CN1386313A - 包括至少两个印刷电路板的系统 - Google Patents

包括至少两个印刷电路板的系统 Download PDF

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Publication number
CN1386313A
CN1386313A CN01802262A CN01802262A CN1386313A CN 1386313 A CN1386313 A CN 1386313A CN 01802262 A CN01802262 A CN 01802262A CN 01802262 A CN01802262 A CN 01802262A CN 1386313 A CN1386313 A CN 1386313A
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Prior art keywords
printed circuit
pcb
circuit board
pin
conductivity
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CN01802262A
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CN1214492C (zh
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J·F·A·雷尼尔斯
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Koninklijke Philips NV
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Koninklijke Philips Electronics NV
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/366—Assembling printed circuits with other printed circuits substantially perpendicularly to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/048—Second PCB mounted on first PCB by inserting in window or holes of the first PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/09172—Notches between edge pads

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Multi-Conductor Connections (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

在包括两个印刷电路板的系统中,每个印刷电路板都被配置有至少一个用于将这些印刷电路板相互电连接的至少一个电接触元件。一个电接触元件包括由一个印刷电路板形成的至少一个导电引脚,同时另一个电接触元件由在另一个印刷电路板上的至少一个孔形成,所述孔的壁覆有一导电层。

Description

包括至少两个印刷电路板的系统
本发明涉及一个包括至少两个其上具有印刷电路的印刷电路板的系统，所述每个印刷电路板包括用于电互连这些印刷电路板的电连接元件
这样一个系统由德国专利说明书No.19636335(西门子AG)可知.在此已知系统中，一个所谓的子板(daughterboard)利用一个独立的连接器以直角固定在一个所谓的母板(motherboard)上，为此，子板被安置在连接器的一个插槽中，而这一整体又连接到母板上。在板的两平面侧上，子板包括为多个间隔的金属接触带形式的接触元件，这些金属接触带在子板的安装状态下电连接到相应的，位于插槽两侧的，连接器的接触元件上。子板和连接器的整体顺序地又通过将连接器的连接触点焊接到母板的接触元件上而被电连接到母板上。以此方式，两个印刷电路板的印刷电路相互电连接。
由上述德国专利公开所知的系统的一个缺点在于一方面在子板和连接器之间的电连接和另一方面子板和母板与连接器的电连接被发现在实践中很弱。这是由于在上述金属接触带和连接器的接触元件之间的电连接容易中断，例如，由于子板的移动，同时当该整体承受一个机械负载时与母板的焊接接触容易断开。
本发明的一个目的是以这样一种方式来改进根据现有技术的系统，以获得在印刷电路板之间的一个可靠的电连接；为实现这一目的，在开头段落中所述类型的系统的特征在于，根据本发明，一个印刷电路板的电接触元件由多个被制造为与所述印刷电路板成一片形式的导电性引脚形成，和在于另一个印刷电路板的电接触元件由多个具有形成在所述另一印刷电路板上的导电性内表面的凹陷来形成，引脚进入相应凹陷并通过焊接被固定于此。优选地，母板和子板被如此固定，使得它们相互垂直。引脚和相应凹陷之间的导电是通过在引脚的外表面和凹陷的内表面全向性提供一种导电性材料，优选地包括金属，来获得。所讨论的系统具有特殊的优点，即不要求为在印刷电路板之间的可靠连接提供一个单独的连接器。
在根据本发明的系统的一个优选实施例中，导电性材料利用电解被提供在引脚的外表面和在凹陷的内表面。
在根据本发明的系统的另一个优选实施例中，导电性材料的厚度范围在25微米和40微米之间，优选地为35微米。
在根据本发明的系统的再一个优选实施例中，导电性引脚的直径小于3mm，具体为小于2mm，更具体地为小于1.5mm。
本发明还涉及一个用于制造作为根据本发明的系统的部分的印刷电路板的方法，其中导电性引脚通过由一个印刷电路板去除材料来形成，具体为研磨和钻孔。优选地，印刷电路板的相邻导电性引脚通过由所述印刷电路板去除中间部分的材料来彼此电绝缘，具体地利用研磨和钻孔。
本发明的这些和其他方面将通过下面参照附图的描述变得更加清楚和明了。
在附图中：
图1为根据本发明的一个优选实施例的母板和子板的透视图；
图2为在工作状态下的图1所示的印刷电路板。
图1示出了配置有印刷电路的母板1和子板2，印刷电路的铜带的参考标记为3。母板1包括，在此例中，18个钻孔的圆形凹陷4，其内表面被金属化。子板2包括18个金属化的引脚，其正方形截面与圆形凹陷4相应。引脚5由子板2所研磨出，因此与所述子板成一片。为了制造排除在子板的位于相邻引脚5中间的区域中，由于金属轨迹所产生的在相邻引脚5中间的导电接触，这些区域被研磨去除，并为半圆弧标记6。上述动词“金属化”和其结合意指在此连接中，凹陷4的整个内表面和引脚5的整个外表面被覆以优选为35微米厚度的金属层。
图2示出了安装状态的图1所示的印刷电路板1，2，在凹陷4和相应引脚5之间提供了焊接7以保证组件被可靠安装。
本发明不限于附图所示的实施例，但是还包括在所附权利要求的范围中其他变型。

Claims (8)

1.一个系统，包括至少两个其上配置有印刷电路的印刷电路板，所述每个印刷电路板包括由于将这些印刷电路板相互电连接的电接触元件，其特征在于，一个印刷电路板的电接触元件由多个被制造为与所述印刷电路板成一片形式的导电性引脚形成，而其中另一个印刷电路板的电接触元件由多个具有形成在所述另一印刷电路板上的导电性内表面的凹陷来形成，引脚进入相应凹陷并通过焊接被固定于此。
2.如权利要求1所述的系统，其特征在于，导电性引脚在所有侧面都覆有一种导电性材料，具体为金属。
3.如权利要求1或2所述的系统，其特征在于，凹陷的内表面在所有侧面都覆有一种导电性材料，具体为金属。
4.如权利要求2或3所述的系统，其特征在于，该导电性材料利用电解过程来提供。
5.如权利要求2，3或4所述的系统，其特征在于，导电性材料的厚度范围在25微米和40微米之间，优选地为35微米。
6.如前述权利要求1到5中任一权利要求所述的系统，其中导电性引脚的直径小于3mm，具体为小于2mm，更具体地为小于1.5mm。
7.一个用于制造作为根据本发明的系统的部分的印刷电路板的方法，其特征在于，导电性引脚通过由一个印刷电路板去除材料来形成，具体为研磨和钻孔。
8.如权利要求7所述的方法，其特征在于，印刷电路板的相邻导电性引脚通过由所述印刷电路板去除中间部分的材料来彼此电绝缘，具体地利用研磨和钻孔。
CNB018022626A 2000-07-31 2001-07-13 包括至少两个印刷电路板的系统 Expired - Fee Related CN1214492C (zh)

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US (1) US6661674B2 (zh)
EP (1) EP1238445B1 (zh)
JP (1) JP2004505471A (zh)
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DE (1) DE60128537T2 (zh)
WO (1) WO2002011245A1 (zh)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102143655A (zh) * 2010-12-24 2011-08-03 华为技术有限公司 电源模块及网络设备
CN103096621A (zh) * 2011-11-08 2013-05-08 罗伯特·博世有限公司 机动车用的电控制设备
CN104109935A (zh) * 2014-06-16 2014-10-22 福建睿能科技股份有限公司 一种横机的机头箱系统

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10251615A1 (de) * 2002-11-06 2004-05-19 Valeo Schalter Und Sensoren Gmbh Steckerelement und Platinenaufbau
JP2009135194A (ja) * 2007-11-29 2009-06-18 Toshiba Corp プリント基板システム及びプリント基板の接続方法
KR20130097481A (ko) * 2012-02-24 2013-09-03 삼성전자주식회사 인쇄회로기판(ｐｃｂ) 및 그 ｐｃｂ를 포함한 메모리 모듈
USD733145S1 (en) * 2014-03-14 2015-06-30 Kingston Digital, Inc. Memory module
WO2015177060A1 (en) * 2014-05-22 2015-11-26 Koninklijke Philips N.V. Printed circuit board arrangement and method for mounting a product to a main printed circuit board
USD735201S1 (en) * 2014-07-30 2015-07-28 Kingston Digital, Inc. Memory module
CN106704993A (zh) * 2017-01-09 2017-05-24 宁波亚茂光电股份有限公司 一种插卡式电源与光源板的连接结构
WO2019006344A1 (en) * 2017-06-30 2019-01-03 Lutron Electronics Co., Inc. CIRCUIT BOARD SOLDER JOINTS PRINTED
CN109388195A (zh) * 2017-08-03 2019-02-26 华硕电脑股份有限公司 电脑系统及其主板
KR102088323B1 (ko) * 2017-11-23 2020-03-12 주식회사 유라코퍼레이션 인쇄회로기판의 결합구조

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3105869A (en) * 1962-03-23 1963-10-01 Hughes Aircraft Co Electrical connection of microminiature circuit wafers
US3934334A (en) * 1974-04-15 1976-01-27 Texas Instruments Incorporated Method of fabricating metal printed wiring boards
US4074419A (en) * 1976-03-16 1978-02-21 Texas Instruments Incorporated Printed wiring board with angled portion and its method of manufacture
US4109298A (en) * 1976-07-26 1978-08-22 Texas Instruments Incorporated Connector with printed wiring board structure
JPS59121993A (ja) * 1982-12-28 1984-07-14 富士通株式会社 半導体パツケ−ジの実装方法
US4586764A (en) * 1985-01-07 1986-05-06 Motorola, Inc. Electrical subassembly structure
JPS62229896A (ja) * 1986-03-29 1987-10-08 株式会社東芝 印刷配線基板
FI82169C (fi) * 1987-08-21 1991-01-10 Nokia Mobira Oy Rf-skyddad hybridkrets.
JPH01270390A (ja) * 1988-04-22 1989-10-27 Seiko Epson Corp 電子部品の印刷回路基板への取付け方法
FR2693340B1 (fr) * 1992-07-03 1994-10-07 Jaeger Ensemble électrique comprenant au moins deux circuits imprimés.
KR940022803A (ko) * 1993-03-05 1994-10-21 김광호 반도체 패키지 및 그 실장에 적합한 인쇄회로기판
JPH08279670A (ja) * 1995-04-07 1996-10-22 Hitachi Ltd 電子部品の表面実装構造
US5907475A (en) * 1996-04-16 1999-05-25 Allen-Bradley Company, Llc Circuit board system having a mounted board and a plurality of mounting boards
US6042423A (en) * 1997-02-27 2000-03-28 The Whitaker Corporation Alignment adapters for post header
US6191954B1 (en) * 1998-11-16 2001-02-20 International Business Machines Corporation Controlled low impedance high current circuit board interconnect

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102143655A (zh) * 2010-12-24 2011-08-03 华为技术有限公司 电源模块及网络设备
CN102143655B (zh) * 2010-12-24 2014-09-17 华为技术有限公司 电源模块及网络设备
CN103096621A (zh) * 2011-11-08 2013-05-08 罗伯特·博世有限公司 机动车用的电控制设备
CN103096621B (zh) * 2011-11-08 2017-05-17 罗伯特·博世有限公司 机动车用的电控制设备
CN104109935A (zh) * 2014-06-16 2014-10-22 福建睿能科技股份有限公司 一种横机的机头箱系统

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WO2002011245A1 (en) 2002-02-07
CN1214492C (zh) 2005-08-10
DE60128537T2 (de) 2008-01-31
EP1238445B1 (en) 2007-05-23
US20020015290A1 (en) 2002-02-07
EP1238445A1 (en) 2002-09-11
US6661674B2 (en) 2003-12-09
DE60128537D1 (de) 2007-07-05
JP2004505471A (ja) 2004-02-19

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