CN1512600A - 发光二极管灯 - Google Patents

发光二极管灯 Download PDF

Info

Publication number
CN1512600A
CN1512600A CNA021599874A CN02159987A CN1512600A CN 1512600 A CN1512600 A CN 1512600A CN A021599874 A CNA021599874 A CN A021599874A CN 02159987 A CN02159987 A CN 02159987A CN 1512600 A CN1512600 A CN 1512600A
Authority
CN
China
Prior art keywords
light
reflector
wick
emitting diode
axis
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA021599874A
Other languages
English (en)
Inventor
赵宏图
赵宏伟
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to CNA021599874A priority Critical patent/CN1512600A/zh
Priority to JP2004562446A priority patent/JP2006512752A/ja
Priority to EP03709566A priority patent/EP1589589A4/en
Priority to AU2003221278A priority patent/AU2003221278A1/en
Priority to US10/540,937 priority patent/US20060243994A1/en
Priority to PCT/CN2003/000139 priority patent/WO2004059749A1/zh
Publication of CN1512600A publication Critical patent/CN1512600A/zh
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S43/00—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights
    • F21S43/10—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by the light source
    • F21S43/13—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by the light source characterised by the type of light source
    • F21S43/14—Light emitting diodes [LED]
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
    • F21W2102/00—Exterior vehicle lighting devices for illuminating purposes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48095—Kinked
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)

Abstract

一种发光二极管灯，它具有发光角小，发光强度高等特点。它由一个含有一个或多个发光二极管芯片组的灯芯和一个反光碗组成。每个发光二极管芯片组至少含一只发光二极管芯片，灯芯上的发光二极管芯片的发光面对着反光碗的反光面，与反光碗的轴线成0－30度角。反光碗由一个或多个抛物面形反光镜组成，抛物面的轴线与反光碗的轴线平行且以反光碗的轴线为中心等距离均匀分布，每个发光二极管芯片组对应一个抛物面形反光镜，且位于抛物面形反光镜的焦点处。

Description

发光二极管灯
本发明涉及一种发光二极管灯，它具有较小的发光角和较高的光利用率。
发光二极管具有寿命长、体积小、重量轻等优点，作为一种新型光源已在显示、照明等各个领域取得越来越广泛的应用。在实际应用中，多数场合下要求发光二极管灯具有较高的亮度和较小的发光角。由于发光二极管芯片为面发光源，其发光强度接近余弦分布，且发光角度较大，因此在实际使用时均采用各种方式封装后方可使用。
采用现有封装方式的发光二极管灯剖面图如图1所示，其中101为发光二极管灯的正极引脚，102为发光二极管灯的负极引脚，并在其上端含有一个凹形反射器，103为发光二极管芯片，它处于凹形反射器内，104为环氧树脂封装，它的顶部形成一球面聚光透镜104，该透镜的曲率半径为r，透镜焦点到球面顶点的距离为f。为了使光线以较小的角度出射，发光二极管芯片103位于球面透镜的焦点上，根据焦距公式：f＝r*n2/(n2-n1)，其中n2为环氧树脂的折射率约为1.5，n1为空气的折射率约为1，则f等于r的3倍，因此从发光二极管芯片发出的小于30度角的光才以聚光镜焦点的位置透过聚光镜以接近0度的发光角射出。在要求小于3度发光角的时候，其光的利用率小于30％。
为克服现有发光二极管灯在要求小的发光角时光的利用率低，发光强度较小的缺点，本发明提供了一种新的发光二极管灯的封装方法，该方法使封装后的发光二极管灯可作为平行光源或小角度光源，且具有较高的光强度，可广泛应用于汽车灯、投影机光源、照明光源等各领域。
本发明依据的原理是：由抛物面焦点发出的光经抛物面反射后，以平行于抛物面轴线的方向出射。将发光二极管芯片置于抛物面形反光镜的焦点上，并使其发光面对着反光镜与反光碗的轴线成0-30度角，则由芯片发出的光除少部分从反光镜的开口处直接逸出外，其余的光经反光镜反射后平行于抛物面轴线，从而使其发光角接近于0度，光的利用率高。由于发光二极管芯片不是点光源，而是面发光源，为提高反光碗的利用率，可将多个发光二极管沿正多边形排列，发光面向外，按此方式构成的灯芯的发光角为360度，在不增加灯的体积的情况下，提高了灯的光强度。将多个发光二极管沿正多边形排列所构成的灯芯的体积较大，已不可视为点光源，因此将抛物面形反光碗分为多个抛物面，使每个发光二极管芯片对应一个抛物面的焦点。在反光碗较大时，上述单只发光二极管芯片可由多个芯片组成，而对抛物面形反光碗来讲，仍可视为点光源。
采用本发明的一个实施例如下：
图2A和图2B为其纵剖图和横剖图。
反光碗的制备：反光碗由4个抛物面形反射镜(202)组成，抛物线方程为y2＝8x，高度为8mm，各反光镜抛物面的轴线距离反光碗的轴线0.5mm，并呈对称分布，在反光碗的底部以反光碗轴线为中心开有直径2mm的孔。
灯芯的制备：将四个1×6mm厚度为0.2mm的单面印刷电路板用树脂胶分别粘在1×1mm高度为×10mm的铜质四棱柱的四个侧面上，棱柱的上下两端各露出2mm形成灯芯基体，把四只0.3×0.3的发光二极管芯片用银浆分别固化在灯芯基体的四个侧面距离顶端1mm处，将芯片正极用金丝绑定在灯芯基体的印刷电路板上，制成灯芯。
将灯芯穿过底部的孔进入反光碗，并调整灯芯的位置使每个发光二极管芯片都处于与其对应的抛物面形反光碗的焦点上。
以上制成的发光二极管灯在要求小于3度发散角的情况下其效率可达80％以上。

Claims (4)

1.一种发光二极管灯，由一个含有发光二极管芯片的灯芯和一个反光碗组成。其特征在于：
灯芯上的发光二极管芯片的发光面正对反光碗的反光面，与反光碗的轴线成0-30度角。
2.如权利要求1所述的发光二极管灯，其特征是：灯芯由一个正棱柱形的灯芯基体和一个或多个发光二极管芯片组构成，每个发光二极管芯片组位于灯芯基体的一个侧面，灯芯基体由相互绝缘的两层导电层组成。
3.如权利要求1所述的发光二极管灯，其特征是：反光碗由一个或多个抛物面形反光镜组成，抛物面的轴线与反光碗的轴线平行且以反光碗的轴线为中心等距离均匀排列。
4.如权利要求1、2、3所述的发光二极管灯，其特征是：每个发光二极管芯片组对应一个抛物面形反光镜，且位于抛物面形反光镜的焦点处。
CNA021599874A 2002-12-31 2002-12-31 发光二极管灯 Pending CN1512600A (zh)

Priority Applications (6)

Application Number Priority Date Filing Date Title
CNA021599874A CN1512600A (zh) 2002-12-31 2002-12-31 发光二极管灯
JP2004562446A JP2006512752A (ja) 2002-12-31 2003-02-21 発光ダイオードランプとその製造方法
EP03709566A EP1589589A4 (en) 2002-12-31 2003-02-21 Light-emitting diode lamp and method of making same
AU2003221278A AU2003221278A1 (en) 2002-12-31 2003-02-21 Light emitting diode lamp and manufacturing method thereof
US10/540,937 US20060243994A1 (en) 2002-12-31 2003-02-21 Light emitting diode lamp and manufacturing method thereof
PCT/CN2003/000139 WO2004059749A1 (en) 2002-12-31 2003-02-21 Light emitting diode lamp and manufacturing method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNA021599874A CN1512600A (zh) 2002-12-31 2002-12-31 发光二极管灯

Publications (1)

Publication Number Publication Date
CN1512600A true CN1512600A (zh) 2004-07-14

Family

ID=32661104

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA021599874A Pending CN1512600A (zh) 2002-12-31 2002-12-31 发光二极管灯

Country Status (6)

Country Link
US (1) US20060243994A1 (zh)
EP (1) EP1589589A4 (zh)
JP (1) JP2006512752A (zh)
CN (1) CN1512600A (zh)
AU (1) AU2003221278A1 (zh)
WO (1) WO2004059749A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102563426A (zh) * 2012-01-13 2012-07-11 兰普电器有限公司 一种led反光灯

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007184319A (ja) * 2006-01-04 2007-07-19 Showa Denko Kk 半導体発光装置
WO2007077960A1 (en) * 2006-01-04 2007-07-12 Showa Denko K.K. Semiconductor light-emitting device
JP2010506348A (ja) * 2006-10-19 2010-02-25 パナソニック株式会社 発光装置とこれを用いた表示装置及び照明装置
CN201053628Y (zh) * 2007-05-30 2008-04-30 鹤山丽得电子实业有限公司 一种尖头led
FR2932493B1 (fr) 2008-06-11 2010-07-30 Arkema France Compositions a base d'hydrofluoroolefines
CN102779931B (zh) * 2012-07-17 2014-09-17 福建鸿博光电科技有限公司 偏光led支架、灯珠及偏光led支架制造方法
CN108534091A (zh) * 2018-05-10 2018-09-14 华域视觉科技(上海)有限公司 具有立体点灯效果的车灯及汽车

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3821775A (en) * 1971-09-23 1974-06-28 Spectronics Inc Edge emission gaas light emitter structure
JPS5882581A (ja) * 1981-11-11 1983-05-18 Kimura Denki Kk Ｌｅｄランプ
DE8713875U1 (zh) * 1987-10-15 1988-02-18 Siemens Ag, 1000 Berlin Und 8000 Muenchen, De
US5001609A (en) * 1988-10-05 1991-03-19 Hewlett-Packard Company Nonimaging light source
US4964025A (en) * 1988-10-05 1990-10-16 Hewlett-Packard Company Nonimaging light source
JPH066397A (ja) * 1992-03-13 1994-01-14 Nippon Telegr & Teleph Corp <Ntt> 遅延検波器
DE9206859U1 (zh) * 1992-05-20 1992-09-03 Franz, H. G., 2000 Hamburg, De
JPH06216411A (ja) * 1993-01-20 1994-08-05 Rohm Co Ltd Ｌｅｄランプ
JPH077185A (ja) * 1993-06-15 1995-01-10 Stanley Electric Co Ltd Ｌｅｄ発光ユニット
US6080464A (en) * 1995-11-20 2000-06-27 Heraeus Med Gmbh Reflector for a radiating luminous source and use of the same
CN1156908A (zh) * 1996-02-09 1997-08-13 葛一萍 发光二极管
JPH09265807A (ja) * 1996-03-29 1997-10-07 Toshiba Lighting & Technol Corp Ｌｅｄ光源，ｌｅｄ信号灯および信号機
DE19624087A1 (de) * 1996-06-17 1997-12-18 Wendelin Pimpl Beleuchtungsvorrichtung
JP2000269551A (ja) * 1999-03-18 2000-09-29 Rohm Co Ltd チップ型発光装置
US6454433B1 (en) * 2001-05-24 2002-09-24 Eveready Battery Company, Inc. Dual faceted reflector
TW507858U (en) * 2001-07-23 2002-10-21 Lin Chau Tang Energy saving lighting device with high illumination
US6682211B2 (en) * 2001-09-28 2004-01-27 Osram Sylvania Inc. Replaceable LED lamp capsule
US20030103348A1 (en) * 2001-11-30 2003-06-05 Sheng-Tien Hung Projection lamp
US6644841B2 (en) * 2002-03-01 2003-11-11 Gelcore Llc Light emitting diode reflector
US7048412B2 (en) * 2002-06-10 2006-05-23 Lumileds Lighting U.S., Llc Axial LED source
US6851835B2 (en) * 2002-12-17 2005-02-08 Whelen Engineering Company, Inc. Large area shallow-depth full-fill LED light assembly

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102563426A (zh) * 2012-01-13 2012-07-11 兰普电器有限公司 一种led反光灯

Also Published As

Publication number Publication date
US20060243994A1 (en) 2006-11-02
WO2004059749A1 (en) 2004-07-15
EP1589589A1 (en) 2005-10-26
AU2003221278A1 (en) 2004-07-22
EP1589589A4 (en) 2007-09-05
JP2006512752A (ja) 2006-04-13

Similar Documents

Publication Publication Date Title
US9255689B2 (en) Optical lens and light source module having the same
US9841162B2 (en) Lighting device with multiple-region reflector
US9004724B2 (en) Reflector (optics) used in LED deco lamp
KR101981717B1 (ko) 조명 장치
US8419226B2 (en) LED unit
US8231248B2 (en) LED unit
US8591079B2 (en) LED ceiling lamp
US20090279311A1 (en) Illumination device
US20020196620A1 (en) Led flashlight with lens
US8308321B2 (en) LED unit
US8269243B2 (en) LED unit
JP6442199B2 (ja) 発光素子パッケージ
US9388963B2 (en) Optical lens assembly and light source module having the same
CN107062025A (zh) 一种led可变角度准直发光系统
CN1604346A (zh) 新型准直发光二极管封装结构
KR101147322B1 (ko) 반도체 발광장치, 반도체 발광모듈 및 조명장치
CN1512600A (zh) 发光二极管灯
JP2011040196A (ja) Ｌｅｄ照明装置、街路灯及びｌｅｄ照明用リフレクタ
JP2001044515A (ja) 光学媒体、発光体及び照明器具
US20150103534A1 (en) Optical lens and light source module having the same
US20110031518A1 (en) Led device
EP2461082B1 (en) Omnidirectional LED lamp
US20110110101A1 (en) Led unit
US9476572B2 (en) Optical lens assembly and light source module having the same
US20150184828A1 (en) Optical lens and light source module having the same

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication