CN1577741A - 带有抗蚀膜的基片的制造方法 - Google Patents
带有抗蚀膜的基片的制造方法 Download PDFInfo
- Publication number
- CN1577741A CN1577741A CNA2004100709264A CN200410070926A CN1577741A CN 1577741 A CN1577741 A CN 1577741A CN A2004100709264 A CNA2004100709264 A CN A2004100709264A CN 200410070926 A CN200410070926 A CN 200410070926A CN 1577741 A CN1577741 A CN 1577741A
- Authority
- CN
- China
- Prior art keywords
- resist
- substrate
- coater nozzle
- coated
- interval
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 title claims description 151
- 238000004519 manufacturing process Methods 0.000 title claims description 31
- 239000007788 liquid Substances 0.000 claims abstract description 71
- 239000011248 coating agent Substances 0.000 claims description 110
- 238000000576 coating method Methods 0.000 claims description 110
- 238000000034 method Methods 0.000 claims description 34
- 230000008602 contraction Effects 0.000 claims description 18
- 238000009826 distribution Methods 0.000 abstract description 20
- 238000000926 separation method Methods 0.000 abstract 1
- 238000010521 absorption reaction Methods 0.000 description 7
- 230000033228 biological regulation Effects 0.000 description 5
- 230000000630 rising effect Effects 0.000 description 5
- 239000004973 liquid crystal related substance Substances 0.000 description 4
- 238000001179 sorption measurement Methods 0.000 description 4
- 238000009434 installation Methods 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
- H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
- H01L21/02282—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process liquid deposition, e.g. spin-coating, sol-gel techniques, spray coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Nonlinear Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Optics & Photonics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Coating Apparatus (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003276256 | 2003-07-17 | ||
| JP2003276256 | 2003-07-17 | ||
| JP2004200516A JP2005051220A (ja) | 2003-07-17 | 2004-07-07 | レジスト膜付基板の製造方法 |
| JP2004200516 | 2004-07-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1577741A true CN1577741A (zh) | 2005-02-09 |
Family
ID=34277588
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2004100709264A Pending CN1577741A (zh) | 2003-07-17 | 2004-07-16 | 带有抗蚀膜的基片的制造方法 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2005051220A (enExample) |
| KR (1) | KR20050009241A (enExample) |
| CN (1) | CN1577741A (enExample) |
| TW (1) | TWI276474B (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100423852C (zh) * | 2005-04-08 | 2008-10-08 | Hoya株式会社 | 涂布装置以及光掩模件的制造方法 |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4260135B2 (ja) * | 2005-04-08 | 2009-04-30 | Hoya株式会社 | レジスト塗布方法及びレジスト塗布装置、並びにフォトマスクブランクの製造方法 |
| JP5164088B2 (ja) * | 2006-03-30 | 2013-03-13 | Hoya株式会社 | マスクブランク及びフォトマスク |
| JP5073375B2 (ja) * | 2007-06-13 | 2012-11-14 | Hoya株式会社 | マスクブランクの製造方法及びフォトマスクの製造方法 |
| JP5086714B2 (ja) * | 2007-07-13 | 2012-11-28 | Hoya株式会社 | マスクブランクの製造方法及びフォトマスクの製造方法 |
| JP2009258152A (ja) * | 2008-04-11 | 2009-11-05 | Hoya Corp | マスクブランクの製造方法及びフォトマスクの製造方法 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE59309164D1 (de) * | 1993-05-05 | 1999-01-07 | Steag Micro Tech Gmbh | Vorrichtung zur belackung oder beschichtung von platten oder scheiben |
| DE4445985A1 (de) * | 1994-12-22 | 1996-06-27 | Steag Micro Tech Gmbh | Verfahren und Vorrichtung zur Belackung oder Beschichtung eines Substrats |
| JP2001293417A (ja) * | 2000-04-14 | 2001-10-23 | Sharp Corp | 塗布装置 |
| JP2003173015A (ja) * | 2001-09-28 | 2003-06-20 | Hoya Corp | グレートーンマスクの製造方法 |
| JP3658355B2 (ja) * | 2001-10-03 | 2005-06-08 | Hoya株式会社 | 塗布膜の乾燥方法、塗布膜の形成方法、及び塗布膜形成装置 |
| JP4017372B2 (ja) * | 2001-10-15 | 2007-12-05 | 住友化学株式会社 | 薄膜形成方法 |
-
2004
- 2004-07-07 JP JP2004200516A patent/JP2005051220A/ja active Pending
- 2004-07-15 TW TW093121119A patent/TWI276474B/zh not_active IP Right Cessation
- 2004-07-16 KR KR1020040055669A patent/KR20050009241A/ko not_active Ceased
- 2004-07-16 CN CNA2004100709264A patent/CN1577741A/zh active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100423852C (zh) * | 2005-04-08 | 2008-10-08 | Hoya株式会社 | 涂布装置以及光掩模件的制造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI276474B (en) | 2007-03-21 |
| KR20050009241A (ko) | 2005-01-24 |
| JP2005051220A (ja) | 2005-02-24 |
| TW200507950A (en) | 2005-03-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |