CN1388613A - 连接导线的方法及装置 - Google Patents
连接导线的方法及装置 Download PDFInfo
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Abstract
本发明涉及对每个连接区的焊接状态进行检测的方法和装置,其中当确定焊接完成时就立即停止施加超声振动和压力。这使得在最短时间内完成连接,而不需要在焊接完成后施加不必要的超声振动和压力,也不管各个连接底座的焊接特性的分布,这常是与每个导线连接区相对应的。
Description
发明背景
本发明涉及一种连接导线的方法及装置,特别涉及一种将导线连接到半导体器件上的方法及装置。
多种电路都要利用安装在电路板的半导体器件。半导体器件的制作过程包括线路的焊接过程,通过它来把半导体芯片安装在引线框架或基板上。电路中含有形成于芯片外侧的引线,或者形成于基板上的电极极板由例如铝或金的金属导线焊接。
典型地,在这种导线焊接过程中,抽出金属导线给导线焊接器(导线焊接装置)的焊接工具区,并在压力下将其与半导体芯片的焊接底座焊接。在超声型导线焊接器中,对该焊接工具施加超声振动。把导线和焊接工具一起压向芯片焊接底座,从而将导线焊接在一起。
传统的导线焊接器中,在把金属导线与半导体芯片相连时,要预设焊接时间。然后给工具和导线施加超声波和压力并保持一段预设的焊接时间。所述的预设时间需考虑到焊接区的焊接特性而确定,以保证导线最多地扩散并附加一安全时间空白段。
但是,在实际焊接金属导线时完全焊接所需的时间长度可能与取决于各个底座焊接特性的分布的预设时间不同。由此,即使已经焊接好,焊接过程也仍将继续到预设时间结束。所以,对半导体芯片所施加的不必要振动和压力将引起开裂或破损,进而破坏其内部性能。
作为上述问题的一个例子,功率控制单元等特别是例如电驱动机车中的发电机或其他电动机或发生器的旋转装置中存在这样的问题。为了缩短导线长度以减小电阻来改善半导体器件的性能并获得更高的制作效率和更高的安装密度,便把半导体器件作为裸片安装在电极图案和基板的电路图案上。在用前述传统方式进行上述的裸片焊接时,不必要的振动和压力问题将更为严重,从而加重了上述的开裂和损坏缺陷。
因此,本发明的一个目的在于:提供一种能够在不考虑焊接区的焊接特性的情况下,以最佳和最短的时间把金属导线与半导体芯片焊接起来的导线焊接方法和装置。
发明概述
本发明的第一个特征体现在一种同时利用超声振动而将金属导线与一器件进行压力焊接的导线焊接方法中。该方法包括以下步骤:在金属导线和器件间加压,同时施加振动;检测金属导线与该器件之间的焊接程度;检测到焊接状态完成时,停止施加产生超声振动和压力。
本发明的另一个特征体现在一种具有把金属导线压向器件的工具的导线焊接装置。一个振动器给所述的工具施加超声振动。一个振荡器给振动器提供能量,一控制部控制该振荡器的输出。一加压装置给所述工具施加压力。一焊接检测器检测该金属导线与器件间的焊接程度,并通知控制区结束焊接。
附图简介
图1是根据本发明所构造和进行操作的焊接装置的部分侧面立视图,其中含有用横截面图示意的焊接部件区;
图2A和2B是两种可替换方式的示意图,其中在实施本发明时可以确定焊接是否完成;
图3是施加了本发明所检测电路的铝基板的顶视图;
图4是与图3部分相似的顶视图,但它示意了安装在所述铝基板上的芯片和其他部件;
图5是图4所示结构的侧面立视图;
图6是与本发明所检测电路一起使用的电动机车的电动机控制单元的顶视图;
图7是所述电动机控制单元的侧面立视图;
图8是所述电动机控制单元的端面立视图;
图9是与图6部分相似的顶视图,但其中去除了封装化合物且用实线示意其中的所含部件;
图10是与图7部分相似的侧面立视图,但其中去除了封装化合物且用实线示意其中的所含部件;
图11是与图8部分相似的端面立视图,但其中去除了封装化合物且用实线示意其中的所含部件。
详细描述
现在结合附图进行详细描述。通常用附图标记11来表示根据本发明所构建和进行操作的导线焊接装置。该装置包括一个把导线13送给工件的工具12,所述工件常用附图标记14表示,且它具有特殊的结构,这将在后面结合图3-11进行描述。所述的工件12是现有技术中常用的任何类型,对于在本发明所属领域中工作的技术人员来说,没有必要对其作详细的描述。
所述的工具12与一个振动器15相连,该振动器15也可以是本领域中的常用类型。振动器15由超声波振荡器16驱动,给该振动器15、工具12和导线13提供超声振动。而且所述的发生器16的结构也可以是该领域中所用的任何类型。
一个提供负载的线性电动机17为与振动器15整体固接的工具12施加压力。电动机17同样可以是用于此目的常用类型。所述的工具12、导线13、振动器15和线性负载电动机17都位于Z-轴电动机18的纵向位置,所述的Z轴电动机用于在Z方向上(纵向)驱动工具12。一个Z轴解码器19用于检测被Z轴电动机18所驱动的工具12的位置。上述的这些组件都可以是所属领域中的常用类型。
一个压力传感器21用于检测在焊接过程中因压力所引起的工具12和导线13的减压量。最后,该装置还包括一个用于控制本发明的焊接或连接过程的控制部22。
如上所述,图1示意了一种焊接装置,它与工件14对准,特别是位于把导线13焊接到将与之相接的元件上的位置。如前所述,在上述装置中进行焊接操作的特殊工件14将结合附图3-11在以后更详细地描述。但是,它包括一个基板31,并在其上以下述的方式安装半导体器件39。由铝或金制成的金属导线13将与半导体芯片39上所形成的连接底座23相接。
用工具的尖头把金属导线13压向半导体芯片39的连接底座23进行焊接。在把金属导线13焊接到连接底座23上之后,把工具12移到基板31上形成的电极(未示出)上同时拔出金属导线13。这样导线13就被焊接到电极上。上述的焊接完成后剪掉该金属导线13。重复上述的步骤,以同样的方式用金属导线13连接基板上的电极和半导体芯片39上的电极(连接底座23)。
在把工具12压向连接底座23而焊接金属导线13时,已位于X和Y方向的工具12在Z轴由电动机18的带动下被带到指定的位置,并用负载线性电动机17给工具施加预定的压力。用载荷电池(未示出)检测所施加的压力,并根据控制部22中的微机存储器中所存储的程序进行控制。
控制部22根据预设程序给超声波振荡器16施加驱动信号A,且通过振动器15把超声振动施加给工具12,该信号来源于超声波振荡器16的输出信号B。振动所需负载的改变取决于焊接状态。对于超声波振荡器16的输出信号B而言,控制部22把驱动信号A传送给超声波振荡器16,使得输出信号B相应于工具12尖端处金属导线13的焊接状态而改变。与该输出信号B相同的信号反馈给控制部22,作为用于监测输出的输出检测信号C。根据所述的输出检测信号C确定对超声波振荡器16的驱动控制。
输出检测信号C与连接底座23上连接区中的金属导线13的焊接状态对应。所以,如果检测到输出检测信号C,就可以检测焊接的完成情况。现结合图2A和2B所述的方式进行。这些图中的每一个都是用图1所示的导线焊接装置进行焊接操作的过程中施加给半导体芯片的信号波示意图。
在曲线图(2A)(2B)中,曲线“a”表示由图1中的压力传感器21检测到的工具的减压量,曲线“b”表示驱动信号(超声波输出信号)B,它从控制部22输出,成为了一个反馈信号。可以看到,是在t0时由负载线性电动机17施加压力的。在上述压力作用下,减压量“a”增加。
在t1时超声波振荡器16开始工作,且在该过程中超声波输出信号A将随着通常的执行情况上升,这与已有技术中相同。超声波输出信号A响应于导线连接区的连接状态而逐渐增加。
在t2时,导线连接区达到完成连接的状态,此时导线连接区的焊接已完成。可以发现,这已反映在超声波信号中。如图2A所示,超声波输出信号A迅速上升,然后成为约为恒定输出电压的曲线。超声波输出信号中的这种变化可能会更大,或者几乎不会出现,这取决于例如工具12的设置情况。根据该实施例和图2A所示的曲线图,工具、振动器等的安装情况或其他焊接条件可以事先调节,使得在超声波输出信号中的波形出现突变。
在曲线图2B所示的情形中,即使在导线连接区已被焊接完,超声波输出波形也没有出现例如上升这样的变化。但是在曲线图2A和2B所示的任一种情形中,在导线连接区的焊接完成时,超声波输出信号b的波形基本不变,到t2后变平。
所以,在任一种情形中,在焊接导线和连接完成之后,在时间t3停止驱动超声波振荡器16,以停止对工具施加超声振动。而且,停止驱动负载线性电动机17以停止施加压力。从而,半导体芯片的连接底座的连接操作结束。
所以,本发明中,在t2时停止施加超声振动和压力,此时检测到同时进行焊接完成和结束连接底座上的连接操作。这可以通过检测同时进行超声波输出信号波中出现的突变来实现,如曲线图2A所示。这可以通过设定操作程序来做,而且最好这样来设定,即在检测上述突变的同时或在判明上述突变转入平直状态后的短时间内停止连接。另一种情况如图2B所示,在t2后波形变成平直,即在t2时波形不再上升,所以如果检测该平直的波形,则可以确定连接区中的焊接结束,从而停止连接操作。
参见图3-11,其中示意了可用前面已经描述过的装置和方法进行焊接的特殊类型的工件,其中示意了这样一种实施例,其中:含有被安装器件的基板可用作驱动电动机车的电动机控制单元。
如图3-5所示,工件14由铝基板31上形成的铜传导图案(未示出)构成,其上涂覆了一层阻焊剂32。通过刻制阻焊剂32,形成构成电动机控制电路组成区的二极管台阶状图案33和FET台阶状图案34。在铝基板31上的三个位置形成控制电路的输出端35a,35b和35c,且每个输出端都各有两个输出端孔36。在铝基板31的四个角上设置用于固定壳体的安装孔37,这将在后面结合图6-11进行描述。另外,在基板上还设有形成该驱动电路另一部件的栅电阻38。
把二极管39焊接在各二极管台阶状图案33中,把FET 41焊接在各FET台阶状图案34中。用树脂42分别封装或密封每个二极管39。如前所述,可用已经描述的方法和装置进行所有这些半导体器件39和41的连接。
用树脂43沿着连接器44封装每个FET 41。可以选择其线性膨胀系数约为(15-30)×10-6/℃的市售可得的液体密封材料或树脂来作为密封这些二极管39和FET 41的封装材料。例如,其线生膨胀系数约为和15×10-6/℃和22×10-6/℃的密封材料分别约为铜和铝的线性膨胀系数,在市场上可以很容易获得。
现参见图6-11,这些附图示意了如何构造一个加入了图3-5的工作的铝基板31的整个电动机控制单元。通常用附图标记45表示该电动机控制单元,它含有一个位于壳体46内、由前面结合图3-5所示的铝基板31所构成的驱动控制电路。
壳体46由铝或铝合金金属材料挤压而成。该壳体46是两端开口的圆柱状。从它的外圆周表面伸出多个平行排列的突起47,该突起47增大了壳体46的表面积,从而增强了热辐射,也使得壳体46的刚性和强度增加。
在所述的铝基板31上还安装有构成驱动控制电路的其他元件,例如电介质电容器48,所述的驱动控制电路构成驱动控制电路(图9)。而且,端部连接板49a,49b和49c与前述的输出端35a,35b和35(36)c连接。控制电路的每条信号线都经由电缆51和耦合器52与开关和其他机车侧上的驱动或控制部件相连。输出端53穿过前述的输出端孔37,从铝基板31的下表面伸出。上述的铝基板31和置于其上的电学元件都盛装在壳体46内且用树脂54进行封装或密封。
如上所述,在确定焊接结束时,检测每个连接区的焊接状态并立即停止施加超声振动和压力,使得所做的连接在最短时间内结束,而不需要在完成焊接后再施加不必要的超声振动和压力,也不管各个连接底座焊接特性的分布情况,这常常是与每个焊接区相对应的。尽管前述的实施例中,把超声波振荡器输出的输出电压反馈电路用作检测连接区中焊接完成的检测手段,并由所测得的信号波形来确定连接状态,但是本发明不限于此,例如可以通过检测用激光束照射连接区时、连接区所反射的光来确定连接状态的变化。
当然,所属领域中的普通技术人员可以容易理解,前面的描述只是方法和装置的优选实施例,并且可以在不偏离本发明精神和由所附权利要求书所限定范围的情况下作各种修改和变化。
Claims (14)
1、一种在进行压力焊接的同时施加超声振动而连接金属导线与器件的导线连接方法,所述的方法包括以下步骤:在所述金属导线和器件间施加压力,同时施加振动力;检测所述金属导线和器件间的连接程度;和相应于检测到所进行的连接状态完成而停止施加所述的超声振动和压力。
2、一种如权利要求1所述的导线连接方法,其中所述的器件含有一个半导体芯片,所述的金属导线被焊接到所述半导体芯片上的连接底座上。
3、一种如权利要求2所述的导线连接方法,其中在焊接所述金属导线时,把所述的半导体芯片安装到一个基板上。
4、一种如权利要求1所述的导线连接方法,其中所述的超声振动由一个振荡器产生。
5、一种如权利要求4所述的导线连接方法,其中由来自所述振动器的反馈信号确定连接状态。
6、一种如权利要求5所述的导线连接方法,其中由所述反馈信号波的突变来确定连接的完成。
7、一种如权利要求6所述的导线连接方法,其中所述器件含有一个半导体芯片,且把所述的金属导线焊接到所述半导体芯片上的连接底座上。
8、一种如权利要求7所述的导线连接方法,其中在焊接金属导线时把所述的半导体芯片安装在一基板上。
9、一种如权利要求5所述的导线连接方法,其中,由所述反馈信号波中不发生显著变化来确定连接的完成。
10、一种如权利要求9所述的导线连接方法,其中,所述器件含有一个半导体芯片,且把所述的金属导线焊接到所述半导体芯片上的连接底座上。
11、一种如权利要求10所述的导线连接方法,其中,在焊接所述金属导线时把所述半导体芯片安装在一基板上。
12、一种导线连接装置,包括:一个用于支承金属导线并把它压向一器件的工具;一个用于给所述工具施加超声振动的振动器;一个给所述振动器提供能量的振荡器;一个用于控制所述振荡器的输出的控制部;一个用于给所述工具施加压力的压力装置;一个用于检测所述金属导线与器件间的连接程度的连接检测器,并提示所述控制部何时中止焊接过程。
13、一种如权利要求12所述的导线连接装置,其中所述的连接检测器通过检测来自振荡器OLE-LINK1的反馈信号波形的突变来检测焊接的完成。
14、一种如权利要求12所述的导线连接装置,其中所述的连接检测器通过检测来自振荡器的反馈信号波形中没有发生显著的变化来检测焊接的完成。
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CN101728290B (zh) * | 2008-10-22 | 2012-07-04 | 株式会社东芝 | 接合方法 |
CN102945817A (zh) * | 2012-11-21 | 2013-02-27 | 兰荣 | 一体式智能卡封装系统及封装方法 |
CN103077905A (zh) * | 2013-01-29 | 2013-05-01 | 中南大学 | 一种引线成弧方法及装置 |
CN103208720A (zh) * | 2012-01-17 | 2013-07-17 | 东莞市锐祥智能卡科技有限公司 | Cpu模块外置导线的连接方法及连接装置 |
TWI762888B (zh) * | 2019-04-09 | 2022-05-01 | 日商海上股份有限公司 | 絕緣被覆線之接合方法、連接構造、絕緣被覆線之剝離方法及結合裝置 |
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EP1738303B1 (fr) * | 2004-03-25 | 2008-09-17 | Bauer, Eric | Procede de fabrication d'une etiquette electronique |
RU2525962C1 (ru) * | 2013-02-13 | 2014-08-20 | Открытое акционерное общество "Научно-исследовательский институт электронной техники" | Способ приварки вывода в полупроводниковом приборе |
KR20220018470A (ko) * | 2020-08-04 | 2022-02-15 | 야마하 로보틱스 홀딩스 가부시키가이샤 | 와이어 접합 상태 판정 방법 및 와이어 접합 상태 판정 장치 |
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JPH02101754A (ja) * | 1988-10-11 | 1990-04-13 | Hitachi Ltd | ボンディング方法及びボンディング装置 |
JPH0713988B2 (ja) * | 1990-02-13 | 1995-02-15 | 株式会社東芝 | ワイヤボンディング方法 |
JP3007195B2 (ja) * | 1991-09-18 | 2000-02-07 | 株式会社日立製作所 | ボンディング装置およびボンディング部検査装置 |
JP2705423B2 (ja) * | 1992-01-24 | 1998-01-28 | 株式会社日立製作所 | 超音波接合装置及び品質モニタリング方法 |
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Cited By (7)
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CN101728290B (zh) * | 2008-10-22 | 2012-07-04 | 株式会社东芝 | 接合方法 |
CN103208720A (zh) * | 2012-01-17 | 2013-07-17 | 东莞市锐祥智能卡科技有限公司 | Cpu模块外置导线的连接方法及连接装置 |
CN103208720B (zh) * | 2012-01-17 | 2015-09-02 | 东莞市锐祥智能卡科技有限公司 | Cpu模块外置导线的连接方法及连接装置 |
CN102945817A (zh) * | 2012-11-21 | 2013-02-27 | 兰荣 | 一体式智能卡封装系统及封装方法 |
CN103077905A (zh) * | 2013-01-29 | 2013-05-01 | 中南大学 | 一种引线成弧方法及装置 |
CN103077905B (zh) * | 2013-01-29 | 2015-04-08 | 中南大学 | 一种引线成弧方法及装置 |
TWI762888B (zh) * | 2019-04-09 | 2022-05-01 | 日商海上股份有限公司 | 絕緣被覆線之接合方法、連接構造、絕緣被覆線之剝離方法及結合裝置 |
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