC5 chip (10) is fixedly arranged on the side of the IC5 bending terminal (11), and the IC6 chip (12) is fixedly arranged on the side of the IC6 bending terminal (13).
6. A multi-chip bond post-bend packaging method, a multi-chip bond post-bend packaging structure according to any one of claims 1-5, comprising the steps of:
sp 1: the method comprises the following steps of performing plate splicing design on pad connecting circuits of a plurality of chips, designing a flexible circuit board (8) into a double-sided board structure, wherein one side of the flexible circuit board is a pad surface layer (802), the other side of the flexible circuit board is a pad circuit (801) bonded by the chips, the electrical function connection of the two sides is realized through a via hole (803), and the length of bent terminals on the two sides of the flexible circuit board (8) is calculated and determined according to requirements of bending radius, chip position and the like;
sp 2: bonding each chip to a corresponding area of a pad circuit (801) of the flexible circuit board, and increasing the number of packaged chips by utilizing a side bending space of the flexible circuit board (8) according to the size of each chip;
sp 3: punching and forming terminals which need to be bent after bonding chips in jointed boards of the flexible circuit boards (8);
sp 4: bending the punched flexible circuit board (8) terminal to the surface opposite to the bonding pad for fixing, determining the bending sequence according to the designed length of the circuit board bending terminal, and bending and fixing the short bending terminal;
sp 5: the chip fixed after being bent is subjected to glue sealing treatment, so that the chip is isolated from the external environment;
sp 6: and finally, carrying out splitting treatment, and cutting the chip jointed board after glue sealing to form a single chip, namely finishing the bending packaging design after bonding the chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911136701.7A CN110828411A (en) | 2019-11-19 | 2019-11-19 | Multi-chip bonding post-bending type packaging structure and method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911136701.7A CN110828411A (en) | 2019-11-19 | 2019-11-19 | Multi-chip bonding post-bending type packaging structure and method |
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| CN110828411A true CN110828411A (en) | 2020-02-21 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114822234A (en) * | 2021-01-29 | 2022-07-29 | 京东方科技集团股份有限公司 | Flexible display module and preparation method thereof |
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| US6102710A (en) * | 1992-08-05 | 2000-08-15 | Fujitsu Limited | Controlled impedance interposer substrate and method of making |
| US20010015487A1 (en) * | 2000-01-13 | 2001-08-23 | Forthun John A. | Stackable chip package with flex carrier |
| US20020050641A1 (en) * | 2000-08-22 | 2002-05-02 | Freeman Stacy L. | Apparatus and methods of semiconductor packages having circuit-bearing interconnect components |
| US20020137252A1 (en) * | 2001-03-21 | 2002-09-26 | Larson Charles E. | Folded interposer |
| CN105118827A (en) * | 2015-08-10 | 2015-12-02 | 成都锐华光电技术有限责任公司 | Three-dimensional chip stack packaging structure based on flexible substrate and packaging method |
| CN205946348U (en) * | 2016-08-30 | 2017-02-08 | 惠州新联兴实业有限公司 | Circuit board that can buckle |
-
2019
- 2019-11-19 CN CN201911136701.7A patent/CN110828411A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6102710A (en) * | 1992-08-05 | 2000-08-15 | Fujitsu Limited | Controlled impedance interposer substrate and method of making |
| US20010015487A1 (en) * | 2000-01-13 | 2001-08-23 | Forthun John A. | Stackable chip package with flex carrier |
| US20020050641A1 (en) * | 2000-08-22 | 2002-05-02 | Freeman Stacy L. | Apparatus and methods of semiconductor packages having circuit-bearing interconnect components |
| US20020137252A1 (en) * | 2001-03-21 | 2002-09-26 | Larson Charles E. | Folded interposer |
| CN105118827A (en) * | 2015-08-10 | 2015-12-02 | 成都锐华光电技术有限责任公司 | Three-dimensional chip stack packaging structure based on flexible substrate and packaging method |
| CN205946348U (en) * | 2016-08-30 | 2017-02-08 | 惠州新联兴实业有限公司 | Circuit board that can buckle |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114822234A (en) * | 2021-01-29 | 2022-07-29 | 京东方科技集团股份有限公司 | Flexible display module and preparation method thereof |
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Application publication date: 20200221 |
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