CN1489503A - 具有聚合物涂层的焊头 - Google Patents
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Abstract
一种焊头(300),用于将金属丝焊接到基片上。该焊头(300)具有本体部分(302)、连接到本体部分(302)一端上的工作焊嘴、沿主体(302)纵轴线和工作焊嘴延伸的孔、以及沉积到孔表面的至少一部分上的聚合物涂层(320)。
Description
技术领域
本发明一般地涉及一种用于细金属丝焊接的焊头,尤其涉及一种在毛细管的表面上设有聚合物涂层的毛细管焊头。
背景技术
目前,引线接合法是用于半导体器件互联的主要方法。在引线接合领域,焊头故障导致互联的半导体器件的毁坏,从而严重降低产量。为了防止焊头故障,需在故障发生的预计时间之前定期更换焊头。
引线接合工艺由“操作窗”确定,它是焊机允许在其中操作的参数范围。为了保持焊接质量,必须调整焊接参数。然而,并不允许焊接参数超出允许的操作窗。当焊接过程必须停止并更换焊头时,就导致生产率的降低。而且,由于使用大量超出必须需要的焊头,也导致了附加的费用。
在应用引线接合时,杂质的积累和磨损的加快限制了现有技术中基于陶瓷(例如,氧化铝、氧化锆和硬质氧化铝、氧化锆、渗碳的碳化钨等)的焊头的可使用时间。有机衍生的含碳物质的粘性和随后从结合金属丝嵌入含碳物质中的金属颗粒引起了焊头的不对称负载,并最终由于挠性弯曲而导致焊头的机械故障。含碳物质通过电子火焰断开(EFO,用于形成焊球)而在石油和硬脂酸基材料上作用产生,石油和硬脂酸基材料一般被置于金属丝的表面以提高金属丝的低卷绕性能。由于焊结力局部化为焊头表面的一个点负荷,所以也增加了表面的磨损。
转让给本发明同一受让人的美国专利US5,871,141、US5,558,270和US5,421,503,描述了用于在半导体器件上产生引线接合的各种现有焊头,在此一并参考。
发明内容
鉴于现有技术的缺陷,本发明提供了一种焊头,其包括:沿焊头本体的纵轴线延伸的孔;连接到焊头本体一端的工作焊嘴;和位于孔的至少一部分表面上的聚合物涂层。
本发明还涉及一种制造焊头的方法,所述焊头用于把细金属丝焊接到基片上,它包括步骤:形成圆柱形本体,在本体的第一端形成圆锥形部分,形成沿本体纵轴线延伸的孔,以及用聚合物涂敷本体。
根据本发明的另一个方面,第一涂层沉积在孔的表面,第二涂层沉积在焊头的外表面。
附图简介
在阅读下面的详细说明时,结合附图将对本发明有更好的理解。需要着重指出的是,根据惯例,附图的各个特征不可以测量。相反,为了清楚起见,各个特征的尺寸可以任意地增大或减小。包含在图中的为以下各附图:
图1是现有技术的焊头的横断面视图;
图2A-2B是根据本发明第一个实施例的焊头的横断面视图;
图3A-3B是根据本发明第二个实施例的焊头的横断面视图;
图4示出了本发明的具体实施例对焊结力影响的图表;
图5示出了本发明的具体实施例对焊接功率影响的图表;
图6示出了本发明的具体实施例对焊球尺寸影响的图表;
图7示出了本发明的具体实施例对焊球尺寸比影响的图表;
图8示出了本发明的具体实施例对焊接性能(即剪切力/单位面积)影响的图表;
图9是根据本发明具体实施例的涂层工艺的流程图。
具体实施方式
为克服上述缺陷,把聚合物涂层,如聚对二甲苯(pary 1ene)沉积到焊头的表面上。这种表面涂层能够降低杂质与焊头表面的粘附力,所述杂质例如为碳、金、铜、氯、钙、铁、硫、铍、氧、氮等,从而延长了发生故障的时间并使引线接合操作窗稳定。可以理解,涂层将被主要用于新制造的焊头,但是如果想要,涂层也可以被应用于以前制造的焊头。
图1A所示的是现有焊头100的横断面视图,图1B是工作焊嘴102的放大的横断面视图。在图1A中,焊头100有一孔104,所述孔从焊头100的末端延伸至工作焊嘴102。焊丝(未示出)被插入孔104中,并穿过工作焊嘴102。随着焊丝穿过孔104被拉出,其与在其上沉积有杂质的接触面108和110(在图1中示出)接触并磨损焊头100的未受保护的表面。
图2A是根据本发明第一个具体实施例的焊头的横断面视图。在图2A中,焊头200具有涂层220、222,它们分别位于焊头200的外表面和内表面。如在下面详述中将要讨论的,涂层220、222可以是相同的或者是不同的。在具体实施例中,涂层220、222可以是聚合物,例如聚对二甲苯或POLYCORBOFLUORO。在具体实施例中,涂层的平均厚度可达大约2.0微米。在优选实施例中,涂层220、222的厚度为大约0.1微米。然而,本发明并不受此限制,基于特殊应用,涂层220、222可以为其它厚度。更详细地如图2B所示,涂层220、222也分别保护表面226、224,在这里焊丝(未示出)与其有最大接触。而且,由于聚合物涂层220、222有电绝缘性质,所以它也可以被用作导电毛细管的绝缘体。另外,由于在焊头200的内表面上包含有聚合物涂层222,所以在焊丝通过焊头200时,可以降低焊丝的曳力。
一般地,毛细管和焊头为圆柱形,它们或者通过直接陶瓷模压、然后进行烧结而制成,或者通过注射成型、然后进行烧结而制成,并通过研磨或放电加工(EDM)而机加工成最终形状。
图9是根据本发明的具体实施例的涂布工艺的流程图。在步骤900,焊头表面被处理。示例的处理方法包括等离子处理、热处理和化学处理。在步骤902,被处理过的焊头被置于真空容器内。在步骤904,应用例如二-对-二甲苯基二聚物([2,2]二聚二甲苯-羧酸),在大约150摄氏度和1.0托的压力下,焊头汽化。然后在步骤906,在大约690℃和0.5托压力下焊头热解,以产生例如对二甲苯基(para-xylylene)的前单体。在步骤908,在大约环境温度(例如25℃)和大约0.1托的容器压力下,完成涂层220、222例如多-对-二甲苯基的沉积。这个示例过程在焊头200上沉积大致均匀连续的涂层220、222,其厚度大约为0.1微米。本领域的普通技术人员易于理解,涂层的沉积可以通过各种汽相淀积法来实现,如化学汽相沉积法(CVD)、物理汽相沉积法(PVD)以及它们的变型。另外,焊头可以通过将焊头浸入涂层材料中而被涂敷。
图3A是根据本发明第二个具体实施例的焊头的横断面视图。在图3A中,焊头300上有涂层320,所述涂层320沉积在焊头300的内表面部分上。如图3B更详细的示出,涂层320被涂敷在与焊丝(未示出)有最大接触的表面上。也可以理解,涂层可以被涂敷在焊头任意想要的内表面和/或外表面上。
更进一步理解,在任意组合方式中,涂层可以是软的或者硬的,像在焊头外表面上的硬涂层220和在焊头内表面上的软涂层222,反之亦然。在焊头200的外表面采用硬涂层220可以增加焊头的抗磨损性,特别是沿226部分,该部分在焊接过程中与焊接区(未示出)的表面相接触。然而,在焊头200的内表面采用软涂层222有助于降低焊丝在通过焊头时的曳力。这种硬涂层例如是无定型氧化铝和Si3N4。这种软涂层例如可以是聚合物(即聚烯烃、聚对苯二甲撑、floropolymers等)。
图4-8示出聚合物涂层在改善引线接合工艺的可靠性和稳定性方面的作用。参照图4,示出图表400。在图4中,图表400绘出了聚合物涂层对焊结力的影响。在图4中,纵坐标是相对于被焊接的金属丝的数量的焊头的使用寿命,横坐标是形成焊缝所需的焊结力。曲线402是现有焊头的点403的线性表示。如图所示,曲线402随焊缝数的增加而显著增加。曲线402还示出在大约800,000个焊缝之后焊头损坏(即,落在上述的操作窗之外,需要更换)。通过比较,曲线404是根据本发明的焊头的点405的线性表示。如图所示,曲线404示出随焊缝数的增加,焊结力的增加很小。曲线404也示出示例焊头的使用寿命为大约两倍于现有焊头的寿命。
在图5中,图表500绘制出聚合物涂层对焊接功率的影响。在图5中,纵坐标是相对于被焊接的金属丝的数量焊头的使用寿命,横坐标是形成焊缝所需的焊接功率。曲线502是现有焊头的点503的线性表示。如图所示,曲线502随焊缝数的增加而显著增加。通过比较,曲线504是根据本发明的焊头的点505的线性表示。如图所示,曲线504示出随焊缝数的增加,焊接功率的增加很小。
在图6中,图表600绘制出聚合物涂层对焊球尺寸的影响。在图6中,纵坐标是相对于被焊接的金属丝的数量焊头的使用寿命,横坐标是焊球的平均直径。曲线602是现有焊头的点603的线性表示,曲线604是根据本发明的焊头的点605的线性表示。如图所示,不仅现有焊头的平均焊球直径比示例的焊头的要大,平均直径增长率也大于示例焊头的增长率。这种增加的直径会影响焊接工艺,如在工业中增加的密度要求。
在图7中,图表700绘制出聚合物涂层对焊球尺寸比的影响。在图7中,纵坐标是相对于被焊接的金属丝的数量焊头的使用寿命,横坐标是焊球尺寸比。曲线702是现有焊头的点703的线性表示。如图所示,曲线702随焊缝的增加而显著下降。相比较,曲线704是根据本发明的焊头的点705的线性表示。如图所示,曲线704示出,随焊缝数的增加,焊球尺寸比的变化很小。因此,通过使用示例的焊头,可以获得更均匀的焊球。
在图8中,图表800绘制出聚合物涂层对破坏一个焊缝所需的单位面积剪切力的影响。在图8中,纵坐标是焊头相对于被焊接的金属丝数量的使用寿命,横坐标是剪切力。曲线802是现有焊头的点803的线性表示。如图所示,曲线802随焊缝数的增加而下降,因此表明随着焊头的使用,焊缝变弱。相比较,曲线804是根据本发明的焊头的点805的线性表示。如图所示,曲线804示出,随焊缝数的增加,破坏一个焊缝所需的剪切力有点增加。
尽管已参照具体实施例对本发明进行了叙述,但其并不受限于此。相反地,在不偏离本发明的精神和保护范围的情况下,附属权利要求书应被视为包括其它变型实施方式,它们可以由本领域的普通技术人员做出。
Claims (27)
1、一种用于把金属丝焊接到基片上的焊头,所述焊头具有一本体和一连接到本体一端上的工作焊嘴,并包括:
孔,其沿本体的纵轴和工作焊嘴延伸;和
涂层,其沉积在所述孔的至少一部分表面上。
2、如权利要求1所述的毛细管焊头,其特征在于,所述涂层沿所述孔的全长延伸。
3、如权利要求2所述的毛细管焊头,其特征在于,所述涂层被涂覆在所述工作焊嘴的外表面的至少一部分上。
4、如权利要求1所述的毛细管焊头,其特征在于,所述涂层位于所述工作焊嘴的外表面的至少一部分上。
5、如权利要求1所述的毛细管焊头,其特征在于,所述涂层位于所述工作焊嘴的外表面上和所述本体上。
6、如权利要求1所述的毛细管焊头,其特征在于,所述涂层是聚合物。
7、如权利要求1所述的毛细管焊头,其特征在于,所述涂层是以下物质中的至少一种:i)聚合物,ii)氧化铝,ii)Si3N4,iv)氧化硅,v)12%的氧化硅和88%的氧化铝的组合物,和vi)类金刚石硅石(DLC)。
8、如权利要求1所述的毛细管焊头,其特征在于,所述涂层是沿孔的内表面沉积的聚合物,以及沿孔的外表面沉积的以下物质中的一种:i)氧化铝,ii)Si3N4,iii)氧化硅,iv)12%的氧化硅和88%的氧化铝的组合物,和v)类金刚石硅石(DLC)。
9、如权利要求1所述的毛细管焊头,其特征在于,所述涂层基本上厚度均匀。
10、如权利要求1所述的毛细管焊头,其特征在于,所述涂层具有基本上达大约2.0微米的均匀厚度。
11、如权利要求1所述的毛细管焊头,其特征在于,所述涂层具有大约为0.1微米的基本均匀的厚度。
12、如权利要求1所述的毛细管焊头,其特征在于,所述焊头的本体基本为圆柱形。
13、如权利要求1所述的毛细管焊头,其特征在于,所述涂层是聚烯烃和聚对二甲苯中的一种。
14、如权利要求1所述的毛细管焊头,其特征在于,所述涂层通过汽相淀积形成。
15、如权利要求1所述的毛细管焊头,其特征在于,所述涂层通过化学汽相沉积法和物理汽相沉积法中的一种形成。
16、如权利要求1所述的毛细管焊头,其特征在于,所述涂层通过把焊头浸入一涂层材料中形成。
17、一种制造用于把细金属丝焊接到基片上的毛细管焊头的方法,所述方法包括以下步骤:
形成一圆柱本体;
在本体的第一端形成一锥形;
形成一沿本体纵轴延伸的孔;以及
用聚合物涂敷所述孔的至少一部分。
18、如权利要求17所述的方法,其特征在于,所述涂敷步骤形成厚度大约2.0微米的大致均匀连续的涂层。
19、如权利要求17所述的方法,其特征在于,所述涂敷步骤形成厚度为大约0.1微米的大致均匀连续的涂层。
20、如权利要求17所述的方法,其特征在于,所述涂敷步骤包括:
在第一温度和第一压力下形成前单体;和
在第二温度和第二压力下从所述前单体形成所述涂层。
21、如权利要求20所述的方法,其特征在于,
所述第一温度为大约690℃,
所述第一压力为大约0.5托,
所述第二温度为大约25℃,
所述第二压力为大约0.1托。
22、如权利要求20所述的方法,其特征在于,所述前单体是这样形成的:即在大约150℃和大约1.0托下二-对-二甲苯基二聚物汽化,然后在大约690℃和大约0.5托下热解。
23、如权利要求17所述的方法,其特征在于,所述毛细管通过i)陶瓷直接模压,和ii)注射成型中的一种形成,并且通过i)研磨和ii)放电加工中的一种进行机加工而形成最终形状。
24、一种用于把金属丝焊接到基片上的焊头,包括:
本体部分;
连接到本体一端的工作焊嘴;
沿所述本体的纵轴和所述工作焊嘴延伸的孔;
第一涂层,其位于所述孔的表面的至少一部分上;和
第二涂层,其位于所述本体的外表面的至少一部分上。
25、如权利要求24所述的毛细管焊头,其特征在于,所述第一涂层是聚合物,所述第二涂层是除聚合物以外的其他物质。
26、如权利要求25所述的毛细管焊头,其特征在于,所述第二涂层是氧化铝和Si3N4中的其中一种。
27、一种制造毛细管焊头的方法,所述毛细管焊头用于把细金属丝焊接到一基片上,所述方法包括以下步骤:
形成沿焊头纵轴线延伸的一个孔;
用聚合物涂敷所述孔的至少一部分;和
用非聚合物涂敷所述焊头外表面的至少一部分。
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US09/772,421 | 2001-01-30 | ||
US09/772,421 US6729527B2 (en) | 2001-01-30 | 2001-01-30 | Bonding tool with polymer coating |
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CN1489503A true CN1489503A (zh) | 2004-04-14 |
CN1278814C CN1278814C (zh) | 2006-10-11 |
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US (3) | US6729527B2 (zh) |
EP (1) | EP1355759B1 (zh) |
JP (1) | JP2004523899A (zh) |
KR (1) | KR100847705B1 (zh) |
CN (1) | CN1278814C (zh) |
AT (1) | ATE305359T1 (zh) |
DE (1) | DE60206357T2 (zh) |
HK (1) | HK1065274A1 (zh) |
MY (1) | MY122875A (zh) |
TW (1) | TW554507B (zh) |
WO (1) | WO2002060632A2 (zh) |
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Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3555844B2 (ja) | 1999-04-09 | 2004-08-18 | 三宅 正二郎 | 摺動部材およびその製造方法 |
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Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US100790A (en) * | 1870-03-15 | Improvement in buckwheat-hulling machines | ||
US4049506A (en) * | 1974-09-03 | 1977-09-20 | Tribotech | Method for coating bonding tools and product |
US4513190A (en) * | 1983-01-03 | 1985-04-23 | Small Precision Tools, Inc. | Protection of semiconductor wire bonding capillary from spark erosion |
GB2165178A (en) | 1984-10-05 | 1986-04-09 | Hitachi Ltd | Method and apparatus for wire bonding |
US4691854A (en) * | 1984-12-21 | 1987-09-08 | Texas Instruments Incorporated | Coatings for ceramic bonding capillaries |
US4950365A (en) | 1988-12-22 | 1990-08-21 | Vac-Tec Systems, Inc. | Corrosion free hard coated metal substrates |
US5421503A (en) | 1994-08-24 | 1995-06-06 | Kulicke And Soffa Investments, Inc. | Fine pitch capillary bonding tool |
US5558270A (en) | 1995-01-06 | 1996-09-24 | Kulicke And Soffa Investments, Inc | Fine pitch capillary/wedge bonding tool |
US5879808A (en) | 1995-10-27 | 1999-03-09 | Alpha Metals, Inc. | Parylene polymer layers |
AU5087198A (en) | 1996-10-25 | 1998-05-22 | Specialty Coating Systems, Inc. | Process for making a parylene coating |
US5931368A (en) * | 1997-03-28 | 1999-08-03 | Kulicke And Soffa Investments, Inc | Long life bonding tool |
US5871141A (en) | 1997-05-22 | 1999-02-16 | Kulicke And Soffa, Investments, Inc. | Fine pitch bonding tool for constrained bonding |
JPH11284014A (ja) | 1998-03-30 | 1999-10-15 | Sumitomo Metal Mining Co Ltd | ワイヤボンディング用キャピラリ |
US20020079349A1 (en) * | 2000-03-27 | 2002-06-27 | Kessem Trade Company Ltd. | Wire bonding capillary |
US6497356B2 (en) * | 2000-04-28 | 2002-12-24 | Kulicke & Soffa Investments, Inc. | Controlled attenuation capillary with planar surface |
US6729527B2 (en) * | 2001-01-30 | 2004-05-04 | Kulicke & Soffa Investments, Inc. | Bonding tool with polymer coating |
-
2001
- 2001-01-30 US US09/772,421 patent/US6729527B2/en not_active Expired - Lifetime
-
2002
- 2002-01-15 MY MYPI20020125A patent/MY122875A/en unknown
- 2002-01-21 TW TW091100881A patent/TW554507B/zh not_active IP Right Cessation
- 2002-01-29 AT AT02703272T patent/ATE305359T1/de not_active IP Right Cessation
- 2002-01-29 KR KR1020037009968A patent/KR100847705B1/ko active IP Right Grant
- 2002-01-29 JP JP2002560815A patent/JP2004523899A/ja active Pending
- 2002-01-29 DE DE60206357T patent/DE60206357T2/de not_active Expired - Fee Related
- 2002-01-29 WO PCT/US2002/002546 patent/WO2002060632A2/en active IP Right Grant
- 2002-01-29 EP EP02703272A patent/EP1355759B1/en not_active Expired - Lifetime
- 2002-01-29 CN CNB028042581A patent/CN1278814C/zh not_active Expired - Lifetime
-
2004
- 2004-02-25 US US10/786,188 patent/US20040164129A1/en not_active Abandoned
- 2004-10-14 HK HK04107938A patent/HK1065274A1/xx not_active IP Right Cessation
- 2004-12-03 US US11/004,504 patent/US7077304B2/en not_active Expired - Fee Related
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WO2002060632A3 (en) | 2002-10-10 |
KR100847705B1 (ko) | 2008-07-23 |
US20020100790A1 (en) | 2002-08-01 |
EP1355759A2 (en) | 2003-10-29 |
WO2002060632A2 (en) | 2002-08-08 |
US20040164129A1 (en) | 2004-08-26 |
JP2004523899A (ja) | 2004-08-05 |
ATE305359T1 (de) | 2005-10-15 |
US6729527B2 (en) | 2004-05-04 |
DE60206357D1 (de) | 2005-11-03 |
KR20040010583A (ko) | 2004-01-31 |
CN1278814C (zh) | 2006-10-11 |
MY122875A (en) | 2006-05-31 |
DE60206357T2 (de) | 2006-06-22 |
US7077304B2 (en) | 2006-07-18 |
EP1355759B1 (en) | 2005-09-28 |
TW554507B (en) | 2003-09-21 |
HK1065274A1 (en) | 2005-02-18 |
US20050077339A1 (en) | 2005-04-14 |
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