CN1522281A - 包含磷光体的环氧模塑化合物和制备这些组合物的方法 - Google Patents
包含磷光体的环氧模塑化合物和制备这些组合物的方法 Download PDFInfo
- Publication number
- CN1522281A CN1522281A CNA028130308A CN02813030A CN1522281A CN 1522281 A CN1522281 A CN 1522281A CN A028130308 A CNA028130308 A CN A028130308A CN 02813030 A CN02813030 A CN 02813030A CN 1522281 A CN1522281 A CN 1522281A
- Authority
- CN
- China
- Prior art keywords
- phosphor material
- epoxy composite
- epoxy
- composition
- molding compounds
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 title claims abstract description 99
- 239000000203 mixture Substances 0.000 title claims abstract description 74
- 238000004519 manufacturing process Methods 0.000 title description 4
- 229920006336 epoxy molding compound Polymers 0.000 title description 2
- 239000004593 Epoxy Substances 0.000 claims abstract description 136
- 150000001875 compounds Chemical class 0.000 claims abstract description 99
- 239000000463 material Substances 0.000 claims abstract description 94
- 238000000465 moulding Methods 0.000 claims abstract description 85
- 238000000034 method Methods 0.000 claims abstract description 39
- 230000005693 optoelectronics Effects 0.000 claims abstract description 25
- 230000008569 process Effects 0.000 claims abstract description 17
- 239000002131 composite material Substances 0.000 claims description 86
- 238000007789 sealing Methods 0.000 claims description 34
- 239000003795 chemical substances by application Substances 0.000 claims description 30
- 238000006243 chemical reaction Methods 0.000 claims description 23
- 239000007806 chemical reaction intermediate Substances 0.000 claims description 15
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 14
- 150000008065 acid anhydrides Chemical class 0.000 claims description 14
- 150000008064 anhydrides Chemical class 0.000 claims description 14
- 239000007795 chemical reaction product Substances 0.000 claims description 13
- 238000009827 uniform distribution Methods 0.000 claims description 11
- 239000008240 homogeneous mixture Substances 0.000 claims description 10
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 claims description 8
- 230000008859 change Effects 0.000 claims description 8
- 238000002156 mixing Methods 0.000 claims description 8
- MUTGBJKUEZFXGO-OLQVQODUSA-N (3as,7ar)-3a,4,5,6,7,7a-hexahydro-2-benzofuran-1,3-dione Chemical compound C1CCC[C@@H]2C(=O)OC(=O)[C@@H]21 MUTGBJKUEZFXGO-OLQVQODUSA-N 0.000 claims description 7
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 6
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 5
- 239000012812 sealant material Substances 0.000 claims description 5
- 235000011187 glycerol Nutrition 0.000 claims description 4
- -1 isocyanuric acid ester Chemical class 0.000 claims description 4
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 claims description 3
- 230000015572 biosynthetic process Effects 0.000 claims description 3
- 238000001816 cooling Methods 0.000 claims description 2
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 claims 3
- SZXQTJUDPRGNJN-UHFFFAOYSA-N dipropylene glycol Chemical compound OCCCOCCCO SZXQTJUDPRGNJN-UHFFFAOYSA-N 0.000 claims 1
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Natural products OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 claims 1
- 238000003756 stirring Methods 0.000 claims 1
- 238000005538 encapsulation Methods 0.000 abstract description 3
- 239000003963 antioxidant agent Substances 0.000 abstract 1
- 230000003078 antioxidant effect Effects 0.000 abstract 1
- 239000000126 substance Substances 0.000 description 17
- 239000000206 moulding compound Substances 0.000 description 13
- 239000000047 product Substances 0.000 description 11
- 239000007788 liquid Substances 0.000 description 9
- 239000002245 particle Substances 0.000 description 9
- 150000005846 sugar alcohols Polymers 0.000 description 9
- 238000007711 solidification Methods 0.000 description 7
- 230000008023 solidification Effects 0.000 description 7
- 239000002253 acid Substances 0.000 description 5
- 239000008188 pellet Substances 0.000 description 5
- 238000004062 sedimentation Methods 0.000 description 5
- 238000001721 transfer moulding Methods 0.000 description 5
- 229910052799 carbon Inorganic materials 0.000 description 4
- 125000004432 carbon atom Chemical group C* 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 4
- 239000013067 intermediate product Substances 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- CTKINSOISVBQLD-UHFFFAOYSA-N Glycidol Chemical compound OCC1CO1 CTKINSOISVBQLD-UHFFFAOYSA-N 0.000 description 3
- 235000021355 Stearic acid Nutrition 0.000 description 3
- 238000004100 electronic packaging Methods 0.000 description 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 3
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 3
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 3
- 229920005862 polyol Polymers 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 239000000376 reactant Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 239000008117 stearic acid Substances 0.000 description 3
- ZCHGODLGROULLT-UHFFFAOYSA-N 2,2-bis(hydroxymethyl)propane-1,3-diol;propane-1,2-diol Chemical group CC(O)CO.OCC(CO)(CO)CO ZCHGODLGROULLT-UHFFFAOYSA-N 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N Bisphenol F Natural products C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- HPEUJPJOZXNMSJ-UHFFFAOYSA-N Methyl stearate Chemical compound CCCCCCCCCCCCCCCCCC(=O)OC HPEUJPJOZXNMSJ-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 125000001931 aliphatic group Chemical group 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 2
- 238000000748 compression moulding Methods 0.000 description 2
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 239000005022 packaging material Substances 0.000 description 2
- 230000005622 photoelectricity Effects 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 150000003077 polyols Chemical class 0.000 description 2
- 238000007142 ring opening reaction Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000000344 soap Substances 0.000 description 2
- 238000001228 spectrum Methods 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229910000980 Aluminium gallium arsenide Inorganic materials 0.000 description 1
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- DJOWTWWHMWQATC-KYHIUUMWSA-N Karpoxanthin Natural products CC(=C/C=C/C=C(C)/C=C/C=C(C)/C=C/C1(O)C(C)(C)CC(O)CC1(C)O)C=CC=C(/C)C=CC2=C(C)CC(O)CC2(C)C DJOWTWWHMWQATC-KYHIUUMWSA-N 0.000 description 1
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 description 1
- 208000034189 Sclerosis Diseases 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 238000001994 activation Methods 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000013019 agitation Methods 0.000 description 1
- 125000003158 alcohol group Chemical group 0.000 description 1
- JNDMLEXHDPKVFC-UHFFFAOYSA-N aluminum;oxygen(2-);yttrium(3+) Chemical group [O-2].[O-2].[O-2].[Al+3].[Y+3] JNDMLEXHDPKVFC-UHFFFAOYSA-N 0.000 description 1
- 239000012752 auxiliary agent Substances 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 235000010290 biphenyl Nutrition 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- 229940106691 bisphenol a Drugs 0.000 description 1
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 description 1
- 125000002843 carboxylic acid group Chemical group 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000002872 contrast media Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 239000011353 cycloaliphatic epoxy resin Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- CAMHHLOGFDZBBG-UHFFFAOYSA-N epoxidized methyl oleate Natural products CCCCCCCCC1OC1CCCCCCCC(=O)OC CAMHHLOGFDZBBG-UHFFFAOYSA-N 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 150000002632 lipids Chemical class 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000009828 non-uniform distribution Methods 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- ULWHHBHJGPPBCO-UHFFFAOYSA-N propane-1,1-diol Chemical class CCC(O)O ULWHHBHJGPPBCO-UHFFFAOYSA-N 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 229910019655 synthetic inorganic crystalline material Inorganic materials 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 125000003698 tetramethyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 229910019901 yttrium aluminum garnet Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
- C08G59/3236—Heterocylic compounds
- C08G59/3245—Heterocylic compounds containing only nitrogen as a heteroatom
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
- C08G59/4215—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof cycloaliphatic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/02—Use of particular materials as binders, particle coatings or suspension media therefor
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Materials Engineering (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Inorganic Chemistry (AREA)
- Epoxy Resins (AREA)
- Led Device Packages (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/875,323 | 2001-06-06 | ||
| US09/875,323 US6989412B2 (en) | 2001-06-06 | 2001-06-06 | Epoxy molding compounds containing phosphor and process for preparing such compositions |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1522281A true CN1522281A (zh) | 2004-08-18 |
Family
ID=25365593
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA028130308A Pending CN1522281A (zh) | 2001-06-06 | 2002-06-05 | 包含磷光体的环氧模塑化合物和制备这些组合物的方法 |
Country Status (8)
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI450919B (zh) * | 2008-12-23 | 2014-09-01 | Micron Technology Inc | 含碳奈米管分散體之模製材料 |
| TWI485175B (zh) * | 2008-12-15 | 2015-05-21 | Nichia Corp | 熱硬化性環氧樹脂組成物及半導體裝置 |
Families Citing this family (51)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6989412B2 (en) * | 2001-06-06 | 2006-01-24 | Henkel Corporation | Epoxy molding compounds containing phosphor and process for preparing such compositions |
| CN1558921A (zh) * | 2001-08-03 | 2004-12-29 | Dsm | 显示器件用可固化组合物 |
| US7695166B2 (en) * | 2001-11-23 | 2010-04-13 | Derose Anthony | Shaped LED light bulb |
| US20050188569A1 (en) * | 2001-11-23 | 2005-09-01 | Derose Anthony | Display signs and ornaments for holiday seasons |
| US20080084009A1 (en) * | 2005-05-02 | 2008-04-10 | Derose Anthony | Method of Making Shaped LED Light Bulb |
| US20040124433A1 (en) * | 2002-07-19 | 2004-07-01 | Kelly Stephen G. | Process for fabricating, and light emitting device resulting from, a homogenously mixed powder/pelletized compound |
| JP4037207B2 (ja) * | 2002-08-09 | 2008-01-23 | 信越化学工業株式会社 | 難燃性エポキシ樹脂組成物、並びにそれを使用する半導体封止材料及び樹脂封止型半導体装置 |
| US7042020B2 (en) * | 2003-02-14 | 2006-05-09 | Cree, Inc. | Light emitting device incorporating a luminescent material |
| US20050052871A1 (en) * | 2003-07-11 | 2005-03-10 | Hon Hai Precision Industry Co., Ltd. | Light-emitting diode and backlight system using the same |
| WO2005025933A2 (en) * | 2003-09-08 | 2005-03-24 | Schefenacker Vision Systems Usa Inc. | Led light source |
| KR100558446B1 (ko) * | 2003-11-19 | 2006-03-10 | 삼성전기주식회사 | 파장변환용 몰딩 화합물 수지 태블릿 제조방법과 이를이용한 백색 발광다이오드 제조방법 |
| CN100377370C (zh) * | 2003-11-22 | 2008-03-26 | 鸿富锦精密工业（深圳）有限公司 | 发光二极管和面光源装置 |
| JP5004410B2 (ja) * | 2004-04-26 | 2012-08-22 | Ｔｏｗａ株式会社 | 光素子の樹脂封止成形方法および樹脂封止成形装置 |
| US20050264194A1 (en) * | 2004-05-25 | 2005-12-01 | Ng Kee Y | Mold compound with fluorescent material and a light-emitting device made therefrom |
| CN1725521B (zh) * | 2004-07-16 | 2010-10-27 | 国际商业机器公司 | 光电子器件及其制造方法 |
| TWI256149B (en) * | 2004-09-27 | 2006-06-01 | Advanced Optoelectronic Tech | Light apparatus having adjustable color light and manufacturing method thereof |
| JP5128047B2 (ja) * | 2004-10-07 | 2013-01-23 | Ｔｏｗａ株式会社 | 光デバイス及び光デバイスの生産方法 |
| JP2006193570A (ja) * | 2005-01-12 | 2006-07-27 | Stanley Electric Co Ltd | 熱硬化性樹脂組成物、該組成物を熱硬化してなる透光性硬化物、該硬化物で封止された発光ダイオード |
| CA2492994A1 (en) * | 2005-01-19 | 2006-07-19 | Ivan To | Method for fabricating luminescent articles |
| US7394440B2 (en) * | 2005-02-10 | 2008-07-01 | Interdigital Technology Corporation | Three-dimensional antenna fabrication from multiple two-dimensional structures |
| JP4953578B2 (ja) * | 2005-02-18 | 2012-06-13 | 日亜化学工業株式会社 | 発光装置 |
| KR101204115B1 (ko) | 2005-02-18 | 2012-11-22 | 니치아 카가쿠 고교 가부시키가이샤 | 배광 특성을 제어하기 위한 렌즈를 구비한 발광 장치 |
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Cited By (6)
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| TWI485175B (zh) * | 2008-12-15 | 2015-05-21 | Nichia Corp | 熱硬化性環氧樹脂組成物及半導體裝置 |
| US9303115B2 (en) | 2008-12-15 | 2016-04-05 | Nichia Corporation | Thermosetting epoxy resin composition and semiconductor device |
| TWI450919B (zh) * | 2008-12-23 | 2014-09-01 | Micron Technology Inc | 含碳奈米管分散體之模製材料 |
| US9041228B2 (en) | 2008-12-23 | 2015-05-26 | Micron Technology, Inc. | Molding compound including a carbon nano-tube dispersion |
| US9950464B2 (en) | 2008-12-23 | 2018-04-24 | Micron Technology, Inc. | Forming a carbon nano-tube dispersion |
| US10953593B2 (en) | 2008-12-23 | 2021-03-23 | Micron Technology, Inc. | Molding compound including a carbon nano-tube dispersion |
Also Published As
| Publication number | Publication date |
|---|---|
| US20040063840A1 (en) | 2004-04-01 |
| KR20040014546A (ko) | 2004-02-14 |
| US20030001140A1 (en) | 2003-01-02 |
| US6989412B2 (en) | 2006-01-24 |
| JP2004528472A (ja) | 2004-09-16 |
| DE60204462D1 (de) | 2005-07-07 |
| US7125917B2 (en) | 2006-10-24 |
| US7622516B1 (en) | 2009-11-24 |
| EP1401956B1 (en) | 2005-06-01 |
| ATE296857T1 (de) | 2005-06-15 |
| EP1401956A1 (en) | 2004-03-31 |
| WO2002098981A1 (en) | 2002-12-12 |
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