CN1561524A - 柔顺且可交联的热界面材料 - Google Patents
柔顺且可交联的热界面材料 Download PDFInfo
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Abstract
描述了一种由至少一种硅氧烷树脂混合物,至少一种润湿促进剂和至少一种导热填料形成的柔顺的且可交联的热界面材料,制备和使用该材料的方法;以及提高聚合物和树脂体系导热率的方法。
Description
本申请要求美国实用新型申请No.09/774466的权利,在此将其全文引入作为参考。
背景
随着电子器件变得更小并更高速地运行,以热量形式放射出的能量剧增。在本行业中普遍的做法是在这些器件中单独或借助于载体使用热脂或油脂状材料,来转移经过物理界面散逸的多余热量。最常用的热界面材料的类型是热脂、相变材料和弹性体带。热脂或相变材料比弹性体带的阻热更低,这是因为其能够被分布成为极薄层并能在相邻表面之间提供紧密接触。典型的热阻抗值为0.6-1.6℃cm2/W。
热脂的严重缺陷是当其用于VLSI芯片中时,在热循环,如-65℃至150℃之后,或在做功循环之后,其导热性能会显著变差。还发现,当表面平面度的大偏差在电子器件中的接触面之间形成缝隙或由于其它原因如制造公差等在接触面之间出现大的缝隙时,这些材料的性能会变差。当这些材料的热传递能力失效时,使用了这些材料的电子器件的性能会受到负面影响。本发明提供了一种热界面材料,该材料特别适合用作电子器件的界面材料。
发明概述
本发明提供了一种柔顺且可交联的材料,所述材料包含硅氧烷树脂混合物,如乙烯基硅氧烷、乙烯基Q树脂、含氢功能团的硅氧烷和铂-乙烯基硅氧烷的混合物,润湿促进剂和至少一种导热填料。所述柔顺的导热材料能够促进高功率半导体器件中的热量散逸并保持稳定的热性能。在使用该材料的电子器件的热-力学应力或波动的功率循环中,不会发生界面层离或相分离。
所述柔顺且可交联的热界面材料可以这样进行配制:将各组分混合在一起以得到一种糊状物,可用各种分配方法将其施涂在任何特定的表面上并在室温或高温下固化。也可以配制为高度柔顺、固化的、粘性弹性体薄膜或片材以用在其它的界面用途中,在这些用途中该材料可以预先施用在例如受热器上或用在任何其它的界面情况下。
最好在将要掺入的填料中包含至少一种导热填料,如银、铜、铝及其合金;氮化硼、氮化铝、镀银的铜、镀银的铝和碳纤维。另外,向其中加入抗氧化剂以降低树脂氧化作用,加入润湿促进剂以促进表面的润湿作用,加入固化加速剂如可令其在室温下固化,加入降粘剂来提高分散性和加入交联助剂,这样做可能也是有用的。还经常需要包含基本为球形颗粒的填料以限制所述用于界面用途中的柔顺材料的可压缩性,即限制或控制其厚度。
还发现,树脂体系如上述的填料和混有硅氧烷树脂混合物的组合的导热率可通过向体系中掺入碳微纤维和其它填料而得到特别地改进。
发明详述
柔顺且可交联的热界面材料可以如下配制:将硅氧烷树脂混合物如乙烯基硅氧烷、乙烯基Q树脂、含氢功能团的硅氧烷和铂-乙烯基硅氧烷的混合物,有机钛酸酯润湿促进剂和至少一种导热填料混合在一起。可以混入不止一种的硅氧烷树脂混合物来制造柔顺且可交联的界面材料。含硅氧烷树脂的界面材料,结合以适当的导热填料,表现出的热容低于0.5cm2℃/W。与热脂不同,所述材料的热性能在IC器件的热循环或流动循环(flow cycling)之后不会变差,这是因为液态的硅氧烷树脂在热活化作用下会交联形成软凝胶。而且,当用作界面材料时,其不会像热脂那样被“挤出来”并且不会在热循环中发生界面层离。该新材料可以以可分配的液体糊状物的形式提供,用分配方法施用,然后按需要固化。其也可以以高度柔顺、固化的弹性体薄膜或片材的形式提供以预先施用在界面如受热器上。使用导热率大于约0.2,优选至少为约0.4w/m℃的填料是有利的。柔顺的导热材料促进了高功率半导体器件的热量散逸。所述糊状物可以配制成功能硅氧烷树脂和导热填料的混合物。
如本文中所使用的,术语“柔顺”涵盖的材料性能是:该材料在室温下是屈服且可成型的,与室温下是固体且不屈服的材料相反。如本文中所使用的,术语“可交联”指尚未交联的那些材料或化合物。
乙烯基Q树脂是一种活性硫化的特种硅氧烷橡胶,其具有如下的基体聚合物结构:
乙烯基Q树脂还是用于加成固化弹性体的透明的增强添加剂。含有至少20%Q-树脂的乙烯基Q树脂分散体的例子有VQM-135(DMS-V41Base),VQM-146(DMS-V46 Base)和VQX-221(在二甲苯Base中含50%)。
例如,一种可考虑使用的硅氧烷树脂混合物可如下形成:
组分 | 重量百分数 | 备注/功能 |
乙烯基硅氧烷乙烯基Q树脂含氢功能团的硅氧烷铂-乙烯基硅氧烷 | 75(在70-97范围内)20(在0-25范围内)5(在3-10范围内)20-200ppm | 乙烯基封端的硅氧烷增强添加剂交联剂催化剂 |
该树脂混合物既可在室温下也可在高温下固化以形成柔顺的弹性体。该反应通过含氢功能团的硅氧烷在催化剂,如铂络合物或镍络合物存在下与含乙烯基功能团的硅氧烷的氢化硅烷化作用(加成固化)来实现。优选的铂催化剂为SIP6830.0,SIP6832.0和铂-乙烯基硅氧烷。
可考虑的乙烯基硅氧烷的实例包括分子量为约10000-50000的乙烯基封端的聚二甲基硅氧烷。含氢功能团的硅氧烷的实例包括甲基氢化硅氧烷-二甲基硅氧烷共聚物,其分子量为约500-5000。物理性质可从非常低交联密度下的非常柔软的凝胶到较高交联密度的韧性弹性体网络之间变化。
分散在树脂混合物中的导热填料颗粒最好具有高导热率。适合的填料材料包括银、铜、铝及其合金;氮化硼,铝球体,氮化铝,镀银的铜,镀银的铝和碳纤维。氮化硼和银或氮化硼和银/铜的组合也能提供高导热率。至少为20wt%用量的氮化硼,至少为70wt%用量的铝球体和至少为约60wt%用量的银特别有用。
一种包含称作“蒸汽生成碳纤维”(VGCF)的特殊形式的碳纤维的填料具有特殊效能,其可从Applied Sciences,Inc.,Cedarville,.Ohio获得。VGCF,或“碳微纤维”,是一种经过热处理的高度石墨化的形式(导热率=1900w/m℃)。加入约0.5wt%的碳微纤维能显著提高导热率。可以购得各种长度和直径的此类纤维;如,1mm至几十厘米长和小于0.1至超过100μm的直径。一种有用的形式为直径不大于约1μm且长度为约50-100μm,其具有的导热率比直径大于5μm的其它普通碳纤维大约2或3倍。
向树脂体系如上述的硅氧烷树脂混合物中加入大量的VGCF是困难的。当向所述树脂中加入碳微纤维,例如(约1μm或更小)时,它们不能良好地混合,因为相对于树脂的量需要加入大量的纤维以有益地提高导热率。然而,我们发现可以向含有相对大量的其它纤维的树脂体系中加入较大量的碳微纤维。当树脂中加入了其它纤维时可以比单独向聚合物中添加时加入更大量的碳微纤维,由此可以在改善热界面材料的导热率方面提供更大益处。碳微纤维与聚合物的重量比优选为0.05-0.50。
掺入基本为球形的填料颗粒使填充密度最大化也是有利的。另外,基本为球体或相似的形状还可以在压实过程中提供对厚度的某种控制。加入功能化有机金属偶联剂或润湿剂,如有机硅烷,有机钛酸酯,有机锆等可以使填料颗粒易于分散。在树脂材料中使用的填料的一般颗粒度可以是约1-20μm,最大为约100μm。可以加入抗氧化剂以抑制树脂混合物凝胶的氧化作用和热降解。一般使用的抗氧化剂包括Irganoz1076,酚类的Irganox 565,胺类,(用量为0.01%-约1wt%),购自Ciba Giegy of Hawthorne,New York。
为说明本发明,通过将描述于以下实施例A-F中的各组分混合制备了一些实例。所列的实施例包含一种或多种任选的添加物,例如抗氧化剂或润湿性促进剂。这些添加物的量可以变化,但是通常它们以大约以下的量存在是有用的(以重量百分数计):填料为最高至总量(填料加树脂)的95%;润湿性促进剂为(总量的)0.1-5%;增粘剂为(总量)的0.01-1%以及抗氧化剂为(总量的)0.01-1%。应当注意的是加入至少约0.5%的碳纤维显著提高了导热率。实施例还显示了对所考虑使用的混合物的各种物理-化学性能的测试。
导热糊状物实施例
组分 | A | B | C | D | E | F |
硅氧烷树脂混合物环氧硅烷硅烷醇封端的乙烯基硅氧烷有机钛酸酯铝球体 | 2575 | 2080 | 24.80.10.175 | 19.80.10.180 | 160.10.13.880 | 120.10.13.884 |
粘度(Pa.s)粘合强度(psi)25℃的模量(Mpa)热阻抗(cm2C/w)导热率(w/mC) | 80100200.441.8 | 27545350.551.5 | 78250220.401.8 | 280180300.501.5 | 85160140.283.0 | 180250280.253.2 |
环氧硅烷和硅烷醇封端的乙烯基硅氧烷是增粘添加剂。有机钛酸酯作为润湿促进剂降低了糊状物粘度并增加填料负载。所用的有机钛酸酯为异丙基三异硬脂酰基钛酸酯。有机钛酸酯的一般结构为RO-Ti(OXRY),其中RO为可水解基团,X和Y是粘合剂官能团。铝球体的颗粒尺寸为1-20μm。
这样,柔顺且可交联的热界面材料的特定实施方案和用途得到了公开。然而,对于本领域技术人员而言,除已经描述过的那些,在不背离本发明的概念的情况下是可能有更多的改进方案,这一点是显而易见的。因此,本发明的主旨除了受所附权利要求的精神限制以外将不受其它限制。而且,在理解说明书和权利要求时,所有术语都应以与上下文一致的最广义的可能方式去理解。特别是术语“包含”应被理解为其是非排除地引用元素、组分或步骤,表明其所指的元素、组分或步骤可与其它未特别指明的元素、组分或步骤一起存在或使用或相互结合。
Claims (22)
1.一种柔顺的且可交联的材料,其用作电子器件的界面材料,包含至少一种硅氧烷树脂混合物,至少一种润湿促进剂和至少一种导热填料。
2.权利要求1的柔顺的且可交联的材料,其中的至少一种硅氧烷树脂混合物包含乙烯基封端的硅氧烷,增强添加剂,交联剂和催化剂。
3.权利要求2的柔顺的且可交联的材料,其中的乙烯基封端的硅氧烷是乙烯基硅氧烷。
4.权利要求2的柔顺的且可交联的材料,其中的增强添加剂是乙烯基Q树脂。
5.权利要求2的柔顺的且可交联的材料,其中的交联剂包含一种含氢功能团的硅氧烷。
6.权利要求2的柔顺的且可交联的材料,其中的催化剂包含一种铂络合物。
7.权利要求6的柔顺的且可交联的材料,其中的铂络合物是铂-乙烯基硅氧烷化合物。
8.权利要求1的柔顺的且可交联的材料,其中的润湿促进剂包含一种有机钛酸酯化合物。
9.权利要求1的柔顺的且可交联的材料,其中所述填料包含如下的至少一种:银、铜、铝及其合金;氮化硼,氮化铝,铝球体,镀银的铜,镀银的铝和碳纤维;以及它们的混合物。
10.权利要求9的柔顺的且可交联的材料,除了至少含有一种其它填料以外还包含碳微纤维。
11.权利要求1的柔顺的且可交联的材料,其中所述填料包含所述的碳微纤维和至少一种其它填料,其包含银、铜、铝及其合金;氮化硼,氮化铝,镀银的铜,镀银的铝和碳纤维;以及它们的混合物。
12.权利要求1的柔顺的且可交联的材料,其中至少一部分所述填料包含其本为球形的颗粒。
13.权利要求1的柔顺的且可交联的材料,还包含一种抗氧化剂。
14.权利要求7的柔顺的且可交联的材料,其中所述抗氧化剂存在的量为0.01-1wt%。
15.用作电子器件界面材料的柔顺的且可交联的材料的可分配的糊状物,其包含至少一种硅氧烷树脂混合物,至少一种润湿促进剂和至少一种导热填料。
16.用作电子器件界面材料的柔顺的且可交联材料的片材或薄膜,其包含至少一种硅氧烷树脂混合物,至少一种润湿促进剂和至少一种导热填料。
17.一种制备柔顺且可交联材料的方法,包含将至少一种硅氧烷树脂混合物与至少一种润湿促进剂和至少一种导热填料相混合。
18.权利要求17的方法,其进一步包括配制所述材料的可分配糊状物。
19.权利要求17的方法,其进一步包含将所述材料模制成片材或薄膜,所述片材或薄膜能够按尺寸切割并用作电子器件中各部分间的界面。
20.一种提高聚合物导热率的方法,包含向其中掺入碳微纤维和至少一种导热填料。
21.权利要求20的方法,其中所述碳微纤维存在的量为至少约0.5wt%,或碳微纤维与聚合物之比至少为0.05。
22.权利要求21的方法,其还包含另外掺入一种填料,该填料包括如下的至少一种:银、铜、铝及其合金;氮化硼、氮化铝、镀银的铜、镀银的铝和碳纤维;以及它们的混合物。
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
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CN101802101B (zh) * | 2007-09-20 | 2012-08-08 | Abb研究有限公司 | 电气绝缘设备和具有该电气绝缘设备的电气设备 |
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Families Citing this family (57)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6706219B2 (en) * | 1999-09-17 | 2004-03-16 | Honeywell International Inc. | Interface materials and methods of production and use thereof |
US6673434B2 (en) * | 1999-12-01 | 2004-01-06 | Honeywell International, Inc. | Thermal interface materials |
US7608324B2 (en) * | 2001-05-30 | 2009-10-27 | Honeywell International Inc. | Interface materials and methods of production and use thereof |
US6651736B2 (en) * | 2001-06-28 | 2003-11-25 | Intel Corporation | Short carbon fiber enhanced thermal grease |
JP4784720B2 (ja) * | 2001-09-25 | 2011-10-05 | 信越化学工業株式会社 | 粘着テープ |
KR100796678B1 (ko) * | 2001-09-28 | 2008-01-21 | 삼성에스디아이 주식회사 | 평면 표시 소자용 전자 방출원 조성물, 이를 이용한 평면 표시 소자용 전자 방출원의 제조방법 및 이를 포함하는 평면 표시 소자 |
US6620515B2 (en) * | 2001-12-14 | 2003-09-16 | Dow Corning Corporation | Thermally conductive phase change materials |
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US6783692B2 (en) * | 2002-10-17 | 2004-08-31 | Dow Corning Corporation | Heat softening thermally conductive compositions and methods for their preparation |
JP4568472B2 (ja) * | 2002-11-29 | 2010-10-27 | 東レ・ダウコーニング株式会社 | 銀粉末の製造方法および硬化性シリコーン組成物 |
EP1751479B1 (en) * | 2004-04-09 | 2014-05-14 | Ail Research Inc. | Heat and mass exchanger |
CN100370604C (zh) * | 2004-04-15 | 2008-02-20 | 鸿富锦精密工业(深圳)有限公司 | 一种热界面材料及其制造方法 |
CN100389166C (zh) * | 2004-04-29 | 2008-05-21 | 鸿富锦精密工业(深圳)有限公司 | 一种热界面材料及其制造方法 |
CN100543103C (zh) * | 2005-03-19 | 2009-09-23 | 清华大学 | 热界面材料及其制备方法 |
US7390377B1 (en) | 2005-09-22 | 2008-06-24 | Sandia Corporation | Bonding thermoplastic polymers |
CN100528315C (zh) * | 2005-10-11 | 2009-08-19 | 鸿富锦精密工业(深圳)有限公司 | 热界面材料混合装置 |
WO2007053571A2 (en) * | 2005-11-01 | 2007-05-10 | Techfilm, Llc | Thermal interface material with multiple size distribution thermally conductive fillers |
CN1962067B (zh) * | 2005-11-10 | 2010-04-14 | 鸿富锦精密工业(深圳)有限公司 | 碾磨设备 |
CN1978580B (zh) * | 2005-12-09 | 2010-09-29 | 富准精密工业(深圳)有限公司 | 导热膏及使用该导热膏的电子装置 |
JP2007161806A (ja) * | 2005-12-12 | 2007-06-28 | Shin Etsu Chem Co Ltd | 熱伝導性シリコーンゴム組成物 |
US20100219369A1 (en) * | 2005-12-20 | 2010-09-02 | Industrial Technology Research Institute | Composition of thermal interface material |
TWI291480B (en) * | 2005-12-20 | 2007-12-21 | Ind Tech Res Inst | Composition for thermal interface materials |
CN1986643B (zh) * | 2005-12-23 | 2010-05-12 | 富准精密工业(深圳)有限公司 | 硅脂组合物 |
CN101003685A (zh) * | 2006-01-18 | 2007-07-25 | 富准精密工业(深圳)有限公司 | 导热聚硅氧烷组合物 |
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US7951871B2 (en) * | 2006-11-10 | 2011-05-31 | Exxonmobil Chemical Patents Inc. | Curing rubber by hydrosilation |
EP2042558A1 (en) * | 2007-09-20 | 2009-04-01 | ABB Research Ltd. | An electric insulation device and an electric device provided therewith |
JP2008160126A (ja) * | 2007-12-21 | 2008-07-10 | Shin Etsu Chem Co Ltd | 電子部品の冷却構造 |
US20110038124A1 (en) * | 2008-04-21 | 2011-02-17 | Honeywell International Inc. | Thermal interconnect and interface materials, methods of production and uses thereof |
US7808099B2 (en) * | 2008-05-06 | 2010-10-05 | International Business Machines Corporation | Liquid thermal interface having mixture of linearly structured polymer doped crosslinked networks and related method |
US20100112360A1 (en) * | 2008-10-31 | 2010-05-06 | Delano Andrew D | Layered thermal interface systems methods of production and uses thereof |
US9751264B2 (en) * | 2009-10-09 | 2017-09-05 | Alcatel-Lucent Usa Inc. | Thermal interface device |
US8247494B2 (en) * | 2009-11-23 | 2012-08-21 | Exxonmobil Chemical Patents Inc. | Thermoset compositions with dispersed thermoplastic resin therein and process for making them |
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US9693481B2 (en) * | 2013-06-25 | 2017-06-27 | Henkel IP & Holding GmbH | Thermally conductive dielectric interface |
WO2015084778A1 (en) | 2013-12-05 | 2015-06-11 | Honeywell International Inc. | Stannous methansulfonate solution with adjusted ph |
KR20160122172A (ko) | 2014-02-13 | 2016-10-21 | 허니웰 인터내셔날 인코포레이티드 | 압축성 열전도 재료 |
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JP6149831B2 (ja) * | 2014-09-04 | 2017-06-21 | 信越化学工業株式会社 | シリコーン組成物 |
MY183994A (en) | 2014-12-05 | 2021-03-17 | Honeywell Int Inc | High performance thermal interface materials with low thermal impedance |
EP3274124A1 (en) * | 2015-03-26 | 2018-01-31 | SABIC Global Technologies B.V. | Use of dynamic cross-linked polymer compositions in soldering applications |
US10312177B2 (en) | 2015-11-17 | 2019-06-04 | Honeywell International Inc. | Thermal interface materials including a coloring agent |
JP6842469B2 (ja) | 2016-03-08 | 2021-03-17 | ハネウェル・インターナショナル・インコーポレーテッドHoneywell International Inc. | 相変化材料 |
US10501671B2 (en) | 2016-07-26 | 2019-12-10 | Honeywell International Inc. | Gel-type thermal interface material |
US9873774B1 (en) * | 2016-09-01 | 2018-01-23 | International Business Machines Corporation | Shape memory thermal interface materials |
US9937662B2 (en) | 2016-09-01 | 2018-04-10 | International Business Machines Corporation | Shape memory thermal interface materials |
US10165841B2 (en) | 2016-10-28 | 2019-01-01 | SWings Products, LLC | Footwear carrying system |
JP2018078272A (ja) * | 2016-10-31 | 2018-05-17 | スリーエム イノベイティブ プロパティズ カンパニー | 三次元形状熱伝導性成形体、及びその製造方法 |
CN107189767B (zh) * | 2017-05-27 | 2020-11-27 | 广州中科检测技术服务有限公司 | 一种高界面传热效果、可塑、无粘污的界面传热材料及其制备方法 |
US11041103B2 (en) | 2017-09-08 | 2021-06-22 | Honeywell International Inc. | Silicone-free thermal gel |
US10428256B2 (en) | 2017-10-23 | 2019-10-01 | Honeywell International Inc. | Releasable thermal gel |
US11072706B2 (en) | 2018-02-15 | 2021-07-27 | Honeywell International Inc. | Gel-type thermal interface material |
CN108620765A (zh) * | 2018-05-09 | 2018-10-09 | 长沙小如信息科技有限公司 | 一种汽车钣金件焊接材料及焊接工艺 |
IT201800006010A1 (it) * | 2018-06-04 | 2019-12-04 | Strato sigillante di uno pneumatico | |
US11373921B2 (en) | 2019-04-23 | 2022-06-28 | Honeywell International Inc. | Gel-type thermal interface material with low pre-curing viscosity and elastic properties post-curing |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4842911A (en) * | 1983-09-02 | 1989-06-27 | The Bergquist Company | Interfacing for heat sinks |
US4790968A (en) | 1985-10-19 | 1988-12-13 | Toshiba Silicone Co., Ltd. | Process for producing pressure-sensitive electroconductive sheet |
US5891951A (en) * | 1987-09-14 | 1999-04-06 | Idemitsu Kosan Co., Ltd. | Styrene-based resin composition |
US5094769A (en) * | 1988-05-13 | 1992-03-10 | International Business Machines Corporation | Compliant thermally conductive compound |
JPH0484444A (ja) | 1990-07-27 | 1992-03-17 | Toshiba Chem Corp | 導電性ペースト |
EP0476224A1 (en) | 1990-08-21 | 1992-03-25 | Ricon Resins, Inc. | Adhesive rubber compositions |
US5227093A (en) * | 1991-11-29 | 1993-07-13 | Dow Corning Corporation | Curable organosiloxane compositions yielding electrically conductive materials |
US5380770A (en) | 1992-04-09 | 1995-01-10 | General Electric Company | Heat cured silicone rubber compositions containing a potassium aluminosilicate filler which provides resistance to hydrocarbon oils and adjustable shrinkage |
US5665473A (en) * | 1994-09-16 | 1997-09-09 | Tokuyama Corporation | Package for mounting a semiconductor device |
US5837119A (en) | 1995-03-31 | 1998-11-17 | International Business Machines Corporation | Methods of fabricating dendritic powder materials for high conductivity paste applications |
US5859105A (en) | 1997-02-11 | 1999-01-12 | Johnson Matthey, Inc. | Organosilicon-containing compositions capable of rapid curing at low temperature |
US5852092A (en) | 1997-02-11 | 1998-12-22 | Johnson Matthey, Inc. | Organosilicon-containing compositions having enhanced adhesive properties |
JPH1140224A (ja) | 1997-07-11 | 1999-02-12 | Jsr Corp | 異方導電性シート |
US6432497B2 (en) * | 1997-07-28 | 2002-08-13 | Parker-Hannifin Corporation | Double-side thermally conductive adhesive tape for plastic-packaged electronic components |
GB9816377D0 (en) | 1998-07-29 | 1998-09-23 | Dow Corning Sa | Foam control agents |
JP3948642B2 (ja) * | 1998-08-21 | 2007-07-25 | 信越化学工業株式会社 | 熱伝導性グリース組成物及びそれを使用した半導体装置 |
JP2000109373A (ja) * | 1998-10-02 | 2000-04-18 | Shin Etsu Chem Co Ltd | 放熱用シリコーングリース組成物及びそれを使用した半導体装置 |
US6271299B1 (en) | 1999-02-02 | 2001-08-07 | Dow Corning Corporation | Fire resistant sealant composition |
US6238596B1 (en) * | 1999-03-09 | 2001-05-29 | Johnson Matthey Electronics, Inc. | Compliant and crosslinkable thermal interface materials |
US5989459A (en) | 1999-03-09 | 1999-11-23 | Johnson Matthey, Inc. | Compliant and crosslinkable thermal interface materials |
US6162663A (en) * | 1999-04-20 | 2000-12-19 | Schoenstein; Paul G. | Dissipation of heat from a circuit board having bare silicon chips mounted thereon |
US6706219B2 (en) * | 1999-09-17 | 2004-03-16 | Honeywell International Inc. | Interface materials and methods of production and use thereof |
-
2001
- 2001-01-30 US US09/774,466 patent/US6605238B2/en not_active Expired - Lifetime
-
2002
- 2002-01-17 AT AT02704176T patent/ATE411605T1/de not_active IP Right Cessation
- 2002-01-17 EP EP08012564A patent/EP1993134A3/en not_active Withdrawn
- 2002-01-17 CN CNB028042662A patent/CN1288668C/zh not_active Ceased
- 2002-01-17 JP JP2002561844A patent/JP2004526822A/ja not_active Withdrawn
- 2002-01-17 CA CA002433567A patent/CA2433567A1/en not_active Abandoned
- 2002-01-17 EP EP02704176A patent/EP1356477B1/en not_active Expired - Lifetime
- 2002-01-17 DE DE60229355T patent/DE60229355D1/de not_active Expired - Lifetime
- 2002-01-17 CN CNA2006101318229A patent/CN1927989A/zh active Pending
- 2002-01-17 KR KR1020037009484A patent/KR100621538B1/ko not_active IP Right Cessation
- 2002-01-17 WO PCT/US2002/001573 patent/WO2002061764A1/en active Application Filing
- 2002-01-25 TW TW091101240A patent/TWI305218B/zh not_active IP Right Cessation
- 2002-01-29 MY MYPI20020327A patent/MY122904A/en unknown
-
2003
- 2003-05-27 US US10/446,891 patent/US6811725B2/en not_active Expired - Fee Related
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
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CN102554486A (zh) * | 2010-12-28 | 2012-07-11 | 上海杰远环保科技有限公司 | 一种高导热焊接材料及其制造方法 |
CN110591658A (zh) * | 2019-08-20 | 2019-12-20 | 深圳市博恩实业有限公司 | 通道式柔性复合材料高导热体及其制备方法 |
CN114269848A (zh) * | 2019-08-26 | 2022-04-01 | 富士胶片株式会社 | 导热材料形成用组合物、导热材料、导热片、带导热层的器件 |
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Publication number | Publication date |
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US20020007035A1 (en) | 2002-01-17 |
US6605238B2 (en) | 2003-08-12 |
US20040026670A1 (en) | 2004-02-12 |
CA2433567A1 (en) | 2002-08-08 |
WO2002061764A1 (en) | 2002-08-08 |
KR20040030491A (ko) | 2004-04-09 |
EP1993134A2 (en) | 2008-11-19 |
CN1288668C (zh) | 2006-12-06 |
KR100621538B1 (ko) | 2006-09-13 |
JP2004526822A (ja) | 2004-09-02 |
MY122904A (en) | 2006-05-31 |
ATE411605T1 (de) | 2008-10-15 |
EP1356477A4 (en) | 2005-10-12 |
EP1993134A3 (en) | 2009-03-18 |
TWI305218B (en) | 2009-01-11 |
US6811725B2 (en) | 2004-11-02 |
EP1356477A1 (en) | 2003-10-29 |
EP1356477B1 (en) | 2008-10-15 |
DE60229355D1 (de) | 2008-11-27 |
WO2002061764A8 (en) | 2003-11-06 |
CN1927989A (zh) | 2007-03-14 |
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