CN110829069A - 连接器及其组合 - Google Patents

连接器及其组合 Download PDF

Info

Publication number
CN110829069A
CN110829069A CN201911021215.0A CN201911021215A CN110829069A CN 110829069 A CN110829069 A CN 110829069A CN 201911021215 A CN201911021215 A CN 201911021215A CN 110829069 A CN110829069 A CN 110829069A
Authority
CN
China
Prior art keywords
conductive
elastic arms
groups
terminals
connector
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201911021215.0A
Other languages
English (en)
Other versions
CN110829069B (zh
Inventor
郑善雍
周志贤
廖芳竹
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Foxconn Interconnect Technology Ltd
Original Assignee
Foxconn Interconnect Technology Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Foxconn Interconnect Technology Ltd filed Critical Foxconn Interconnect Technology Ltd
Publication of CN110829069A publication Critical patent/CN110829069A/zh
Application granted granted Critical
Publication of CN110829069B publication Critical patent/CN110829069B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02Contact members
    • H01R13/22Contacts for co-operating by abutting
    • H01R13/24Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2464Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the contact point
    • H01R13/2492Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the contact point multiple contact points
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70Coupling devices
    • H01R12/71Coupling devices for rigid printing circuits or like structures
    • H01R12/712Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/714Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02Contact members
    • H01R13/22Contacts for co-operating by abutting
    • H01R13/24Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2457Contacts for co-operating by abutting resilient; resiliently-mounted consisting of at least two resilient arms contacting the same counterpart
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/40Securing contact members in or to a base or case; Insulating of contact members
    • H01R13/405Securing in non-demountable manner, e.g. moulding, riveting
    • H01R13/41Securing in non-demountable manner, e.g. moulding, riveting by frictional grip in grommet, panel or base
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/46Bases; Cases
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/646Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
    • H01R13/6461Means for preventing cross-talk
    • H01R13/6471Means for preventing cross-talk by special arrangement of ground and signal conductors, e.g. GSGS [Ground-Signal-Ground-Signal]
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/11Printed elements for providing electric connections to or between printed circuits
    • H05K1/111Pads for surface mounting, e.g. lay-out
    • H05K1/112Pads for surface mounting, e.g. lay-out directly combined with via connections
    • H05K1/113Via provided in pad; Pad over filled via
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/14Structural association of two or more printed circuits
    • H05K1/144Stacked arrangements of planar printed circuit boards
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70Coupling devices
    • H01R12/71Coupling devices for rigid printing circuits or like structures
    • H01R12/72Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
    • H01R12/73Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04Assemblies of printed circuits
    • H05K2201/042Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/0929Conductive planes
    • H05K2201/093Layout of power planes, ground planes or power supply conductors, e.g. having special clearance holes therein
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/09372Pads and lands
    • H05K2201/09418Special orientation of pads, lands or terminals of component, e.g. radial or polygonal orientation
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10189Non-printed connector
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227Other objects, e.g. metallic pieces
    • H05K2201/10265Metallic coils or springs, e.g. as part of a connection element
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227Other objects, e.g. metallic pieces
    • H05K2201/1031Surface mounted metallic connector elements
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

Abstract

一种连接器及其组合,所述连接器包括绝缘本体以及设于所述绝缘本体上的若干导电端子;所述绝缘本体设有若干上下贯穿以收容所述导电端子的端子槽;所述导电端子沿左右方向排布形成若干排,并沿垂直于左右方向的前后方向排布形成若干列,从上下方向看,每一列导电端子呈Z字型方式排列,所述导电端子设有收容在对应端子槽内的主体部以及分别自所述主体部的上下两端倾斜延伸的至少两组弹性臂,以增加导电端子的面积,降低导电端子传输电源时的接触阻抗。

Description

连接器及其组合
【技术领域】
本发明涉及一种连接器及其组合,尤其涉及一种用于传输电源的连接器及其组合。
【背景技术】
请参阅图1-11所示的相关现有技术,该连接器组合10包括一对上下平行间隔设置的电路板(PCB)200以及夹持在该对电路板200之间的连接器100。所述连接器100包括绝缘本体110以及设于所述绝缘本体110上的若干导电端子120。所述绝缘本体110设有若干沿上下方向Z贯穿所述绝缘本体110的端子槽112,该等端子槽112沿左右方向X排布成若干排,并且沿垂直于左右方向X的前后方向Y排布成若干列,从上下方向上看,每一列端子槽112呈Z字形方式排列。每一所述导电端子120设有收容在对应端子槽112内的主体部122以及分别自主体部122的上下两端同时倾斜延伸的弹性臂126,所述主体部122的两侧设有与端子槽112干涉配合的倒钩124。
所述每一电路板200均为沿上下方向均呈堆叠的五层设置。以位于上方的电路板200为例,其包括位于底部的第一绝缘层202,位于中间的第二绝缘层204以及位于顶部的第三绝缘层206。所述第一、第二绝缘层202、204之间设有一层金属导电的电源(Vbus)层208,所述第二、第三绝缘层204、206之间设有一层金属导电的接地层210。所述第一绝缘层202的下表面设有若干与导电端子120的弹性臂126对接配合的导电片220。所述第一绝缘层202设有若干上下贯穿的第一导电通孔222以电性连接相应的导电片220和电源层208。所述第一、第二绝缘层202、204均设有若干上下贯穿的第二导电通孔224以电性连接相应的导电片220和接地层210。所述第一绝缘层202的上方设有若干向上突伸的突出部203,所述电源层208设有若干收容对应突出部203的开口209,所述第二导电通孔224沿上下方向贯穿对应的突出部203。
所述导电端子120包括沿左右方向彼此交替排列的多列电源端子120P和多列接地端子120G,其中每列电源端子120P和每列接地端子120G均呈Z字型方式排布。在该现有技术中,每一排导电端子120中相邻的电源端子120P与接地端子120G之间形成的间距为P1,而相邻的两电源端子120P的之间所形成的间距为P2,其中P2为P1的两倍,而在相邻两排的导电端子120中,相邻的电源端子120P与接地端子120G之间形成的间距为P3,其中,P3为P1的一半,该等排布方式不仅无法提升导电端子120及电路板200导电片200的排布密度,进而不利于连接器100及电路板200的小型化发展趋势,而且间隔设置的电源端子120P,在进行更高电流的电源传输时,将会使得连接器100的整体电阻变高,进而使得连接器100的导电性能变差。
因此,有必要提供一种改良的连接器及其组合来解决以上的问题。
【发明内容】
本发明的主要目的在于提供一种提升导电性能的连接器及其组合。
为实现上述目的,本发明采用以下技术方案:一种连接器,包括绝缘本体以及设于所述绝缘本体上的若干导电端子;所述绝缘本体设有若干上下贯穿以收容所述导电端子的端子槽;所述导电端子沿左右方向排布形成若干排,并沿垂直于左右方向的前后方向排布形成若干列,从上下方向看,每一列导电端子呈Z字型方式排列,所述导电端子设有收容在对应端子槽内的主体部以及分别自所述主体部的上下两端倾斜延伸的至少两组弹性臂。
为实现上述目的,本发明还可采用以下技术方案:一种连接器组合,包括一对上下平行间隔设置的电路板以及夹持在该对电路板之间的连接器;所述每一电路板设有若干导电片;所述连接器包括绝缘本体以及设于所述绝缘本体的若干导电端子,其中,至少一导电端子设有至少两组向上倾斜延伸并与位于上方电路板的同一导电片接触配合的弹性臂以及至少两组向下倾斜延伸并与位于下方电路板的同一导电片接触配合的弹性臂。
与现有技术相比,本发明连接器及其组合中的导电端子通过设置至少两组弹性臂与电路板上的同一导电片接触配合,从而增加了导电端子的面积,降低导电端子传输电源时的接触阻抗,提升了连接器的导电性能,并且本发明可增加导电端子弹性臂的排布密度,符合连接器的小型化发展趋势。
【附图说明】
图1是现有技术的电路板的立体图。
图2是1另一角度的立体图。
图3是图1的立体分解图。
图4是图3另一角度的立体分解图。
图5是现有技术中连接器组合的立体图。
图6是图5另一角度的立体图。
图7是图5中连接器的俯视图。
图8是图5中连接器的立体分解图。
图9是图5连接器组合的剖视图。
图10是图1所示电路板的第一、第二导电通孔排布示意图。
图11是本发明的电路板的立体图。
图12是11另一角度的立体图。
图13是图11的立体分解图。
图14是图13另一角度的立体分解图。
图15是本发明连接器组合的立体图。
图16是图15另一角度的立体图。
图17是图15中连接器的俯视图。
图18是图15中连接器的立体分解图。
图19是图18另一角度的立体分解图。
图20是图15连接器组合的剖视图。
图21是图12所示电路板的第一、第二导电通孔排布示意图。
图22是本发明与现有技术电路板的导电片排布比对示意图。
图23是本发明另一实施例的连接器的立体分解图。
【主要元件符号说明】
连接器组合 10、20 连接器 100、500
绝缘本体 110、502 端子槽 112、504
导电端子 120、510 主体部 122、512
倒钩 124、514 弹性臂 126、516
外弹性臂 516a 内弹性臂 516b
臂部 516c 电源端子 120P、510P
接地端子 120G、510G 间距 S1、S2、P1、P2、P3
电路板 200、600 第一绝缘层 202、602
导电片 220、620 电源导电片 220P、620P
接地导电片 220G、620G 突出部 203、630
第一导电通孔 222、622 第二导电通孔 224、624
第二绝缘层 204、604 开口 209、632
第三绝缘层 206、606 电源层 208、608
接地层 210、610 绝缘块 511
第一间距 P5 第二间距 P6
第三间距 P7
如下具体实施方式将结合上述附图进一步说明本发明。
【具体实施方式】
为便于更好的理解本发明的目的、结构、特征以及功效等,现结合附图和具体实施方式对本发明作进一步说明。
请参阅图15-16所示本发明的连接器组合20,该连接器组合20包括一对上下平行间隔设置的电路板(PCB)600以及夹持在该对电路板600之间的连接器500。
请参阅图17-19所示,所述连接器500包括绝缘本体502以及设于所述绝缘本体502上的若干导电端子510。所述绝缘本体502设有若干上下贯穿的端子槽504,该等端子槽504沿左右方向X排布形成若干排,并且沿垂直于左右方向X的前后方向Y排布形成若干列,从上下方向Z看,每一列端子槽504呈Z字型方式排列,而每一端子槽50则沿左右方向X呈纵长设置。每一所述导电端子510设有收容在对应端子槽504内的主体部512以及分别自主体部512的上下两端朝前倾斜延伸的三组弹性臂516,所述主体部512的左右两侧设有与端子槽504干涉配合的倒钩514。因此,所述导电端子510沿左右方向X排布形成若干排,并且沿垂直于左右方向X的前后方向Y排布形成若干列,从上下方向Z看,每一列导电端子510呈Z字型方式排列。
所述三组弹性臂516沿左右方向X对齐设置,包括两组位于外侧的外弹性臂516a以及一组沿左右方向X位于该两组外弹性臂516a之间的内弹性臂516b,每组弹性臂516包括两个间隔设置的臂部516c,在其他实施例中,每组弹性臂516也可以包括三个及以上间隔设置的臂部516c。每一导电端子510的内弹性臂516a与外弹性臂516b之间形成第一间距P5,每一排导电端子510中相邻两导电端子510的相邻两组外弹性臂516a之间形成第二间距P6,所述第二间距P6为所述第一间距P5的两倍。在其他实施例中,所述第二间距P6也可以大于第一间距P5的两倍,如第二间距P6为第一间距P5的2.5倍或3倍,也可以说所述第一间距P5小于或等于所述第二间距P6的一半。所述相邻两排导电端子510中相邻两导电端子510的相邻两组外弹性臂516a之间沿左右方向形成第三间距P7,所述第三间距P7等于第一间距P5。在本发明的其他实施例中,所述每一导电端子510也可设置两组所述弹性臂516。
每一排导电端子510包括依次交替排列的电源端子510P和接地端子510G,并且所述每一列导电端子510对应均为电源端子510P或接地端子510G。
请参阅图11-14所示,所述上下设置的电路板600沿上下方向均呈堆叠的五层设置。在本实施例中,位于下方的电路板600为母电路板,如市场上常见的主机板,而位于上方的电路板600为子电路板,如市场上常见的芯片模块或集成电路。其中,以位于上方的电路板600为例,其包括位于底部的第一绝缘层602,位于中间的第二绝缘层604以及位于顶部的第三绝缘层606。所述第一、第二绝缘层602、604之间设有一层金属导电的电源(Vbus)层608,所述第二、第三绝缘层604、606之间设有一层金属导电的接地层610。所述第一绝缘层602的下表面设有若干与导电端子510对接配合的导电片620。所述第二绝缘层604沿上下方向的厚度大于所述第一、第三绝缘层602、606。所述第一绝缘层602设有若干向上贯穿其上表面的第一导电通孔622以电性连接相应的导电片620和电源层608。所述第一、第二绝缘层602、604均设有第二导电通孔624以电性连接相应的导电片620和接地层610。所述第一绝缘层602的上方设有若干向上突伸的突出部630,所述电源层608设有若干收容对应突出部630的开口632,所述第一绝缘层602的第二导电通孔624沿上下方向贯穿对应的突出部630。由于第一绝缘层602的第二导电通孔624设置在收容在开口632内的突出部632上,因而第一绝缘层602的第二导电通孔624不会与电源层608相接触,并且所述第一绝缘层602的第二导电通孔624向上贯穿突出部630进而与第二绝缘层604的第二导电通孔624连接,从而达成电性接对应接地层610与导电片620的作用。
请参阅图23所示本发明与现有技术中的电路板600、200上导电片620、220的比对分析图。在现有技术中,电路板200上的导电片220包括与电源端子120P对应接触配合的电源导电片220P以及与接地端子120G对应接触配合的接地导电片220G,该等电源导电片220P通过第一导电通孔222连接至电源层208,该等接地导电片220G通过第二导电通孔224连接至接地层210。本发明通过对现有技术进行改良后,将电源导电片620P及接地导电片620G的面积分别扩大为现有技术的电源导电片220P及接地导电片220G的三倍;并且每一电源导电片620P设置三个第一导电通孔622,每一接地导电片620G设置三个第二导电通孔624,从而可大幅降低接触电阻,提升电路板600导电性能。从图示上可以明显看出,在同样的区域内,现有技术的电路板200设有依次为电源导电片220P及接地导电片220G交替排列的六列导电片220,而本发明仅设有三列导电片620,依次为电源导电片620P、接地导电片620G、电源接地片620P,因此本发明的电路板600在同样的区域面积内相对现有技术可以大大减少导电片600的排布数量,降低电路板600的制造难度及制造成本。另外,现有技术中,假设每一排导电片220中相邻的两电源导电片220P及接地导电片220G对应的第一、第二导电通孔222、224之间的间距为S1,本发明每一排导电片620中相邻的两电源导电片620P及接地导电片620G对应的相邻第一、第二导电通孔622、624之间的间距同样为S1,而每一电源导电片620P或接地导电片620G对应设置三个第一导电通孔622或第二导电通孔624,假设每一导电片620上的相邻两个导电通孔622、624之间的间距为S2,则间距S1为间距S2的两倍,因此,本发明电路板600上第一、第二导电通孔622、624的排布密度高于现有技术,电路板600在进行电源传输时,接触电阻将会大幅降低,进而使得导电性能得到提升。
本发明连接器500中每一导电端子510的三组弹性臂516与电路板600上的同一导电片620接触配合,从而增加了导电端子510的面积,降低导电端子510传输电源时的接触阻抗,同时,每一导电端子510的相邻两组弹性臂516之间所形成的第一间距P5为每一排导电端子510中相邻两导电端子510的相邻两弹性臂516之间形成的第二间距P6的一半,如此设置,可增加导电端子弹性臂516的排布密度,有利于连接器500的小型化。
请参阅图23所示本发明另一实施例的连接器,与上述连接器500不同的是,本发明的连接器还包括一固定导电端子的绝缘块511,导电端子固定在绝缘块511上一起形成端子模组后在组装至绝缘本体的端子槽内,该结构可以对导电端子进行更好的定位,并且增加连接器的整体结构强度。
以上仅为本发明的较佳实施例而已,不应以此限制本发明的范围。即凡是依本发明权利要求书及本发明说明书内容所作的简单的等效变化与修饰,皆应仍属本发明专利涵盖的范围内。

Claims (10)

1.一种连接器,包括绝缘本体以及设于所述绝缘本体上的若干导电端子;所述绝缘本体设有若干上下贯穿以收容所述导电端子的端子槽;所述导电端子沿左右方向排布形成若干排,并沿垂直于左右方向的前后方向排布形成若干列,其特征在于:从上下方向看,每一列导电端子呈Z字型方式排列,所述导电端子设有收容在对应端子槽内的主体部以及分别自所述主体部的上下两端倾斜延伸的至少两组弹性臂。
2.如权利要求1所述的连接器,其特征在于:同一所述导电端子的相邻两组弹性臂之间所形成第一间距,每一排导电端子中相邻两导电端子的相邻两组弹性臂之间形成第二间距,所述第一间距小于或等于所述第二间距的一半。
3.如权利要求2所述的连接器,其特征在于:位于上下两端的所述弹性臂均呈三组设置,并且每组弹性臂设有至少两个设置的臂部,所述三组弹性臂沿左右方向对齐设置,并且同时朝前倾斜延伸。
4.如权利要求3所述的连接器,其特征在于:所述三组弹性臂包括两组位于外侧的外弹性臂以及一组沿左右方向位于该两组外弹性臂之间的内弹性臂;所述一组内弹性臂与两组外弹性臂之间均形成第一间距。
5.如权利要求4所述的连接器,其特征在于:所述相邻两排导电端子中相邻两导电端子的相邻两组外弹性臂之间沿左右方向形成第三间距,所述第三间距等于第一间距。
6.如权利要求5所述的连接器,其特征在于:每一排所述导电端子包括依次交替排列的电源端子和接地端子,并且所述每一列导电端子对应均为电源端子或接地端子。
7.一种连接器组合,包括一对上下平行间隔设置的电路板以及夹持在该对电路板之间的连接器;所述每一电路板设有若干导电片;所述连接器包括绝缘本体以及设于所述绝缘本体的若干导电端子,其特征在于:至少一导电端子设有至少两组向上倾斜延伸并与位于上方电路板的同一导电片接触配合的弹性臂以及至少两组向下倾斜延伸并与位于下方电路板的同一导电片接触配合的弹性臂。
8.如权利要求7所述的连接器组合,其特征在于:所述导电端子沿左右方向排布形成若干排,并沿垂直于左右方向的前后方向排布形成若干列,从上下方向看,每一列导电端子呈Z字型方式排列,所述导电端子中向上及向下倾斜延伸的所述弹性臂均呈三组设置,并且每组弹性臂设有至少两个间隔设置的臂部,所述三组弹性臂均与位于上方或下方电路板的对应同一导电片接触配合,所述三组弹性臂沿左右方向对齐设置,并包括两组位于外侧的外弹性臂以及一组沿左右方向位于该两组外弹性臂之间的内弹性臂;所述同一导电端子的一组内弹性臂与两组外弹性臂之间均形成第一间距,同一排导电端子中相邻两导电端子的相邻两组外弹性臂之间形成第二间距,所述第一间距小于或等于所述第二间距的一半。
9.如权利要求8所述的连接器组合,其特征在于:所述导电端子包括电源端子和接地端子;所述位于上方及下方的电路板均包括上下间隔设置的第一绝缘层、第二绝缘层以及第三绝缘层;所述第一、第二绝缘层之间设有一层电源层,所述第二、第三绝缘层之间设有一层接地层;所述导电片设置在所述第一绝缘层的表面,并包括与电源端子对应接触配合的电源导电片以及与接地端子对应接触配合的接地导电片;所述第一绝缘层设有若干第一导电通孔以电性连接相应的电源导电片和电源层,所述第一、第二绝缘层均设有第二导电通孔以电性连接相应的接地导电片和接地层;所述第一绝缘层设有若干向电源层突伸的突出部,所述电源层设有若干收容对应突出部的开口,所述第一绝缘层的第二导电通孔沿上下方向贯穿对应的突出部。
10.如权利要求9所述的连接器组合,其特征在于:所述每一电源导电片对应设置三个所述第一导电通孔,所述每一接地导电片对应设置三个所述第二导电通孔。
CN201911021215.0A 2018-11-01 2019-10-25 连接器及其组合 Active CN110829069B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201862753946P 2018-11-01 2018-11-01
US62/753946 2018-11-01

Publications (2)

Publication Number Publication Date
CN110829069A true CN110829069A (zh) 2020-02-21
CN110829069B CN110829069B (zh) 2023-07-18

Family

ID=69550792

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201911021215.0A Active CN110829069B (zh) 2018-11-01 2019-10-25 连接器及其组合

Country Status (2)

Country Link
US (1) US11050173B2 (zh)
CN (1) CN110829069B (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN211605463U (zh) * 2020-01-07 2020-09-29 番禺得意精密电子工业有限公司 电连接器
CN114597712A (zh) * 2020-08-14 2022-06-07 富士康(昆山)电脑接插件有限公司 芯片电连接器

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62293744A (ja) * 1986-06-10 1987-12-21 アンプ インコ−ポレ−テツド 電気ソケット
TWM358429U (en) * 2008-09-01 2009-06-01 Hon Hai Prec Ind Co Ltd Electrical connector
CN201440492U (zh) * 2009-05-25 2010-04-21 富士康(昆山)电脑接插件有限公司 电连接器

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4726777A (en) * 1986-06-10 1988-02-23 Amp Incorporated Socket for zig-zag inline package
JP2513017Y2 (ja) * 1990-07-30 1996-10-02 株式会社アドバンテスト 高周波多極コネクタ
US6585540B2 (en) * 2000-12-06 2003-07-01 Pulse Engineering Shielded microelectronic connector assembly and method of manufacturing
CN100470964C (zh) 2005-12-27 2009-03-18 富士康(昆山)电脑接插件有限公司 电连接器
TWI336544B (en) 2006-06-05 2011-01-21 Hon Hai Prec Ind Co Ltd Electrical connector
JP4862796B2 (ja) * 2007-09-28 2012-01-25 山一電機株式会社 高速伝送用高密度コネクタ
TWM348350U (en) 2008-04-21 2009-01-01 Hon Hai Prec Ind Co Ltd Electrical connector
KR101594616B1 (ko) * 2009-06-18 2016-02-16 엘지디스플레이 주식회사 백라이트 유닛 및 이를 구비한 액정표시장치
US9544992B2 (en) * 2013-01-29 2017-01-10 Fci Americas Technology Llc PCB having offset differential signal routing
JP6536792B2 (ja) * 2015-03-25 2019-07-03 セイコーエプソン株式会社 超音波センサー及びその製造方法
WO2017111855A1 (en) * 2015-12-26 2017-06-29 Intel Corporation Microprocessor package with first level die bump ground webbing structure

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62293744A (ja) * 1986-06-10 1987-12-21 アンプ インコ−ポレ−テツド 電気ソケット
US4726776A (en) * 1986-06-10 1988-02-23 Amp Incorporated Socket for zig-zag inline package
TWM358429U (en) * 2008-09-01 2009-06-01 Hon Hai Prec Ind Co Ltd Electrical connector
CN201440492U (zh) * 2009-05-25 2010-04-21 富士康(昆山)电脑接插件有限公司 电连接器

Also Published As

Publication number Publication date
US11050173B2 (en) 2021-06-29
TW202025558A (zh) 2020-07-01
CN110829069B (zh) 2023-07-18
US20200144747A1 (en) 2020-05-07

Similar Documents

Publication Publication Date Title
CA1236187A (en) Backplane-daughter board connector
US6394822B1 (en) Electrical connector
US6537087B2 (en) Electrical connector
US6152747A (en) Electrical connector
US6183301B1 (en) Surface mount connector with integrated PCB assembly
CN2571026Y (zh) 背板连接器
EP0757851B1 (en) Conductive shroud for electrical connectors
US6431914B1 (en) Grounding scheme for a high speed backplane connector system
US8932080B2 (en) Electrical connector with improved shielding means
CN110994230B (zh) 电连接器
US6500029B2 (en) Connector easy in wire connection and improved in transmission characteristic
US9048591B2 (en) Electrical connector having a grounding plate for shielding
JPH0636382B2 (ja) 電気コネクター
US6908313B2 (en) Electrical socket having terminals with elongated mating beams
US20140057497A1 (en) Connector
US7059907B2 (en) Modular electrical connector
CN112701511B (zh) 电连接器
KR101462523B1 (ko) 커넥터
CN110829069B (zh) 连接器及其组合
US6663445B1 (en) Electrical connector with staggered contacts
US11387607B2 (en) Electrical connector assembly and interconnect device
JP2002134861A (ja) フレキシブル配線基板
CN112186387B (zh) 电连接器
US20100029101A1 (en) Low-profile cable assembly and its complementary connector
TW202213878A (zh) 電連接器組合

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant