CN1604724A - 焊球供应方法及供应装置 - Google Patents
焊球供应方法及供应装置 Download PDFInfo
- Publication number
- CN1604724A CN1604724A CN200410092192.XA CN200410092192A CN1604724A CN 1604724 A CN1604724 A CN 1604724A CN 200410092192 A CN200410092192 A CN 200410092192A CN 1604724 A CN1604724 A CN 1604724A
- Authority
- CN
- China
- Prior art keywords
- soldered ball
- receiver hole
- upper mass
- charging hopper
- separator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0607—Solder feeding devices
- B23K3/0623—Solder feeding devices for shaped solder piece feeding, e.g. preforms, bumps, balls, pellets, droplets
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
Abstract
Description
Claims (10)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003311010A JP4212992B2 (ja) | 2003-09-03 | 2003-09-03 | 半田ボールの供給方法および供給装置 |
JP311010/2003 | 2003-09-03 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1604724A true CN1604724A (zh) | 2005-04-06 |
CN100415069C CN100415069C (zh) | 2008-08-27 |
Family
ID=34214242
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB200410092192XA Expired - Fee Related CN100415069C (zh) | 2003-09-03 | 2004-09-03 | 焊球供应方法及供应装置 |
Country Status (3)
Country | Link |
---|---|
US (1) | US7357295B2 (zh) |
JP (1) | JP4212992B2 (zh) |
CN (1) | CN100415069C (zh) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101132690B (zh) * | 2006-08-23 | 2010-11-03 | Tdk株式会社 | 导电元件供给设备与导电元件供给方法 |
CN103358020A (zh) * | 2012-03-28 | 2013-10-23 | 新科实业有限公司 | 在磁盘驱动单元中形成电性焊点的装置和方法 |
CN103529063A (zh) * | 2013-10-14 | 2014-01-22 | 广西壮族自治区质量技术监督局珍珠产品质量监督检验站 | 一种测量珍珠用夹具以及珍珠无损检测设备 |
CN103894762A (zh) * | 2012-12-26 | 2014-07-02 | 徐维雄 | 自动焊接机 |
CN104175102A (zh) * | 2014-07-28 | 2014-12-03 | 昆山市烽禾升精密机械有限公司 | 弹簧装配机构 |
CN106538078A (zh) * | 2014-07-15 | 2017-03-22 | 派克泰克封装技术有限公司 | 具有超声波装置和压力接口的焊球供给装置 |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6268275B1 (en) | 1998-10-08 | 2001-07-31 | Micron Technology, Inc. | Method of locating conductive spheres utilizing screen and hopper of solder balls |
DE10055742B4 (de) * | 2000-11-10 | 2006-05-11 | Schwarz Pharma Ag | Neue Polyester, Verfahren zu ihrer Herstellung und aus den Polyestern hergestellte Depot-Arzneiformen |
DE10145420B4 (de) * | 2001-09-14 | 2005-02-24 | Smart Pac Gmbh Technology Services | Verfahren zur Herstellung einer Lotverbindung |
CN102413643A (zh) * | 2004-08-04 | 2012-04-11 | 揖斐电株式会社 | 焊球搭载方法及焊球搭载装置 |
CN101151947B (zh) * | 2005-03-30 | 2010-05-12 | 富士通株式会社 | 球捕捉方法及焊锡球配置方法 |
JP4822105B2 (ja) * | 2005-11-30 | 2011-11-24 | 澁谷工業株式会社 | 導電性ボールの配列装置 |
US7472473B2 (en) * | 2006-04-26 | 2009-01-06 | Ibiden Co., Ltd. | Solder ball loading apparatus |
JP4672698B2 (ja) * | 2007-05-23 | 2011-04-20 | 株式会社シンアペックス | 粒状体取出装置 |
JP4503053B2 (ja) * | 2007-07-24 | 2010-07-14 | 新光電気工業株式会社 | 導電性ボールの搭載装置および搭載方法 |
JP2010225680A (ja) * | 2009-03-19 | 2010-10-07 | Panasonic Corp | 半田ボール搭載装置及び半田ボール搭載方法 |
JP2011041971A (ja) * | 2009-08-24 | 2011-03-03 | Canon Machinery Inc | はんだ供給装置及びはんだ供給方法 |
JP5800778B2 (ja) * | 2011-11-25 | 2015-10-28 | 三菱電機株式会社 | 接合方法および半導体装置の製造方法 |
KR101508039B1 (ko) * | 2012-05-17 | 2015-04-06 | 삼성전기주식회사 | 솔더볼 공급장치 |
DE102013017159B3 (de) * | 2013-10-16 | 2014-12-24 | Pac Tech - Packaging Technologies Gmbh | Vorrichtung zur vereinzelten Applikation von Lotmaterialdepots |
KR102307528B1 (ko) * | 2014-07-21 | 2021-10-05 | 삼성전자주식회사 | 솔더 볼 흡착 장치 |
CN107246547B (zh) * | 2017-06-22 | 2018-12-07 | 江苏力星通用钢球股份有限公司 | 一种滚珠加工润滑装置 |
KR101853847B1 (ko) * | 2017-10-24 | 2018-05-02 | 주식회사 이비기술 | 솔더볼 토출 유닛 및 이를 이용한 레이저 솔더링 장치 |
KR20210101357A (ko) * | 2020-02-07 | 2021-08-19 | 삼성전자주식회사 | 볼 배치 시스템 및 기판 상에 볼을 배치하는 방법 |
US11247285B1 (en) * | 2020-04-03 | 2022-02-15 | Seagate Technology Llc | Fluidization of agglomerated solder microspheres |
DE102021112861A1 (de) | 2021-05-18 | 2022-11-24 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Trägerstruktur, verfahren zur herstellung einer trägerstruktur und vorrichtung und druckkopf zum durchführen eines solchen verfahrens |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0795554B2 (ja) * | 1987-09-14 | 1995-10-11 | 株式会社日立製作所 | はんだ球整列装置 |
JP3254459B2 (ja) | 1994-03-04 | 2002-02-04 | 株式会社日立製作所 | 微小ハンダ供給方法及び微小ハンダ供給装置 |
JPH07273439A (ja) * | 1994-03-31 | 1995-10-20 | Du Pont Kk | 半田バンプ形成方法 |
US5499487A (en) * | 1994-09-14 | 1996-03-19 | Vanguard Automation, Inc. | Method and apparatus for filling a ball grid array |
JPH08236916A (ja) * | 1995-03-01 | 1996-09-13 | Fujitsu Ltd | 半田ボール搭載方法及び装置 |
US5585162A (en) * | 1995-06-16 | 1996-12-17 | Minnesota Mining And Manufacturing Company | Ground plane routing |
US6010058A (en) * | 1995-10-19 | 2000-01-04 | Lg Semicon Co., Ltd. | BGA package using a dummy ball and a repairing method thereof |
DE19544929C2 (de) | 1995-12-01 | 2001-02-15 | Fraunhofer Ges Forschung | Vorrichtung zum flußmittelfreien Aufbringen eines Lötmittels auf ein Substrat oder einen Chip |
US6641030B1 (en) * | 1997-02-06 | 2003-11-04 | Speedline Technologies, Inc. | Method and apparatus for placing solder balls on a substrate |
US6386433B1 (en) * | 1999-08-24 | 2002-05-14 | Kulicke & Soffa Investments, Inc. | Solder ball delivery and reflow apparatus and method |
US6336581B1 (en) * | 2000-06-19 | 2002-01-08 | International Business Machines Corporation | Solder ball connection device and capillary tube thereof |
JP2002025025A (ja) | 2000-06-23 | 2002-01-25 | Internatl Business Mach Corp <Ibm> | はんだボール接合装置及びはんだボール接合方法 |
JP4130526B2 (ja) * | 2000-11-10 | 2008-08-06 | 株式会社日立製作所 | バンプ形成方法およびその装置 |
US6766938B2 (en) * | 2002-01-08 | 2004-07-27 | Asm Assembly Automation Ltd. | Apparatus and method of placing solder balls onto a substrate |
US6830175B2 (en) * | 2003-02-05 | 2004-12-14 | Carl T. Ito | Solder ball dispenser |
-
2003
- 2003-09-03 JP JP2003311010A patent/JP4212992B2/ja not_active Expired - Fee Related
-
2004
- 2004-09-03 US US10/933,389 patent/US7357295B2/en not_active Expired - Fee Related
- 2004-09-03 CN CNB200410092192XA patent/CN100415069C/zh not_active Expired - Fee Related
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101132690B (zh) * | 2006-08-23 | 2010-11-03 | Tdk株式会社 | 导电元件供给设备与导电元件供给方法 |
CN103358020A (zh) * | 2012-03-28 | 2013-10-23 | 新科实业有限公司 | 在磁盘驱动单元中形成电性焊点的装置和方法 |
CN103894762A (zh) * | 2012-12-26 | 2014-07-02 | 徐维雄 | 自动焊接机 |
CN103894762B (zh) * | 2012-12-26 | 2016-04-13 | 徐维雄 | 自动焊接机 |
CN103529063A (zh) * | 2013-10-14 | 2014-01-22 | 广西壮族自治区质量技术监督局珍珠产品质量监督检验站 | 一种测量珍珠用夹具以及珍珠无损检测设备 |
CN106538078A (zh) * | 2014-07-15 | 2017-03-22 | 派克泰克封装技术有限公司 | 具有超声波装置和压力接口的焊球供给装置 |
CN104175102A (zh) * | 2014-07-28 | 2014-12-03 | 昆山市烽禾升精密机械有限公司 | 弹簧装配机构 |
Also Published As
Publication number | Publication date |
---|---|
JP2005079492A (ja) | 2005-03-24 |
US7357295B2 (en) | 2008-04-15 |
US20050045701A1 (en) | 2005-03-03 |
CN100415069C (zh) | 2008-08-27 |
JP4212992B2 (ja) | 2009-01-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
ASS | Succession or assignment of patent right |
Owner name: TDK CORP.; APPLICANT Free format text: FORMER OWNER: TDK CORP. Effective date: 20071123 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20071123 Address after: Tokyo, Japan, Japan Applicant after: TDK Corp. Co-applicant after: Xinke Industry Co., Ltd. Address before: Tokyo, Japan, Japan Applicant before: TDK Corp. |
|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20080827 Termination date: 20190903 |