CN1429471A - 印刷电路板单面和双面装配的流水作业线 - Google Patents
印刷电路板单面和双面装配的流水作业线 Download PDFInfo
- Publication number
- CN1429471A CN1429471A CN01809301A CN01809301A CN1429471A CN 1429471 A CN1429471 A CN 1429471A CN 01809301 A CN01809301 A CN 01809301A CN 01809301 A CN01809301 A CN 01809301A CN 1429471 A CN1429471 A CN 1429471A
- Authority
- CN
- China
- Prior art keywords
- production line
- printed circuit
- assembling
- circuit board
- pcb
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 56
- 238000005476 soldering Methods 0.000 claims abstract description 11
- 238000000034 method Methods 0.000 description 21
- 230000000694 effects Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 239000003990 capacitor Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000006386 neutralization reaction Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/085—Production planning, e.g. of allocation of products to machines, of mounting sequences at machine or facility level
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53187—Multiple station assembly apparatus
Abstract
Description
Claims (5)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10023358A DE10023358A1 (de) | 2000-05-12 | 2000-05-12 | Fertigungslinie für die einseitige und doppelseitige Bestückung von Leiterplatten |
DE10023358.9 | 2000-05-12 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1429471A true CN1429471A (zh) | 2003-07-09 |
CN1199550C CN1199550C (zh) | 2005-04-27 |
Family
ID=7641840
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB018093019A Expired - Fee Related CN1199550C (zh) | 2000-05-12 | 2001-05-09 | 印刷电路板单面和双面装配的流水作业线 |
Country Status (7)
Country | Link |
---|---|
US (1) | US20030154596A1 (zh) |
EP (1) | EP1281305B1 (zh) |
JP (1) | JP2004507075A (zh) |
KR (1) | KR100791152B1 (zh) |
CN (1) | CN1199550C (zh) |
DE (2) | DE10023358A1 (zh) |
WO (1) | WO2001087035A1 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102933068A (zh) * | 2011-07-27 | 2013-02-13 | 富士机械制造株式会社 | 电子元件安装系统 |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6318437B1 (en) * | 1998-07-09 | 2001-11-20 | Samsung Aerospace Industries, Ltd. | Tape feeder for component part mounter |
JP4745825B2 (ja) * | 2003-07-22 | 2011-08-10 | 富士機械製造株式会社 | 電子回路生産方法および電子回路生産システム |
DE102005045161A1 (de) * | 2005-09-21 | 2007-04-05 | Endress + Hauser Gmbh + Co. Kg | Vorrichtung zum Wenden und Bestücken von Leiterplatten |
DE102006020012B4 (de) * | 2006-04-26 | 2019-01-03 | Behr-Hella Thermocontrol Gmbh | Verfahren zur Erstellung von beidseitig mit Bauteilen bestückten Leiterkarten |
DE102008019102A1 (de) | 2008-04-16 | 2009-10-29 | Siemens Aktiengesellschaft | Anordnung zum Transport von Substraten, Anordnung zum Handhaben von Substraten, Anordnung zum Herstellen elektronischer Baugruppen sowie Verfahren zum Handhaben von Substraten |
CN102689071B (zh) * | 2012-06-18 | 2016-07-06 | 日东电子科技(深圳)有限公司 | 回流焊接设备 |
CN106276784B (zh) * | 2015-05-13 | 2017-11-24 | 无锡华润安盛科技有限公司 | 一种Flip Chip生产线 |
CN108282993A (zh) * | 2017-12-27 | 2018-07-13 | 昆山遥矽微电子科技有限公司 | 安装印刷电路板的流水线 |
CN116193754B (zh) * | 2023-04-26 | 2023-08-22 | 云泰智能科技(天津)有限责任公司 | 一种印刷电路板及其防护件 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2634319B1 (fr) * | 1988-07-13 | 1990-09-07 | Europ Composants Electron | Procede de soudure des fils de connexions exterieures sur un composant electronique |
US5170554A (en) * | 1990-09-28 | 1992-12-15 | Hewlett-Packard Company | High mix printed circuit assembly technique |
AU651881B2 (en) * | 1991-03-18 | 1994-08-04 | Fujitsu Limited | System for producing printed-wiring board unit and its producing method |
US5371940A (en) * | 1991-05-24 | 1994-12-13 | Fujitsu Limited | Pallet arranging system |
JPH056212A (ja) * | 1991-06-27 | 1993-01-14 | Mitsubishi Electric Corp | 部品搭載機用データ作成方法 |
JPH06232543A (ja) * | 1993-02-04 | 1994-08-19 | Omron Corp | プリント基板の部品実装方法 |
JP2518539B2 (ja) * | 1993-11-15 | 1996-07-24 | 日本電気株式会社 | 縦型リフロ―半田付装置 |
DE4433565A1 (de) * | 1994-09-20 | 1996-03-21 | Blaupunkt Werke Gmbh | Einrichtung zum automatischen Bestücken der Ober- und Unterseite von Leiterplatten mit SMD-Bauteilen |
JP3702496B2 (ja) * | 1995-07-10 | 2005-10-05 | 三菱電機株式会社 | 数値制御装置を用いた加工方法 |
US5678304A (en) * | 1996-07-24 | 1997-10-21 | Eastman Kodak Company | Method for manufacturing double-sided circuit assemblies |
-
2000
- 2000-05-12 DE DE10023358A patent/DE10023358A1/de not_active Withdrawn
-
2001
- 2001-05-09 CN CNB018093019A patent/CN1199550C/zh not_active Expired - Fee Related
- 2001-05-09 EP EP01943042A patent/EP1281305B1/de not_active Expired - Lifetime
- 2001-05-09 KR KR1020027015100A patent/KR100791152B1/ko not_active IP Right Cessation
- 2001-05-09 JP JP2001583114A patent/JP2004507075A/ja not_active Ceased
- 2001-05-09 WO PCT/DE2001/001759 patent/WO2001087035A1/de active IP Right Grant
- 2001-05-09 US US10/275,545 patent/US20030154596A1/en not_active Abandoned
- 2001-05-09 DE DE50110454T patent/DE50110454D1/de not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102933068A (zh) * | 2011-07-27 | 2013-02-13 | 富士机械制造株式会社 | 电子元件安装系统 |
CN102933068B (zh) * | 2011-07-27 | 2016-08-17 | 富士机械制造株式会社 | 电子元件安装系统 |
Also Published As
Publication number | Publication date |
---|---|
DE50110454D1 (de) | 2006-08-24 |
DE10023358A1 (de) | 2001-11-29 |
KR20030010619A (ko) | 2003-02-05 |
EP1281305A1 (de) | 2003-02-05 |
WO2001087035A1 (de) | 2001-11-15 |
JP2004507075A (ja) | 2004-03-04 |
US20030154596A1 (en) | 2003-08-21 |
EP1281305B1 (de) | 2006-07-12 |
CN1199550C (zh) | 2005-04-27 |
KR100791152B1 (ko) | 2008-01-02 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: SIEMENS ELECTRONICS ASSEMBLY SYSTEMS LIMITED PARTN Free format text: FORMER OWNER: SIEMENS AG Effective date: 20091030 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20091030 Address after: Munich, Germany Patentee after: Siemens AG (DE) Address before: Munich, Germany Patentee before: Siemens AG |
|
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20050427 Termination date: 20100509 |