CN1484934A - 具有偏离中心的几何形状的焊盘中通孔及制造方法 - Google Patents
具有偏离中心的几何形状的焊盘中通孔及制造方法 Download PDFInfo
- Publication number
- CN1484934A CN1484934A CNA018215823A CN01821582A CN1484934A CN 1484934 A CN1484934 A CN 1484934A CN A018215823 A CNA018215823 A CN A018215823A CN 01821582 A CN01821582 A CN 01821582A CN 1484934 A CN1484934 A CN 1484934A
- Authority
- CN
- China
- Prior art keywords
- hole
- weld zone
- geometric center
- zone
- weld
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
- H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
- H05K1/113—Via provided in pad; Pad over filled via
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10734—Ball grid array [BGA]; Bump grid array
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1178—Means for venting or for letting gases escape
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
Description
Claims (30)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/751,614 US6833615B2 (en) | 2000-12-29 | 2000-12-29 | Via-in-pad with off-center geometry |
US09/751,614 | 2000-12-29 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1484934A true CN1484934A (zh) | 2004-03-24 |
CN1284426C CN1284426C (zh) | 2006-11-08 |
Family
ID=25022776
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB018215823A Expired - Lifetime CN1284426C (zh) | 2000-12-29 | 2001-11-28 | 具有偏离中心的几何形状的焊盘中通孔及制造方法 |
Country Status (8)
Country | Link |
---|---|
US (2) | US6833615B2 (zh) |
EP (1) | EP1346613B1 (zh) |
JP (1) | JP2005501393A (zh) |
KR (1) | KR100603879B1 (zh) |
CN (1) | CN1284426C (zh) |
AT (1) | ATE509510T1 (zh) |
MY (1) | MY130278A (zh) |
WO (1) | WO2002054838A1 (zh) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100527917C (zh) * | 2005-11-23 | 2009-08-12 | 比亚迪股份有限公司 | 一种线路板基体上焊盘的制造方法及焊盘 |
CN101066003B (zh) * | 2004-12-02 | 2010-12-08 | 松下电器产业株式会社 | 印刷电路板及其设计方法、ic封装端子的设计方法及其连接方法 |
CN102498565A (zh) * | 2009-09-09 | 2012-06-13 | 东京毅力科创株式会社 | 半导体装置的制造方法 |
CN103858525A (zh) * | 2012-11-15 | 2014-06-11 | 华为技术有限公司 | 一种印刷电路板、一种部件及一种电路组件 |
CN104051389A (zh) * | 2013-03-12 | 2014-09-17 | 台湾积体电路制造股份有限公司 | 具有焊盘连接件上通孔的叠层封装件 |
CN104394646A (zh) * | 2014-11-28 | 2015-03-04 | 京东方科技集团股份有限公司 | 印刷电路板、球栅阵列封装体及印刷电路板的布线方法 |
CN107172809A (zh) * | 2017-06-08 | 2017-09-15 | 冯俊谊 | 一种bga焊接方法 |
CN113936545A (zh) * | 2021-10-15 | 2022-01-14 | 业成科技(成都)有限公司 | 背光模组及其制造方法 |
Families Citing this family (64)
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US6833615B2 (en) * | 2000-12-29 | 2004-12-21 | Intel Corporation | Via-in-pad with off-center geometry |
US6441486B1 (en) * | 2001-03-19 | 2002-08-27 | Texas Instruments Incorporated | BGA substrate via structure |
TWI222192B (en) * | 2003-09-04 | 2004-10-11 | Advanced Semiconductor Eng | Substrate with net structure |
US7206196B2 (en) * | 2003-09-15 | 2007-04-17 | Intel Corporation | Computer system with detachable display |
US7326859B2 (en) | 2003-12-16 | 2008-02-05 | Intel Corporation | Printed circuit boards having pads for solder balls and methods for the implementation thereof |
KR100541655B1 (ko) * | 2004-01-07 | 2006-01-11 | 삼성전자주식회사 | 패키지 회로기판 및 이를 이용한 패키지 |
TWI281367B (en) * | 2005-02-04 | 2007-05-11 | Lite On Technology Corp | Printed circuit board and forming method thereof |
JP2006228997A (ja) * | 2005-02-18 | 2006-08-31 | Fujitsu Ltd | プリント基板 |
JP2006303173A (ja) * | 2005-04-20 | 2006-11-02 | Mitsubishi Electric Corp | 回路基板デバイスおよびその製造方法 |
US7461771B2 (en) * | 2005-04-22 | 2008-12-09 | Hewlett-Packard Development Company, L.P. | Method of treating and probing a via |
US7371673B2 (en) * | 2005-05-17 | 2008-05-13 | Texas Instruments Incorporated | Method and apparatus for attaching an IC package to a PCB assembly |
US7772115B2 (en) * | 2005-09-01 | 2010-08-10 | Micron Technology, Inc. | Methods for forming through-wafer interconnects, intermediate structures so formed, and devices and systems having at least one solder dam structure |
US7768083B2 (en) * | 2006-01-20 | 2010-08-03 | Allegro Microsystems, Inc. | Arrangements for an integrated sensor |
US20070207632A1 (en) * | 2006-03-03 | 2007-09-06 | Fci Americas Technology, Inc. | Midplane with offset connectors |
US20080012099A1 (en) * | 2006-07-11 | 2008-01-17 | Shing Yeh | Electronic assembly and manufacturing method having a reduced need for wire bonds |
US20080067665A1 (en) * | 2006-09-20 | 2008-03-20 | Azniza Binti Abd Aziz | Via structure |
US7714430B2 (en) * | 2006-09-28 | 2010-05-11 | Intel Corporation | Substrate with lossy material insert |
US20080185181A1 (en) * | 2006-11-08 | 2008-08-07 | Pfeil Charles L | Alternating via fanout patterns |
WO2008058258A2 (en) * | 2006-11-08 | 2008-05-15 | Mentor Graphics Corporation | Use of breakouts in printed circuit board designs |
US7497736B2 (en) | 2006-12-19 | 2009-03-03 | Fci Americas Technology, Inc. | Shieldless, high-speed, low-cross-talk electrical connector |
KR100791009B1 (ko) * | 2007-01-10 | 2008-01-04 | 삼성전자주식회사 | 솔더볼 연결시 발생하는 보이드 제어가 가능한인쇄회로기판 |
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US20080230901A1 (en) * | 2007-03-20 | 2008-09-25 | International Business Machines Corporation | Structure for controlled collapse chip connection with displaced captured pads |
US7812438B2 (en) * | 2008-01-07 | 2010-10-12 | International Business Machines Corporation | Via offsetting to reduce stress under the first level interconnect (FLI) in microelectronics packaging |
TWM339185U (en) * | 2008-01-15 | 2008-08-21 | Wintek Corp | Bend prevention structure for connection terminal of FPC |
US20090188710A1 (en) * | 2008-01-30 | 2009-07-30 | Cisco Technology, Inc. | System and method for forming filled vias and plated through holes |
US8764464B2 (en) | 2008-02-29 | 2014-07-01 | Fci Americas Technology Llc | Cross talk reduction for high speed electrical connectors |
JP2010045246A (ja) * | 2008-08-14 | 2010-02-25 | Fujitsu Ltd | 基板ユニットとその製造方法 |
US9277649B2 (en) | 2009-02-26 | 2016-03-01 | Fci Americas Technology Llc | Cross talk reduction for high-speed electrical connectors |
US8366485B2 (en) | 2009-03-19 | 2013-02-05 | Fci Americas Technology Llc | Electrical connector having ribbed ground plate |
US8378230B2 (en) * | 2009-07-23 | 2013-02-19 | Ibiden Co., Ltd. | Printed wiring board and method for manufacturing the same |
US8267721B2 (en) | 2009-10-28 | 2012-09-18 | Fci Americas Technology Llc | Electrical connector having ground plates and ground coupling bar |
US8616919B2 (en) | 2009-11-13 | 2013-12-31 | Fci Americas Technology Llc | Attachment system for electrical connector |
US8587901B1 (en) | 2009-12-30 | 2013-11-19 | Western Digital (Fremont), Llc | Magnetic recording head slider comprising bond pad having a probe contact area and a solder contact area |
US8298929B2 (en) * | 2010-12-03 | 2012-10-30 | International Business Machines Corporation | Offset solder vias, methods of manufacturing and design structures |
US8759689B2 (en) * | 2011-01-04 | 2014-06-24 | Alcatel Lucent | Land pattern for 0201 components on a 0.8 mm pitch array |
US20120298406A1 (en) * | 2011-05-23 | 2012-11-29 | International Business Machines Corporation | Reduced stress gull wing solder joints for printed wiring board connections |
EP2624034A1 (en) | 2012-01-31 | 2013-08-07 | Fci | Dismountable optical coupling device |
US8629557B2 (en) | 2012-03-08 | 2014-01-14 | International Business Machines Corporation | Structures and methods for detecting solder wetting of pedestal sidewalls |
US9257778B2 (en) | 2012-04-13 | 2016-02-09 | Fci Americas Technology | High speed electrical connector |
USD727852S1 (en) | 2012-04-13 | 2015-04-28 | Fci Americas Technology Llc | Ground shield for a right angle electrical connector |
USD727268S1 (en) | 2012-04-13 | 2015-04-21 | Fci Americas Technology Llc | Vertical electrical connector |
USD718253S1 (en) | 2012-04-13 | 2014-11-25 | Fci Americas Technology Llc | Electrical cable connector |
US8944831B2 (en) | 2012-04-13 | 2015-02-03 | Fci Americas Technology Llc | Electrical connector having ribbed ground plate with engagement members |
USD751507S1 (en) | 2012-07-11 | 2016-03-15 | Fci Americas Technology Llc | Electrical connector |
US9543703B2 (en) | 2012-07-11 | 2017-01-10 | Fci Americas Technology Llc | Electrical connector with reduced stack height |
USD745852S1 (en) | 2013-01-25 | 2015-12-22 | Fci Americas Technology Llc | Electrical connector |
CN103983809A (zh) * | 2013-02-08 | 2014-08-13 | 辉达公司 | Pcb板及其在线测试结构以及该在线测试结构的制造方法 |
US9024208B2 (en) * | 2013-02-27 | 2015-05-05 | Dell Products L.P. | Systems and methods for frequency shifting resonance of an unused via in a printed circuit board |
USD720698S1 (en) | 2013-03-15 | 2015-01-06 | Fci Americas Technology Llc | Electrical cable connector |
US20150092373A1 (en) * | 2013-10-02 | 2015-04-02 | Alcatel-Lucent Canada Inc. | Mounting solution for components on a very fine pitch array |
US9147664B2 (en) | 2013-10-11 | 2015-09-29 | Mediatek Inc. | Semiconductor package |
US9806053B2 (en) | 2013-10-11 | 2017-10-31 | Mediatek Inc. | Semiconductor package |
US9392696B2 (en) | 2013-10-11 | 2016-07-12 | Mediatek Inc. | Semiconductor package |
US10163767B2 (en) | 2013-10-11 | 2018-12-25 | Mediatek Inc. | Semiconductor package |
US9040316B1 (en) * | 2014-06-12 | 2015-05-26 | Deca Technologies Inc. | Semiconductor device and method of adaptive patterning for panelized packaging with dynamic via clipping |
FR3046902B1 (fr) * | 2016-01-20 | 2021-05-07 | Valeo Systemes De Controle Moteur | Carte electronique destinee a recevoir un composant electronique |
US10090271B1 (en) | 2017-06-28 | 2018-10-02 | International Business Machines Corporation | Metal pad modification |
US10729050B2 (en) | 2017-11-16 | 2020-07-28 | Seagate Technology Llc | Fine pitch component placement on printed circuit boards |
KR102467030B1 (ko) | 2018-01-17 | 2022-11-14 | 삼성전자주식회사 | 반도체 패키지 및 그 패키지를 포함한 반도체 장치 |
US10935612B2 (en) | 2018-08-20 | 2021-03-02 | Allegro Microsystems, Llc | Current sensor having multiple sensitivity ranges |
KR20220056296A (ko) | 2020-10-27 | 2022-05-06 | 삼성전자주식회사 | 반도체 패키지 및 반도체 패키지의 제조 방법 |
US11567108B2 (en) | 2021-03-31 | 2023-01-31 | Allegro Microsystems, Llc | Multi-gain channels for multi-range sensor |
US11844176B2 (en) | 2021-06-24 | 2023-12-12 | Samsung Electronics Co., Ltd. | Printed circuit board |
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-
2000
- 2000-12-29 US US09/751,614 patent/US6833615B2/en not_active Expired - Lifetime
-
2001
- 2001-11-28 AT AT01273027T patent/ATE509510T1/de not_active IP Right Cessation
- 2001-11-28 KR KR1020037008832A patent/KR100603879B1/ko active IP Right Grant
- 2001-11-28 JP JP2002555593A patent/JP2005501393A/ja active Pending
- 2001-11-28 CN CNB018215823A patent/CN1284426C/zh not_active Expired - Lifetime
- 2001-11-28 EP EP01273027A patent/EP1346613B1/en not_active Expired - Lifetime
- 2001-11-28 WO PCT/US2001/044721 patent/WO2002054838A1/en active Application Filing
- 2001-12-10 MY MYPI20015604A patent/MY130278A/en unknown
-
2004
- 2004-11-22 US US10/994,995 patent/US7208348B2/en not_active Expired - Lifetime
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101066003B (zh) * | 2004-12-02 | 2010-12-08 | 松下电器产业株式会社 | 印刷电路板及其设计方法、ic封装端子的设计方法及其连接方法 |
CN100527917C (zh) * | 2005-11-23 | 2009-08-12 | 比亚迪股份有限公司 | 一种线路板基体上焊盘的制造方法及焊盘 |
CN102498565A (zh) * | 2009-09-09 | 2012-06-13 | 东京毅力科创株式会社 | 半导体装置的制造方法 |
CN102498565B (zh) * | 2009-09-09 | 2014-10-22 | 东京毅力科创株式会社 | 半导体装置的制造方法 |
CN103858525A (zh) * | 2012-11-15 | 2014-06-11 | 华为技术有限公司 | 一种印刷电路板、一种部件及一种电路组件 |
CN104051389A (zh) * | 2013-03-12 | 2014-09-17 | 台湾积体电路制造股份有限公司 | 具有焊盘连接件上通孔的叠层封装件 |
CN104394646A (zh) * | 2014-11-28 | 2015-03-04 | 京东方科技集团股份有限公司 | 印刷电路板、球栅阵列封装体及印刷电路板的布线方法 |
US9629241B2 (en) | 2014-11-28 | 2017-04-18 | Boe Technology Group Co., Ltd. | Printed circuit board, ball grid array package and wiring method of printed circuit board |
CN107172809A (zh) * | 2017-06-08 | 2017-09-15 | 冯俊谊 | 一种bga焊接方法 |
CN113936545A (zh) * | 2021-10-15 | 2022-01-14 | 业成科技(成都)有限公司 | 背光模组及其制造方法 |
CN113936545B (zh) * | 2021-10-15 | 2024-01-16 | 业成科技(成都)有限公司 | 背光模组及其制造方法 |
Also Published As
Publication number | Publication date |
---|---|
US6833615B2 (en) | 2004-12-21 |
MY130278A (en) | 2007-06-29 |
ATE509510T1 (de) | 2011-05-15 |
KR20030067738A (ko) | 2003-08-14 |
EP1346613B1 (en) | 2011-05-11 |
US20020084105A1 (en) | 2002-07-04 |
US20050090040A1 (en) | 2005-04-28 |
KR100603879B1 (ko) | 2006-07-24 |
US7208348B2 (en) | 2007-04-24 |
EP1346613A1 (en) | 2003-09-24 |
WO2002054838A1 (en) | 2002-07-11 |
CN1284426C (zh) | 2006-11-08 |
JP2005501393A (ja) | 2005-01-13 |
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