CN1438361A - 对印刷电路板进行喷射操作的装置 - Google Patents
对印刷电路板进行喷射操作的装置 Download PDFInfo
- Publication number
- CN1438361A CN1438361A CN 02107722 CN02107722A CN1438361A CN 1438361 A CN1438361 A CN 1438361A CN 02107722 CN02107722 CN 02107722 CN 02107722 A CN02107722 A CN 02107722A CN 1438361 A CN1438361 A CN 1438361A
- Authority
- CN
- China
- Prior art keywords
- suction
- printed circuit
- pcb
- circuit board
- unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005507 spraying Methods 0.000 title claims abstract description 17
- 238000000034 method Methods 0.000 claims description 25
- 238000012545 processing Methods 0.000 claims description 13
- 239000012530 fluid Substances 0.000 claims description 9
- 238000011161 development Methods 0.000 claims description 2
- 238000011010 flushing procedure Methods 0.000 claims description 2
- 238000007639 printing Methods 0.000 claims description 2
- 239000007921 spray Substances 0.000 abstract description 12
- 239000007788 liquid Substances 0.000 abstract description 11
- 238000002347 injection Methods 0.000 description 7
- 239000007924 injection Substances 0.000 description 7
- 238000013461 design Methods 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 238000005755 formation reaction Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000002349 favourable effect Effects 0.000 description 3
- 230000014509 gene expression Effects 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 238000005086 pumping Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910021591 Copper(I) chloride Inorganic materials 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- OXBLHERUFWYNTN-UHFFFAOYSA-M copper(I) chloride Chemical compound [Cu]Cl OXBLHERUFWYNTN-UHFFFAOYSA-M 0.000 description 1
- 229940045803 cuprous chloride Drugs 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000013519 translation Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Landscapes
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
Description
Claims (17)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 02107722 CN1269994C (zh) | 2002-02-11 | 2002-02-11 | 对印刷电路板进行喷射操作的装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 02107722 CN1269994C (zh) | 2002-02-11 | 2002-02-11 | 对印刷电路板进行喷射操作的装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1438361A true CN1438361A (zh) | 2003-08-27 |
CN1269994C CN1269994C (zh) | 2006-08-16 |
Family
ID=27672143
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN 02107722 Expired - Lifetime CN1269994C (zh) | 2002-02-11 | 2002-02-11 | 对印刷电路板进行喷射操作的装置 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN1269994C (zh) |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1910972B (zh) * | 2004-01-16 | 2010-10-13 | 埃托特克德国有限公司 | 喷嘴装置及用于以处理介质处理待处理材料的方法 |
CN102161251A (zh) * | 2010-11-30 | 2011-08-24 | 梅州市志浩电子科技有限公司 | 贴膜设备及采用该贴膜设备的贴膜工艺 |
CN102131349B (zh) * | 2010-01-14 | 2013-10-16 | 富葵精密组件(深圳)有限公司 | 滚压装置及滚压电路板的方法 |
CN103369850A (zh) * | 2012-03-30 | 2013-10-23 | 北大方正集团有限公司 | Pcb喷淋蚀刻生产线 |
CN105200425A (zh) * | 2015-09-28 | 2015-12-30 | 惠州市特创电子科技有限公司 | 刻蚀设备 |
CN108472693A (zh) * | 2015-11-04 | 2018-08-31 | 吉布尔·施密德有限责任公司 | 处理流体-抽吸装置和包含其的蚀刻装置 |
CN109104821A (zh) * | 2018-08-27 | 2018-12-28 | 珠海研深科技有限公司 | 一种蚀刻系统 |
CN112822873A (zh) * | 2019-11-15 | 2021-05-18 | 宇泰和股份有限公司 | 高纵深比电路板通孔化学处理/电化学处理装置 |
CN114143983A (zh) * | 2021-08-28 | 2022-03-04 | 深圳市赛姆烯金科技有限公司 | 线路板石墨烯金属化水平自动制造系统和方法 |
-
2002
- 2002-02-11 CN CN 02107722 patent/CN1269994C/zh not_active Expired - Lifetime
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1910972B (zh) * | 2004-01-16 | 2010-10-13 | 埃托特克德国有限公司 | 喷嘴装置及用于以处理介质处理待处理材料的方法 |
CN102131349B (zh) * | 2010-01-14 | 2013-10-16 | 富葵精密组件(深圳)有限公司 | 滚压装置及滚压电路板的方法 |
CN102161251A (zh) * | 2010-11-30 | 2011-08-24 | 梅州市志浩电子科技有限公司 | 贴膜设备及采用该贴膜设备的贴膜工艺 |
CN103369850A (zh) * | 2012-03-30 | 2013-10-23 | 北大方正集团有限公司 | Pcb喷淋蚀刻生产线 |
CN103369850B (zh) * | 2012-03-30 | 2016-08-03 | 北大方正集团有限公司 | Pcb喷淋蚀刻生产线 |
CN105200425A (zh) * | 2015-09-28 | 2015-12-30 | 惠州市特创电子科技有限公司 | 刻蚀设备 |
CN105200425B (zh) * | 2015-09-28 | 2018-05-18 | 惠州市特创电子科技有限公司 | 刻蚀设备 |
CN108472693A (zh) * | 2015-11-04 | 2018-08-31 | 吉布尔·施密德有限责任公司 | 处理流体-抽吸装置和包含其的蚀刻装置 |
CN109104821A (zh) * | 2018-08-27 | 2018-12-28 | 珠海研深科技有限公司 | 一种蚀刻系统 |
CN112822873A (zh) * | 2019-11-15 | 2021-05-18 | 宇泰和股份有限公司 | 高纵深比电路板通孔化学处理/电化学处理装置 |
CN114143983A (zh) * | 2021-08-28 | 2022-03-04 | 深圳市赛姆烯金科技有限公司 | 线路板石墨烯金属化水平自动制造系统和方法 |
CN114143983B (zh) * | 2021-08-28 | 2024-04-05 | 深圳市赛姆烯金科技有限公司 | 线路板石墨烯金属化水平自动制造系统和方法 |
Also Published As
Publication number | Publication date |
---|---|
CN1269994C (zh) | 2006-08-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR101073340B1 (ko) | 기판 세정 처리 장치 | |
CN1269994C (zh) | 对印刷电路板进行喷射操作的装置 | |
JP4117135B2 (ja) | プリント回路板のスプレー処理装置 | |
CN104781452A (zh) | 用于处理待处理的扁平材料的装置及方法 | |
CN105297014B (zh) | 湿制程系统 | |
CN100377297C (zh) | 衬底处理装置 | |
CN1576961A (zh) | 基板的处理装置和处理方法 | |
KR101218449B1 (ko) | 기판 처리 장치 | |
CN1447395A (zh) | 基板处理装置 | |
CN1867805A (zh) | 用于对处理过的物品进行干燥的装置和方法 | |
JPH1070103A (ja) | 半導体ウェーハウェットエッチング処理装置 | |
CN1959951A (zh) | 运送处理装置 | |
KR101563229B1 (ko) | 인쇄회로기판의 습식 에칭 공정에서 기판 위의 퍼들링 제거를 위한 흡입 롤러 장치 | |
CN1341489A (zh) | 加压浮出装置 | |
JP3173836U (ja) | 板状被処理物に付着する酸素ガス泡の除去手段を備えた水平電解メッキ装置 | |
JP4092971B2 (ja) | プリント配線板の表面処理装置 | |
KR102432828B1 (ko) | 기판 처리 장치 | |
JP3901635B2 (ja) | 板材の酸処理設備 | |
CN112566383B (zh) | 一种逆变器主板蚀刻设备 | |
JP5289296B2 (ja) | 処理液の回収装置 | |
CN101004281B (zh) | 用于在洁净间中待处理之产品的、特别是用于液晶屏幕之玻璃板的货栈以及用于在这样的货栈中使产品保持洁净的方法 | |
JP2004006631A (ja) | 基板処理装置 | |
KR102545295B1 (ko) | 처리 유체 추출 장치 및 이를 포함하는 에칭 장치 | |
JP3955382B2 (ja) | スプレー塗装装置におけるスラッジ回収装置 | |
CN210897202U (zh) | 喷雾处理装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Kai MEI COMPANY LIMITED Assignor: Pill Registered Businessman Contract record no.: 2010990000804 Denomination of invention: Apparatus for spraying printed circuit-board Granted publication date: 20060816 License type: Exclusive License Open date: 20030827 Record date: 20101009 |
|
ASS | Succession or assignment of patent right |
Owner name: ACER COMPUTER (CHINA) CO., LTD. Free format text: FORMER OWNER: BEIDA FANGZHENG SCIENCE + TECHNOLOGY COMPUTER SYSTEM CO., LTD., SHANGHAI Effective date: 20101029 |
|
C41 | Transfer of patent application or patent right or utility model | ||
COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 102200 ROOM 204, SECONDARY BUILDING, FANGZHENG BUILDING, NO.9, SHANGDI STREET 5, HAIDIAN DISTRICT, BEIJING TO: 200001 3/F, NO.168, XIZANG MIDDLE ROAD, HUANGPU DISTRICT, SHANGHAI |
|
TR01 | Transfer of patent right |
Effective date of registration: 20101104 Address after: Germany Wald auen Patentee after: Pierre limited liability company Address before: Orn Wald, Federal Republic of Germany Patentee before: Pill Registered Businessman |
|
ASS | Succession or assignment of patent right |
Owner name: UNIVERSE P. C. B. EQUIPMENT CO., LTD. Free format text: FORMER OWNER: PEAL CO., LTD. Effective date: 20130927 |
|
C41 | Transfer of patent application or patent right or utility model | ||
COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; TO: HONG KONG, CHINA |
|
TR01 | Transfer of patent right |
Effective date of registration: 20130927 Address after: Hongkong Road, No. 8 China Tun door center 15 floor, room 1510-1513, CIMB Patentee after: Universal P.C.B. Equipment Ltd Address before: Germany Wald auen Patentee before: Pierre limited liability company |
|
CX01 | Expiry of patent term |
Granted publication date: 20060816 |
|
CX01 | Expiry of patent term |