CN1629536A - 使用近白色发光二极管产生无杂色白光的方法和装置 - Google Patents
使用近白色发光二极管产生无杂色白光的方法和装置 Download PDFInfo
- Publication number
- CN1629536A CN1629536A CNA200410101333XA CN200410101333A CN1629536A CN 1629536 A CN1629536 A CN 1629536A CN A200410101333X A CNA200410101333X A CN A200410101333XA CN 200410101333 A CN200410101333 A CN 200410101333A CN 1629536 A CN1629536 A CN 1629536A
- Authority
- CN
- China
- Prior art keywords
- light
- emitting diode
- white
- white light
- led
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
- H05B45/20—Controlling the colour of the light
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
- H05B45/40—Details of LED load circuits
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49175—Parallel arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Led Device Packages (AREA)
Abstract
Description
Claims (27)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/742,688 | 2003-12-19 | ||
US10/742,688 US7066623B2 (en) | 2003-12-19 | 2003-12-19 | Method and apparatus for producing untainted white light using off-white light emitting diodes |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1629536A true CN1629536A (zh) | 2005-06-22 |
CN100541837C CN100541837C (zh) | 2009-09-16 |
Family
ID=34678512
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB200410101333XA Active CN100541837C (zh) | 2003-12-19 | 2004-12-17 | 使用近白色发光二极管产生无杂色白光的方法和装置 |
Country Status (5)
Country | Link |
---|---|
US (2) | US7066623B2 (zh) |
JP (1) | JP4947610B2 (zh) |
KR (1) | KR101216878B1 (zh) |
CN (1) | CN100541837C (zh) |
DE (1) | DE102004057499B4 (zh) |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102007612A (zh) * | 2008-11-21 | 2011-04-06 | Lg伊诺特有限公司 | 发光设备和使用该发光设备的显示设备 |
CN1917731B (zh) * | 2005-08-15 | 2011-10-26 | 安华高科技Ecbuip(新加坡)私人有限公司 | 校准的led光模块 |
CN101657671B (zh) * | 2007-02-22 | 2012-07-11 | 科锐公司 | 照明装置、照明方法、滤光器和滤光方法 |
CN102651364A (zh) * | 2011-02-24 | 2012-08-29 | 新世纪光电股份有限公司 | 发光二极管组件 |
CN102803822A (zh) * | 2009-06-15 | 2012-11-28 | 夏普株式会社 | 照明装置、显示装置以及电视接收装置 |
CN101939859B (zh) * | 2008-03-14 | 2012-12-19 | Lg伊诺特有限公司 | 发光设备和包括该发光设备的显示设备 |
CN102969437A (zh) * | 2012-12-06 | 2013-03-13 | 上海顿格电子贸易有限公司 | Led发光元器件 |
CN103839935A (zh) * | 2014-03-14 | 2014-06-04 | 无锡实益达电子有限公司 | 一种具有高色彩表现能力的集成式白光led光源 |
US9115852B2 (en) | 2008-12-19 | 2015-08-25 | Osram Opto Semiconductors Gmbh | Method for producing a plurality of LED illumination devices and a plurality of LED chipsets for illumination devices, and LED illumination device |
CN105324859A (zh) * | 2013-06-18 | 2016-02-10 | 夏普株式会社 | 光源装置以及发光装置 |
Families Citing this family (153)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100502062C (zh) * | 2003-04-30 | 2009-06-17 | 美商克立股份有限公司 | 具有小型光学元件的高功率发光器封装 |
US7005679B2 (en) | 2003-05-01 | 2006-02-28 | Cree, Inc. | Multiple component solid state white light |
KR100655894B1 (ko) * | 2004-05-06 | 2006-12-08 | 서울옵토디바이스주식회사 | 색온도 및 연색성이 우수한 파장변환 발광장치 |
KR100658700B1 (ko) | 2004-05-13 | 2006-12-15 | 서울옵토디바이스주식회사 | Rgb 발광소자와 형광체를 조합한 발광장치 |
US8308980B2 (en) * | 2004-06-10 | 2012-11-13 | Seoul Semiconductor Co., Ltd. | Light emitting device |
KR100665298B1 (ko) * | 2004-06-10 | 2007-01-04 | 서울반도체 주식회사 | 발광장치 |
KR100665299B1 (ko) * | 2004-06-10 | 2007-01-04 | 서울반도체 주식회사 | 발광물질 |
US7534633B2 (en) | 2004-07-02 | 2009-05-19 | Cree, Inc. | LED with substrate modifications for enhanced light extraction and method of making same |
US7404652B2 (en) * | 2004-12-15 | 2008-07-29 | Avago Technologies Ecbu Ip Pte Ltd | Light-emitting diode flash module with enhanced spectral emission |
US20060132431A1 (en) * | 2004-12-17 | 2006-06-22 | Eliezer Oren E | Multi-function digital device as a human-input-device for a computer |
US8125137B2 (en) | 2005-01-10 | 2012-02-28 | Cree, Inc. | Multi-chip light emitting device lamps for providing high-CRI warm white light and light fixtures including the same |
US7564180B2 (en) | 2005-01-10 | 2009-07-21 | Cree, Inc. | Light emission device and method utilizing multiple emitters and multiple phosphors |
KR101138944B1 (ko) * | 2005-01-26 | 2012-04-25 | 서울옵토디바이스주식회사 | 직렬 연결된 복수개의 발광셀들을 갖는 발광 소자 및그것을 제조하는 방법 |
CN101120204A (zh) * | 2005-02-14 | 2008-02-06 | 三菱化学株式会社 | 光源、固体发光元件组件、荧光体组件、配光元件组件、照明装置、图像显示装置及光源的调节方法 |
US8718437B2 (en) | 2006-03-07 | 2014-05-06 | Qd Vision, Inc. | Compositions, optical component, system including an optical component, devices, and other products |
US8128272B2 (en) | 2005-06-07 | 2012-03-06 | Oree, Inc. | Illumination apparatus |
US8215815B2 (en) | 2005-06-07 | 2012-07-10 | Oree, Inc. | Illumination apparatus and methods of forming the same |
US8272758B2 (en) | 2005-06-07 | 2012-09-25 | Oree, Inc. | Illumination apparatus and methods of forming the same |
KR101258397B1 (ko) * | 2005-11-11 | 2013-04-30 | 서울반도체 주식회사 | 구리 알칼리토 실리케이트 혼성 결정 형광체 |
EP1948994B1 (en) * | 2005-11-18 | 2012-09-19 | Cree, Inc. | Tile for solid state lighting panel |
KR101055772B1 (ko) * | 2005-12-15 | 2011-08-11 | 서울반도체 주식회사 | 발광장치 |
CN101460779A (zh) | 2005-12-21 | 2009-06-17 | 科锐Led照明技术公司 | 照明装置 |
US7213940B1 (en) | 2005-12-21 | 2007-05-08 | Led Lighting Fixtures, Inc. | Lighting device and lighting method |
KR101332139B1 (ko) * | 2005-12-21 | 2013-11-21 | 크리, 인코포레이티드 | 조명 장치 및 조명 방법 |
TWI396814B (zh) | 2005-12-22 | 2013-05-21 | 克里公司 | 照明裝置 |
KR100771811B1 (ko) * | 2005-12-27 | 2007-10-30 | 삼성전기주식회사 | 백색 발광 장치 |
US20070153495A1 (en) * | 2005-12-29 | 2007-07-05 | Wang Michael Dongxue | Illumination mechanism for mobile digital imaging |
EP2041478B1 (en) | 2006-03-07 | 2014-08-06 | QD Vision, Inc. | An article including semiconductor nanocrystals |
US9874674B2 (en) | 2006-03-07 | 2018-01-23 | Samsung Electronics Co., Ltd. | Compositions, optical component, system including an optical component, devices, and other products |
KR100875443B1 (ko) | 2006-03-31 | 2008-12-23 | 서울반도체 주식회사 | 발광 장치 |
US9084328B2 (en) * | 2006-12-01 | 2015-07-14 | Cree, Inc. | Lighting device and lighting method |
US8998444B2 (en) * | 2006-04-18 | 2015-04-07 | Cree, Inc. | Solid state lighting devices including light mixtures |
US8513875B2 (en) | 2006-04-18 | 2013-08-20 | Cree, Inc. | Lighting device and lighting method |
US9921428B2 (en) | 2006-04-18 | 2018-03-20 | Cree, Inc. | Light devices, display devices, backlighting devices, edge-lighting devices, combination backlighting and edge-lighting devices |
US7821194B2 (en) * | 2006-04-18 | 2010-10-26 | Cree, Inc. | Solid state lighting devices including light mixtures |
KR101419954B1 (ko) | 2006-04-18 | 2014-07-16 | 크리, 인코포레이티드 | 조명 장치 및 조명 방법 |
BRPI0710461A2 (pt) | 2006-04-20 | 2011-08-16 | Cree Led Lighting Solutions | dispositivo de iluminação e método de iluminação |
WO2007142947A2 (en) | 2006-05-31 | 2007-12-13 | Cree Led Lighting Solutions, Inc. | Lighting device with color control, and method of lighting |
KR20090019871A (ko) | 2006-05-31 | 2009-02-25 | 크리 엘이디 라이팅 솔루션즈, 인크. | 조명 장치 및 조명 방법 |
US7661840B1 (en) | 2006-06-21 | 2010-02-16 | Ilight Technologies, Inc. | Lighting device with illuminated front panel |
KR20090048640A (ko) * | 2006-08-23 | 2009-05-14 | 크리 엘이디 라이팅 솔루션즈, 인크. | 조명 장치 및 조명 방법 |
KR101258227B1 (ko) * | 2006-08-29 | 2013-04-25 | 서울반도체 주식회사 | 발광 소자 |
US8029155B2 (en) | 2006-11-07 | 2011-10-04 | Cree, Inc. | Lighting device and lighting method |
US7901111B2 (en) * | 2006-11-30 | 2011-03-08 | Cree, Inc. | Lighting device and lighting method |
US9441793B2 (en) * | 2006-12-01 | 2016-09-13 | Cree, Inc. | High efficiency lighting device including one or more solid state light emitters, and method of lighting |
US7918581B2 (en) * | 2006-12-07 | 2011-04-05 | Cree, Inc. | Lighting device and lighting method |
US8836212B2 (en) | 2007-01-11 | 2014-09-16 | Qd Vision, Inc. | Light emissive printed article printed with quantum dot ink |
US20080169746A1 (en) * | 2007-01-12 | 2008-07-17 | Ilight Technologies, Inc. | Bulb for light-emitting diode |
US7686478B1 (en) | 2007-01-12 | 2010-03-30 | Ilight Technologies, Inc. | Bulb for light-emitting diode with color-converting insert |
US8109656B1 (en) | 2007-01-12 | 2012-02-07 | Ilight Technologies, Inc. | Bulb for light-emitting diode with modified inner cavity |
TWI336962B (en) * | 2007-02-08 | 2011-02-01 | Touch Micro System Tech | White light emitting diode package structure having silicon substrate and method of making the same |
US7568815B2 (en) * | 2007-03-26 | 2009-08-04 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | Light source having a plurality of white LEDs with different output spectra |
WO2008137975A1 (en) * | 2007-05-08 | 2008-11-13 | Cree Led Lighting Solutions, Inc. | Lighting device and lighting method |
EP2156090B1 (en) * | 2007-05-08 | 2016-07-06 | Cree, Inc. | Lighting device and lighting method |
JP2010527510A (ja) * | 2007-05-08 | 2010-08-12 | クリー エル イー ディー ライティング ソリューションズ インコーポレイテッド | 照明デバイスおよび照明方法 |
KR20100020464A (ko) * | 2007-05-08 | 2010-02-22 | 크리 엘이디 라이팅 솔루션즈, 인크. | 조명 장치 및 조명 방법 |
JP2010527156A (ja) * | 2007-05-08 | 2010-08-05 | クリー エル イー ディー ライティング ソリューションズ インコーポレイテッド | 照明デバイスおよび照明方法 |
KR100818162B1 (ko) * | 2007-05-14 | 2008-03-31 | 루미마이크로 주식회사 | 색온도 조절이 가능한 백색 led 장치 |
WO2009014707A2 (en) | 2007-07-23 | 2009-01-29 | Qd Vision, Inc. | Quantum dot light enhancement substrate and lighting device including same |
US7663315B1 (en) | 2007-07-24 | 2010-02-16 | Ilight Technologies, Inc. | Spherical bulb for light-emitting diode with spherical inner cavity |
US7863635B2 (en) | 2007-08-07 | 2011-01-04 | Cree, Inc. | Semiconductor light emitting devices with applied wavelength conversion materials |
RU2467051C2 (ru) | 2007-08-22 | 2012-11-20 | Сеул Семикондактор Ко., Лтд. | Люминофоры на основе нестехиометрических тетрагональных силикатов меди и щелочноземельного металла и способ их получения |
US11114594B2 (en) * | 2007-08-24 | 2021-09-07 | Creeled, Inc. | Light emitting device packages using light scattering particles of different size |
KR101055769B1 (ko) * | 2007-08-28 | 2011-08-11 | 서울반도체 주식회사 | 비화학양론적 정방정계 알칼리 토류 실리케이트 형광체를채택한 발광 장치 |
US8128249B2 (en) | 2007-08-28 | 2012-03-06 | Qd Vision, Inc. | Apparatus for selectively backlighting a material |
WO2009049019A1 (en) * | 2007-10-10 | 2009-04-16 | Cree Led Lighting Solutions, Inc. | Lighting device and method of making |
US7841759B2 (en) * | 2007-10-10 | 2010-11-30 | Apple Inc. | LED backlight for display systems |
US9634191B2 (en) * | 2007-11-14 | 2017-04-25 | Cree, Inc. | Wire bond free wafer level LED |
US8267542B2 (en) | 2007-11-15 | 2012-09-18 | Cree, Inc. | Apparatus and methods for selecting light emitters |
US8866410B2 (en) | 2007-11-28 | 2014-10-21 | Cree, Inc. | Solid state lighting devices and methods of manufacturing the same |
US9431589B2 (en) * | 2007-12-14 | 2016-08-30 | Cree, Inc. | Textured encapsulant surface in LED packages |
CN101463975A (zh) * | 2007-12-19 | 2009-06-24 | 富士迈半导体精密工业(上海)有限公司 | 固态光源装置 |
US8172447B2 (en) | 2007-12-19 | 2012-05-08 | Oree, Inc. | Discrete lighting elements and planar assembly thereof |
US7929816B2 (en) | 2007-12-19 | 2011-04-19 | Oree, Inc. | Waveguide sheet containing in-coupling, propagation, and out-coupling regions |
WO2009093895A1 (en) * | 2008-01-21 | 2009-07-30 | Eldolab Holding B.V. | A method for producing a led assembly and led assembly produced by the method |
EP2260341A2 (en) * | 2008-03-05 | 2010-12-15 | Oree, Advanced Illumination Solutions INC. | Illumination apparatus and methods of forming the same |
US8916890B2 (en) * | 2008-03-19 | 2014-12-23 | Cree, Inc. | Light emitting diodes with light filters |
US8350461B2 (en) | 2008-03-28 | 2013-01-08 | Cree, Inc. | Apparatus and methods for combining light emitters |
US9207385B2 (en) | 2008-05-06 | 2015-12-08 | Qd Vision, Inc. | Lighting systems and devices including same |
WO2009137053A1 (en) | 2008-05-06 | 2009-11-12 | Qd Vision, Inc. | Optical components, systems including an optical component, and devices |
WO2009151515A1 (en) | 2008-05-06 | 2009-12-17 | Qd Vision, Inc. | Solid state lighting devices including quantum confined semiconductor nanoparticles |
KR101280390B1 (ko) * | 2008-05-13 | 2013-07-01 | 엘지디스플레이 주식회사 | 엘이디 백라이트 유닛 및 이를 이용한 액정표시장치모듈 |
DE102008025864A1 (de) * | 2008-05-29 | 2009-12-03 | Lumitech Produktion Und Entwicklung Gmbh | LED Modul für die Allgemeinbeleuchtung |
US8240875B2 (en) | 2008-06-25 | 2012-08-14 | Cree, Inc. | Solid state linear array modules for general illumination |
KR101269592B1 (ko) * | 2008-07-09 | 2013-06-05 | 엘지디스플레이 주식회사 | 액정표시모듈의 엘이디 백라이트 구성방법 |
US8301002B2 (en) | 2008-07-10 | 2012-10-30 | Oree, Inc. | Slim waveguide coupling apparatus and method |
US8297786B2 (en) * | 2008-07-10 | 2012-10-30 | Oree, Inc. | Slim waveguide coupling apparatus and method |
JP5196262B2 (ja) * | 2008-09-30 | 2013-05-15 | ソニー株式会社 | 表示装置の製造方法 |
DE102008051256B4 (de) * | 2008-10-10 | 2018-05-24 | Ivoclar Vivadent Ag | Halbleiter-Strahlungsquelle |
US8075165B2 (en) | 2008-10-14 | 2011-12-13 | Ledengin, Inc. | Total internal reflection lens and mechanical retention and locating device |
JP5263515B2 (ja) * | 2008-10-20 | 2013-08-14 | 東芝ライテック株式会社 | 照明装置 |
US8507300B2 (en) * | 2008-12-24 | 2013-08-13 | Ledengin, Inc. | Light-emitting diode with light-conversion layer |
JP5344149B2 (ja) * | 2009-01-28 | 2013-11-20 | 東芝ライテック株式会社 | Led装置の製造方法 |
US7967652B2 (en) * | 2009-02-19 | 2011-06-28 | Cree, Inc. | Methods for combining light emitting devices in a package and packages including combined light emitting devices |
US8339029B2 (en) | 2009-02-19 | 2012-12-25 | Cree, Inc. | Light emitting devices and systems having tunable chromaticity |
US8333631B2 (en) * | 2009-02-19 | 2012-12-18 | Cree, Inc. | Methods for combining light emitting devices in a package and packages including combined light emitting devices |
US8624527B1 (en) | 2009-03-27 | 2014-01-07 | Oree, Inc. | Independently controllable illumination device |
DE102009015313B4 (de) * | 2009-03-27 | 2022-02-24 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Anzeigeeinrichtung |
US7985000B2 (en) * | 2009-04-08 | 2011-07-26 | Ledengin, Inc. | Lighting apparatus having multiple light-emitting diodes with individual light-conversion layers |
US8328406B2 (en) | 2009-05-13 | 2012-12-11 | Oree, Inc. | Low-profile illumination device |
TWI383345B (zh) * | 2009-05-22 | 2013-01-21 | Chunghwa Picture Tubes Ltd | 顯示器與其所使用的光源裝置 |
US8921876B2 (en) | 2009-06-02 | 2014-12-30 | Cree, Inc. | Lighting devices with discrete lumiphor-bearing regions within or on a surface of remote elements |
KR101055762B1 (ko) * | 2009-09-01 | 2011-08-11 | 서울반도체 주식회사 | 옥시오소실리케이트 발광체를 갖는 발광 물질을 채택한 발광 장치 |
US8727597B2 (en) | 2009-06-24 | 2014-05-20 | Oree, Inc. | Illumination apparatus with high conversion efficiency and methods of forming the same |
DE102009030205A1 (de) * | 2009-06-24 | 2010-12-30 | Litec-Lp Gmbh | Leuchtstoffe mit Eu(II)-dotierten silikatischen Luminophore |
US8384114B2 (en) | 2009-06-27 | 2013-02-26 | Cooledge Lighting Inc. | High efficiency LEDs and LED lamps |
US8648546B2 (en) * | 2009-08-14 | 2014-02-11 | Cree, Inc. | High efficiency lighting device including one or more saturated light emitters, and method of lighting |
CN105713599B (zh) | 2009-08-14 | 2018-09-11 | 三星电子株式会社 | 发光器件、用于发光器件的光学元件、以及方法 |
TWI354365B (en) * | 2009-08-26 | 2011-12-11 | Quasioptical led package structure for increasing | |
US8901845B2 (en) | 2009-09-24 | 2014-12-02 | Cree, Inc. | Temperature responsive control for lighting apparatus including light emitting devices providing different chromaticities and related methods |
CN102630288B (zh) | 2009-09-25 | 2015-09-09 | 科锐公司 | 具有低眩光和高亮度级均匀性的照明设备 |
KR101640813B1 (ko) * | 2009-09-29 | 2016-07-19 | 엘지디스플레이 주식회사 | 백색 광원모듈 및 이를 적용한 액정표시장치 |
WO2011067298A1 (en) * | 2009-12-04 | 2011-06-09 | Osram Gesellschaft mit beschränkter Haftung | Led lighting device for producing multi - chromatic light radiation |
US9480133B2 (en) | 2010-01-04 | 2016-10-25 | Cooledge Lighting Inc. | Light-emitting element repair in array-based lighting devices |
US8653539B2 (en) | 2010-01-04 | 2014-02-18 | Cooledge Lighting, Inc. | Failure mitigation in arrays of light-emitting devices |
US8508116B2 (en) | 2010-01-27 | 2013-08-13 | Cree, Inc. | Lighting device with multi-chip light emitters, solid state light emitter support members and lighting elements |
US9275979B2 (en) | 2010-03-03 | 2016-03-01 | Cree, Inc. | Enhanced color rendering index emitter through phosphor separation |
KR100999809B1 (ko) * | 2010-03-26 | 2010-12-08 | 엘지이노텍 주식회사 | 발광 소자 및 이를 구비한 라이트 유닛 |
KR101683888B1 (ko) * | 2010-03-29 | 2016-12-08 | 엘지이노텍 주식회사 | 발광 장치 및 이를 구비한 표시 장치 |
US8329482B2 (en) | 2010-04-30 | 2012-12-11 | Cree, Inc. | White-emitting LED chips and method for making same |
JP2011254064A (ja) * | 2010-05-06 | 2011-12-15 | Funai Electric Co Ltd | 面発光装置 |
WO2011143197A2 (en) | 2010-05-13 | 2011-11-17 | Cree, Inc. | Lighting device and method of making |
US8339472B2 (en) * | 2010-05-28 | 2012-12-25 | Research In Motion Limited | Composite flash for a mobile device |
US8684559B2 (en) | 2010-06-04 | 2014-04-01 | Cree, Inc. | Solid state light source emitting warm light with high CRI |
KR101372084B1 (ko) | 2010-06-29 | 2014-03-07 | 쿨레지 라이팅 인크. | 항복형 기판을 갖는 전자 장치 |
US20120092862A1 (en) * | 2010-10-13 | 2012-04-19 | Shih-Jen Chuang | Structure of light-emitting diode (led) having high color rendering index |
US11251164B2 (en) | 2011-02-16 | 2022-02-15 | Creeled, Inc. | Multi-layer conversion material for down conversion in solid state lighting |
EP2523534B1 (en) * | 2011-05-12 | 2019-08-07 | Ledengin, Inc. | Apparatus and methods for tuning of emitter with multiple LEDs to a single color bin |
US8513900B2 (en) | 2011-05-12 | 2013-08-20 | Ledengin, Inc. | Apparatus for tuning of emitter with multiple LEDs to a single color bin |
KR101872253B1 (ko) * | 2011-08-09 | 2018-06-28 | 엘지이노텍 주식회사 | 발광 소자 패키지, 발광 장치 및 조명 장치 |
US20140246990A1 (en) * | 2011-09-08 | 2014-09-04 | LG Inntotek Co., Ltd. | Lighting device and lighting control method |
US8591072B2 (en) | 2011-11-16 | 2013-11-26 | Oree, Inc. | Illumination apparatus confining light by total internal reflection and methods of forming the same |
CN104303298B (zh) * | 2012-04-06 | 2018-01-19 | 飞利浦照明控股有限公司 | 白色发光模块 |
DE102012207185A1 (de) * | 2012-04-30 | 2013-10-31 | Zumtobel Lighting Gmbh | Anordnung zur Erzeugung von weißem Licht mit einstellbarer Farbtemperatur |
US8877561B2 (en) | 2012-06-07 | 2014-11-04 | Cooledge Lighting Inc. | Methods of fabricating wafer-level flip chip device packages |
WO2014006501A1 (en) | 2012-07-03 | 2014-01-09 | Yosi Shani | Planar remote phosphor illumination apparatus |
US20140042470A1 (en) | 2012-08-09 | 2014-02-13 | Epistar Corporation | Method of making light emitting device and light emitting device made thereof |
US9353917B2 (en) | 2012-09-14 | 2016-05-31 | Cree, Inc. | High efficiency lighting device including one or more solid state light emitters, and method of lighting |
US8876312B2 (en) | 2013-03-05 | 2014-11-04 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Lighting device and apparatus with spectral converter within a casing |
US8928219B2 (en) * | 2013-03-05 | 2015-01-06 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Lighting device with spectral converter |
TWI476383B (zh) * | 2013-04-17 | 2015-03-11 | Nat Univ Tsing Hua | 以黑體輻射光譜相似性分析光源品質之方法 |
CN104241262B (zh) | 2013-06-14 | 2020-11-06 | 惠州科锐半导体照明有限公司 | 发光装置以及显示装置 |
DE202014103047U1 (de) * | 2014-03-27 | 2014-08-20 | Tridonic Jennersdorf Gmbh | Beleuchtungsvorrichtung zur Erzeugung von weißem Licht |
KR101616193B1 (ko) * | 2014-09-03 | 2016-04-29 | 송인실 | 혼합광 생성장치 |
KR102261955B1 (ko) | 2015-02-02 | 2021-06-24 | 엘지이노텍 주식회사 | 발광 모듈 및 이를 구비한 조명 장치 |
US9530943B2 (en) | 2015-02-27 | 2016-12-27 | Ledengin, Inc. | LED emitter packages with high CRI |
DE102016102596A1 (de) * | 2016-02-15 | 2017-08-17 | Osram Opto Semiconductors Gmbh | Verfahren zum Betreiben einer Halbleiterlichtquelle und Halbleiterlichtquelle |
CN107946441A (zh) | 2016-10-12 | 2018-04-20 | 亿光电子工业股份有限公司 | 发光装置及发光二极管封装结构 |
US10219345B2 (en) | 2016-11-10 | 2019-02-26 | Ledengin, Inc. | Tunable LED emitter with continuous spectrum |
WO2018160743A1 (en) * | 2017-02-28 | 2018-09-07 | Quarkstar Llc | Lifetime color stabilization of color-shifting artificial light sources |
JP6912732B2 (ja) | 2018-08-31 | 2021-08-04 | 日亜化学工業株式会社 | 発光装置およびその製造方法 |
JP7007595B2 (ja) * | 2019-05-31 | 2022-01-24 | 日亜化学工業株式会社 | 発光装置の製造方法 |
US11912918B2 (en) * | 2020-06-29 | 2024-02-27 | Lumileds Llc | Phosphor particle coating |
Family Cites Families (31)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3649748B2 (ja) * | 1993-03-22 | 2005-05-18 | 三洋電機株式会社 | 発光ダイオードランプ |
US5803579A (en) * | 1996-06-13 | 1998-09-08 | Gentex Corporation | Illuminator assembly incorporating light emitting diodes |
JPH1011002A (ja) * | 1996-06-19 | 1998-01-16 | Toyoda Gosei Co Ltd | 2色発光ダイオード及び2色発光ダイオードディスプレイ装置 |
TW383508B (en) | 1996-07-29 | 2000-03-01 | Nichia Kagaku Kogyo Kk | Light emitting device and display |
JPH10163535A (ja) * | 1996-11-27 | 1998-06-19 | Kasei Optonix Co Ltd | 白色発光素子 |
US7014336B1 (en) * | 1999-11-18 | 2006-03-21 | Color Kinetics Incorporated | Systems and methods for generating and modulating illumination conditions |
JPH11149262A (ja) * | 1997-11-17 | 1999-06-02 | Copal Co Ltd | 白色発光素子及び電光表示ユニット |
JP2000294834A (ja) * | 1999-04-09 | 2000-10-20 | Matsushita Electronics Industry Corp | 半導体発光装置 |
JP2000349345A (ja) * | 1999-06-04 | 2000-12-15 | Matsushita Electronics Industry Corp | 半導体発光装置 |
ES2547927T5 (es) | 1999-11-18 | 2020-07-30 | Signify North America Corp | Generación de luz blanca con diodos emisores de luz que tienen diferente espectro |
FR2801386A1 (fr) * | 1999-11-19 | 2001-05-25 | Adiatec Sa | Dispositif de test pour l'analyse de faibles volumes d'echantillons par des methodes immunochromatographiques |
US6513949B1 (en) * | 1999-12-02 | 2003-02-04 | Koninklijke Philips Electronics N.V. | LED/phosphor-LED hybrid lighting systems |
US6538371B1 (en) * | 2000-03-27 | 2003-03-25 | The General Electric Company | White light illumination system with improved color output |
JP2002057376A (ja) * | 2000-05-31 | 2002-02-22 | Matsushita Electric Ind Co Ltd | Ledランプ |
US6577073B2 (en) * | 2000-05-31 | 2003-06-10 | Matsushita Electric Industrial Co., Ltd. | Led lamp |
TW557373B (en) * | 2000-10-25 | 2003-10-11 | Lumileds Lighting Bv | Illumination system and display device |
JP2003046131A (ja) * | 2001-07-27 | 2003-02-14 | Matsushita Electric Ind Co Ltd | 色度補正機能を有する半導体発光装置 |
JP2003152227A (ja) * | 2001-11-14 | 2003-05-23 | Citizen Electronics Co Ltd | Ledの色補正手段および色補正方法 |
JP2002252374A (ja) * | 2002-01-31 | 2002-09-06 | Sanyo Electric Co Ltd | 発光ダイオードランプ |
US20040120140A1 (en) * | 2002-03-27 | 2004-06-24 | Fye Michael E. | Illuminated graphics using fluorescing materials |
DE10216395B4 (de) * | 2002-04-12 | 2004-09-16 | Osram Opto Semiconductors Gmbh | Verfahren zur Festlegung der Farbgruppe einer LED und LED-Modul |
KR100567548B1 (ko) * | 2002-04-22 | 2006-04-05 | 서울반도체 주식회사 | 백색 칩 발광 다이오드 및 그 제조 방법 |
KR100449503B1 (ko) * | 2002-05-29 | 2004-09-22 | 서울반도체 주식회사 | 백색 칩 발광 다이오드 및 그 제조 방법 |
KR100449502B1 (ko) * | 2002-05-29 | 2004-09-22 | 서울반도체 주식회사 | 백색 발광 다이오드 및 그 제작 방법 |
KR100632659B1 (ko) * | 2002-05-31 | 2006-10-11 | 서울반도체 주식회사 | 백색 발광 다이오드 |
US6794686B2 (en) * | 2002-06-06 | 2004-09-21 | Harvatek Corporation | White light source |
JP2004071807A (ja) * | 2002-08-06 | 2004-03-04 | Sharp Corp | 照明装置、カメラ装置及び携帯機器 |
JP2004356116A (ja) * | 2003-05-26 | 2004-12-16 | Citizen Electronics Co Ltd | 発光ダイオード |
KR101131648B1 (ko) * | 2003-09-24 | 2012-03-28 | 오스람 옵토 세미컨덕터스 게엠베하 | 연색성이 개선된 led-기반 고효율 조명 시스템 |
JP4458804B2 (ja) * | 2003-10-17 | 2010-04-28 | シチズン電子株式会社 | 白色led |
DE10351081A1 (de) * | 2003-10-31 | 2005-06-09 | Lite-On Technology Co. | Weißlicht-emittierende Vorrichtung |
-
2003
- 2003-12-19 US US10/742,688 patent/US7066623B2/en not_active Expired - Lifetime
-
2004
- 2004-11-29 DE DE102004057499A patent/DE102004057499B4/de active Active
- 2004-12-17 JP JP2004365932A patent/JP4947610B2/ja active Active
- 2004-12-17 CN CNB200410101333XA patent/CN100541837C/zh active Active
- 2004-12-17 KR KR1020040107927A patent/KR101216878B1/ko active IP Right Grant
-
2006
- 2006-04-26 US US11/412,297 patent/US7206507B2/en not_active Expired - Lifetime
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1917731B (zh) * | 2005-08-15 | 2011-10-26 | 安华高科技Ecbuip(新加坡)私人有限公司 | 校准的led光模块 |
CN101657671B (zh) * | 2007-02-22 | 2012-07-11 | 科锐公司 | 照明装置、照明方法、滤光器和滤光方法 |
CN101939859B (zh) * | 2008-03-14 | 2012-12-19 | Lg伊诺特有限公司 | 发光设备和包括该发光设备的显示设备 |
CN102007612A (zh) * | 2008-11-21 | 2011-04-06 | Lg伊诺特有限公司 | 发光设备和使用该发光设备的显示设备 |
CN102007612B (zh) * | 2008-11-21 | 2014-05-14 | Lg伊诺特有限公司 | 发光设备和使用该发光设备的显示设备 |
US8913213B2 (en) | 2008-11-21 | 2014-12-16 | Lg Innotek Co., Ltd. | Light emitting apparatus and display apparatus using the same |
US9115852B2 (en) | 2008-12-19 | 2015-08-25 | Osram Opto Semiconductors Gmbh | Method for producing a plurality of LED illumination devices and a plurality of LED chipsets for illumination devices, and LED illumination device |
CN102803822A (zh) * | 2009-06-15 | 2012-11-28 | 夏普株式会社 | 照明装置、显示装置以及电视接收装置 |
CN102651364A (zh) * | 2011-02-24 | 2012-08-29 | 新世纪光电股份有限公司 | 发光二极管组件 |
CN102969437A (zh) * | 2012-12-06 | 2013-03-13 | 上海顿格电子贸易有限公司 | Led发光元器件 |
CN105324859A (zh) * | 2013-06-18 | 2016-02-10 | 夏普株式会社 | 光源装置以及发光装置 |
CN103839935A (zh) * | 2014-03-14 | 2014-06-04 | 无锡实益达电子有限公司 | 一种具有高色彩表现能力的集成式白光led光源 |
Also Published As
Publication number | Publication date |
---|---|
DE102004057499B4 (de) | 2010-07-29 |
US20060198137A1 (en) | 2006-09-07 |
CN100541837C (zh) | 2009-09-16 |
KR101216878B1 (ko) | 2012-12-28 |
DE102004057499A1 (de) | 2005-07-14 |
US7206507B2 (en) | 2007-04-17 |
US7066623B2 (en) | 2006-06-27 |
JP2005183986A (ja) | 2005-07-07 |
JP4947610B2 (ja) | 2012-06-06 |
KR20050062433A (ko) | 2005-06-23 |
US20050135094A1 (en) | 2005-06-23 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN100541837C (zh) | 使用近白色发光二极管产生无杂色白光的方法和装置 | |
CN102132424B (zh) | 固态照明部件 | |
CN102272923B (zh) | 固态照明部件 | |
US9202999B2 (en) | Light emitting device and its method of manufacture | |
KR100532638B1 (ko) | 발광 장치 | |
US9859259B2 (en) | Light emitting apparatus | |
CN100463168C (zh) | 半导体发光器件 | |
CN1610137A (zh) | 白光发光二极管 | |
US20150001557A1 (en) | Semiconductor light emitting device and method for manufacturing light source module | |
CN102203495A (zh) | 用于颜色混合的阵列布局 | |
US20110037083A1 (en) | Led package with contrasting face | |
CN1212069A (zh) | 多颜色的光辐射图象显示装置 | |
KR102300558B1 (ko) | 광원 모듈 | |
US9857042B2 (en) | Light source module and lighting device having same | |
CN104218135A (zh) | 固态发射器封装、多像素发射封装和led显示器 | |
JP2002351359A (ja) | Ledアレイおよびled表示装置 | |
KR100643583B1 (ko) | 메탈 pcb를 이용한 다색 발광소자 모듈 및 그 제조방법 | |
US20170175957A1 (en) | Light-emitting device and illuminating apparatus | |
JP3658840B2 (ja) | 発光ダイオード及びそれを用いた表示装置 | |
CN202111155U (zh) | Led封装 | |
CN215988825U (zh) | 多色led集成光源 | |
CN200953348Y (zh) | 一种发光装置的封装结构 | |
KR200205422Y1 (ko) | 백색 발광 다이오드 | |
CN104051439A (zh) | 具有ic集成照明模块的led | |
CN2667670Y (zh) | 多芯片发光二极管封装装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
REG | Reference to a national code |
Ref country code: HK Ref legal event code: DE Ref document number: 1079839 Country of ref document: HK |
|
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
ASS | Succession or assignment of patent right |
Owner name: ANHUA HIGH SCIENCE ECBU IP (SINGAPORE)PRIVATE CO. Free format text: FORMER OWNER: AVAGO TECHNOLOGIES GENERAL IP Effective date: 20061222 Owner name: AVAGO TECHNOLOGIES GENERAL IP Free format text: FORMER OWNER: ANJELEN SCI. + TECH. INC. Effective date: 20061222 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20061222 Address after: Singapore Singapore Applicant after: ANHUA HIGH TECHNOLOGY ECBUIP (SINGAPORE) PRIVATE Ltd. Address before: Singapore Singapore Applicant before: Avago Technologies General IP (Singapore) Pte. Ltd. Effective date of registration: 20061222 Address after: Singapore Singapore Applicant after: Avago Technologies General IP (Singapore) Pte. Ltd. Address before: California, USA Applicant before: AGILENT TECHNOLOGIES, Inc. |
|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: TAIWAN SEMICONDUCTOR MFG Free format text: FORMER OWNER: AVAGO TECHNOLOGIES ECBU IP (SINGAPORE) PTE. LTD. Effective date: 20111109 |
|
C41 | Transfer of patent application or patent right or utility model | ||
COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; TO: TAIWAN, CHINA |
|
TR01 | Transfer of patent right |
Effective date of registration: 20111109 Address after: Taiwan, China Patentee after: Taiwan Semiconductor Manufacturing Co.,Ltd. Address before: Singapore, Singapore Patentee before: ANHUA HIGH TECHNOLOGY ECBUIP (SINGAPORE) PRIVATE Ltd. |
|
REG | Reference to a national code |
Ref country code: HK Ref legal event code: WD Ref document number: 1079839 Country of ref document: HK |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20160504 Address after: Hsinchu City, Taiwan, China Patentee after: EPISTAR Corp. Address before: Hsinchu City, Taiwan, China Patentee before: Yuanxin Optoelectronics Co.,Ltd. Effective date of registration: 20160504 Address after: Hsinchu City, Taiwan, China Patentee after: Yuanxin Optoelectronics Co.,Ltd. Address before: Taiwan, China Patentee before: Taiwan Semiconductor Manufacturing Co.,Ltd. |