CN201053628Y - 一种尖头led - Google Patents

一种尖头led Download PDF

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Publication number
CN201053628Y
CN201053628Y CNU2007200522191U CN200720052219U CN201053628Y CN 201053628 Y CN201053628 Y CN 201053628Y CN U2007200522191 U CNU2007200522191 U CN U2007200522191U CN 200720052219 U CN200720052219 U CN 200720052219U CN 201053628 Y CN201053628 Y CN 201053628Y
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CN
China
Prior art keywords
led
rotary body
light
encapsulated layer
utility
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNU2007200522191U
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English (en)
Inventor
樊邦弘
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Heshan Lide Electronic Enterprise Co Ltd
Original Assignee
Heshan Lide Electronic Enterprise Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Heshan Lide Electronic Enterprise Co Ltd filed Critical Heshan Lide Electronic Enterprise Co Ltd
Priority to CNU2007200522191U priority Critical patent/CN201053628Y/zh
Priority to EP07816755A priority patent/EP2161762A1/en
Priority to PCT/CN2007/003142 priority patent/WO2008144974A1/zh
Priority to CA002689283A priority patent/CA2689283A1/en
Priority to US11/961,131 priority patent/US20080298074A1/en
Priority to JP2008000028U priority patent/JP3140306U/ja
Application granted granted Critical
Publication of CN201053628Y publication Critical patent/CN201053628Y/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)

Abstract

本实用新型是一种尖头LED，将LED封装层的顶部设置成子弹头状的旋转体，能将光线聚集到该旋转体的顶点，从而在该顶点形成LED晶片以外的另一个光点，就像是另一个“发光源”一样，而该“发光源”发出的光线会直接发射到任意方向，使人们能在任意方向都能感受到灯泡的光线，解决了传统封装形式的LED具有的光线方向性，并且本实用新型细长的封装结构，形如子弹头，外形独特，用于装饰灯上会达到很别致的视觉效果。

Description

一种尖头LED
技术领域
本实用新型涉及LED封装领域，尤其是一种尖头LED。
背景技术
发光二极管作为新型的光源被广泛应用于各种照明的地方，由于发光二极管需要进行封装才能方便使用，因此在封装的形式上有多种变化，来改变发光二极管的光线效果，或聚光或散光等。在聚光的很多封装方案中，以圆头封装LED为代表，其封装顶部形成凸透镜的形状，使光线聚集而让人感觉灯泡更亮，用于照明或装饰时效果更佳。但是这种普通的LED也有一定的欠缺，因为现有的LED封装胶体大都采用具有很好透光性的环氧树脂作材料，现有的封装方法形成的封装形状会使封装胶体的侧壁产生反光面，而使光线在封装胶体内反射而只有非常少量的光线能透过该胶体侧壁，因而只有在正对灯泡看时才觉得灯泡比较亮，而在其它角度看时基本没有光线，造成现有LED具有光线的方向性。针对此问题，人们作了一些改进的方法，一般都是在封装胶体内添加散光剂，比如荧光粉，这样无形之中增加了成本也使生产工艺变得比较繁杂，不适用于大批量生产。
发明内容
本实用新型针对上述的问题，而提供一种尖头LED，它能改善现有LED光线的方向性而不必增加成本。
为了达到上述目的，本实用新型采用的技术方案如下：一种尖头LED，包括LED晶片、承载LED晶片的支架和封装支架顶部的封装层，其特征是：所述封装层顶部为子弹头状的旋转体，且该旋转体的高度大于该旋转体底面的半径；所述LED晶片位于旋转体的旋转轴上；封装层根部的半径与旋转体底面半径相等；所述旋转体的顶点到LED晶片的距离是封装层根部半径的2.5～3倍。
本实用新型采用上述的技术方案后，可以在旋转体的顶部形成相对于LED晶片的另一个光点，该光点相当于使LED增加了一个“发光源”，而位于旋转体顶部的此“发光源”发出的光线会直接发射到任意方向，使人们能在任意方向都能感受到灯泡的光线，解决了传统封装形式的LED具有的光线方向性的问题，而且在侧向观看时可以看到LED就像有两个“发光源”一样，当用于装饰灯上时有很好的装饰效果。另外，本实用新型只是改变了LED封装胶体的形状，在制作工艺上很容易就能实现，不需要花费过多的成本也没有使工艺变得特别繁杂。
附图说明
图1是本实用新型的示意图。
具体实施方式
如图1所示，本实用新型主要由LED晶片1、支架2和封装层3组成。封装层3的材料为透明塑料，一般为环氧树脂，在该封装层3的顶部是一个子弹头状的旋转体31，旋转体31的横截面形状呈抛物线形状，也相似于一个椭圆尖头的一半，如图中所示，旋转体31的高度h大于其底面的半径r，旋转体31与封装层3具有相同的外径，即旋转体31底面的直径2r与封装层3的根部32直径d相等，另外旋转体31的顶点311到LED晶片1的距离L是封装层3的根部32直径d的2.5～3.5倍，一般为3倍，而且LED晶片1位于旋转体31的旋转轴上。本实用新型的封装层3具有如上述的结构形状后，与普通LED封装层相比，它的封装层3相对比较细长，呈子弹头式的尖头形状。当LED晶片1发光时，光线经封装层内壁的反射后，会在旋转体31顶点311处聚集形成一个光点，该光点相当于一个“发光源”，再加上LED晶片发光，使LED就像是有两个发光源一样。位于旋转体顶部311处的“发光源”发出的光线会直接发射到任意方向，使人们能在任意方向都能感受到灯泡的光线，解决了传统封装形式的LED具有的光线方向性，而且在侧向观看时可以看到LED就像有两个“发光源”一样，并且子弹头的形状也很美观，当用于装饰灯上时具有很好的装饰效果。

Claims (4)

1.一种尖头LED，包括LED晶片、承载LED晶片的支架和封装支架顶部的封装层，其特征是：所述封装层顶部为子弹头状的旋转体，且该旋转体的高度大于该旋转体底面的半径。
2.根据权利要求1所述的尖头LED，其特征是：所述LED晶片位于旋转体的旋转轴上。
3.根据权利要求2所述的尖头LED，其特征是：封装层根部的直径与旋转体底面直径相等。
4.根据权利要求3所述的尖头LED，其特征是：所述旋转体的顶点到LED晶片的距离是封装层根部直径的2.5～3倍。
CNU2007200522191U 2007-05-30 2007-05-30 一种尖头led Expired - Fee Related CN201053628Y (zh)

Priority Applications (6)

Application Number Priority Date Filing Date Title
CNU2007200522191U CN201053628Y (zh) 2007-05-30 2007-05-30 一种尖头led
EP07816755A EP2161762A1 (en) 2007-05-30 2007-11-06 Tip led
PCT/CN2007/003142 WO2008144974A1 (fr) 2007-05-30 2007-11-06 Del pointue
CA002689283A CA2689283A1 (en) 2007-05-30 2007-11-06 Bullet shaped led bulb
US11/961,131 US20080298074A1 (en) 2007-05-30 2007-12-20 Bullet shaped led bulb
JP2008000028U JP3140306U (ja) 2007-05-30 2008-01-08 弾丸形状の発光ダイオードバルブ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNU2007200522191U CN201053628Y (zh) 2007-05-30 2007-05-30 一种尖头led

Publications (1)

Publication Number Publication Date
CN201053628Y true CN201053628Y (zh) 2008-04-30

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Country Link
US (1) US20080298074A1 (zh)
EP (1) EP2161762A1 (zh)
JP (1) JP3140306U (zh)
CN (1) CN201053628Y (zh)
CA (1) CA2689283A1 (zh)
WO (1) WO2008144974A1 (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10096742B2 (en) 2012-03-28 2018-10-09 Sensor Electronic Technology, Inc. Light emitting device substrate with inclined sidewalls
WO2013148955A1 (en) 2012-03-28 2013-10-03 Sensor Electronic Technology, Inc. Light emitting device substrate with inclined sidewalls

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3593055A (en) * 1969-04-16 1971-07-13 Bell Telephone Labor Inc Electro-luminescent device
JPS63271983A (ja) * 1986-12-12 1988-11-09 Mitsubishi Cable Ind Ltd 発光ダイオ−ドランプ
JPH1146013A (ja) * 1997-07-25 1999-02-16 Sharp Corp Ｌｅｄランプ
JP2907286B1 (ja) * 1998-06-26 1999-06-21 サンケン電気株式会社 蛍光カバーを有する樹脂封止型半導体発光装置
EP1213773B1 (en) * 1999-07-26 2009-12-16 Labosphere Institute Bulk lens, light emitting body, lighting device and optical information system
US6831306B1 (en) * 2002-03-06 2004-12-14 Daktronics, Inc. Extended length light emitting diode
CN1512600A (zh) * 2002-12-31 2004-07-14 赵宏图 发光二极管灯
US7408201B2 (en) * 2004-03-19 2008-08-05 Philips Lumileds Lighting Company, Llc Polarized semiconductor light emitting device
US7543959B2 (en) * 2005-10-11 2009-06-09 Philips Lumiled Lighting Company, Llc Illumination system with optical concentrator and wavelength converting element

Also Published As

Publication number Publication date
EP2161762A1 (en) 2010-03-10
WO2008144974A1 (fr) 2008-12-04
CA2689283A1 (en) 2008-12-04
US20080298074A1 (en) 2008-12-04
JP3140306U (ja) 2008-03-21

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CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20080430

Termination date: 20130530