KR100791152B1 - 프린트 회로 기판의 단면 및 양면 조립을 위한 제조 라인 - Google Patents

프린트 회로 기판의 단면 및 양면 조립을 위한 제조 라인 Download PDF

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Publication number
KR100791152B1
KR100791152B1 KR1020027015100A KR20027015100A KR100791152B1 KR 100791152 B1 KR100791152 B1 KR 100791152B1 KR 1020027015100 A KR1020027015100 A KR 1020027015100A KR 20027015100 A KR20027015100 A KR 20027015100A KR 100791152 B1 KR100791152 B1 KR 100791152B1
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KR
South Korea
Prior art keywords
printed circuit
assembly
circuit board
elements
sided
Prior art date
Application number
KR1020027015100A
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English (en)
Korean (ko)
Other versions
KR20030010619A (ko
Inventor
안드레아스 가이츠
우베 크랍스
Original Assignee
지멘스 악티엔게젤샤프트
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 지멘스 악티엔게젤샤프트 filed Critical 지멘스 악티엔게젤샤프트
Publication of KR20030010619A publication Critical patent/KR20030010619A/ko
Application granted granted Critical
Publication of KR100791152B1 publication Critical patent/KR100791152B1/ko

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/085—Production planning, e.g. of allocation of products to machines, of mounting sequences at machine or facility level
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53187—Multiple station assembly apparatus

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Combinations Of Printed Boards (AREA)
KR1020027015100A 2000-05-12 2001-05-09 프린트 회로 기판의 단면 및 양면 조립을 위한 제조 라인 KR100791152B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE10023358A DE10023358A1 (de) 2000-05-12 2000-05-12 Fertigungslinie für die einseitige und doppelseitige Bestückung von Leiterplatten
DE10023358.9 2000-05-12
PCT/DE2001/001759 WO2001087035A1 (de) 2000-05-12 2001-05-09 Fertigungslinie für die einseitige und doppelseitige bestückung von leiterplatten

Publications (2)

Publication Number Publication Date
KR20030010619A KR20030010619A (ko) 2003-02-05
KR100791152B1 true KR100791152B1 (ko) 2008-01-02

Family

ID=7641840

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020027015100A KR100791152B1 (ko) 2000-05-12 2001-05-09 프린트 회로 기판의 단면 및 양면 조립을 위한 제조 라인

Country Status (7)

Country Link
US (1) US20030154596A1 (zh)
EP (1) EP1281305B1 (zh)
JP (1) JP2004507075A (zh)
KR (1) KR100791152B1 (zh)
CN (1) CN1199550C (zh)
DE (2) DE10023358A1 (zh)
WO (1) WO2001087035A1 (zh)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6318437B1 (en) * 1998-07-09 2001-11-20 Samsung Aerospace Industries, Ltd. Tape feeder for component part mounter
JP4745825B2 (ja) * 2003-07-22 2011-08-10 富士機械製造株式会社 電子回路生産方法および電子回路生産システム
DE102005045161A1 (de) * 2005-09-21 2007-04-05 Endress + Hauser Gmbh + Co. Kg Vorrichtung zum Wenden und Bestücken von Leiterplatten
DE102006020012B4 (de) * 2006-04-26 2019-01-03 Behr-Hella Thermocontrol Gmbh Verfahren zur Erstellung von beidseitig mit Bauteilen bestückten Leiterkarten
DE102008019102A1 (de) 2008-04-16 2009-10-29 Siemens Aktiengesellschaft Anordnung zum Transport von Substraten, Anordnung zum Handhaben von Substraten, Anordnung zum Herstellen elektronischer Baugruppen sowie Verfahren zum Handhaben von Substraten
JP5780869B2 (ja) * 2011-07-27 2015-09-16 富士機械製造株式会社 電子部品実装システム
CN102689071B (zh) * 2012-06-18 2016-07-06 日东电子科技(深圳)有限公司 回流焊接设备
CN106276784B (zh) * 2015-05-13 2017-11-24 无锡华润安盛科技有限公司 一种Flip Chip生产线
CN108282993A (zh) * 2017-12-27 2018-07-13 昆山遥矽微电子科技有限公司 安装印刷电路板的流水线
CN116193754B (zh) * 2023-04-26 2023-08-22 云泰智能科技(天津)有限责任公司 一种印刷电路板及其防护件

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR970005523A (ko) * 1995-07-10 1997-02-19 원본미기재 수치제어장치를 사용한 가공방법
US5678304A (en) * 1996-07-24 1997-10-21 Eastman Kodak Company Method for manufacturing double-sided circuit assemblies

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2634319B1 (fr) * 1988-07-13 1990-09-07 Europ Composants Electron Procede de soudure des fils de connexions exterieures sur un composant electronique
US5170554A (en) * 1990-09-28 1992-12-15 Hewlett-Packard Company High mix printed circuit assembly technique
GB2262495B (en) * 1991-03-18 1994-08-24 Fujitsu Ltd System for manufacturing printed wiring board units and method of manufacturing the same
US5371940A (en) * 1991-05-24 1994-12-13 Fujitsu Limited Pallet arranging system
JPH056212A (ja) * 1991-06-27 1993-01-14 Mitsubishi Electric Corp 部品搭載機用データ作成方法
JPH06232543A (ja) * 1993-02-04 1994-08-19 Omron Corp プリント基板の部品実装方法
JP2518539B2 (ja) * 1993-11-15 1996-07-24 日本電気株式会社 縦型リフロ―半田付装置
DE4433565A1 (de) * 1994-09-20 1996-03-21 Blaupunkt Werke Gmbh Einrichtung zum automatischen Bestücken der Ober- und Unterseite von Leiterplatten mit SMD-Bauteilen

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR970005523A (ko) * 1995-07-10 1997-02-19 원본미기재 수치제어장치를 사용한 가공방법
US5678304A (en) * 1996-07-24 1997-10-21 Eastman Kodak Company Method for manufacturing double-sided circuit assemblies

Also Published As

Publication number Publication date
EP1281305B1 (de) 2006-07-12
WO2001087035A1 (de) 2001-11-15
DE10023358A1 (de) 2001-11-29
KR20030010619A (ko) 2003-02-05
DE50110454D1 (de) 2006-08-24
CN1199550C (zh) 2005-04-27
EP1281305A1 (de) 2003-02-05
CN1429471A (zh) 2003-07-09
US20030154596A1 (en) 2003-08-21
JP2004507075A (ja) 2004-03-04

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