CN1393035A - 电子仪器 - Google Patents
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Abstract
本发明的电子仪器,包括布线电路板、安装在布线电路板上的、表面具有散热部的电子部件、和电子部件热连接的绝缘性散热板,上述散热部通过热传导性连接剂直接连接在上述散热板上。本发明的电子仪器的散热板是具有至少一个与电子部件连接用的焊盘的陶瓷板,或者包含高热传导材料的树脂板。在伴有发热的电子部件上,通过直接连接绝缘性散热板,在散热板和电子部件之间,不需要介入现有的绝缘板。其结果,可以提高电子仪器中的电子部件的散热特性。
Description
技术领域
本发明涉及一种安装了伴有发热的电子部件的电子仪器。
背景技术
现有的安装了伴有发热的电子部件的电子仪器具有如下的结构。即,具有布线印刷电路板和安装在该布线电路板上的电子部件。在该电子部件中,通过让伴有发热的部件与金属板进行热连接,从该电子部件发出的热可以通过金属板散热。
在上述现有例中,成为问题的是从电子部件散热性能低的事实。即,如上所述,在现有例中,虽然伴有发热的电子部件与金属板热连接,但为了让电子部件与金属板处于绝缘状态,在两者之间放入树脂制成的或者无机物的绝缘板。因此,该绝缘板成为降低散热性能的原因。
本发明的目的在于提供一种提高了伴随发热的电子部件的散热效果的电子部件安装方法,以及采用该安装方法安装的电子仪器。
发明内容
本发明的电子仪器,包括布线电路板、安装在布线电路板上的、表面具有散热部的电子部件、与电子部件热连接的绝缘性散热板,所述散热部通过热传导性连接剂直接连接在所述散热板上。本发明的电子仪器的散热板是具有至少一个与电子部件连接用的焊盘的陶瓷板,或者包含高热传导材料的树脂板。
在伴随发热的电子部件上,通过直接连接绝缘性散热板,在散热板和电子部件之间,不需要介入现有的绝缘板。其结果,可以提高电子仪器中的电子部件的散热效果。附图说明
图1是表示本发明第1实施方式的电子仪器单元的立体图。
图2是表示本发明中的陶瓷板和FET之间的状态的分解立体图。
图3是表示本发明中的陶瓷板和布线电路板的主视图。
图4是表示本发明第2实施方式的散热板的立体图。
图5是表示本发明第2实施方式的另一散热板的立体图。
图6是表示本发明第2实施方式的又一散热板的侧视图。
图7是表示本发明第2实施方式的又一散热板的立体图。
图8是表示本发明第3实施方式的电子仪器盖子的立体图。符号说明
1-布线电路板,2-电解电容器,3-变压器,4-配线模块,5、6、7-FET,8-二极管,9-陶瓷板,10、15、16-焊盘,11-模制树脂,12-散热部,13-间隙,14-树脂板,17-通气孔,18-支撑部,19-散热片,20-螺钉,21-孔,22-盖子。
具体实施方式
以下参照附图说明本发明的实施方式。
(实施方式1)
在图1中,在布线电路板1的上面,安装了电解电容器2、变压器3、配线模块4、FET5、6、7、二极管8等电子部件,构成电子仪器单元。
如上所述,在布线电路板1上安装了多个电子部件,其中特别是FET5、6、7以及二极管8在通电时会产生大量的热。
在本实施方式中,将这些电子部件通过焊锡与作为散热板之一的陶瓷板9连接。在本实施方式中,作为热传导粘接剂的一例采用了焊锡。
以下用图2更加详细地说明本发明的要点。
如图2所示,在陶瓷板9上按照指定间隔设置焊锡连接用的焊盘10。另一方面,上述的各个电子部件,例如FET5,如图2所示,在外周覆盖了模制树脂11,而在背面侧露出散热部12。又,该散热部12和焊盘10为图2所示的相同形状。进一步,在本实施方式中,散热部12和焊盘10的形状为上方宽、下方窄的T字形。
然后,这些散热部12和焊盘10通过焊锡连接,这样,由于焊盘10和散热部12大致为T字形,利用自动对齐的效果,可以减少焊接时FET5和焊盘10之间的偏离。
焊盘的形成,可以采用通常的陶瓷部件中所采用的各种陶瓷金属化方法。作为金属化方法的一例,可以采用高温烧成的导电糊浆的烧结法、湿式电镀法、真空蒸镀法、溅射法、CVD法、金属溶射法等。焊盘的形成材料,可以采用与连接材料对应的任意的金属材料。
又,在陶瓷板9上按指定间隔设置多个焊盘10,如果在各焊盘10上如图1所示焊接电子部件的散热部12,如图3所示,容易在陶瓷板9上热连接多个电子部件。
在本实施方式的电子仪器中,在陶瓷板9的下端和布线电路板1的上面之间形成有间隙13。
即,陶瓷板9由这些电子部件支撑并安装在电路板上的状态下,其下方形成有间隙13。这样,通过该间隙13引起空气的流动,提高通气性,结果是可以提高散热效果。
在本实施方式中,作为热传导的连接剂,虽然采用了焊锡,连接剂的材料并不限定于焊锡,只要是可以将电子部件连接在电路板上的高热传导材料即可。作为其他材料的例子,可以使用包含锡、铟、铋等的合金、或者包含多量的银、铜等的导电性连接剂。
(实施方式2)
图4是表示本发明第2实施方式的电子仪器的散热板的一例。在本实施方式中,作为散热板,替代第1实施方式的陶瓷板9的是,设置包含陶瓷填料等高热传导材料的树脂板14,在树脂板14上按照指定间隔设置多个焊锡连接用的焊盘15,在各焊盘15上焊接如图2所是的电子部件的散热部12。
由于树脂板14比陶瓷板9容易成形,可以如图4那样将端部弯曲90度,在此设置安装其它电子部件的焊盘16。
又,在图14的树脂板14上形成通气孔17,通过通气孔17让空气流动,可以提高散热效果。
又,由于树脂板14加工性良好,可以如图5所示在树脂板14上一体形成支撑电子部件的支撑部18,也可以如图6所示一体形成散热片19,或者如图7所示设置螺入电子部件螺钉20的螺纹孔21。
(实施方式3)
采用图8说明本发明第3实施方式的电子仪器盖子。
在本实施方式中,树脂板14和电子仪器的盖子22一体形成。这样,如果将树脂板14作为盖子22使用,可以增大散热面积,并且,由于散热板在仪器的最外部,可以特别提高散热效果。
在一体形成时,盖子22整体也可以采用混合了高热传导材料的树脂形成。作为其他形成方法,也可以采用树脂板14部分由混合了高热传导材料的树脂形成,而盖子22的其它部分则由其他树脂形成的所谓2色成形法。
在本实施方式的电子仪器中,也可以预先在布线电路板上设置为连接与盖子连接的发热部件的连接器,或者用引线将发热部件连接在布线电路板上。
进一步,也可以直接在盖子内侧的树脂板14上形成布线图形,构成部件作为所有面的安装部件,在树脂14部分上搭载所有构成部件,而不需要布线电路板。
产业上的利用可能性
以上的本发明的电子仪器,包括布线电路板、安装在该布线电路板上的电子部件、和电子部件热连接的绝缘性散热板,所述电子部件在其表面上有散热部,在与该散热部对向的散热板部分上,采用热传导性连接剂将该电子部件连接。依据本发明,在电子部件和散热板之间,不需要介入成为热阻抗的绝缘板,可以极大地提高电子部件发出的热的散热特性。
Claims (11)
1.一种电子仪器,其特征在于:
包括布线电路板、安装在所述布线电路板上的、表面具有散热部的电子部件、与电子部件热连接的绝缘性散热板,所述散热部通过热传导性连接剂直接连接在所述散热板上。
2.根据权利要求1所述的电子仪器,其特征在于:
所述散热板是具有与所述电子部件连接的至少一个焊盘的陶瓷板。
3.根据权利要求1所述的电子仪器,其特征在于:
所述散热板在所述布线电路板上设置有指定的间隙。
4.根据权利要求1所述的电子仪器,其特征在于:
所述散热板是具有与所述电子部件连接的至少一个焊盘的包含高热传导材料的树脂板。
5.根据权利要求4所述的电子仪器,其特征在于:
所述散热板在所述布线电路板上设置有指定的间隙。
6.根据权利要求4所述的电子仪器,其特征在于:
所述散热板在所述表面上进一步包括与具有散热部的电子部件之外的电子部件连接用的焊盘。
7.根据权利要求4所述的电子仪器,其特征在于:
所述散热板进一步具有支撑电子部件的支撑部。
8.根据权利要求4所述的电子仪器,其特征在于:
所述散热板进一步具有一体形成的散热用的散热片部。
9.根据权利要求4所述的电子仪器,其特征在于:
所述散热板进一步具有通气孔。
10.根据权利要求4所述的电子仪器,其特征在于:
所述散热板进一步具有螺纹孔。
11.根据权利要求4所述的电子仪器,其特征在于:
所述散热板与电子仪器盖子成一体。
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
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JP283018/2000 | 2000-09-19 | ||
JP2000283018 | 2000-09-19 | ||
JP242874/2001 | 2001-08-09 | ||
JP2001242874A JP4165045B2 (ja) | 2000-09-19 | 2001-08-09 | 電子機器 |
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CN1393035A true CN1393035A (zh) | 2003-01-22 |
CN1200459C CN1200459C (zh) | 2005-05-04 |
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CN01802798.9A Expired - Fee Related CN1200459C (zh) | 2000-09-19 | 2001-09-17 | 电子仪器 |
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US (1) | US6753603B2 (zh) |
EP (1) | EP1253636A4 (zh) |
JP (1) | JP4165045B2 (zh) |
CN (1) | CN1200459C (zh) |
WO (1) | WO2002025731A1 (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103621190A (zh) * | 2011-07-06 | 2014-03-05 | 株式会社丰田自动织机 | 电路板以及电路板的制造方法 |
CN109152309A (zh) * | 2018-10-19 | 2019-01-04 | 徐州携创智能科技有限公司 | 一种电子装置 |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI278795B (en) * | 2004-04-20 | 2007-04-11 | Fujitsu Hitachi Plasma Display | Display device |
ATE509509T1 (de) | 2005-08-02 | 2011-05-15 | Dunkermotoren Gmbh | Kühlung eines elektronischen leistungsbauelementes |
JP4525648B2 (ja) * | 2006-08-31 | 2010-08-18 | 船井電機株式会社 | 画像形成装置 |
WO2008144856A2 (en) * | 2007-05-30 | 2008-12-04 | Techinvest Ltda | Constructive disposition in housing for the heat dissipation system and component installation in electric-electronic appliances |
JP2009027043A (ja) * | 2007-07-20 | 2009-02-05 | Tdk-Lambda Corp | 電子部品とその組立方法 |
DE202008005708U1 (de) * | 2008-04-24 | 2008-07-10 | Vishay Semiconductor Gmbh | Oberflächenmontierbares elektronisches Bauelement |
US9465049B2 (en) * | 2012-04-13 | 2016-10-11 | James B. Colvin | Apparatus and method for electronic sample preparation |
DE102014000126A1 (de) * | 2014-01-13 | 2015-07-16 | Auto-Kabel Management Gmbh | Leiterplatte, Schaltung und Verfahren zur Herstellung einer Schaltung |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
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JPS58116235U (ja) * | 1982-01-30 | 1983-08-08 | 松下電工株式会社 | 電子部品の放熱装置 |
JPS58116235A (ja) | 1982-09-29 | 1983-07-11 | Nozawa Seisakusho:Kk | 自走式作業台車 |
DE3342923A1 (de) * | 1983-11-26 | 1985-06-05 | Philips Patentverwaltung Gmbh, 2000 Hamburg | Befestigungsanordnung |
US4853763A (en) * | 1984-06-27 | 1989-08-01 | The Bergquist Company | Mounting base pad means for semiconductor devices and method of preparing same |
JPS6398135A (ja) * | 1986-10-15 | 1988-04-28 | Matsushita Electric Ind Co Ltd | 機器のプリント基板装置 |
JPH0621589A (ja) * | 1992-07-06 | 1994-01-28 | Mitsubishi Materials Corp | ハイブリッドicの放熱構造およびその製造方法 |
DE9300865U1 (de) * | 1993-01-22 | 1994-05-26 | Siemens AG, 80333 München | Einstückiges Kunststoffteil, insbesondere Spritzgießteil |
JPH06275668A (ja) * | 1993-03-18 | 1994-09-30 | Fujitsu Ltd | 半導体素子冷却用放熱フィンを有する半導体装置の製造方法及び放熱フィン用樹脂組成物 |
JPH06283838A (ja) * | 1993-03-26 | 1994-10-07 | Mitsubishi Electric Corp | 電子回路モジュール |
JPH08288438A (ja) * | 1995-04-14 | 1996-11-01 | Hitachi Ltd | 電子機器の冷却装置 |
US5663529A (en) * | 1995-09-14 | 1997-09-02 | Ford Motor Company | Anti-skew mounting pads and processing method for electronic surface mount components |
US5796584A (en) * | 1996-04-30 | 1998-08-18 | Telefonaktiebolaget Lm Ericsson | Bridge for power transistors with improved cooling |
DE69727207T2 (de) * | 1996-09-09 | 2004-11-25 | Nec Tokin Corp., Sendai | Hoch warmeleitendes magnetisches mischmaterial |
JPH10205861A (ja) * | 1997-01-18 | 1998-08-04 | Matsushita Electric Ind Co Ltd | 空気調和機の電子制御装置 |
JPH10290086A (ja) * | 1997-04-15 | 1998-10-27 | Nemic Lambda Kk | 電子部品の放熱板 |
JPH11307968A (ja) * | 1998-04-20 | 1999-11-05 | Matsushita Electric Ind Co Ltd | 電子制御装置の放熱構造 |
JP2001185653A (ja) * | 1999-10-12 | 2001-07-06 | Fujitsu Ltd | 半導体装置及び基板の製造方法 |
-
2001
- 2001-08-09 JP JP2001242874A patent/JP4165045B2/ja not_active Expired - Fee Related
- 2001-09-17 EP EP20010967704 patent/EP1253636A4/en not_active Withdrawn
- 2001-09-17 CN CN01802798.9A patent/CN1200459C/zh not_active Expired - Fee Related
- 2001-09-17 US US10/130,210 patent/US6753603B2/en not_active Expired - Fee Related
- 2001-09-17 WO PCT/JP2001/008053 patent/WO2002025731A1/ja active Application Filing
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103621190A (zh) * | 2011-07-06 | 2014-03-05 | 株式会社丰田自动织机 | 电路板以及电路板的制造方法 |
CN109152309A (zh) * | 2018-10-19 | 2019-01-04 | 徐州携创智能科技有限公司 | 一种电子装置 |
Also Published As
Publication number | Publication date |
---|---|
CN1200459C (zh) | 2005-05-04 |
WO2002025731A1 (en) | 2002-03-28 |
EP1253636A4 (en) | 2005-03-02 |
US20030057885A1 (en) | 2003-03-27 |
JP2002171087A (ja) | 2002-06-14 |
EP1253636A1 (en) | 2002-10-30 |
US6753603B2 (en) | 2004-06-22 |
EP1253636A8 (en) | 2003-03-12 |
JP4165045B2 (ja) | 2008-10-15 |
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