CN1513207A - 接触装置 - Google Patents

接触装置 Download PDF

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CN1513207A
CN1513207A CNA028109104A CN02810910A CN1513207A CN 1513207 A CN1513207 A CN 1513207A CN A028109104 A CNA028109104 A CN A028109104A CN 02810910 A CN02810910 A CN 02810910A CN 1513207 A CN1513207 A CN 1513207A
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S・考夫曼
S·考夫曼
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Abstract

根据本发明，功率半导体模块包含模块外壳，它具有导电盖板(2)、导电基底板、以及排列在盖板与基底板之间的绝缘外壳壁(3)。功率半导体电路被置于模块外壳中。功率半导体电路的两个连接(5，6)通过模块外壳被引出，至少两个连接中的第一个(5)被提供来接触盖板。两个连接(5，6)被排列在通过模块外壳被引出的印刷电路板(4)的相反表面上，并能够与标准插头形成接触。就稳定性和电感而言，本发明的功率半导体模块具有改善了的接触。

Description

接触装置
技术领域
本发明涉及到功率电子部件领域。它基于根据专利权利要求1前序部分的功率半导体模块。
背景技术
所谓“冰球”半导体模块，是用于例如包含多个模块的叠层中的半导体模块，这些模块通常具有冰球的圆饼形状亦即带有两个相反的基底区的大致圆柱形的形状。这些基底区以导电的方式被形成并连接到半导体的功率电极即主电极(发射极，收集极)，而基底区之间的侧壁以电绝缘的方式形成。在具有多个串联连接的模块的叠层中，在各种情况下排列在两个模块之间的热沉(Kuehl koerper)都位于主电流路径中。为了控制和监视各个功率半导体元件，控制端子(栅)和辅助端子(辅助发射极)在各种情况下都被引出模块外壳。在常规“冰球”模块的情况下，所述端子包含凸起的插脚，辅助端子被焊接到一个基底区(发射极)上。
在外力的作用下，这些插脚容易断裂。焊接点可能被损伤。此外，各个插脚状接触之间的电感比较大。
EP 0772235公开了一种半导体模块，它包含由电绝缘外壳中的IGBT组成的半导体电路。连接到IGBT主电极的是两个通过侧壁引出模块外壳的功率端子。这些功率端子大致以被绝缘层隔离的方式被制作成彼此平行排列的平板。IGBT的控制端子通过侧壁在另一位置处被引出。
发明内容
本发明的目的是提供一种引言中所述类型的功率半导体模块，此功率半导体模块在接触稳定性和接触之间的电感方面得到了改善。
利用具有专利权利要求1的特征的功率半导体模块，来达到此目的。
本发明的核心在于，从模块外壳引出的功率半导体电路的两个端子被排列在从模块外壳引出的印刷电路板(PCB)的相反的区域上，且印刷电路板以锁紧的方式被固定装置固定到盖板，致使排列在印刷电路板与盖板之间的盖板端子被电连接到盖板，最好将固定装排列在连接位置区域中。
结果，各个端子就具有提高了的稳定性以及降低了的电感。而且，确保了盖板与盖板端子之间的最佳电连接。
盖板和/或盖板端子在连接位置区域中有利地具有滚花。结果，电连接被进一步改善。从而即使在变化的条件(温度，湿度)下，也能够在更长的时间内实现更可靠的电连接。
在根据本发明的功率半导体模块的另一优选实施方案中，盖板和印刷电路板各具有至少两个凸起。盖板和印刷电路板的各个凸起被彼此层叠排列，且固定装置被排列在凸起区域中。此外，印刷电路板在两个凸起之间还具有至少另一个凸起。
盖板的两个凸起确保了防止印刷电路板的另一个凸起被冲击。所述凸起被有利地形成为基本上矩形式样，以便能够用常规的连接件来进行接触连接。
附图说明
下面基于附图所述的各个示例实施方案对本发明进行详细描述，在这些附图中：
图1示意地示出了根据本发明的具有盖板和印刷电路板的功率半导体模块，
图2示出了根据图1的具有盖板和印刷电路板第一实施方案的功率半导体模块部分，
图3示出了根据图2的功率半导体模块沿III-III线的剖面图，
图4示出了根据图2的功率半导体模块沿IV-IV线的剖面图，
图5示出了根据图2的印刷电路板的第二实施方案的俯视图，而
图6示出了根据图5的印刷电路板的仰视图。
具体实施方式
在所有附图中，相同的参考号涉及到功能相同的零件。
图1中的功率半导体模块包含由两个功率半导体组成的功率半导体电路1。功率半导体电路的功能和构造是任意的，且与本发明无关。于是，举例来说，多个半导体元件可以被组合在能够被预先制造的子模块中。
功率半导体电路1被安置在主要包含导电盖板2、导电基底板9、以及排列在之间的电绝缘外壳壁3的模块外壳中。
如在常规“冰球”模块中那样，功率半导体电路1的功率端子即主端子被电连接到导电盖板和基底板。
功率半导体的控制信号，例如绝缘栅双极晶体管(IGBT)的栅控制信号，经由汇流母线和控制端子导体6从外壳通过。
根据本发明，控制端子导体6被排列在两侧均被金属化的印刷电路板4的一侧上。位于印刷电路板另一侧上的是电连接到盖板2的盖板端子导体5。
图2示出了根据本发明的功率半导体模块部分的俯视图。
将两侧均有金属化涂层的印刷电路板4排列在外壳壁3与盖板2之间。盖板端子导体5位于面对盖板的上侧。两个控制端子导体6被置于面对外壳壁的下侧。
盖板2具有两个伸出模块外壳边沿的凸起21。如从图3可见，印刷电路板具有两个排列在盖板凸起21下方的对应的凸起41。凸起21与41被连接到固定装置7，例如铆钉或螺钉。从而在排列于印刷电路板上侧的盖板端子导体51与盖板21之间产生导电连接。滚花22(糙化表面)被嵌入到盖板凸起21的下侧中。将长度直至几百微米的滚花的尖端压入到印刷电路板的金属化涂层中，就得到改善了的电连接。
印刷电路板在两个凸起41之间具有另一个凸起42。如从图4可见，所述凸起42用来接纳连接件8。连接件8沿箭头方向被推到凸起42上。排列在连接件中的各个接触元件被推到排列在印刷电路板4二侧上的端子52和61上。常规的印刷电路板连接件能够被用作此连接件。
凸起42被盖板凸起21保护免受来自上方和来自侧面的冲击。
图5和图6示出了仅仅具有一个控制端子61的印刷电路板的另一个实施方案。而且，滚花53被嵌入到固定装置的开口71区域中的盖板端子导体51中。糙化的表面改善了对盖板的电连接。
印刷电路板还包含模块外壳内部的其它凸起43，所述其它凸起用于控制汇流母线的接触连接。垂直的接触元件(未示出)将控制端子导体62连接到汇流母线。除了嵌入在凸起21中的开口71之外，还可以为其它固定装置提供开口。
除了所示的各个实施方案之外，可以设想对多个连接件采用彼此并排排列的多个凸起。用来保护各个凸起的盖板凸起在各种情况下可以设置在各个连接件之间。
此外，可以设想为每个印刷电路板凸起提供一个或两个以上的控制端子。
尤其是，具有其中各个导电层包含至少一个端子的三层或多层印刷电路板的示例实施方案，也是可能的。
参考号表
1                功率半导体电路
2                导电盖板，发射极板
3                绝缘外壳
4                绝缘印刷电路板
5，51            盖板端子导体
6，62            控制端子导体
7                固定装置
8                端子连接件
9                导电基底板
21，41，42，43   凸起
22，53           滚花
52               盖板端子
61               控制端子
71               固定装置开口

Claims (4)

1.一种功率半导体模块，它包含
-模块外壳，具有导电盖板(2)和基本上平行于盖板排列的导电基底板(9)以及排列在盖板与基底板之间的绝缘外壳壁(3)，
-安置在模块外壳中且具有至少两个功率端子的功率半导体电路(1)，两个功率端子中的一个被电连接到盖板，而另一个被电连接到基底板，以及
-从模块外壳引出的功率半导体电路的至少两个端子(5，52；6，61)，此至少两个端子之一(5，52)被用于盖板(2)的接触连接，
其特征在于
以大致平面方式制作的印刷电路板(4)从模块外壳被引出，此印刷电路板(4)被制作层至少二层中，两个端子被制作成印刷电路板(4)的导体(5，6)，且导体(5，6)被排列成基本上平行于印刷电路板(4)的基底区，
并且
-印刷电路板(4)通过固定装置(7)以锁紧的方式固定到盖板(2)，致使排列在面对盖板的侧上的盖板端子导体(5)被电连接到盖板。
2.权利要求1所述的功率半导体模块，
其特征在于
-固定装置(7)被排列在连接位置区域中。
3.权利要求1或2所述的功率半导体模块，
其特征在于
-盖板(2)和/或盖板端子导体(5，51)在连接位置区域中具有优化接触的滚花(22，53)。
4.权利要求1-3之一所述的功率半导体模块，
其特征在于
-盖板(2)和印刷电路板(4)各具有至少两个凸起(21)，
-盖板的凸起(21)和印刷电路板的凸起(41)被彼此叠层排列，
-固定装置(7)被安排在凸起(21，41)区域中，
-印刷电路板(4)在两个凸起(41)之间具有至少另一个凸起(42)，
-端子(52，61)被安排在所述另一个凸起(42)上。
CNB028109104A 2001-06-01 2002-05-30 接触装置 Expired - Lifetime CN100511677C (zh)

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CN102956570A (zh) * 2011-08-17 2013-03-06 Abb技术有限公司 母座、功率半导体模块以及具有多个功率半导体模块的半导体模块组装件
CN102956570B (zh) * 2011-08-17 2017-06-23 Abb 技术有限公司 母座、功率半导体模块以及具有多个功率半导体模块的半导体模块组装件

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CN100511677C (zh) 2009-07-08
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DE50214290D1 (de) 2010-04-29
EP1393375A1 (de) 2004-03-03
WO2002097885A1 (de) 2002-12-05
EP1393375B1 (de) 2010-03-17
JP2004527919A (ja) 2004-09-09
US20040145050A1 (en) 2004-07-29
EP1263046A1 (de) 2002-12-04
RU2003137843A (ru) 2005-02-27
JP4266814B2 (ja) 2009-05-20

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