CN1637034B - 聚氨酯-酰亚胺树脂、粘合剂组合物及电路连接用粘合剂组合物 - Google Patents

聚氨酯-酰亚胺树脂、粘合剂组合物及电路连接用粘合剂组合物 Download PDF

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Publication number
CN1637034B
CN1637034B CN2005100001931A CN200510000193A CN1637034B CN 1637034 B CN1637034 B CN 1637034B CN 2005100001931 A CN2005100001931 A CN 2005100001931A CN 200510000193 A CN200510000193 A CN 200510000193A CN 1637034 B CN1637034 B CN 1637034B
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China
Prior art keywords
polyurethane
resin
imide resin
binder composition
imide
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Expired - Fee Related
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CN2005100001931A
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English (en)
Chinese (zh)
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CN1637034A (zh
Inventor
杉浦实
汤佐正己
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Showa Denko Materials Co ltd
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Hitachi Chemical Co Ltd
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Publication of CN1637034A publication Critical patent/CN1637034A/zh
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Expired - Fee Related legal-status Critical Current
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
    • C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09J179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G61/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
    • C08G61/12—Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Conductive Materials (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
CN2005100001931A 2004-01-08 2005-01-06 聚氨酯-酰亚胺树脂、粘合剂组合物及电路连接用粘合剂组合物 Expired - Fee Related CN1637034B (zh)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2004-002922 2004-01-08
JP2004002922 2004-01-08
JP2004002923 2004-01-08
JP2004002923 2004-01-08
JP2004002922 2004-01-08
JP2004-002923 2004-01-08

Related Child Applications (1)

Application Number Title Priority Date Filing Date
CN2009100016085A Division CN101445714B (zh) 2004-01-08 2005-01-06 聚氨酯-酰亚胺树脂、粘合剂组合物及电路连接用粘合剂组合物

Publications (2)

Publication Number Publication Date
CN1637034A CN1637034A (zh) 2005-07-13
CN1637034B true CN1637034B (zh) 2010-04-28

Family

ID=34889283

Family Applications (2)

Application Number Title Priority Date Filing Date
CN2005100001931A Expired - Fee Related CN1637034B (zh) 2004-01-08 2005-01-06 聚氨酯-酰亚胺树脂、粘合剂组合物及电路连接用粘合剂组合物
CN2009100016085A Expired - Fee Related CN101445714B (zh) 2004-01-08 2005-01-06 聚氨酯-酰亚胺树脂、粘合剂组合物及电路连接用粘合剂组合物

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CN2009100016085A Expired - Fee Related CN101445714B (zh) 2004-01-08 2005-01-06 聚氨酯-酰亚胺树脂、粘合剂组合物及电路连接用粘合剂组合物

Country Status (3)

Country Link
KR (2) KR100792056B1 (ko)
CN (2) CN1637034B (ko)
TW (2) TW200526710A (ko)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101501153B (zh) * 2006-08-04 2012-08-29 日立化成工业株式会社 膜状粘接剂、粘接片及使用其的半导体装置
CN102732207B (zh) * 2006-08-22 2014-05-07 日立化成株式会社 电路连接材料、电路部件的连接结构及其制造方法
WO2008041646A1 (en) 2006-10-04 2008-04-10 Hitachi Chemical Company, Ltd. Resin paste for die bonding, method for manufacturing semiconductor device, and semiconductor device
WO2008132960A1 (ja) * 2007-04-19 2008-11-06 Kaneka Corporation 新規なポリイミド前駆体組成物及びその利用
CN101121101B (zh) * 2007-07-06 2010-06-02 清华大学 聚氨酯酰亚胺渗透汽化芳烃/烷烃分离膜的制备方法
CN102549074B (zh) * 2009-10-07 2015-11-25 日立化成株式会社 热固性树脂组合物、形成柔性配线板的保护膜的方法以及柔性配线板
TWI510521B (zh) * 2013-01-21 2015-12-01 Daxin Materials Corp 聚亞醯胺結構以及聚亞醯胺樹脂組成物
CN104031241A (zh) * 2013-03-09 2014-09-10 东莞市长安东阳光铝业研发有限公司 一种有机硅改性聚氨酯-酰亚胺材料的制备方法及其应用
JP6069153B2 (ja) * 2013-09-27 2017-02-01 デクセリアルズ株式会社 アンダーフィル材、及びこれを用いた半導体装置の製造方法
JP6578100B2 (ja) * 2014-12-25 2019-09-18 日東シンコー株式会社 絶縁紙
CN105097068B (zh) * 2015-06-25 2017-03-08 英利能源（中国）有限公司 导电胶、太阳能电池串及其制备方法
JP7202691B2 (ja) * 2018-10-02 2023-01-12 ナミックス株式会社 樹脂組成物、フィルム、積層板および半導体装置
CN110041212B (zh) * 2019-05-21 2020-10-02 吉林大学 一种含氟多胺单体及其制备方法、一种聚酰亚胺及其制备方法和一种聚酰亚胺膜
CN110373026B (zh) * 2019-09-02 2021-06-29 无锡创彩光学材料有限公司 聚酰亚胺树脂组合物及其制备方法和薄膜

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4929358A (en) * 1989-08-09 1990-05-29 Exxon Research And Engineering Company Polyurethane-imide membranes and their use for the separation of aromatics from non-aromatics
US4962271A (en) * 1989-12-19 1990-10-09 Exxon Research And Engineering Company Selective separation of multi-ring aromatic hydrocarbons from distillates by perstraction
CN1050883A (zh) * 1989-10-10 1991-04-24 B·F·谷德里奇公司 辐射可固化的热塑性聚氨酯
KR970006896B1 (ko) * 1993-11-10 1997-04-30 생산기술연구원 내열성 폴리(우레탄-이미드)수지 및 그 제조방법

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JPH0523558A (ja) * 1989-12-19 1993-02-02 Exxon Res & Eng Co 支持薄層膜の製造
US5254659A (en) * 1990-03-27 1993-10-19 Hitachi, Ltd. Insulating coating composition, solderable insulated wires, production process of the insulated wires and flyback transformers using the insulated wires
SG76530A1 (en) * 1997-03-03 2000-11-21 Hitachi Chemical Co Ltd Circuit boards using heat resistant resin for adhesive layers
GB9814835D0 (en) * 1998-07-08 1998-09-09 Europ Org For Nuclear Research A thermal management board
US6403753B1 (en) * 2000-01-18 2002-06-11 Sandia Corporation Method of making thermally removable polyurethanes
KR100545255B1 (ko) * 2003-04-29 2006-01-24 (주)애드뷰 전도성 고분자를 포함하는 액정 배향제 조성물, 이를이용한 액정 배향막, 그 제조방법 및 상기 액정 배향막을포함하는 액정 소자
JP2006241174A (ja) * 2005-02-07 2006-09-14 Hitachi Chem Co Ltd ダイボンディング用フィルム状接着剤及びこれを用いた接着シート、並びに半導体装置。

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Publication number Priority date Publication date Assignee Title
US4929358A (en) * 1989-08-09 1990-05-29 Exxon Research And Engineering Company Polyurethane-imide membranes and their use for the separation of aromatics from non-aromatics
CN1050883A (zh) * 1989-10-10 1991-04-24 B·F·谷德里奇公司 辐射可固化的热塑性聚氨酯
US4962271A (en) * 1989-12-19 1990-10-09 Exxon Research And Engineering Company Selective separation of multi-ring aromatic hydrocarbons from distillates by perstraction
KR970006896B1 (ko) * 1993-11-10 1997-04-30 생산기술연구원 내열성 폴리(우레탄-이미드)수지 및 그 제조방법

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刘瑾.不同软段结构聚氨酯－酰亚胺嵌段共聚物的合成及热性能研究.高分子学报 2.2002,(2),221-226.
刘瑾.不同软段结构聚氨酯－酰亚胺嵌段共聚物的合成及热性能研究.高分子学报 2.2002,(2),221-226. *
王东.侧链型二阶非线性光学聚(氨酯—酰亚胺)的极化和取向稳定性的研究.功能高分子学报14 1.2001,14(1),35-38.
王东.侧链型二阶非线性光学聚(氨酯-酰亚胺)的极化和取向稳定性的研究.功能高分子学报14 1.2001,14(1),35-38. *
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陈正国.聚氨酯酰亚胺的合成、性能及应用进展.胶体与聚合物17 4.1999,17(4),26-30. *
陈正国.聚氨酯酰亚胺的合成及性能研究.湖北大学学报（自然科学版）23 3.2001,23(3),实验部分.
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Also Published As

Publication number Publication date
CN101445714B (zh) 2013-03-20
KR100860892B1 (ko) 2008-09-29
TW200848483A (en) 2008-12-16
CN101445714A (zh) 2009-06-03
CN1637034A (zh) 2005-07-13
KR20070077201A (ko) 2007-07-25
KR20050073528A (ko) 2005-07-14
KR100792056B1 (ko) 2008-01-04
TW200526710A (en) 2005-08-16
TWI314567B (ko) 2009-09-11

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Granted publication date: 20100428

Termination date: 20140106