CN1069448C - 连接穿过枝状承接器球栅阵列器件的自准直低剖面插座 - Google Patents

连接穿过枝状承接器球栅阵列器件的自准直低剖面插座 Download PDF

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CN1069448C
CN1069448C CN97117578A CN97117578A CN1069448C CN 1069448 C CN1069448 C CN 1069448C CN 97117578 A CN97117578 A CN 97117578A CN 97117578 A CN97117578 A CN 97117578A CN 1069448 C CN1069448 C CN 1069448C
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D·P·比曼
小·J·S·科宾
D·E·马西
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Abstract

用于通过枝状承接器将球栅阵列型器件连接到印刷电路板的自准直低剖面插座，提供以最小热阻将冷却器安装到电子器件的措施。压力均匀分布在承接器阵列的图形上，通过采用由螺丝机构啮合的互补凸凹表面，在电子器件的顶部和冷却器之间提供热传导。当提供枝状承接器和有效的冷却器安装的灵活性时，插座呈现低剖面。

Description

连接穿过枝状承接器球栅阵列器件的自准直低剖面插座
本发明总地涉及电子器件的连接。更具体地，本发明涉及一种自准直低剖面插座，用于将球栅阵列电子器件连接到印刷电路板上，同时保持从电子器件到装设在插座上冷却器的有效热通路。
本发明涉及1995年9月29日提交的共同未决美国专利申请No08/536,880的主题。该共同未决申请被转让给本申请的受让人。
缩小集成电路的尺寸和扩大其功能急剧地增加了集成电路外壳的输入/输出连接数目，同时为了制造这些连接而减少了集成电路的可用尺寸。这种趋势，与采用常规设计的位于周边的线或管脚阵列技术相比，导致模制采用输入/输出连接的球(ball)栅阵列、列(column)栅阵列和格(land)栅阵列(以下统称“球栅阵列”)的包装技术。倒装技术在输入/输出连接是直接形成在集成电路模片上的部分钎料球栅阵列且有效地免去模制外壳的情况下是特别有效的例子。
采用球栅阵列将集成电路外壳、模片或甚至具有多个模片的模块连接到印刷电路板上，与其它连接技术相比，大大地增加了可得到的连接的相对密度。不幸的是，球栅阵列构成的组件有两个缺点。首先，难以为了测试或预烧而可靠地暂时连接到器件的球上。其次，如果在回流安装期间在栅的钎料球和印刷电路板格之间发生不良连接，难以定位和校正不良钎料连接。在大多数情况下，整个器件必须被焊开。
受让人的开发者最近发现通过涂覆金属管(vias)或填料而形成的钯枝晶能够被用于在管或填料和球栅阵列集成电路器件的钎料球之间形成可靠的连接。已发现在涂覆有填料或管的枝晶和钎料球之间的连接在这种情况下特别有效，即为了可靠的电连接枝晶穿透钎料球的表面氧化物，并且嵌入在相对较软的钎料中以在覆盖有管或填料的枝晶和钎料球之间产生机械粘结和封固。相关的概念在US5,137,461中和IBM技术公告板1993年7月No.7第36卷第137和138页上有描述，这两个对比文件的内容都引入此处作为参考。
大模片尺寸、快时钟速率和小晶体管尺寸的工业发展趋势导致出现需要冷却器以保持适当的工作温度的集成电路器件。冷却器的采用当然意味着在产生能量的集成电路模片或外壳与散去能量的冷却器体之间要有低的热阻抗。众所周知，固体间的热传导随着例如在集成电路器件之间存在的在配合表面之间的接触压力而增加，而不论是模块、陶瓷外壳、倒装模片和冷却器体，还是插入热传导元件。
一种采用枝状承接器以将球栅阵列器件连接到印刷电路板从而使集成电路器件易于移开的插座，已在上述共同未决美国专利申请08/536,880中教导。尽管采用承接器以完成连接的插座是有效的，但是，插座的冷却能力在设计不允许通过低热阻抗通路的叶片型冷却器的简单安装的情况下受到限制。此外，上述插座的基本设计未涉及低剖面，而低剖面设计对于较小的计算机外壳和需要冷却器叶片空间是特别重要的。
因此，需要适当的低剖面插座以通过枝状承接器将球栅阵列器件连接到印刷电路板，该插座具有平面准直能力并提供压力以便最小化在集成电路和连接在其上的冷却器之间的热阻抗。
现有技术的问题通过采用自准直低剖面并适于将球栅阵列器件连接到穿过枝状承接器的印刷电路板的电子器件插座而得以解决，并且提供了在器件和设在插座上的冷却器之间的低热通路的措施。插座包括由具有多重管(vias)或填料覆盖的枝晶的介电材料构成的平面承接器，其中管或填料以与电子球栅器件基本一致的图形分布；还包括用于准直承接器的管或填料以与印刷电路板上的区域接触的装置；用于在球栅阵列表面上划出球的图形以将球的图形与承接器上的管或填料准直的装置；加接在印刷电路板上的机架部件；装在机架部件中用于可调节地将平面承接器压成在电路板和电子球栅阵列器件之间准直的致动装置，其中致动装置包括第一平面热传导部件和第二平面热传导部件，第一平面热传导部件具有其平面表面适于接触电子球栅阵列器件的表面而没有求的图形的第一侧面，和具有凸或凹形表面的第二侧面，第二平面热传导部件具有其表面补偿配合第一部件的凸或凹形表面的侧面；插座还包括用于连接冷却器以建立与在致动装置中的第二部件热接触的装置。
进一步的改进包括采用用于从相对于接触区的侧面支撑印刷电路板的后板，和用于将后板连接到机架部件的装置。还有一种改进包括可调节的致动装置，可调节的致动装置包括具有孔洞的一个滑动板，孔洞内部的螺纹与形成在第一平面热传导部件中的一套外部螺纹啮合匹配。
在一种插座的特殊形式中，位于印刷电路板底侧的后板具有穿过在印刷电路板中精确定位的孔洞延伸而与具有装设在机架部件中的滑动板的机架部件相啮合的柱。
滑动板具有其内壁攻出螺纹的大孔洞，以与低剖面组件的螺丝致动器相啮合。螺丝致动器具有一较低的凹表面，与在下面的旋转板上的补偿匹配凸表面相啮合，螺丝致动器和旋转板由热传导材料构成。承接器和定位器通过孔洞啮合管脚而准直，其中定位器随后将集成电路器件的球直接与管脚和印刷电路板格准直。集成电路器件和螺丝致动器之间的热通路穿过旋转板延伸，而由螺丝致动器施加压力。冷却器与螺丝致动器热接触装设。由此获得了低剖面、低热阻的枝状连接插座。
本发明的这些和其它特征将通过以下对实施例的详细描述而更清楚明白。
图1示出倒装模片、陶瓷球栅阵列外壳、或具有电连接的钎料球阵列的球栅阵列模块；
图2示出在相对的侧面上的涂覆管或填料的枝晶承接器；
图3示出承接器两个涂覆管的枝晶的截面；
图4示出球栅阵列器件与采用具有覆盖管或填料的枝晶的承接器的印刷电路板的连接；
图5示出插座及其与印刷电路板和球栅阵列器件关系的优选实施例的分解视图；
图6示出螺丝致动器与提供自准直和低热阻的旋转板之间的补偿表面的截面图。
图1示出将要通过钎料球阵列2连接到印刷电路板的集成电路器件1。器件1可以为倒装模片、装设在外壳(通常为具有顶盖的陶瓷外壳)内的模片或可以为多芯片模块(通常为具有多模片的陶瓷外壳)。钎料球2通常分布在器件一侧上的阵列中并独特地为半球形。钎料球通常由高熔融温度的钎料(铅/锡为10/90)构成以便当通过回流低熔融温度的钎料来产生连接时保持钎料球的轮廓。如前所述，模片或外壳上的阵列可以由列栅阵列和格栅阵列钎料结构构成。本发明的目的之一是避免为了测试、预烧和最后制造的目的回流连接，同时提供至印刷电路板格的可靠连接。
本发明将联系将钎料球栅阵列器件连接到印刷电路板来描述。但是，本发明的基本概念完全适用于采用其它结构阵列的器件。
图2示出薄承接器3，该承接器具有介电体4和在相对的侧面上的多管和/或填料。图3的截面图示出钯枝晶8涂覆在铜管7上。对承接器的进一步说明在1994年10月IBM技术公告板No.10卷37的35和36页，引入此处作为参考。
图4示出采用承接器3将电子集成电路1的钎料球2连接到印刷电路板10的钎料覆盖格9。在此例中，当器件1和印刷电路板10被压紧连接时，涂覆在承接器3的外表面上的枝晶嵌入到钎料球2和钎料涂层9中。注意，前述专利中描述的枝晶不仅在钎料涂层2和9之间产生电连接，而且在即使没有另外的压力的情况下也保持可靠的物理固接。
图4示出采用承接器的灵活性，其中11示出器件到印刷电路板的连接垂直准直，而12或13示出由承接器3的导线图形产生的电通路。14示出另一种改进，其中传导内层16当钎料涂层在17准直保持断开电连接时产生另外的交联。18处的管示出承接器可以具有涂覆管而不影响其以以上方式使用的固体。
尽管承接器提供可观的能力和灵活性，但是用于装设器件的插座被证明还是一个挑战。前述共同未决美国专利申请08/536880提出了一种解决方案。但是，如上所述，插座设计限制了用于平均分布压力的准直措施，不能用于提供低剖面，特别重要的是不能提供致密的和有效的热通路以及用于固接冷却器或其它散热装置的机械接口。本发明致力于并解决了这些问题。
本发明的一个实施例以分解示意图的形式示于图5。参考图5，插座包括后板19，它通常由钢或其它坚硬的材料制成，适于在接触阵列上提供均匀的负载分布。四个定位柱22通常压配在后板19中。柱22在电路板21中采用匹配孔洞图形定位后板19。一个柱/孔洞对可以被做成小于三对以提供插座相对于印刷电路板21的特别对准，如果需要的话。由于后板19是金属的和导电的，通常由聚酰胺构成的绝缘体23被从印刷电路板21的后侧安装以避免相邻的格、管或其它导电元件的短路。如果后板是不导电的，就不需要绝缘体23。明显地，如果电路板21的下面在后板19的位置处没有导电通路，也不需要绝缘体23。后板19上的柱22从整个电路板21的图形中伸出并提供枝状承接器24和定位器26位置的定位。
承接器24是由诸如商用的Kapton和Driclad之类的薄的介电层构成的，且具有在其两个侧面涂覆填料的枝状阵列，如以上参考图2所述的。枝状填料阵列的形状和尺寸与将被插入插座的器件的钎料球阵列相匹配，而不论是倒装器件、陶瓷外壳器件还是模块器件，正如参考图1所述的。在承接器顶部的单独的枝状填料一般连接到在承接器底部的相应的填料，以形成穿过承接器的传导通路。但是，如以上参考图4所述的，承接器可以重构电子器件和印刷电路板之间的连接通路，以便可以在需要时测试、纠错或替换器件。
定位器26由具有与要被连接的器件相配的孔洞阵列的电介质构成。器件的球滑过定位器中的孔洞以便模块适当地对准在承接器的填料和穿过定位器的导体上。如图5中定位器所示，当完成所需的对准时，采用一定数目的孔洞是可能的。采用定位器要优于采用器件本体作为与承接器准直的定位方案，通过直接准直而不是通过相对不精确参考器件本体可以更精确地定位球栅阵列图形。
机架27定位在从电路板21、承接器24和定位器26伸出的柱22上。在机架27的底侧上开有与柱22的底部中的槽啮合的缝隙。通过将机架27放在柱22上，然后横向再定位机架27使其缝隙与柱22的槽啮合来完成组装。此时插座的组装就完成了并可以插入器件了。
电子器件的安装是通过在适当地在机架27之内对准之后定位器件并同时将球栅阵列图形与定位器26中的定位孔洞啮合来完成的。该定位将器件28阵列图形的钎料球与在承接器24上的类似的枝状连接图形阵列准直，所有这些部件又都同时与电路板21上类似的接触图形阵列准直。器件28对着电路板21装载以完成枝状互连。装载是通过螺丝致动器29完成的，螺丝致动器29是一个具有与在穿过滑动板33的孔洞中的内螺纹32相配套啮合的外螺纹31的大尺寸、圆筒形、热传导元件。旋转板34位于滑动板33和电子器件29的顶部之间。
螺丝致动器29和旋转板34在图6中以截面图示出。旋转板34是插座的关键元件，它补偿螺丝致动器29的底部和器件28的顶部之间表面的不准直并在其间提供低热阻通路。准直是通过使旋转板34顶部上的凸半球表面与螺丝致动器29底部上的凹半球表面啮合相配来完成的。相配合的表面外形使旋转板34旋转的同时保持从器件28顶部到热传导旋转板34、到旋转板34与螺丝致动器29之间的半球表面接触、直到热传导螺丝致动器29的表面与表面的接触。良好的表面与表面接触是必不可少的以便提供良好的热通路，从而使热量从器件28流向冷却器、冷却板或其它与螺丝致动器29的顶部表面传导接触的冷却装置。图5示出一旦夹子37的各个柄舌啮合机架27中的孔洞38，冷却器36就被采用夹子37压紧连接到螺丝致动器29的顶部表面。
为了加强热通路，旋转板34和螺丝致动器29优选地由高导热材料，如铜或铝制成。此外，通常将一薄油膜施加到热通路内的配合表面。
一旦器件28被定位于机架27内，旋转板34被放在器件28的顶部。螺丝致动器29啮合滑动板33的配合螺纹，滑动板33能够在机架27内横向移动。通过螺丝致动器29施加的负载被通过与在机架27内的槽啮合的滑动板33的肩部送入机架27，从而夹住器件28和在插座后板19与螺丝致动器29之间的电路板21。电子器件模块的装载借助于通过利用扳手(或类似的转矩工具)拧螺丝致动器29使其啮合孔洞39而施加的转矩来完成。
注意，完成的器件提供了具有结构性的固定器以装设冷却器的低剖面插座，且冷却器通过低热阻通路连接到具有相对大面积和均匀压力的自准直接触表面的电子器件。
本领域的普通技术人员应该理解上述实施例仅是示例性的，而且可以由不背离由随附的权利要求限定的本发明的等同手段所代替。

Claims (11)

1.一种插座，包括：
由具有多重管或填料覆盖的枝晶的介电材料构成的一个平面承接器，其中管或填料以与一个电子球栅器件基本一致的图形分布；
用于在球栅阵列表面上定位一个球的图形以将所述球的图形与承接器上的管或填料准直的装置；
一个加接在印刷电路板上的机架部件；
装在机架部件中用于可调节地将平面承接器压成在电路板和电子球栅阵列器件之间准直的致动装置，其中致动装置包括：
一个第一平面热传导部件，具有凸或凹形表面的一个侧面；
一个第二平面热传导部件，具有其表面补偿配合所述第一部件的所述凸或凹形表面的侧面；
用于连接一个冷却器以建立与在所述致动装置中的所述第二部件热接触的装置。
2.根据权利要求1所述的插座，其特征在于，它还包括：
采用用于从相对于接触区的侧面支撑印刷电路板的后板；和
用于将后板连接到机架部件的装置。
3.根据权利要求2所述的插座，其特征在于，
所述可调节的致动装置包括具有孔洞的一个滑动板，孔洞内部的螺纹与形成在所述第一平面热传导部件中的一套外部螺纹啮合匹配。
4.根据权利要求2所述的插座，其特征在于，
所述用于连接后板的装置是管脚，它们从后板向机架部件延伸，准直承接器的管或填料并定位用于定位的装置。
5.根据权利要求3所述的插座，其特征在于，
所述用于连接后板的装置是管脚，它们从后板向机架部件延伸，准直承接器的管或填料并定位用于定位的装置。
6.根据权利要求4所述的插座，其特征在于，
所述平面承接器由具有成图形的电通路以连接所选择的管或填料的多个层构成。
7.根据权利要求5所述的插座，其特征在于，
所述平面承接器由具有成图形的电通路以连接所选择的管或填料的多个层构成。
8.根据权利要求6所述的插座，其特征在于，
所述印刷电路板上的接触区域图形由钎料覆盖的格构成。
9.根据权利要求8所述的插座，其特征在于，
所述印刷电路板上的接触区域图形由钎料覆盖的格构成。
10.根据权利要求7所述的插座，其特征在于，
所述用于在球栅阵列器件的表面上定位钎料球图形的装置与球栅阵列器件的球相匹配。
11.根据权利要求9所述的插座，其特征在于，
所述用于在球栅阵列器件的表面上定位钎料球图形的装置与球栅阵列器件的球相匹配。
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Families Citing this family (51)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5883788A (en) * 1996-10-31 1999-03-16 Hewlett-Packard Company Backing plate for LGA mounting of integrated circuits facilitates probing of the IC's pins
US6142789A (en) * 1997-09-22 2000-11-07 Silicon Graphics, Inc. Demateable, compliant, area array interconnect
US6010340A (en) * 1998-03-04 2000-01-04 Internatinal Business Machines Corporation Solder column tip compliancy modification for use in a BGA socket connector
JPH11329648A (ja) * 1998-05-19 1999-11-30 Molex Inc Ｉｃデバイスソケット
US5997316A (en) * 1998-06-12 1999-12-07 Twp, Inc. Slide-lock test socket assembly
US6050832A (en) * 1998-08-07 2000-04-18 Fujitsu Limited Chip and board stress relief interposer
US6042412A (en) * 1998-08-28 2000-03-28 The Whitaker Corporation Land grid array connector assembly
US6198630B1 (en) * 1999-01-20 2001-03-06 Hewlett-Packard Company Method and apparatus for electrical and mechanical attachment, and electromagnetic interference and thermal management of high speed, high density VLSI modules
US6559388B1 (en) 1999-06-08 2003-05-06 International Business Machines Corporation Strain relief for substrates having a low coefficient of thermal expansion
US6282093B1 (en) * 1999-06-11 2001-08-28 Thomas & Betts International, Inc. LGA clamp mechanism
KR100298829B1 (ko) 1999-07-21 2001-11-01 윤종용 칩 사이즈 패키지의 솔더 접합 구조 및 방법
US6293810B1 (en) * 2000-02-08 2001-09-25 Thomas & Betts International, Inc. Socket for BGA packages
US20030175091A1 (en) 2000-03-10 2003-09-18 Aukzemas Thomas V. Floating captive screw
WO2002013265A2 (en) * 2000-08-04 2002-02-14 Tyco Electronics Logistics Ag Heat sink assembly with evenly distributed compression force
US6816385B1 (en) * 2000-11-16 2004-11-09 International Business Machines Corporation Compliant laminate connector
US6634095B2 (en) 2001-06-27 2003-10-21 International Business Machines Corporation Apparatus for mounting a land grid array module
US6835072B2 (en) * 2002-01-09 2004-12-28 Paricon Technologies Corporation Apparatus for applying a mechanically-releasable balanced compressive load to a compliant anisotropic conductive elastomer electrical connector
US6830463B2 (en) 2002-01-29 2004-12-14 Fci Americas Technology, Inc. Ball grid array connection device
US20040000428A1 (en) * 2002-06-26 2004-01-01 Mirng-Ji Lii Socketless package to circuit board assemblies and methods of using same
US6781837B2 (en) * 2002-12-06 2004-08-24 Dell Products L.P. System and method for information handling system heat sink retention
US6929484B2 (en) * 2003-01-09 2005-08-16 Roger E. Weiss Apparatus for applying a mechanically-releasable balanced compressive load to an assembly such as a compliant anisotropic conductive elastomer electrical connector
US6839965B2 (en) * 2003-02-06 2005-01-11 R-Tec Corporation Method of manufacturing a resistor connector
US7289335B2 (en) * 2003-07-08 2007-10-30 Hewlett-Packard Development Company, L.P. Force distributing spring element
US6866519B2 (en) * 2003-07-10 2005-03-15 Wei-Fang Fan Adaptable resilient pin assembly for BGA based IC encapsulation
US7137827B2 (en) * 2003-11-17 2006-11-21 International Business Machines Corporation Interposer with electrical contact button and method
US7209354B2 (en) * 2003-12-02 2007-04-24 Silicon Intergrated Systems Corp. Ball grid array package with heat sink device
US7201583B2 (en) * 2003-12-31 2007-04-10 Intel Corporation Three-dimensional flexible interposer
US7344345B2 (en) * 2004-05-27 2008-03-18 Southco, Inc. Captive shoulder nut having spring tie-down
DE102004037656B4 (de) * 2004-08-03 2009-06-18 Infineon Technologies Ag Elektronikmodul mit optimierter Montagefähigkeit und Bauteilanordnung mit einem Elektronikmodul
US7342796B2 (en) * 2005-06-03 2008-03-11 Southco, Inc. Captive shoulder nut assembly
US7486516B2 (en) * 2005-08-11 2009-02-03 International Business Machines Corporation Mounting a heat sink in thermal contact with an electronic component
US7777329B2 (en) * 2006-07-27 2010-08-17 International Business Machines Corporation Heatsink apparatus for applying a specified compressive force to an integrated circuit device
US20080081489A1 (en) * 2006-09-29 2008-04-03 Macgregor Mike G Reliable land grid array socket loading device
US20080079129A1 (en) * 2006-09-29 2008-04-03 Shankar Ganapathysubramanian Shape memory based mechanical enabling mechanism
US7751918B2 (en) * 2007-01-05 2010-07-06 International Business Machines Corporation Methods for configuring tubing for interconnecting in-series multiple liquid-cooled cold plates
JP2009152000A (ja) * 2007-12-19 2009-07-09 Nec Electronics Corp 半導体装置用ソケット
CN101668406B (zh) * 2008-09-01 2011-11-09 鸿富锦精密工业（深圳）有限公司 电子装置及其支撑件
JP5409242B2 (ja) * 2009-10-07 2014-02-05 新光電気工業株式会社 インダクタ及びインダクタの製造方法
US7871275B1 (en) * 2009-12-04 2011-01-18 Tyco Electronics Corporation Interposer frame assembly for mating a circuit board with an interposer assembly
TW201217684A (en) * 2010-10-25 2012-05-01 Foxsemicon Integrated Tech Inc LED lamp and LED module thereof
US9474156B2 (en) * 2011-02-10 2016-10-18 Apple Inc. Interposer connectors with alignment features
US8801440B2 (en) * 2012-10-08 2014-08-12 Hon Hai Precision Industry Co., Ltd. Electrical connector with low profile
US20150036278A1 (en) * 2013-08-05 2015-02-05 Qualcomm Incorporated Composite socket probing platform for a mobile memory interface
CN107211553A (zh) * 2014-11-14 2017-09-26 安费诺富加宜（亚洲）私人有限公司 具有固持部件的板上收发器组件
US9812795B2 (en) * 2015-11-03 2017-11-07 Ironwood Electronics, Inc. Packaged device adapter with force applied using bearing apparatus
US10095282B2 (en) * 2016-06-23 2018-10-09 Dell Products, Lp Cover for heat sink
US11523530B2 (en) * 2020-01-03 2022-12-06 Aptiv Technologies Limited Self-aligning mechanical mount and electrical connection system for electronic modules with features for robotic assembly
US11723154B1 (en) * 2020-02-17 2023-08-08 Nicholas J. Chiolino Multiwire plate-enclosed ball-isolated single-substrate silicon-carbide-die package
US11493551B2 (en) * 2020-06-22 2022-11-08 Advantest Test Solutions, Inc. Integrated test cell using active thermal interposer (ATI) with parallel socket actuation
US11821913B2 (en) 2020-11-02 2023-11-21 Advantest Test Solutions, Inc. Shielded socket and carrier for high-volume test of semiconductor devices
US11587640B2 (en) 2021-03-08 2023-02-21 Advantest Test Solutions, Inc. Carrier based high volume system level testing of devices with pop structures

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1113035A (zh) * 1994-02-10 1995-12-06 株式会社日立制作所 半导体器件及其制造方法
CN1161761A (zh) * 1994-09-06 1997-10-08 惠特克公司 球栅阵列插座
CN1175307A (zh) * 1995-02-06 1998-03-04 明尼苏达矿产制造公司 用于球栅阵列器件的最大负载插座

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4381131A (en) * 1981-05-04 1983-04-26 Burroughs Corporation Levered system connector for an integrated circuit package
US4679118A (en) * 1984-08-07 1987-07-07 Aavid Engineering, Inc. Electronic chip-carrier heat sinks
US4748495A (en) * 1985-08-08 1988-05-31 Dypax Systems Corporation High density multi-chip interconnection and cooling package
US4652973A (en) * 1985-09-04 1987-03-24 At&T Bell Laboratories Chip carrier mounting apparatus
US4933808A (en) * 1989-05-11 1990-06-12 Westinghouse Electric Corp. Solderless printed wiring board module and multi-module assembly
US4923404A (en) * 1989-10-20 1990-05-08 Amp Incorporated Sealed chip carrier
US5161983A (en) * 1991-02-11 1992-11-10 Kel Corporation Low profile socket connector
US5302853A (en) * 1993-01-25 1994-04-12 The Whitaker Corporation Land grid array package
US5313099A (en) * 1993-03-04 1994-05-17 Square Head, Inc. Heat sink assembly for solid state devices
US5397919A (en) * 1993-03-04 1995-03-14 Square Head, Inc. Heat sink assembly for solid state devices
US5477161A (en) * 1993-06-18 1995-12-19 Emulation Technology, Inc. Test adapter for packaged integrated circuits
US5397245A (en) * 1993-10-29 1995-03-14 Texas Instruments Incorporated Non-destructive interconnect system for semiconductor devices
US5468157A (en) * 1993-10-29 1995-11-21 Texas Instruments Incorporated Non-destructive interconnect system for semiconductor devices
US5468996A (en) * 1994-03-25 1995-11-21 International Business Machines Corporation Electronic package assembly and connector for use therewith
US5451165A (en) * 1994-07-27 1995-09-19 Minnesota Mining And Manufacturing Company Temporary package for bare die test and burn-in
US5493475A (en) * 1995-02-27 1996-02-20 Lin; Shih-Jen Cooling device for an integrated circuit

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1113035A (zh) * 1994-02-10 1995-12-06 株式会社日立制作所 半导体器件及其制造方法
CN1161761A (zh) * 1994-09-06 1997-10-08 惠特克公司 球栅阵列插座
CN1175307A (zh) * 1995-02-06 1998-03-04 明尼苏达矿产制造公司 用于球栅阵列器件的最大负载插座

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