CN1419581A - 低热膨胀层压板 - Google Patents

低热膨胀层压板 Download PDF

Info

Publication number
CN1419581A
CN1419581A CN01807318A CN01807318A CN1419581A CN 1419581 A CN1419581 A CN 1419581A CN 01807318 A CN01807318 A CN 01807318A CN 01807318 A CN01807318 A CN 01807318A CN 1419581 A CN1419581 A CN 1419581A
Authority
CN
China
Prior art keywords
resin
lowly
heat
laminate
weight
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN01807318A
Other languages
English (en)
Other versions
CN1205257C (zh
Inventor
井上伦子
奥村浩也
平田勳夫
冈田茂浩
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Nippon Shokubai Co Ltd
Original Assignee
Mitsui Takeda Chemicals Inc
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Takeda Chemicals Inc, Matsushita Electric Works Ltd filed Critical Mitsui Takeda Chemicals Inc
Publication of CN1419581A publication Critical patent/CN1419581A/zh
Application granted granted Critical
Publication of CN1205257C publication Critical patent/CN1205257C/zh
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/22Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed
    • B32B5/24Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer
    • B32B5/26Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer another layer next to it also being fibrous or filamentary
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/04Reinforcing macromolecular compounds with loose or coherent fibrous material
    • C08J5/06Reinforcing macromolecular compounds with loose or coherent fibrous material using pretreated fibrous materials
    • C08J5/08Reinforcing macromolecular compounds with loose or coherent fibrous material using pretreated fibrous materials glass fibres
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/04Layered products comprising a layer of synthetic resin as impregnant, bonding, or embedding substance
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/18Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/20Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/02Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
    • B32B5/022Non-woven fabric
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/02Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
    • B32B5/024Woven fabric
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F283/00Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
    • C08F283/01Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to unsaturated polyesters
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/06Polymers provided for in subclass C08G
    • C08F290/064Polymers containing more than one epoxy group per molecule
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/241Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
    • C08J5/244Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/249Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs characterised by the additives used in the prepolymer mixture
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0313Organic insulating material
    • H05K1/0353Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/04Impregnation, embedding, or binder material
    • B32B2260/046Synthetic resin
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/10Inorganic fibres
    • B32B2262/101Glass fibres
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2264/00Composition or properties of particles which form a particulate layer or are present as additives
    • B32B2264/02Synthetic macromolecular particles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2305/00Condition, form or state of the layers or laminate
    • B32B2305/72Cured, e.g. vulcanised, cross-linked
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/70Other properties
    • B32B2307/732Dimensional properties
    • B32B2307/734Dimensional stability
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2398/00Unspecified macromolecular compounds
    • B32B2398/20Thermoplastics
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2605/00Vehicles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2605/00Vehicles
    • B32B2605/12Ships
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0313Organic insulating material
    • H05K1/0353Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036Multilayers with layers of different types
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0313Organic insulating material
    • H05K1/0353Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01Dielectrics
    • H05K2201/0104Properties and characteristics in general
    • H05K2201/0129Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01Dielectrics
    • H05K2201/0137Materials
    • H05K2201/0145Polyester, e.g. polyethylene terephthalate [PET], polyethylene naphthalate [PEN]
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203Fillers and particles
    • H05K2201/0206Materials
    • H05K2201/0209Inorganic, non-metallic particles
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203Fillers and particles
    • H05K2201/0206Materials
    • H05K2201/0212Resin particles
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06Thermal details
    • H05K2201/068Thermal details wherein the coefficient of thermal expansion is important
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/249921Web or sheet containing structurally defined element or component
    • Y10T428/249924Noninterengaged fiber-containing paper-free web or sheet which is not of specified porosity
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/25Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/25Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y10T428/254Polymeric or resinous material
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/26Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/29Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • Y10T428/2904Staple length fiber
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/29Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • Y10T428/2913Rod, strand, filament or fiber
    • Y10T428/2927Rod, strand, filament or fiber including structurally defined particulate matter
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/29Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • Y10T428/2913Rod, strand, filament or fiber
    • Y10T428/298Physical dimension
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/29Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • Y10T428/2982Particulate matter [e.g., sphere, flake, etc.]
    • Y10T428/2991Coated
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/31504Composite [nonstructural laminate]
    • Y10T428/31786Of polyester [e.g., alkyd, etc.]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Polymers & Plastics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Textile Engineering (AREA)
  • Laminated Bodies (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Superconductors And Manufacturing Methods Therefor (AREA)

Abstract

本发明公开了一种通过层压并固化浸渍有树脂组合物的纤维增强层而得到,所述树脂组合物包含含自由基可聚合树脂、自由基可聚合单体和无机填料以及特定量的热塑料树脂混合得到的低热膨胀层压板。该层压板具有优异的耐热性,耐水性、韧性并在40-150℃温度范围内的平均线性膨胀系数为20×10-6/℃或更低。

Description

低热膨胀层压板
技术领域
本发明涉及一种具有低热膨胀和优异的韧性,耐热性和耐水性的层压板,尤其涉及复合层压板。
背景技术
自由基可聚合树脂如不饱和聚酯树脂或乙烯基酯树脂的固化制品在机械,化学和电特性方面具有平衡良好的性能,并已广泛用于装饰、运输和汽车工业领域中。
但这些自由基可聚合树脂的固化制品在利用其优异的耐热性,耐水性和电特性而应用于印刷电路板所用的层压板或绝缘板时产生不足的板韧性和耐冲击性并在穿孔工艺过程中在纤维增强层之间成问题地发生开裂或脱层。
为了克服该问题,将液体橡胶组分加入树脂以增加韧性,但包含橡胶组分的树脂的固化制品具有高热膨胀率,这对在高温下使用的层压板并不总是合适的。
因此,为了将固化制品的热膨胀率减至最低,例如日本专利申请延迟公开No.231654(1996)提出了一种方法,其中将聚合物细颗粒加入自由基可聚合树脂。
但在该方法中,应加入大量的聚合物细颗粒以得到足够低的热膨胀。遗憾的是,如此加入大量的聚合物细颗粒导致树脂及其组合物的粘度升高,产生新的问题,即,难以通过常规的方法和装置来生产树脂组合物。
本发明的一个目的是提供一种层压板,尤其复合层压板,它由其主要组分是自由基可聚合树脂的树脂组合物而得到,它具有优异的韧性,耐热性和耐水性,它具有低热膨胀率使得在40-150℃温度范围内的平均线性膨胀系数(10-6/℃)不高于20,它可在升高的温度下加工和使用,且它可以较低成本制成但可产生可与常规的昂贵材料如环氧树脂相当的性能。
本发明的公开内容
我们为解决上述问题作出努力并发现由包含自由基聚合树脂并结合有特定量的热塑性树脂的树脂组合物得到的层压板可解决上述问题,然后进一步尝试以确立本发明。
因此,本发明是:
1.一种低热膨胀层压板,它通过固化浸渍有热固性树脂组合物的纤维增强层的层压材料而得到,所述组合物包含(a)自由基可聚合树脂,(b)热塑性树脂,(c)自由基可聚合单体和(d)无机填料,其中(a)的存在量为10-75重量份,(b)的存在量为2-30重量份,(c)的存在量为20-60重量份和(d)的存在量为5-250重量份,基于100重量份的(a),(b)和(c)的总重。
2.根据上述1的低热膨胀层压板,其中所述层压品在40℃-150℃温度范围内的平均线性膨胀系数不高于20×10-6/℃。
3.根据上述1或2的低热膨胀层压板,其中热塑性树脂(b)的玻璃转变点不高于60℃。
4.根据上述1或2的低热膨胀层压板,其中热塑性树脂(b)是一种其玻璃转变点不高于60℃的饱和聚酯树脂。
5.根据上述1或2的低热膨胀层压板,其中热塑性树脂(b)是一种其玻璃转变点不高于60℃且其数均分子量是2,000-100,000的饱和聚酯树脂。
6.根据上述1-5任何一项的低热膨胀层压板,它进一步包含其颗粒尺寸是0.1-5.0μm的聚合物细颗粒(e)。
7.根据上述1-6任何一项的低热膨胀层压板,其中纤维增强层的层压材料是一种浸渍有热固性树脂组合物的玻璃纤维织制织物作为表面层并层压有的衬里内层的复合层压材料,所述内层是一种浸渍有热塑性树脂组合物的玻璃纤维无纺织物。
8.根据上述1-7任何一项的低热膨胀层压板,其中自由基可聚合树脂(a)是乙烯基酯树脂或不饱和聚酯树脂。
9.一种金属箔覆盖的层压板,它采用根据上述1-8任何一项的低热膨胀层压板。
尽管对用于本发明的自由基可聚合树脂(a)不特别限定,只要它是一种具有烯属不饱和键的树脂,但优选使用的是通过将烯属不饱和一价酸加成到环氧树脂上而得到的乙烯基酯树脂、和通过应该包含α,β-烯烃不饱和二羧酸或其酸酐的二羧酸和二醇之间的脱水缩合反应而制成的不饱和聚酯树脂。
作为乙烯基酯树脂的起始原料,环氧树脂可以是例如公开于日本专利申请延迟公开No.110948(1997)的那些,如包括双酚A和双酚F的双酚环氧树脂,包括苯酚酚醛清漆[如,YDPN638,由TOTO KASEI CO.LTD.生产,环氧当量:200]和甲酚酚醛清漆[如,YDCN702P,由TOTO KASEI CO.LTD.生产,环氧当量:200]的酚醛清漆环氧树脂,脂族环氧树脂,含氮的环氧树脂(如,三缩水甘油基异氰脲酸酯),共聚物环氧树脂和类似物。
烯属不饱和一价酸可以是例如不饱和单羧酸如(甲基)丙烯酸以及多价酸酐和同时在一个分子中具有至少一个(甲基)丙烯酸双键和醇OH基团的化合物之间的反应产物。
同时具有至少一种(甲基)丙烯酸双键和醇OH基团的化合物可以是例如(甲基)丙烯酸羟乙基酯,(甲基)丙烯酸羟丙基酯,(甲基)丙烯酸羟丁基酯,季戊四醇三(甲基)丙烯酸酯,甘油二(甲基)丙烯酸酯,(甲基)丙烯酸和多元醇之间的反应产物。在以上列举的这些中,(甲基)丙烯酸是优选的。
环氧树脂和上述烯属不饱和一价酸之间的反应可通过已知的方法进行。例如,反应在80-150℃下在聚合反应抑制剂如氢醌和催化剂如叔胺如,苄基二甲基胺或磷化合物如三苯基膦的存在下进行1-20小时,这样得到预期的乙烯基酯树脂。
尽管环氧基团和羧基基团之间的反应在乙烯基酯化反应是1比1当量反应,但该合成有时也可用过量的环氧基团或用过量的羧基基团进行。
用于本发明的不饱和聚酯树脂可通过α,β-烯烃不饱和二羧酸和二醇之间的缩合而合成。除了这两种组分,也可在不饱和聚酯树脂的合成中采用饱和二羧酸,芳族二羧酸或能够与二羧酸反应的二环戊二烯。
α,β-烯烃不饱和二羧酸可例如是马来酸,富马酸,衣康酸,柠康酸和这些二羧酸的酸酐。能够与这种α,β-烯烃不饱和二羧酸一起使用的二羧酸可例如是己二酸,癸二酸,琥珀酸,葡萄糖酸,o-,m-,p-邻苯二甲酸,四氢邻苯二甲酸,六氢邻苯二甲酸和类似物。
二醇可例如是链烷二醇,氧杂-链烷二醇,通过将氧化烯如氧化乙烯或氧化丙烯加成到双酚A上而得到的二醇。另外,也可使用一元或三元醇。链烷二醇可例如是乙二醇,1,2-丙二醇,1,3-丙二醇,1,3-丁二醇,1,4-丁二醇,新戊二醇,1,5-戊二醇,1,6-己二醇,环己烷二醇,氢化双酚A和类似物。氧杂-链烷二醇可例如是二氧基乙二醇和三甘醇。与上述二醇一起使用的一元或三元醇可例如是辛醇,苄基醇,三羟甲基丙烷和类似物。
不饱和聚酯树脂的合成一般在加热下进行,同时去除作为副产物产生的水。一般,不饱和聚酯树脂的Tg可通过选择起始原料降低树脂的交联密度和反应性,或通过由作为饱和酸的己二酸或癸二酸和作为具有长链分子结构的二醇的二甘醇或二亚丙基二醇为原料而降低。相反,树脂的Tg可通过选择起始原料增加树脂的交联密度或反应性或通过由作为具有刚性结构的二醇的氢化双酚A为原料而升高。
自由基可聚合树脂(a)的用量通常是10-75重量份,优选30-67重量份,基于被认为是100重量份的组分(a),(b)和(c)的总重。
热塑性树脂(b)在本发明中中的用量可例如是在不饱和聚酯树脂中常用作低分布剂(low profile agent)的热塑性树脂。这种热塑性树脂可例如是聚丁二烯或其氢化衍生物,聚异戊二烯或其氢化衍生物,芳族乙烯基/共轭二烯嵌段共聚物或其氢化衍生物,聚苯乙烯,苯乙烯/乙酸乙烯酯嵌段共聚物,聚乙酸乙烯酯,聚甲基丙烯酸甲酯,以及饱和聚酯树脂,聚醚树脂和类似物。在以上列举的那些中,芳族乙烯基/共轭二烯嵌段共聚物和饱和聚酯树脂是优选的,其中饱和聚酯树脂是尤其优选的。
尽管并不特别限定作为热塑性树脂的饱和聚酯树脂,但它优选具有60℃或更低,更优选50℃或更低的Tg。高于60℃的饱和聚酯树脂的Tg可导致难以充分降低固化制品的热膨胀率。
饱和聚酯树脂通常可以是用作SMC和类似物的单个组分抗收缩剂的那些,例如,由二羧酸如对苯二甲酸,间苯二甲酸,琥珀酸,己二酸,癸二酸,壬二酸和类似物和二醇如乙二醇,丙二醇,新戊二醇,1,6-己二醇,二甘醇,双丙甘醇,和类似物合成的那些。
尽管并不特别限定饱和聚酯树脂的分子量,但数均分子量通常是2,000-100,000,优选3,000-30,000,因为太低的分子量导致耐热性下降,而太高的分子量导致高粘度。
饱和聚酯树脂可例如是TTK-101(由TAKEDA化学INDUSTRIES LTD.生产)和BYLON300,630,550(由TOYOBO CO.,LTD.生产)。
芳族乙烯基/共轭二烯嵌段共聚物也是热塑性树脂(b)的优选例子。
芳族乙烯基/共轭二烯嵌段共聚物可以是本身已知的嵌段共聚物,而且可通过常规的聚合反应方法由芳族乙烯基单体如苯乙烯,氯苯乙烯和乙烯基甲苯与共轭二烯单体如丁二烯和异戊二烯的嵌段共聚反应而合成。这种嵌段共聚物可例如是苯乙烯/异戊二烯嵌段共聚物。这些嵌段共聚物的芳族乙烯基单体和共轭二烯单体的摩尔比是约50∶50-5∶95且平均分子量是约30,000-200,000。
热塑性树脂(b)的加入量通常是2-30重量份,优选2-20重量份,基于被认为是100重量份的组分(a),(b)和(c)的总重。
自由基可聚合单体(c)可例如是不饱和脂肪酸如丙烯酸和甲基丙烯酸,不饱和羧酸盐如甲基丙烯酸甲酯,甲基丙烯酸乙酯,甲基丙烯酸丙酯,甲基丙烯酸丁酯,甲基丙烯酸2-乙基己酯,甲基丙烯酸缩水甘油酯,甲基丙烯酸2-羟乙基酯,丙烯酸甲酯,丙烯酸乙酯,丙烯酸丙酯,丙烯酸丁酯,丙烯酸2-乙基己基酯和丙烯酸十二烷基酯,含氮单体如(甲基)丙烯酰胺和(甲基)丙烯腈,芳族乙烯基化合物如苯乙烯,乙烯基甲苯,二乙烯基苯和对叔-丁基苯乙烯和多官能(甲基)丙烯酸酯如乙二醇二(甲基)丙烯酸酯,二甘醇二(甲基)丙烯酸酯,1,4-丁二醇二(甲基)丙烯酸酯,1,6-己二醇二(甲基)丙烯酸酯,三羟甲基丙烷三(甲基)丙烯酸酯,季戊四醇三(甲基)丙烯酸酯和季戊四醇四(甲基)丙烯酸酯,任何这些物质可单独或相互结合使用。在以上列举的那些中,苯乙烯是尤其优选的。
自由基可聚合单体(c)的加入量通常是20-60重量份,优选25-55重量份,基于被认为是100重量份的组分(a),(b)和(c)的总重。
用于本发明热固性树脂组合物的无机填料(d)可例如是氢氧化铝,玻璃粉末,碳酸钙,滑石,硅石,粘土,玻璃球和类似物。这些物质的用量通常可以是5-250重量份,优选5-200重量份,基于被认为是100重量份的组分(a),(b)和(c)的总重。
层压板的韧性和低热膨胀性能可进一步通过将聚合物细颗粒(e)加入用于本发明的热固性树脂组合物而改进。
聚合物细颗粒(e)优选具有多层结构,但也可使用单层颗粒。这些多层聚合物细颗粒可通过一种连续多级乳液聚合反应而得到,其中在前级别聚合物的存在下,将后级单体顺序地进行种子聚合反应,例如公开于JP-A-8-48704。即,种子胶乳首先通过乳液聚合反应而制成,随后加入用于形成第一层的单体并进行种子聚合反应。随后,加入用于形成第二层的单体并进行种子聚合反应以合成第二层,并重复该步骤直至合成出最外层,这样得到预期的多层结构的聚合物。
在本发明所用聚合物细颗粒(e)的聚合物层的种子聚合反应中使用的反应性不饱和单体可以是在其分子中具有至少一个反应性不饱和键的任何单体,包括共轭二烯如丁二烯,异戊二烯和氯丁二烯,丙烯酸烷基酯如丙烯酸乙酯,丙烯酸丙酯,丙烯酸丁酯,丙烯酸环己基酯,丙烯酸异壬基酯和丙烯酸2-乙基己酯和甲基丙烯酸烷基酯如甲基丙烯酸甲酯,甲基丙烯酸乙酯和甲基丙烯酸环己基酯。任何这些单体可与能够与其共聚的单体共聚,例如,芳族乙烯基或芳族亚乙烯基如苯乙烯,乙烯基甲苯和α-甲基苯乙烯,乙烯基氰化物或亚乙烯基氰化物如丙烯腈和甲基丙烯腈,甲基丙烯酸烷基酯如甲基丙烯酸甲酯和甲基丙烯酸丁酯和芳族(甲基)丙烯酸酯如丙烯酸苄基酯和丙烯酸苯氧基乙酯。
在聚合物细颗粒的聚合物层的聚合反应中,除了上述的单体,可以采用特定量交联单体和接枝单体作为共聚物单体。交联单体的用量可以是基于形成该聚合物的单体的0.1-10%重量,优选0.2-5%重量,而接枝单体的用量可以是基于形成该聚合物的单体的0.1-10%重量,优选0.2-5%重量。
用于本发明的交联单体是一种在其分子中具有至少两个类似可聚合基团的单体,包括芳族二乙烯基化合物如二乙烯基苯和烷烃多元醇聚丙烯酸酯或链烷多元醇聚甲基丙烯酸酯如乙二醇二丙烯酸酯,乙二醇二甲基丙烯酸酯,丁二醇二丙烯酸酯,丁二醇二甲基丙烯酸酯,己二醇二丙烯酸酯,己二醇二甲基丙烯酸酯,低聚乙二醇二丙烯酸酯,低聚乙二醇二甲基丙烯酸酯,三羟甲基丙烷二丙烯酸酯,三羟甲基丙烷三丙烯酸酯和三羟甲基丙烷三甲基丙烯酸酯。在以上列举的那些中,丁二醇二丙烯酸酯和己二醇二丙烯酸酯是尤其优选的。
用于本发明的接枝单体在其分子中具有至少两个具有相互不同的反应性的可聚合基团,例如不饱和羧酸烯丙基酯如丙烯酸烯丙基酯,甲基丙烯酸烯丙基酯,马来酸二烯丙基酯,富马酸二烯丙基酯和衣康酸二烯丙基酯。在以上列举的那些中,甲基丙烯酸烯丙基酯是尤其优选的。
用于本发明的聚合物细颗粒(e)可通过用携带羧基基团或羟基基团的单体改性最外层而用于进一步提高树脂组合物的韧性。
携带羧基基团的单体可例如是丙烯酸,甲基丙烯酸,马来酸和衣康酸。携带羟基基团的单体可例如是(甲基)丙烯酸2-羟基乙基酯,(甲基)丙烯酸2-羟基丙基酯和(甲基)丙烯酸2-羟丁基酯。在以上列举的那些中,甲基丙烯酸是优选的携带羧基基团的单体,而甲基丙烯酸2-羟乙基酯是优选的携带羟基基团的单体。
这种携带官能基团的单体的量低于10%重量,优选低于5%重量,基于形成最外层的单体。超过上述范围的携带官能基团的单体的量可导致在树脂中的分散性下降,造成树脂组合物的粘度升高或固化制品不好的外观或机械性能。
用于本发明的聚合物细颗粒(e)具有作为至少一个内层的聚合物层,该层具有不高于20℃的Tg,存在量为基于多层结构聚合物的50-95%重量,优选70-90%重量。如果Tg不高于20℃的聚合物层的量低于上述水平,可导致树脂组合物的韧性改进不足或低热膨胀性能,而超过上述水平的量可导致在树脂中的分散性下降,造成树脂组合物的粘度升高或硬化制品不好的外观或机械性能。
用于本发明的聚合物细颗粒(e)优选具有其Tg是40℃或更高的最外层。如果不存在该最外层,难以在树脂中进行分散且粘度下降。
如此聚合的聚合物细颗粒(e)的颗粒尺寸通常是0.1-5.0μm,优选0.2-2.0μm。较小的颗粒尺寸可增加树脂组合物的粘度,并导致不好的树脂生产率,或对低热膨胀性能改进不足。相反,较大的颗粒尺寸可导致不足的韧性。颗粒尺寸是指处于胶乳状态的多层结构聚合物的单个颗粒在该多层结构聚合物的生产过程中的重量平均颗粒尺寸,而且可通过动态光散射方法使用动态光散射计(例如,LPA-3000/LPA-3100,由OTSUKADENSHI KK生产)而测定。
本发明的聚合物细颗粒(e)可以用下述方式使用,使得通过上述方法聚合的聚合物胶乳曾被冷却并随后融化以分离聚合物颗粒并随后离心处理以脱水并随后干燥并将所得粉末分散在树脂(a)和(c)的混合物中,或它可混合使得该胶乳自身被放在组分(a)的起始原料中并蒸馏掉水并随后合成组分(a)。
聚合物细颗粒(e)在本发明中中的用量通常是0.1-15重量份,优选0.5-10重量份,基于被认为是100重量份的组分(a),(b)和(c)的总重。
固化剂用于固化本发明的树脂组合物。
用于本发明的这种固化剂可例如是有机过氧化物如甲基乙基酮过氧化物,过苯甲酸叔丁基酯,过氧化苯甲酰,过氧化二枯基和氢过氧化枯烯。固化剂的用量优选为0.1-3重量份,基于被认为是100重量份的组分(a),(b)和(c)的总重。由包含这些组分(a),(b)和(c)的树脂组合物得到的固化制品的Tg优选为120℃或更高,更优选135℃或更高。
按照本发明,浸渍有包含组分(a),(b),(c)和(d)的热固性树脂组合物的纤维增强层可以是常用于层压板的任何材料例如玻璃无纺织物,玻璃纺织物和纸基材。
本发明的层压板可通过叠放三层或多层浸渍有包含固化剂的热固性树脂组合物的纤维增强层,如果需要用金属箔如铜箔覆盖两侧,并随后在加热或加压下固化该层压材料而得到。
本发明的一个尤其优选的实施方案是一种具有玻璃纤维纺织物,玻璃纤维无纺织物和纸基材作为浸渍基材的结合的层压板,即,复合层压板。通过固化和加压一种复合层压材料而得到的本发明复合层压板具有优异的耐热性,耐水性和韧性,并非常适用于印刷电路板,其中将浸渍有包括上述组分(a),(b),(c)和(d)(其中组分(a)的存在量是10-75重量份,组分(b)的存在量是2-30重量份,组分(c)的存在量是20-60重量份和组分(d)的存在量是5-250重量份,基于被认为是100重量份的组分(a),(b)和(c)的总重)的热固性树脂组合物的玻璃纤维纺织物与浸渍有包含上述组分(a),(b),(c)和(d)(其中组分(a)的存在量是10-75重量份,组分(b)的存在量是2-30重量份,组分(c)的存在量是20-60重量份和组分(d)的存在量是5-250重量份,基于被认为是100重量份的组分(a),(b)和(c)的总重)的热固性树脂组合物的玻璃纤维无纺织物一起层压。
本发明层压板的线性膨胀系数通过热分析器来测定,而且是该层压板的垂直和侧向线性膨胀系数中的较大者。
如果由包含用于本发明的组分(a),(b),(c)和(d)的热固性树脂组合物得到的固化制品的Tg是120℃或更高,那么可得到一种具有非常高的耐热性的层压板。对于在温度40-150℃范围内其平均线性膨胀系数不高于20.0 ×10-6/℃的本发明层压板,可首次得到采用常规自由基可聚合树脂组合物的层压板所从未获得的低线性膨胀系数。
由于本发明的层压板具有优异的耐热性和耐水性,具有令人满意的穿孔性能,并具有低热膨胀系数,它也可在高温下应用,例如在汽车中,而由包含常规液体橡胶组分的热固性树脂组合物制成的层压板则不适用于此。
实现本发明的最佳方式
本发明在以下合成实施例,实施例,对比例和实验中进一步描述,它们无意于限定本发明。
合成实施例1(自由基可聚合树脂的合成)
在配有搅拌器和温度计的2-L4-颈烧瓶中,将172g丙烯酸加入800克环氧树脂(YDB-400,TOTO KASEI CO.LTD.,环氧当量:400)并与172克甲基丙烯酸在0.3克氢醌和0.3克苄基二甲基胺的存在下合并,并在120℃下反应6小时,得到一种其酸值是2.0mg KOH/g的乙烯基酯树脂。随后,加入457克苯乙烯单体,得到乙烯基酯树脂(A-1)[NV(非挥发分)=68%]。
合成实施例2(自由基可聚合树脂的合成)
在配有搅拌器和温度计的1-L4-颈烧瓶,将374克环氧树脂(YD-128,TOTO KASEI CO.LTD.,环氧当量:187)与172克甲基丙烯酸在0.3克氢醌和0.3克苄基二甲基胺的存在下合并,并在120℃下反应6小时,得到一种其酸值是2.0mg KOH/g的乙烯基酯树脂。随后,加入294克苯乙烯单体,得到乙烯基酯树脂(A-2)(NV=65%)。
合成实施例3(自由基可聚合树脂的合成)
向配有搅拌器,温度计,氮气加入管和顶部配有温度计的冷凝器的2-L5-颈烧瓶中装入392克马来酸酐,141克丙二醇和0.07克氢醌,然后用氮气冲洗并在200℃进行脱水缩合7小时,得到其酸值是20.4mg KOH/g的不饱和聚酯树脂。随后,加入649克苯乙烯单体,得到不饱和聚酯树脂(A-3)(NV=48%)。
合成实施例4(自由基可聚合树脂的合成)
向配有搅拌器,温度计,氮气加入管和顶部配有温度计的冷凝器的2-L5-颈烧瓶中装入392克马来酸酐,239克丙二醇,141克双丙甘醇和0.07克氢醌,然后用氮气冲洗并在200℃进行脱水缩合7小时,得到其酸值是20.4mg KOH/g的不饱和聚酯树脂。随后,加入649克苯乙烯单体,得到不饱和聚酯树脂(A-4)(NV48%)。
合成实施例5(自由基可聚合树脂的合成)
在配有搅拌器和温度计的3-L4-颈烧瓶中,将374克环氧树脂(YD-128,TOTO KASEI CO.LTD.,环氧当量:187)与971克液体橡胶(CTBN,1300X8,B.Goodrich)在0.3克氢醌和0.3克苄基二甲基胺的存在下合并,并在120℃下反应3小时,得到其酸值是0.2mg KOH/g且其环氧当量是879的橡胶改性环氧树脂。然后,加入121克甲基丙烯酸并在120℃下再反应5小时,得到其酸值是0.9mg KOH/g的橡胶改性乙烯基酯树脂。随后,加入977克苯乙烯单体,得到橡胶改性乙烯基酯树脂(A-5)(NV=60%)
合成实施例6(饱和聚酯树脂的合成)
向配有搅拌器,温度计,氮气加入管和顶部配有温度计的冷凝器的2-L5-颈烧瓶中装入438克己二酸,96克双丙甘醇和117克乙二醇,并用氮气冲洗。将该混合物在200℃进行脱水缩合8小时,得到其酸值是4.6mgKOH/g的饱和聚酯树脂(B-1)。该树脂的Tg和数均分子量分别为42℃和24,400。
合成实施例7(饱和聚酯树脂的合成)
向配有搅拌器,温度计,氮气加入管和顶部配有温度计的冷凝器的1-L5-颈烧瓶中装入233克对苯二甲酸,113克壬二酸,65克乙二醇和106克新戊基二醇,并用氮气冲洗。将该混合物在240℃进行脱水缩合10小时,得到其酸值是1.4mg KOH/g的饱和聚酯树脂(B-2)。该树脂的Tg和数均分子量分别为7℃和26900。
合成实施例8(饱和聚酯树脂的合成)
向配有搅拌器,温度计,氮气加入管和顶部配有温度计的冷凝器的1-L5-颈烧瓶中装入100克对苯二甲酸,66克间苯二甲酸,188克壬二酸,72克乙二醇和96克新戊二醇,并用氮气冲洗。将该混合物在240℃进行脱水缩合9小时,得到其酸值是1.0mg KOH/g的饱和聚酯树脂(B-3)。该树脂的Tg和数均分子量分别为-20℃和23900。
合成实施例9(多层结构聚合物的细颗粒的合成)
向配有冷凝器的用于聚合的2-L克反应器中装入506克去离子水,2.4克1%二辛基磺基琥珀酸钠水溶液和16.4克1%碳酸氢钠水溶液,并在70℃下在氮气流中搅拌加热。在升高的温度下,加入8克丙烯酸乙酯并将该混合物搅拌10分钟,与4.1克2%过硫酸钠水溶液合并,并进一步搅拌1小时以得到种子胶乳。随后,在70℃下加入51克2%过硫酸钠水溶液,并随后在240分钟内连续加入用于形成第一层的单体乳液,它由663克丙烯酸丁酯,2.4克1,4-丁二醇二丙烯酸酯,6.7克甲基丙烯酸烯丙基酯,408克1%二辛基磺基琥珀酸钠水溶液和68克1%碳酸氢钠水溶液组成。加料之后,将该混合物在70℃下进一步搅拌60分钟以熟化该反应混合物。然后,向仍保持在70℃的混合物中加入由7.2克2%过硫酸钠组成的用于形成最外层的单体乳液,随后在90分钟内连续加入101克甲基丙烯酸甲酯,12克丙烯酸乙酯,0.6克甲基丙烯酸2-羟乙基酯,6克1,4-丁二醇二丙烯酸酯,60克1%二辛基磺基琥珀酸钠水溶液和12克1%碳酸氢钠。加料之后,将该混合物进一步加热至80℃,并搅拌60分钟以熟化该反应混合物。在熟化该反应之后,将混合物滤过300目不锈钢丝网,得到其重量平均颗粒尺寸是0.5μm的多层结构聚合物胶乳。将该胶乳在-30℃下一次冷冻,并随后融化,用离心脱水机脱水和洗涤,并在40℃下在氮气流下干燥过夜,这样得到多层结构聚合物细颗粒(B-4)。
实施例1-6和对比例1和2
将表1所示量的在80℃下加热的在合成实施例1-5中得到的自由基可聚合树脂(A-1)-(A-5)与饱和聚酯树脂(B-1)-(B-3)和在合成实施例6-9中得到的聚合物细颗粒(B-4)合并,并在80℃下进行溶解3小时,这样得到热固性树脂组合物。
将100重量份的每种如此得到的热固性树脂组合物与40重量份氢氧化铝(CL-310,SUMITOMO CHEMICAL CO.LTD.)和1.0重量份80%氢过氧化枯烯(PARKMIL H-80,NOF CORPORATION)进行混合以形成配混物(1),或与140重量份氢氧化铝和1.0重量份80%氢过氧化枯烯混合以形成配混物(2)。
将浸渍有配混物(1)的一层用于层压板的玻璃纤维纺织物(WE-18K-BS,NITTO BOSEKI CO.)、浸渍有配混物(2)的三层玻璃纤维无纺织物(Ep-4060,60g/m2,JAPAN VILENE CO.,LTD.)和浸渍有配混物(1)的一层玻璃纤维织制织物(WE-18K-BS,NJTTO BOSEKI CO.)按此顺序层压,并在100℃下在压力下固化30分钟并在175℃下固化30分钟,得到尺寸为150×150×1.6mm的层压板。
实验1
检查在实施例和对比中得到的每种层压板的以下所列项目,并将所得的物理参数与其树脂起始原料一起在表1中给出。
(1)压力锅试验(PCT)
样品:层压板切成尺寸40mm×40mm的片
条件:121℃×95%RH×60分钟
%水吸收:计算如下:
%水吸收=(PCT之后的重量-起始重量)/起始重量×100
260℃焊剂耐热性试验:将PCT之后的样品浸渍在熔融的焊剂浴(260±5℃)中并记录形成水泡时的时间(秒)。
(2)线性膨胀系数(以下简称“α”)测量
层压板在垂直和侧向方向上测定并选择较大的数值。
样品:将玻璃纤维织制织物的板切成3mm×15mm
仪器:热分析器(5g负荷,以5℃/min升温,由20℃测定至200℃,40-150℃的平均线性膨胀系数)
(3)按照ASTM D617的穿孔性能
评估:
优异的:○
良好的:△
可接受的:×
表1
    实施例     对比例
 1  2  3  4  5  6  1  2
  自由基可聚合树脂(%重量) A-1  50  50  15  50  50  50  50  50
A-2  15.3  15.3  31.4  13  12  15.3
A-3  15  18  40  30  20
A-4  18  15
A-5  30
  苯乙烯单体(%重量)  4.7  4.7  9.6  4.7
  热塑性树脂(%重量)     饱和聚酯树脂 B-1  15  10
B-2  12  10  12
B-3  9
    聚合物细颗粒 B-4  2  5
  PCT     水吸收(%)  0.28  0.25  0.24  0.26  0.24  0.21  0.36  0.30
260℃焊剂耐热性(秒)  >180  >180  >180  >180  >180  >180  >180  >180
  线性膨胀系数α(10-6/℃)  18.7  15.2  19.0  17.6  16.0  19.6  30.5  25.4
  穿孔性能   ○   ○   ○   ○   ○   ○   ○   ×
从表1显然看出,本发明每种层压板的线性膨胀系数(10-6/℃)低至20或更低,而没有采用饱和聚酯树脂的对比1或2则高达25。实施例的每种层压板的穿孔性能与对比例相比也明显优异。
工业实用性
本发明的层压板具有优异的耐热性,耐水性和穿孔性能,即使在加热下也可令人满意地使用,尤其是当它在40-150℃温度范围内的线性膨胀系数不高于20.0×10-6/℃时。与通过常规方法例如由环氧树脂得到的层压板相比,它可以低成本得到,而与常规产品相比不会损害最终产品的品质。

Claims (9)

1.一种低热膨胀层压板,它通过固化浸渍有热固性树脂组合物的纤维增强层的层压材料而得到,所述组合物包含(a)自由基可聚合树脂,(b)热塑性树脂,(c)自由基可聚合单体和(d)无机填料,其中(a)的存在量为10-75重量份,(b)的存在量为2-30重量份,(c)的存在量为20-60重量份和(d)的存在量为5-250重量份,基于100重量份的(a),(b)和(c)的总重。
2.根据权利要求1的低热膨胀层压板,其中所述层压品在40℃-150℃温度范围内的平均线性膨胀系数不高于20×10-6/℃。
3.根据权利要求1或2的低热膨胀层压板,其中热塑性树脂(b)的玻璃转变点不高于60℃。
4.根据权利要求1或2的低热膨胀层压板,其中热塑性树脂(b)是一种其玻璃转变点不高于60℃的饱和聚酯树脂。
5.根据权利要求1或2的低热膨胀层压板,其中热塑性树脂(b)是一种其玻璃转变点不高于60℃且其数均分子量是2,000-100,000的饱和聚酯树脂。
6.根据权利要求1-5任一项的低热膨胀层压板,它进一步包含其颗粒尺寸是0.1-5.0μm的聚合物细颗粒(e)。
7.根据权利要求1-6任一项的低热膨胀层压板,其中纤维增强层的层压材料是一种浸渍有热固性树脂组合物的玻璃纤维织制织物作为表面层并层压有的衬里内层的复合层压材料,所述内层是一种浸渍有热塑性树脂组合物的玻璃纤维无纺织物。
8.根据权利要求1-7任一项的低热膨胀层压板,其中自由基可聚合树脂(a)是乙烯基酯树脂或不饱和聚酯树脂。
9.一种金属箔-覆盖的层压板,它采用根据权利要求1-8任一项的低热膨胀层压板。
CNB018073182A 2000-03-27 2001-03-23 低热膨胀层压板 Expired - Lifetime CN1205257C (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP87330/2000 2000-03-27
JP2000087329 2000-03-27
JP2000087330 2000-03-27
JP87329/2000 2000-03-27

Publications (2)

Publication Number Publication Date
CN1419581A true CN1419581A (zh) 2003-05-21
CN1205257C CN1205257C (zh) 2005-06-08

Family

ID=26588482

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB018073182A Expired - Lifetime CN1205257C (zh) 2000-03-27 2001-03-23 低热膨胀层压板

Country Status (8)

Country Link
US (1) US6815053B2 (zh)
EP (1) EP1275682B1 (zh)
JP (1) JP4779129B2 (zh)
KR (1) KR100719866B1 (zh)
CN (1) CN1205257C (zh)
AT (1) ATE381588T1 (zh)
DE (1) DE60131958T2 (zh)
WO (1) WO2001072879A1 (zh)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102300936A (zh) * 2009-03-16 2011-12-28 东丽株式会社 纤维增强树脂组合物、成型材料及纤维增强树脂组合物的制造方法
CN101395208B (zh) * 2006-03-03 2012-07-04 住友电木株式会社 中间层材料和复合层压板
CN104204323A (zh) * 2012-03-30 2014-12-10 尤妮佳股份有限公司 无纺织物及无纺织物的制造方法
CN104889677A (zh) * 2015-04-30 2015-09-09 燕山大学 一种不锈钢/碳钢切屑芯复合型钢的制备方法
CN113950507A (zh) * 2019-07-08 2022-01-18 Dic株式会社 树脂组合物、预浸体、层叠板、多层印刷配线板及半导体封装

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USRE44893E1 (en) 2004-03-26 2014-05-13 Hanwha Azdel, Inc. Fiber reinforced thermoplastic sheets with surface coverings
JP4595429B2 (ja) * 2004-07-30 2010-12-08 パナソニック電工株式会社 Ledを実装するプリント配線板用積層板
JP4595430B2 (ja) * 2004-07-30 2010-12-08 パナソニック電工株式会社 Ledを実装するプリント配線板用基板
CN101142073B (zh) 2005-03-15 2010-06-02 积水化学工业株式会社 拉伸热塑性聚酯类树脂片的制造方法及叠层成型体
KR101115108B1 (ko) * 2007-08-24 2012-03-13 스미토모 베이클리트 컴퍼니 리미티드 다층 배선 기판 및 반도체 장치
FR2934198B1 (fr) * 2008-07-24 2012-12-21 Eads Europ Aeronautic Defence Pli et procede de metallisation d'une piece en materiau composite.
JP2012025122A (ja) * 2010-07-27 2012-02-09 Panasonic Electric Works Co Ltd 繊維強化プラスチック平板の製造方法
US10266292B2 (en) 2015-01-22 2019-04-23 Neptune Research, Llc Carriers for composite reinforcement systems and methods of use

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3549586A (en) * 1969-04-01 1970-12-22 Union Carbide Corp Polyester compositions
CA1014838A (en) * 1973-02-21 1977-08-02 Takahiro Nakayama Flexible metal-clad laminates and method for manufacturing the same
US4803115A (en) 1985-09-27 1989-02-07 Kanegafuchi Kagaku Kogyo Kabushiki Kaisha Glass fiber-reinforced electrical laminates and a continuous production method therefor
US5830548A (en) * 1992-08-11 1998-11-03 E. Khashoggi Industries, Llc Articles of manufacture and methods for manufacturing laminate structures including inorganically filled sheets
JPH07268196A (ja) 1994-03-31 1995-10-17 Matsushita Electric Works Ltd 不飽和ポリエステル樹脂成形材料
JPH08231654A (ja) 1995-02-27 1996-09-10 Matsushita Electric Works Ltd 積層板用樹脂組成物及びそれを用いた銅張り積層板
JP3427553B2 (ja) 1995-03-23 2003-07-22 松下電工株式会社 積層板用樹脂組成物及びそれを用いた銅張積層板
JPH08318593A (ja) 1995-05-25 1996-12-03 Matsushita Electric Works Ltd 銅張積層板の製造方法
US5928767A (en) * 1995-06-07 1999-07-27 Dexter Corporation Conductive film composite
JP2000080260A (ja) 1998-09-03 2000-03-21 Showa Highpolymer Co Ltd 硬化物が可撓性と耐熱性とを併せ有する熱硬化性樹脂組成物
US6605343B1 (en) * 1999-02-22 2003-08-12 Sekisui Chemical Co., Ltd. Composite material and synthetic sleeper using the composite material
US6352782B2 (en) * 1999-12-01 2002-03-05 General Electric Company Poly(phenylene ether)-polyvinyl thermosetting resin

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101395208B (zh) * 2006-03-03 2012-07-04 住友电木株式会社 中间层材料和复合层压板
CN102300936A (zh) * 2009-03-16 2011-12-28 东丽株式会社 纤维增强树脂组合物、成型材料及纤维增强树脂组合物的制造方法
TWI477540B (zh) * 2009-03-16 2015-03-21 Toray Industries 纖維強化樹脂組成物、成形材料及纖維強化樹脂組成物之製造方法
CN104204323A (zh) * 2012-03-30 2014-12-10 尤妮佳股份有限公司 无纺织物及无纺织物的制造方法
CN104204323B (zh) * 2012-03-30 2016-08-24 尤妮佳股份有限公司 无纺织物及无纺织物的制造方法
CN104889677A (zh) * 2015-04-30 2015-09-09 燕山大学 一种不锈钢/碳钢切屑芯复合型钢的制备方法
CN113950507A (zh) * 2019-07-08 2022-01-18 Dic株式会社 树脂组合物、预浸体、层叠板、多层印刷配线板及半导体封装

Also Published As

Publication number Publication date
KR100719866B1 (ko) 2007-05-21
US20040096680A1 (en) 2004-05-20
KR20020093004A (ko) 2002-12-12
JP4779129B2 (ja) 2011-09-28
JPWO2001072879A1 (ja) 2004-01-08
EP1275682A1 (en) 2003-01-15
ATE381588T1 (de) 2008-01-15
WO2001072879A1 (fr) 2001-10-04
EP1275682B1 (en) 2007-12-19
DE60131958D1 (de) 2008-01-31
EP1275682A4 (en) 2003-07-16
US6815053B2 (en) 2004-11-09
CN1205257C (zh) 2005-06-08
DE60131958T2 (de) 2008-12-11

Similar Documents

Publication Publication Date Title
CN1205257C (zh) 低热膨胀层压板
CN100341934C (zh) 热固性树脂组合物及其应用
CN101056933A (zh) 两亲嵌段共聚物增韧的环氧树脂和由其制成的电层压材料
CN1803916A (zh) 树脂组合物和使用该组合物的预浸渍体和层压材料
CN1135161C (zh) 聚乙烯多层层压材料,容器和树脂组合物
CN1717451A (zh) 用于环氧树脂的硬化剂组合物
CN1468904A (zh) 含聚(亚芳基醚)的热固性组合物,其制备方法及由其制得的制品
CN1664000A (zh) 热固性树脂组合物、树脂薄膜以及制品
CN1488483A (zh) 用于敞模成型的阻挡涂层
CN1119363C (zh) 多层丙烯酸系聚合物和使用它的甲基丙烯酸系树脂组合物
JP2009073990A (ja) エポキシ樹脂組成物、金属張積層板の連続生産方法及び金属張積層板
JP4595429B2 (ja) Ledを実装するプリント配線板用積層板
CN1010292B (zh) 片状成型料及其面层
JP2008291145A (ja) 液状熱硬化性樹脂組成物、樹脂硬化物、銅張積層板、銅張積層板の製造方法
CN1020343C (zh) 热塑性聚酯树脂组合物
CN109071738B (zh) 自由基固化性树脂组合物及其固化物
JP2005007783A (ja) ハロゲンフリー低熱膨張性コンポジット積層板
CN100344694C (zh) 生产树脂组合物的方法、聚酯树脂的改性剂和生产改性聚酯树脂的方法
JP3964673B2 (ja) 樹脂組成物
JP2010018778A (ja) 液状熱硬化性樹脂組成物及びそれを用いた銅張積層板
JPH02283718A (ja) エポキシ樹脂組成物、プリプレグ及び積層板
JP2010235777A (ja) 不飽和ポリエステル樹脂
JP4595430B2 (ja) Ledを実装するプリント配線板用基板
JP7478008B2 (ja) 樹脂材料及び多層プリント配線板
Fakhari et al. Bio-Based Hybrid Polymers from Vinyl Ester Resin and Modified Palm Oil: Synthesis and Characterization

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
ASS Succession or assignment of patent right

Owner name: JAPAN COMPOSITE MATERIAL CO.,LTD.

Free format text: FORMER OWNER: MITSUI TAKEDA CHEMICAL CO., LTD.

C41 Transfer of patent application or patent right or utility model
TA01 Transfer of patent application right

Effective date of registration: 20040813

Address after: Tokyo, Japan

Applicant after: Nippon Shokubai Co., Ltd.

Co-applicant after: Matsushita Electric Works, Ltd.

Address before: Tokyo, Japan

Applicant before: Mitsui Takeda Chemicals Co., Ltd.

Co-applicant before: Matsushita Electric Works, Ltd.

C14 Grant of patent or utility model
GR01 Patent grant
CX01 Expiry of patent term
CX01 Expiry of patent term

Granted publication date: 20050608